JPH10178312A - Antenna system - Google Patents
Antenna systemInfo
- Publication number
- JPH10178312A JPH10178312A JP33992596A JP33992596A JPH10178312A JP H10178312 A JPH10178312 A JP H10178312A JP 33992596 A JP33992596 A JP 33992596A JP 33992596 A JP33992596 A JP 33992596A JP H10178312 A JPH10178312 A JP H10178312A
- Authority
- JP
- Japan
- Prior art keywords
- chip antenna
- conductor
- antenna
- base
- mounting board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、アンテナ装置に関
し、特に、移動体通信用及びローカルエリアネットワー
ク(LAN)用に用いられるアンテナ装置に関する。The present invention relates to an antenna device, and more particularly, to an antenna device used for mobile communication and a local area network (LAN).
【0002】[0002]
【従来の技術】図7に、従来のアンテナ装置50の斜視
図を示す。図7において、51はチップアンテナ、52
はチップアンテナ51を実装するための実装基板、53
は実装基板52の表面に形成された伝送線路、54は実
装基板52の裏面に形成されたグランド電極を示す。そ
して、伝送線路53の一端はチップアンテナ51に、他
端はRF部(図示せず)に接続される。また、グランド
電極54はグランドに接続される。2. Description of the Related Art FIG. 7 is a perspective view of a conventional antenna device 50. In FIG. 7, reference numeral 51 denotes a chip antenna;
Denotes a mounting board for mounting the chip antenna 51, 53
Denotes a transmission line formed on the front surface of the mounting substrate 52, and 54 denotes a ground electrode formed on the back surface of the mounting substrate 52. One end of the transmission line 53 is connected to the chip antenna 51, and the other end is connected to an RF unit (not shown). The ground electrode 54 is connected to the ground.
【0003】このチップアンテナ51は、例えば、図8
に示すように、アルミナ、ステアタイト等の絶縁体粉末
からなる絶縁体層(図示せず)を積層した直方体状の絶
縁体55と、銀、銀−パラジウム等からなり、絶縁体5
5の内部にコイル状に形成される導体56と、フェライ
ト粉末等の磁性体粉末からなり、絶縁体55及びコイル
状の導体56の内部に形成される磁性体57と、絶縁体
55を焼成した後、導体56の引き出し端(図示せず)
に、被着、焼き付けされる外部接続端子58a及び58
bとで構成される。The chip antenna 51 is, for example, shown in FIG.
As shown in FIG. 5, a rectangular parallelepiped insulator 55 in which an insulator layer (not shown) made of an insulator powder such as alumina or steatite is laminated, and an insulator 5 made of silver, silver-palladium, or the like.
5, a conductor 56 formed in a coil shape, and a magnetic material 57 made of a magnetic material powder such as a ferrite powder, and formed inside the insulator 55 and the coiled conductor 56, and the insulator 55 are fired. Then, a lead end of the conductor 56 (not shown)
External connection terminals 58a and 58
b.
【0004】[0004]
【発明が解決しようとする課題】ところが、上記の従来
のアンテナ装置においては、チップアンテナを実装した
実装基板の比誘電率により、実装基板の裏面に形成され
たグランド電極とチップアンテナの導体との間に容量が
発生する。しかしながら、この容量の発生により、チッ
プアンテナの利得が劣化する、あるいは帯域幅が狭くな
るという問題があった。However, in the above-mentioned conventional antenna device, the relative permittivity of the mounting board on which the chip antenna is mounted is determined by the difference between the ground electrode formed on the back surface of the mounting board and the conductor of the chip antenna. Capacitance occurs between them. However, there is a problem that the gain of the chip antenna deteriorates or the bandwidth becomes narrow due to the generation of the capacitance.
【0005】本発明は、このような問題点を解決するた
めになされたものであり、利得の劣化を抑制し、帯域幅
を広くすることができるアンテナ装置を提供することを
目的とする。[0005] The present invention has been made to solve such a problem, and an object of the present invention is to provide an antenna device capable of suppressing deterioration of a gain and widening a bandwidth.
【0006】[0006]
【課題を解決するための手段】上述する問題点を解決す
るため本発明は、誘電材料及び磁性材料の少なくとも一
方からなる基体と、該基体の内部及び表面の少なくとも
一方に形成された少なくとも1つの導体と、前記基体の
表面に形成され、前記導体に電圧を印加するための少な
くとも1つの給電用端子とを備えるチップアンテナと、
表面に伝送線路、裏面にグランド電極、前記グランド電
極の設けられてない箇所に貫通孔あるいは切り欠け部を
備える実装基板とからなり、前記チップアンテナが、前
記実装基板に、前記貫通孔あるいは切り欠け部の全てあ
るいは一部を覆うように実装されることを特徴とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a substrate comprising at least one of a dielectric material and a magnetic material, and at least one substrate formed on at least one of the inside and the surface of the substrate. A chip antenna comprising: a conductor; and at least one power supply terminal formed on a surface of the base body and for applying a voltage to the conductor;
A mounting substrate having a transmission line on the front surface, a ground electrode on the back surface, and a through hole or a notch at a location where the ground electrode is not provided, wherein the chip antenna is provided with the through hole or the notch It is characterized by being mounted so as to cover all or a part of the unit.
【0007】本発明のアンテナ装置によれば、実装基板
の貫通孔あるいは切り欠け部の全てあるいは一部を覆う
ようにチップアンテナを実装するため、チップアンテナ
の直下の比誘電率を小さくすることができる。According to the antenna device of the present invention, since the chip antenna is mounted so as to cover all or a part of the through hole or the cutout of the mounting board, the relative permittivity immediately below the chip antenna can be reduced. it can.
【0008】[0008]
【発明の実施の形態】図1に、本発明に係るアンテナ装
置の一実施例の分解透視斜視図を示す。アンテナ装置1
0は、チップアンテナ11と、そのチップアンテナ11
を実装するための実装基板12とからなる。FIG. 1 is an exploded perspective view of an embodiment of an antenna device according to the present invention. Antenna device 1
0 is the chip antenna 11 and the chip antenna 11
And a mounting board 12 for mounting the same.
【0009】チップアンテナ11は、酸化バリウム、酸
化アルミニウム、シリカを主成分とする直方体状の基体
13の内部に、基体13の長手方向に螺旋状に巻回され
る導体14と、基体13の表面に、導体14に電圧を印
加するための給電用端子15とを備える。ここで、導体
14の一端は、基体13の表面に引き出され、給電用端
子15に接続される。一方、導体14の他端は、基体1
3の内部において自由端16を形成する。A chip antenna 11 includes a conductor 14 spirally wound in a longitudinal direction of a base 13 inside a rectangular parallelepiped base 13 mainly composed of barium oxide, aluminum oxide and silica, and a surface of the base 13. And a power supply terminal 15 for applying a voltage to the conductor 14. Here, one end of the conductor 14 is drawn out to the surface of the base 13 and connected to the power supply terminal 15. On the other hand, the other end of the conductor 14 is
A free end 16 is formed inside 3.
【0010】実装基板12は、ガラスエポキシ樹脂から
なり、表面には一端にチップアンテナ11の給電用端子
15が接続されるランド17を有する伝送線路18が設
けられ、裏面にはグランド電極19が設けられる。ま
た、伝送線路18の他端はRF部(図示せず)に接続さ
れ、グランド電極19は、グランドに接続される。さら
に、グランド電極19が設けられていない箇所に貫通孔
20を備える。The mounting substrate 12 is made of glass epoxy resin. A transmission line 18 having a land 17 to which the power supply terminal 15 of the chip antenna 11 is connected at one end is provided on one surface, and a ground electrode 19 is provided on the back surface. Can be The other end of the transmission line 18 is connected to an RF unit (not shown), and the ground electrode 19 is connected to ground. Further, a through hole 20 is provided at a location where the ground electrode 19 is not provided.
【0011】そして、チップアンテナ11が実装基板1
2の貫通孔20の全てを覆うように、実装基板12に搭
載され、チップアンテナ11の給電用端子15と、実装
基板12上のランド17とが、はんだ等により電気的か
つ機械的に接続されることにより、チップアンテナ10
が実装基板12に実装される。The chip antenna 11 is mounted on the mounting board 1.
The power supply terminal 15 of the chip antenna 11 and the land 17 on the mounting substrate 12 are electrically and mechanically connected to each other by soldering or the like. By doing so, the chip antenna 10
Is mounted on the mounting board 12.
【0012】図2及び図3に、図1のチップアンテナ1
1の変形例の透視斜視図を示す。図2のチップアンテナ
11aは、直方体状の基体13aと、基体13aの表面
に沿って、基体13aの長手方向に螺旋状に巻回される
導体14aと、基体13aの表面に、導体14aに電圧
を印加するための給電用端子15aとを備える。ここ
で、導体14aの一端は、基体13aの表面において、
給電用端子15aに接続される。また、導体14aの他
端は、基体13aの表面において自由端16aを形成す
る。この場合には、導体14aを基体13aの表面に螺
旋状にスクリーン印刷等で簡単に形成できるため、チッ
プアンテナ11aの製造工程が簡略化できる。FIGS. 2 and 3 show the chip antenna 1 of FIG.
1 shows a perspective view of a modification of the first embodiment. The chip antenna 11a shown in FIG. 2 includes a rectangular parallelepiped base 13a, a conductor 14a spirally wound in the longitudinal direction of the base 13a along the surface of the base 13a, and a voltage applied to the conductor 14a on the surface of the base 13a. And a power supply terminal 15a for applying a voltage. Here, one end of the conductor 14a is
It is connected to the power supply terminal 15a. The other end of the conductor 14a forms a free end 16a on the surface of the base 13a. In this case, since the conductor 14a can be easily formed spirally on the surface of the base 13a by screen printing or the like, the manufacturing process of the chip antenna 11a can be simplified.
【0013】図3のチップアンテナ11bは、直方体状
の基体13bと、基体13bの表面に、ミアンダ状に形
成される導体14bと、基体13bの表面に、導体14
bに電圧を印加するための給電用端子15bとを備え
る。ここで、導体14bの一端は、基体13bの表面に
おいて、給電用端子15bに接続される。また、導体1
4bの他端は、基体13bの表面において自由端16b
を形成する。この場合には、ミアンダ状の導体14bを
基体13bの一方主面のみ形成するため、基体13bの
低背化が可能となり、それにともないチップアンテナ1
1bの低背化も可能となる。なお、ミアンダ状の導体1
4bは、基体の内部に形成されていてもよい。A chip antenna 11b shown in FIG. 3 has a rectangular parallelepiped base 13b, a conductor 14b formed in a meandering shape on the surface of the base 13b, and a conductor 14b formed on the surface of the base 13b.
and a power supply terminal 15b for applying a voltage to the terminal b. Here, one end of the conductor 14b is connected to the power supply terminal 15b on the surface of the base 13b. Also, conductor 1
4b has a free end 16b on the surface of the base 13b.
To form In this case, since the meandering conductor 14b is formed only on one main surface of the base 13b, the height of the base 13b can be reduced.
1b can be reduced in height. The meandering conductor 1
4b may be formed inside the base.
【0014】図4乃至図6に、図1の実装基板12の変
形例の一部拡大上面図を示す。図4の実装基板12a
は、図1の実装基板12と比較して、チップアンテナ1
1が実装される箇所に切り欠け部21を有する点で異な
る。また、図5及び図6の実装基板12b、12cは、
図1、図4の実装基板12、12aと比較して、貫通孔
20aあるいは切り欠け部21aが、実装基板12、1
2aに延接した突起部22に設けらる点で異なる。FIGS. 4 to 6 show partially enlarged top views of modifications of the mounting substrate 12 of FIG. The mounting substrate 12a of FIG.
Is compared with the mounting substrate 12 of FIG.
1 in that a notch 21 is provided at a position where the component 1 is mounted. In addition, the mounting substrates 12b and 12c in FIGS.
Compared with the mounting substrates 12 and 12a of FIGS.
The difference is that it is provided on the protruding portion 22 extending in contact with 2a.
【0015】表1に、各アンテナ装置の共振周波数1.
9GHzにおける利得及び帯域幅を示す。なお、サンプ
ルaは実装基板に図1の実装基板12を用いた場合、サ
ンプルbは実装基板に図4の実装基板12aを用いた場
合、サンプルcは実装基板に図5の実装基板12bを用
いた場合、サンプルdは実装基板に図6の実装基板12
cを用いた場合である。また、サンプルeは比較のため
の従来のアンテナ装置50(図7)である。Table 1 shows the resonance frequency of each antenna device.
9 shows gain and bandwidth at 9 GHz. Sample a uses the mounting board 12 of FIG. 1 as the mounting board, sample b uses the mounting board 12a of FIG. 4 as the mounting board, and sample c uses the mounting board 12b of FIG. 5 as the mounting board. Sampled, the mounting substrate 12 of FIG.
This is the case where c is used. Sample e is a conventional antenna device 50 (FIG. 7) for comparison.
【0016】[0016]
【表1】 [Table 1]
【0017】表1から、実装基板に貫通孔あるいは切り
かけ部を設けたサンプルa〜サンプルdでは、利得の劣
化を抑制でき、帯域幅を広くできることが理解される。
すなわち、利得の劣化を0〜0.5dBに抑制し、帯域
幅を従来に比べ約30%広くできている。From Table 1, it is understood that in the samples a to d in which the through holes or the cutout portions are provided in the mounting substrate, the deterioration of the gain can be suppressed and the bandwidth can be widened.
That is, the deterioration of the gain is suppressed to 0 to 0.5 dB, and the bandwidth can be increased by about 30% as compared with the related art.
【0018】上述した本実施例のアンテナ装置によれ
ば、実装基板の貫通孔あるいは切り欠け部の全てを覆う
ようにチップアンテナを実装するため、チップアンテナ
の直下の比誘電率を小さくすることができる。According to the antenna device of the present embodiment described above, the chip antenna is mounted so as to cover all of the through holes or cutouts of the mounting board, so that the relative dielectric constant immediately below the chip antenna can be reduced. it can.
【0019】したがって、チップアンテナの導体と、回
路基板の裏面のグランド電極との間に発生する容量を小
さくすることができるため、チップアンテナの利得の劣
化を抑制することや広帯域化を実現することができる。Therefore, since the capacitance generated between the conductor of the chip antenna and the ground electrode on the back surface of the circuit board can be reduced, it is possible to suppress the deterioration of the gain of the chip antenna and to realize a wider band. Can be.
【0020】なお、上述の実施例においては、チップア
ンテナの基体が、酸化バリウム、酸化アルミニウム、シ
リカを主成分とする誘電材料により構成される場合につ
いて説明したが、基体としてはこの誘電材料に限定され
るものではなく、酸化チタン、酸化ネオジウムを主成分
とする誘電材料、ニッケル、コバルト、鉄を主成分とす
る磁性材料、あるいは誘電材料と磁性材料の組み合わせ
でもよい。In the above embodiment, the case where the base of the chip antenna is made of a dielectric material containing barium oxide, aluminum oxide, and silica as a main component has been described, but the base is not limited to this dielectric material. Instead, a dielectric material containing titanium oxide or neodymium oxide as a main component, a magnetic material containing nickel, cobalt, or iron as a main component, or a combination of a dielectric material and a magnetic material may be used.
【0021】また、チップアンテナの導体が1本の場合
について説明したが、それぞれが平行に配置された複数
本の導体を有していてもよい。この場合には、導体の本
数に応じて複数の共振周波数を有することが可能とな
り、1つのアンテナでマルチバンドに対応することが可
能となる。Further, the case where the chip antenna has one conductor has been described, but the chip antenna may have a plurality of conductors arranged in parallel. In this case, it is possible to have a plurality of resonance frequencies according to the number of conductors, and it is possible to cope with multiband with one antenna.
【0022】さらに、実装基板の貫通孔あるいは切り欠
け部の全てを覆うようにチップアンテナを実装する場合
について説明したが、実装基板の貫通孔あるいは切り欠
け部の一部を覆うようにチップアンテナを実装しても、
同様の作用・効果が得られる。Furthermore, the case where the chip antenna is mounted so as to cover all the through holes or cutouts of the mounting board has been described. However, the chip antenna is mounted so as to cover part of the through holes or cutouts of the mounting board. Even if implemented,
Similar functions and effects can be obtained.
【0023】また、実装基板の貫通孔として断面が円形
状の場合を示したが、矩形状、楕円形状等何れの形状で
もよい。Although the through hole of the mounting board has a circular cross section, it may have a rectangular or elliptical shape.
【0024】[0024]
【発明の効果】本発明のアンテナ装置によれば、実装基
板の貫通孔あるいは切り欠け部の全てあるいは一部を覆
うようにチップアンテナを実装するため、チップアンテ
ナの直下の比誘電率を小さくすることができる。According to the antenna device of the present invention, since the chip antenna is mounted so as to cover all or a part of the through hole or the cutout of the mounting board, the relative dielectric constant immediately below the chip antenna is reduced. be able to.
【0025】したがって、チップアンテナの導体と、回
路基板の裏面のグランド電極との間に発生する容量を小
さくすることができるため、チップアンテナの利得の劣
化を抑制することや広帯域化を実現することができる。Therefore, since the capacitance generated between the conductor of the chip antenna and the ground electrode on the back surface of the circuit board can be reduced, it is possible to suppress the deterioration of the gain of the chip antenna and to realize a wider band. Can be.
【図1】本発明のアンテナ装置に係る一実施例の分解透
視斜視図である。FIG. 1 is an exploded perspective view of an embodiment of an antenna device according to the present invention.
【図2】図1のチップアンテナの変形例を示す透視斜視
図である。FIG. 2 is a perspective view showing a modification of the chip antenna of FIG. 1;
【図3】図1のチップアンテナの別の変形例を示す透視
斜視図である。FIG. 3 is a perspective view showing another modification of the chip antenna of FIG. 1;
【図4】図1の実装基板の変形例を示す一部拡大上面図
である。FIG. 4 is a partially enlarged top view showing a modified example of the mounting board of FIG. 1;
【図5】図1の実装基板の別の変形例を示す一部拡大上
面図である。FIG. 5 is a partially enlarged top view showing another modified example of the mounting board of FIG. 1;
【図6】図1の実装基板のさらに別の変形例を示す一部
拡大上面図である。FIG. 6 is a partially enlarged top view showing still another modified example of the mounting board of FIG. 1;
【図7】従来のアンテナ装置を示す斜視図である。FIG. 7 is a perspective view showing a conventional antenna device.
【図8】図7のアンテナ装置を構成するチップアンテナ
の透視側面図である。FIG. 8 is a transparent side view of a chip antenna constituting the antenna device of FIG. 7;
10 アンテナ装置 11 チップアンテナ 12 実装基板 13 基体 14 導体 15 給電用端子 17 貫通孔 19 伝送線路 20 グランド電極 21 切り欠け部 DESCRIPTION OF SYMBOLS 10 Antenna device 11 Chip antenna 12 Mounting substrate 13 Base 14 Conductor 15 Power supply terminal 17 Through hole 19 Transmission line 20 Ground electrode 21 Notch
Claims (1)
からなる基体と、該基体の内部及び表面の少なくとも一
方に形成された少なくとも1つの導体と、前記基体の表
面に形成され、前記導体に電圧を印加するための少なく
とも1つの給電用端子とを備えるチップアンテナと、表
面に伝送線路、裏面にグランド電極、前記グランド電極
の設けられてない箇所に貫通孔あるいは切り欠け部を備
える実装基板とからなり、 前記チップアンテナが、前記実装基板に、前記貫通孔あ
るいは切り欠け部の全てあるいは一部を覆うように実装
されることを特徴とするアンテナ装置。1. A substrate made of at least one of a dielectric material and a magnetic material, at least one conductor formed on at least one of the inside and the surface of the substrate, and a voltage formed on the surface of the substrate, and applying a voltage to the conductor. A chip antenna having at least one power supply terminal for applying voltage; and a mounting board having a transmission line on the front surface, a ground electrode on the back surface, and a through hole or a cutout at a location where the ground electrode is not provided. An antenna device, wherein the chip antenna is mounted on the mounting board so as to cover all or a part of the through hole or the cutout.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33992596A JP2996190B2 (en) | 1996-12-19 | 1996-12-19 | Antenna device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33992596A JP2996190B2 (en) | 1996-12-19 | 1996-12-19 | Antenna device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10178312A true JPH10178312A (en) | 1998-06-30 |
JP2996190B2 JP2996190B2 (en) | 1999-12-27 |
Family
ID=18332065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33992596A Expired - Lifetime JP2996190B2 (en) | 1996-12-19 | 1996-12-19 | Antenna device |
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JP (1) | JP2996190B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1460715A1 (en) * | 2003-03-20 | 2004-09-22 | Hitachi Metals, Ltd. | Surface mount type chip antenna and communication equipment using the same |
JP2004336795A (en) * | 2003-05-07 | 2004-11-25 | Agere Systems Inc | Dual band antenna for wireless local area network device |
EP1505689A1 (en) * | 2003-08-08 | 2005-02-09 | Hitachi Metals, Ltd. | Chip antenna device and communications apparatus using same |
WO2005081359A1 (en) * | 2004-02-20 | 2005-09-01 | Matsushita Electric Industrial Co., Ltd. | Antenna module |
JP2009147556A (en) * | 2007-12-12 | 2009-07-02 | Sony Corp | Antenna, communication device, and method for manufacturing antenna |
WO2011004857A1 (en) * | 2009-07-09 | 2011-01-13 | 東京特殊電線株式会社 | Coil antenna base plate unit for high-frequency use |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6995710B2 (en) | 2001-10-09 | 2006-02-07 | Ngk Spark Plug Co., Ltd. | Dielectric antenna for high frequency wireless communication apparatus |
-
1996
- 1996-12-19 JP JP33992596A patent/JP2996190B2/en not_active Expired - Lifetime
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1460715A1 (en) * | 2003-03-20 | 2004-09-22 | Hitachi Metals, Ltd. | Surface mount type chip antenna and communication equipment using the same |
JP2004336795A (en) * | 2003-05-07 | 2004-11-25 | Agere Systems Inc | Dual band antenna for wireless local area network device |
EP1505689A1 (en) * | 2003-08-08 | 2005-02-09 | Hitachi Metals, Ltd. | Chip antenna device and communications apparatus using same |
US7148851B2 (en) | 2003-08-08 | 2006-12-12 | Hitachi Metals, Ltd. | Antenna device and communications apparatus comprising same |
WO2005081359A1 (en) * | 2004-02-20 | 2005-09-01 | Matsushita Electric Industrial Co., Ltd. | Antenna module |
US7088291B2 (en) | 2004-02-20 | 2006-08-08 | Matsushita Electric Industrial Co., Ltd. | Antenna module |
JP2009147556A (en) * | 2007-12-12 | 2009-07-02 | Sony Corp | Antenna, communication device, and method for manufacturing antenna |
US8599092B2 (en) | 2007-12-12 | 2013-12-03 | Sony Corporation | Antenna, communication device, antenna manufacturing method |
WO2011004857A1 (en) * | 2009-07-09 | 2011-01-13 | 東京特殊電線株式会社 | Coil antenna base plate unit for high-frequency use |
Also Published As
Publication number | Publication date |
---|---|
JP2996190B2 (en) | 1999-12-27 |
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