JPH10173329A - Wave soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent generation of solder cracks, etc., and to improve the quality of solder. SOLUTION: In this wave soldering device in which fused solder 10 is pressure fed to wave guides 1 and 2 by a pressure feeding device, a printed substrate 3 is passed through the fused solder 10 which is jetted out from the jet stream guides 1 and 2, the fused solder jetted out from the wave guides 1 and 2 is jetted up to the inverted oblique upper direction of the progressing direction of the printed substrate 3, and the fused solder 10 is brought into contact with the backside of the printed substrate 3. As a result, vertical upward component force is generated with respect to the fused solder 10, the falling of the fused solder 10 is suppressed by its own weight, and the generation of solder cracks when it is used for a long period of time can be prevented. Also, as the position of the fused solder separated from the substrate 3 almost coincides with the jetting up position, a stabilized solder separating position can be maintained, the generation of bridging, etc., can be prevented, and the quality of solder can be improved. Also, as the fused solder 10 is always blown against the printed substrate 3, the void to be generated by the stagnation of fused solder 10 can be decreased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet-type soldering apparatus for soldering a printed circuit board using molten solder jetted from a jet guide.

[0002]

2. Description of the Related Art Conventionally, as this type of a jet type soldering apparatus, for example, there have been those disclosed in JP-A-63-199064 and JP-A-63-80961. In these soldering apparatuses, the molten solder is ejected by a pumping device, and the ejected molten solder is passed through a printed circuit board to perform soldering. In this case, when the molten solder is ejected in the same direction as the substrate transport direction, a bridge is generated. Therefore, the molten solder is ejected in the opposite direction to the substrate transport direction.

[0003]

However, in the prior art, since the solder jet and the substrate are brought into substantially parallel contact with each other, the solder at the soldering position is pulled by the flow because the relative speed of the solder flow with the substrate is large, and the solder becomes thin. This tends to cause problems such as solder cracks. In addition, since the solder jet is ejected from a narrow slit and comes into contact with the substrate, if the height of the jet varies due to a change in pressure of the pumping device, etc., the jet height changes, and unsolder or solder cover (surface of the substrate) Solder is turned around), and the quality of solder is degraded.

Accordingly, an object of the present invention is to provide a jet-type soldering apparatus capable of preventing solder cracks and the like and improving solder quality.

[0005]

According to a first aspect of the present invention, there is provided a jet-type soldering apparatus in which molten solder is pressure-fed to a jet guide by a pressure-feeding device, and a printed board is passed through a molten solder portion jetted from the jet guide. A jet-type soldering apparatus for performing the soldering, blows up the molten solder ejected from the jet guide in an obliquely upward direction opposite to the traveling direction of the printed circuit board,
It is characterized in that it comes into contact with the back surface of the printed circuit board.

As described above, the molten solder spouted from the jet guide is spouted upward in a direction opposite to the traveling direction of the printed circuit board, and is brought into contact with the back surface of the printed circuit board.
A component force is generated vertically above the molten solder to prevent the molten solder from falling due to its own weight, thereby increasing the amount of solder adhesion. This can prevent solder cracks during long-term use. Further, since the position at which the molten solder separates from the substrate substantially coincides with the blow-up position, a stable solder separating position can be maintained, a bridge or the like can be prevented, and the solder quality can be improved. Also,
Since the molten solder is always sprayed onto the soldered portion of the board, voids (defects inside the solder fillet) due to stagnation of the molten solder are reduced.

According to a second aspect of the present invention, there is provided a jet-type soldering apparatus according to the first aspect, wherein a jet plate for receiving molten solder jetted from the jet guide is provided, and a solder pool is provided by the jet plate. As described above, the jet plate for receiving the molten solder ejected from the jet guide is provided, and the solder pool is provided by the jet plate, so that the pulsation of the molten solder can be absorbed, and a stable jet shape and a soldering time can be secured. It is possible to prevent unsoldering or solder fogging. Also, by flowing the molten solder that has been blown up onto the jet plate, the thickness of the solder flow can be increased, and the contact time between the substrate and the molten solder can be increased. Can be prevented, and the soldering quality is improved.

According to a third aspect of the present invention, there is provided the jet-type soldering apparatus according to the first or second aspect, wherein the jet plate is angled horizontally or downward along the direction in which the solder flows. In this way, the jet plate is angled horizontally or downward along the direction of the solder flow, so that the molten solder can be stably flowed in a certain direction (the direction opposite to the substrate transport direction), and the molten solder is It is possible to prevent a solder ball from being generated when a defect such as a bridge or a blown-up molten solder caused by slipping back is returned to the solder bath.

According to a fourth aspect of the present invention, in the jet type soldering apparatus, the angle of the jet plate is variable. As described above, since the angle of the jet plate is variable, it is possible to control the thickness and the flow speed of the molten solder flowing on the jet plate. That is, by making the angle of the jet plate nearly horizontal, the flow of the molten solder can be slowed down, the soldering time can be lengthened, and the blow-up speed also becomes slow, so that unsolder failure of the printed circuit board can be prevented. In addition, by increasing the angle of inclination of the jet plate, the flow of molten solder can be increased, the soldering time can be shortened, and the blowing speed can be increased.Therefore, the solder fillet of pin lead type components can be enlarged, and solder cracks can be reduced. Can be prevented.

According to a fifth aspect of the present invention, there is provided a jet-type soldering apparatus according to the first, second, or third aspect, wherein a jet guide other than the jet guide is provided, and molten solder ejected from another jet guide travels on the printed circuit board. It was blown up diagonally in the same direction, and was brought into contact with the back surface of the printed circuit board. In this way, the molten solder spouted from another jet guide is blown up in the same obliquely upward direction of the printed circuit board so as to be brought into contact with the back side of the printed circuit board, so that the molten solder is moved in the board conveying direction. Spraying can be performed from both sides diagonally above, and unsolder can be prevented. In particular, the effect is great for a chip mounting substrate or the like. In addition, the amount of solder attached to the board soldering portion increases, the solder fillet becomes large, and solder cracks can be prevented. Further, since the molten solder is positively sprayed onto the substrate, the adhered substance such as flux is removed from the substrate, and the substrate can be cleaned without being cleaned.

According to a sixth aspect of the present invention, there is provided a jet type soldering apparatus according to the first aspect, wherein both side edges along the traveling direction of the printed circuit board are held by the board transfer conveyor claws and contact with the molten solder of the board transfer conveyor claws. The part to be covered was covered with a nail cover. As described above, the portion of the board transfer conveyor claw that comes into contact with the molten solder is covered with the claw cover, so that the conveyor claw in the board transfer section can prevent the molten solder from flowing in a direction opposite to the flow, and the reverse flow can be prevented. This can prevent soldering defects such as bridges and solder balls.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A jet type soldering apparatus according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a side view of a jet type soldering apparatus according to a first embodiment of the present invention, and FIG. 2 is a sectional front view thereof. Reference numeral 10 denotes molten solder, which is pressure-fed from the solder tank to the jet guides 1 and 2 by a pressure feeding device such as a pump. The printed circuit board 3 is passed through the molten solder portion jetted from the jet guides 1 and 2, and the components 11 mounted thereon are soldered. In this case, the board transfer direction A of the printed board 3 is inclined forward and upward.

The jet guides 1 and 2 blow up the molten solder 10 obliquely upward in a direction opposite to the transport direction A of the printed circuit board 3,
It is provided so as to be in contact with the back surface of the printed circuit board 3.
Further, a jet plate 4 for receiving the molten solder 10 jetted from the jet guides 1 and 2 is provided. The jet plate 4 is provided continuously with the jet guide 2 and has a downward angle with substantially the same gradient as the transport direction (progressing direction) A, and is set so that the molten solder 10 flows in a fixed direction. Further, a return guide 6 which is continuously bent downward is provided on the jet flow plate 4 so as to return the molten solder 10 to the solder bath.

Next, the operation of the jet type soldering apparatus will be described. As shown in FIG. 2, the printed circuit board 3 is transported in the direction A while both side edges of the printed circuit board 3 along the transport direction A are held by the board transport conveyor claws 7. Then, the molten solder 10 is ejected from the jet guides 1 and 2 in the direction obliquely upward with respect to the transport direction A as described above to come into contact with the back surface of the printed circuit board 3, and the component 11 is soldered. At this time, as shown in FIG. 1, the jet height of the molten solder 10 becomes B, and the molten solder 10 is received by the jet plate 4 to form a solder pool. Thereby, the pulsation of the molten solder 10 can be absorbed, and a stable jet shape and soldering time can be secured. In addition, the thickness of the solder flow can be increased, and the contact time between the printed board 3 and the molten solder 10 can be increased.

Thereafter, the component 1
The molten solder 10 that has not been used to fix the solder 1 flows along the jet plate 4 and the return guide 6. At this time, since the jet plate 4 has a downward angle, the molten solder 10 can flow stably in a certain direction (the direction opposite to the transport direction A).
It is possible to prevent a defect such as a bridge caused by the molten solder 10 being dragged by the printed circuit board 3 and a solder ball generated when the blown-up molten solder 10 returns to the solder bath.

As described above, according to this embodiment, the molten solder 10 spouted from the jet guides 1 and 2 is blown up obliquely upward in the direction opposite to the traveling direction of the printed circuit board 3 and brought into contact with the back surface of the printed circuit board 3. So that the molten solder 1
A component force in the vertical direction is generated with respect to 0, the fall of the molten solder 10 due to its own weight is suppressed, and the amount of solder adhesion increases.
This can prevent solder cracks during long-term use.
Further, the position at which the molten solder 10 is separated from the printed circuit board 3 substantially coincides with the blow-up position, so that a stable solder separation position is maintained, bridging and the like can be prevented, and the solder quality is improved. Also, the molten solder 10
Is sprayed, voids due to stagnation of the molten solder 10 are reduced.

The jet plate 4 may be parallel, and FIG.
May have a mechanism capable of adjusting the angle. In this case, since the angle of the jet plate 4 'is variable, it is possible to control the thickness and the flow speed of the molten solder 10 flowing on the jet plate 4'. That is, by making the angle of the jet plate 4 ′ close to horizontal, the flow of the molten solder 10 can be slowed down, the soldering time can be lengthened, and the jetting speed is also slowed, so that the unsoldering failure of the printed board 3 can be prevented. Also, by increasing the inclination angle θ of the jet plate 4 ′, the flow of the molten solder 10 can be increased, the soldering time can be shortened, and the ejection speed can be increased, so that the solder fillet of the pin lead type component can be enlarged. And solder cracks can be prevented.

A jet type soldering apparatus according to a second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a side view of a jet type soldering apparatus according to a second embodiment of the present invention. The jet guides 1 and 2, the jet plate 4, and the recirculation guide 6 are the first
Since the configuration is the same as that of the embodiment, the description thereof is omitted. Further, a jet guide 21, which is different from the jet guides 1 and 2,
22 is provided on the upstream side. The jet guides 21 and 22
The molten solder 10 is blown up obliquely upward with respect to the transport direction A of the printed circuit board 3 so as to contact the back surface of the printed circuit board 3. The jet plate 24 and the recirculation guide 26 provided continuously with the jet guide 22 correspond to the jet plate 4 and the recirculation guide 6 of the first embodiment. In this case, the jet plate 24 is angled substantially horizontally or slightly upward in the direction of the solder flow. Reflux guide 2
Reference numeral 6 is provided so as to face the reflux guide 6.

Next, the operation of the jet type soldering apparatus will be described. As in the first embodiment, the printed circuit board 3 is transported in the direction A while both side edges of the printed circuit board 3 along the transport direction A are held by the substrate transport conveyor claws 7. Then, after the molten solder 10 is ejected from the jet guides 21 and 22 in the same obliquely upward direction with respect to the board conveying direction A to contact the back surface of the printed circuit board 3, the molten solder 10 is inverted obliquely from the jet guides 1 and 2. The component 11 is soldered upward by being ejected upward to come into contact with the back surface of the printed circuit board 3. As a result, the molten solder 10 flows on the opposite side to the board conveying direction A with only the jet guides 1 and 2, so that the amount of solder adhering to the rear side of the printed circuit board 3 may decrease. The amount of solder adhesion can be replenished. Subsequent operations are the same as in the first embodiment.

As described above, according to this embodiment, the molten solder 10 ejected from the other jet guides 21 and 22 is ejected upward in the same diagonal direction as the printed board 3 travels.
Since the printed circuit board 3 is brought into contact with the back surface, the molten solder 10 can be sprayed from both sides obliquely above the board transfer direction A, and unsolder can be prevented. In particular, the effect is great for a chip mounting substrate or the like. In addition, the amount of solder attached to the board soldering portion increases, the solder fillet becomes large, and solder cracks can be prevented. Further, since the molten solder 10 is positively sprayed onto the printed circuit board 3, a substance attached to the board such as a flux is removed, and the printed circuit board 3 can be cleaned. Note that the jet plate 24 may have a mechanism capable of adjusting the angle similarly to the jet plate 4.

A jet type soldering apparatus according to a third embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a side view of a jet type soldering apparatus according to a third embodiment of the present invention, and FIG. 6 is a sectional view thereof. The jet guides 1 and 2, the jet plate 4, and the recirculation guide 6 have the same configuration as that of the first embodiment, and a description thereof will be omitted. Further, both side edges of the printed circuit board 3 along the transfer direction A are held by the board transfer conveyor claws 7, and portions of the board transfer conveyor claws 7 that come into contact with the molten solder 10 are covered with the claw covers 8. . In this case, the claw portion 7a capable of holding the side edge of the printed circuit board 3 is provided at the lower end of the board transfer conveyor claw 7. The claw cover 8 is an L-shaped member having a portion along the lower surface of the claw portion 7a, and is fixed to a blow-up portion of the molten solder 10.

The operation of this jet type soldering apparatus is the same as that of the first embodiment. However, in the first embodiment, the board conveying conveyor claw 7 for conveying the printed circuit board 3 is in the jet, and the molten solder is provided. Since the molten solder 10 always moves in the opposite direction to the flow of the molten solder 10, the molten solder 10 is pulled in the opposite direction to the flow, thereby causing the molten solder 10 to flow backward in the vicinity of the substrate holding position, resulting in poor soldering. (Bridge) may occur, but the claw cover 8 can prevent such backflow of the molten solder 10.

As described above, in this embodiment, the portion of the board transfer conveyor claw 7 that comes into contact with the molten solder 10 is covered with the claw cover 8, so that the molten solder 10 flows with the conveyor claw 7 in the board transfer section. The occurrence of reverse flow can be prevented, and poor soldering such as bridges and solder balls due to the reverse flow can be prevented. Note that the claw cover 8 that covers the board transfer conveyor claw 7 can also be applied to the second embodiment. In this case, a claw cover may be provided on the jet guides 1 and 2 and the jet guides 21 and 22 corresponding to the blow-up portion of the molten solder 10.

[0024]

According to the jet-type soldering apparatus according to the first aspect of the present invention, the molten solder spouted from the jet guide is jetted upward in a direction obliquely opposite to the traveling direction of the printed circuit board and brought into contact with the back surface of the printed circuit board. As a result, a vertical component force is generated with respect to the molten solder, the fall of the molten solder due to its own weight is suppressed, and the amount of solder adhesion increases. Thereby, solder cracks during long-term use can be prevented, and long-term reliability of the product can be improved. Further, since the position at which the molten solder separates from the substrate substantially coincides with the blow-up position, a stable solder separating position can be maintained, a bridge or the like can be prevented, and the solder quality can be improved. In addition, since the molten solder is always sprayed onto the soldered portion of the substrate, voids due to stagnation of the molten solder are reduced.

According to the second aspect of the present invention, the jet plate for receiving the molten solder ejected from the jet guide is provided, and the solder pool is provided by the jet plate, so that the pulsation of the molten solder can be absorbed, and the stable jet shape and the solder can be obtained. It is possible to secure the attachment time and prevent unsoldering or solder fogging. Also, by flowing the molten solder that has been blown up onto the jet plate, the thickness of the solder flow can be increased, and the contact time between the substrate and the molten solder can be increased. Can be prevented, and the soldering quality is improved.

According to the third aspect of the present invention, the jet plate is angled horizontally or downward along the solder flowing direction, so that the molten solder can be stably flowed in a fixed direction (the direction opposite to the substrate transport direction). It is possible to prevent a defect such as a bridge caused by the slipping of the molten solder to the substrate and a solder ball generated when the blown-up molten solder returns to the solder bath. According to the fourth aspect, since the angle of the jet plate is variable, it is possible to control the thickness and the flow speed of the molten solder flowing on the jet plate. That is, by making the angle of the jet plate nearly horizontal, the flow of the molten solder can be slowed down, the soldering time can be lengthened, and the blow-up speed also becomes slow, so that unsoldering failure of the printed circuit board can be prevented. In addition, by increasing the angle of inclination of the jet plate, the flow of molten solder can be increased, the soldering time can be shortened, and the blowing speed can be increased, so that the solder fillet of pin lead type components can be enlarged and solder cracks can be reduced. Can be prevented.

According to a fifth aspect of the present invention, the molten solder spouted from another jet flow guide is blown up in the same obliquely upward direction of the printed circuit board so as to be brought into contact with the back surface of the printed circuit board. On the other hand, it can be sprayed obliquely from both sides, and unsolder can be prevented. In particular, the effect is great for a chip mounting substrate or the like. In addition, the amount of solder attached to the board soldering portion increases, the solder fillet becomes large, and solder cracks can be prevented. Further, since the molten solder is positively sprayed onto the substrate, the adhered substance such as flux is removed from the substrate, and the substrate can be cleaned without being cleaned.

According to the sixth aspect, the portion of the board transfer conveyor claw that contacts the molten solder is covered with the claw cover, so that the conveyor claw in the board transfer section can prevent the molten solder from flowing in a direction opposite to the flow. It is possible to prevent a soldering failure such as a bridge and a solder ball due to the reverse flow.

[Brief description of the drawings]

FIG. 1 is a side view of a jet type soldering apparatus according to a first embodiment of the present invention.

FIG. 2 is a sectional front view of FIG.

FIG. 3 is an explanatory diagram of a modified example of the first embodiment of the present invention.

FIG. 4 is a side view of a jet type soldering apparatus according to a second embodiment of the present invention.

FIG. 5 is a side view of a jet type soldering apparatus according to a third embodiment of the present invention.

FIG. 6 is a sectional front view of FIG. 5;

[Explanation of symbols]

 1, 2 Jet Guide 3 Printed Circuit Board 4 Jet Plate 7 Board Conveyor Claw 8 Claw Cover 10 Melted Solder 21, 22 Jet Guide A Board Transfer Direction

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Keisuke Yuki 1048 Kadoma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd.

Claims (6)

[Claims] 1. A jet-type soldering device for feeding molten solder under pressure to a jet guide by a pressure feeding device, passing a printed board through a molten solder portion jetted from the jet guide, and performing soldering. Spouting the molten solder to blow up diagonally upward in the direction opposite to the direction of travel of the printed circuit board,
A jet-type soldering device characterized by being brought into contact with the back surface of a printed circuit board. 2. The jet-type soldering apparatus according to claim 1, further comprising a jet plate for receiving the molten solder jetted from the jet guide, and a solder pool provided by the jet plate. 3. The jet type soldering apparatus according to claim 2, wherein the jet plate is angled horizontally or downward along the direction of the solder flow. 4. The jet type soldering apparatus according to claim 3, wherein the angle of the jet plate is variable. 5. A jet guide different from the jet guide is provided, and molten solder spouted from the jet guide is blown up in the same obliquely upward direction of the printed circuit board so as to contact the back surface of the printed circuit board. The jet-type soldering device according to claim 1, 2 or 3. 6. The jet flow type according to claim 1, wherein both side edges along the traveling direction of the printed circuit board are held by a board transfer conveyor claw, and a portion of the board transfer conveyor claw that comes into contact with the molten solder is covered with a claw cover. Soldering equipment.