JPH10162727A - Manufacture and manufacturing device of flat panel display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate distortion of an exposure pattern by the reflected light from a recessed part by arranging the recessed part on a stage, arranging a second position to cover the recessed part when a transparent pattern is exposed on a base board by a movable shutter and a first position to expose the recessed part at alignment time by using an opaque alignment mark pattern, and setting the shutter in the first position. SOLUTION: A movable shutter 31A to cover a recessed part 26A formed on a stage 26, is formed in an exposing device 30. The shutter 31A is a driving device such as a motor 31 arranged in the stage 26, and can move between a second position to cover the recessed part 26A and a first position to expose it. A reflection preventive film in the same as a main surface of the stage 26 is performed on the shutter 31A. The motor 31 forms the same plane as the main surface of the stage 26 in the stage 26. The shutter 31A is set in the second position to cover the recessed part 26A, and restrains distortion of an exposure pattern by the reflection of an exposing laser beam from the recessed part 26A.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates generally to flat panel displays, and more particularly to the manufacture of so-called plasma displays. 2. Description of the Related Art A plasma display device (PDP) is used as a thin large-screen display device in various information display devices including a large television.

[0002]

2. Description of the Related Art FIG. 8 shows a configuration of a conventional so-called AC type PDP device 10. Referring to FIG. 8, the PDP device 1
Reference numeral 0 denotes a back glass substrate 11 and a front glass substrate 15. On the back glass substrate 11, a number of address electrodes 12 made of Cr or the like extend in parallel with each other in the column direction. Further, a dielectric layer 13 made of low-melting glass is deposited on the substrate 11 so as to cover the address electrodes 12, and a dielectric layer 13 made of low-melting glass is formed on the dielectric layer 13 and extends in the column direction. Many ribs present 14
However, the ribs are formed such that the pair of ribs are located on one side of the address electrode 12. Further, phosphors of three primary colors of red (R), green (G), and blue (B) are applied between the ribs 14 and the ribs 14 adjacent thereto.
B forms one pixel in a set.

On the other hand, on the front glass substrate 15 (on the lower main surface in FIG. 8), a large number of display electrodes 16 made of a transparent conductive material such as ITO (In ₂ O ₃ .SnO ₂ ) are arranged in a row. Extend parallel to each other in a row direction perpendicular to the direction. Further, a bus electrode 17 made of Cr or the like is provided on each of the display electrodes 16 along the display electrodes 16.
A dielectric film 18 made of low-melting glass is formed on the substrate 15 so as to cover the display electrode 16 and the bus electrode 17, and further on the dielectric film 18. A protection film 19 made of MgO or the like is formed.

As shown in FIG. 8, the glass substrates 11 and 15 are disposed so that the ribs 14 on the glass substrate 11 face the protective film 19 on the glass substrate 15.
A plasma gas made of a rare gas such as Ar is sealed between them. In operation, a driving voltage signal is applied to the selected address electrode 12 and the selected display electrode 17, and a predetermined phosphor emits light by the plasma formed as a result.

When manufacturing the PDP device 10, the process of patterning the address electrodes 12 on the substrate 11 and then the patterning of the ribs 14 and the process of forming the display electrodes 16 on the substrate 15 and further forming the bus electrodes Is required by photolithography, but if another pattern is patterned on such an already formed pattern, an alignment step of aligning the lower pattern with the upper pattern is required. . The ribs 14 are made of low-melting glass as described above, but are generally gray and non-translucent.

FIG. 9 shows a configuration of an exposure apparatus 20 used in the patterning step when manufacturing the PDP apparatus 10 of FIG. Referring to FIG. 9, an exposure apparatus 20 includes an acousto-optic conversion element 22 for modulating a laser beam emitted from an Ar laser 21 and a rotary polygon mirror for deflecting and scanning the laser beam modulated by the acousto-optic conversion element 22. 2
3, a lens 24 and a condenser lens 25 for focusing the laser beam deflected by the mirror 23 onto a substrate 27, which is held on a stage 26 and is composed of the substrate 11 or 15; The photoresist formed thereon is exposed by scanning with the laser beam.

FIG. 10 shows an arrangement for aligning the upper pattern with the lower pattern in the apparatus of FIG. Generally, alignment marks are used to align the upper and lower patterns in such an exposure apparatus. However, even in the exposure apparatus of FIG. 10, the alignment marks are detected by the CCD cameras 28A and 28B and the CCD cameras 28A and 28B. Processing device 29 for processing the image of the alignment mark
including.

FIGS. 11A and 11B show alignment marks 15A formed on the front substrate 15, respectively.
2 shows a configuration of an alignment mark 11A formed on the rear substrate 11. FIG. Referring to FIG. 11A, the alignment mark 15A includes an ITO pattern 16A formed at a predetermined position on the glass substrate, and the Cr electrode layer 17 covering the ITO pattern 16A. Corresponding to the Cr
FIG. 10 shows an image of the convex pattern 17A formed on the electrode layer 17.
Is taken by the CCD camera 28A or 28B. The Cr electrode layer 17 actually has a Cr / Cu / Cr structure in which a Cr film is formed above and below a Cu film, and has a high reflectance. In the configuration of FIG. 11A, the Cr electrode layer 1
7, a resist layer 17B is formed.

On the other hand, the alignment mark 11A shown in FIG. 11B shows the same C as the Cr electrode layer 17 shown in FIG.
r / Cu / Cr structure alignment mark pattern 1
2A is formed at the same time as the address electrodes 12 having the same layer structure in the peripheral region of the glass substrate 11 where the ribs 14 are not formed. At this time, the mark pattern 12A is buried in the dielectric layer 13 having a thickness of about 10 μm. As a result, the surface of the layer 13 is substantially flat even in a portion covering the mark pattern 12A. In the configuration of FIG. 10, the CCD camera 28A
Alternatively, even if 28B is used, it is difficult to detect an alignment mark from the surface shape of the dielectric layer 13. However, in FIG. 11B, a resist 14A is formed on the dielectric film 13 so as to cover the rib 14.

Therefore, in the alignment apparatus shown in FIG. 10, a concave portion 26A is formed in the stage 26 corresponding to the alignment mark pattern 12A, and a light emitting element 26B such as an LED is disposed in the concave portion. Substrate 11
10 is in the correct position on the stage 26, the alignment mark pattern 12A blocks the output light beam of the LED 26B, so the apparatus of FIG.
The state of the output light beam of the ED 26B is determined by the CCD camera 2.
By detecting at 8A or 28B, the state of the alignment is detected. In other words, the alignment using the mark pattern 12A is detected by transmitted light, and therefore, the mark pattern 12A can be referred to as a transmission alignment mark. Note that FIG.
In the middle, the LED 26 or the LED 26B
A light beam having a wavelength different from the wavelength (488 nm) of the exposure laser beam 21A is output so that the exposure of A does not occur. For example, the LED 26A or the LED 26B outputs a red light beam.

The apparatus shown in FIG. 10 is conventionally used for exposing a printed circuit board. Therefore, the opaque printed circuit board 27 has a through hole 27A formed in place of the alignment mark pattern. I have.

[0012]

The case where the alignment mark pattern 16A on the substrate 15 is exposed using the exposure apparatus shown in FIGS. 9 and 10 will be described below with reference to FIG. As shown in FIG. 12, when the exposure laser beam 21A is applied to the area where the alignment mark is formed, the exposure laser beam 21A is reflected by the concave portion 26A of the stage 26 and the resist 17B
Will be exposed. When such extra exposure occurs, the pattern 16A to be formed is distorted, and an abnormality such as a dimensional difference occurs. Further, other patterns such as address electrodes formed simultaneously with the alignment mark pattern 16A on the substrate 15 may be abnormal.

A similar problem also occurs when a recess 26C for receiving a robot hand for picking up a substrate is formed on the stage 26 as shown in FIG. Referring to FIG. 13, the concave portion 26C extends to the transparent electrode formation region of the substrate 15 held on the stage 26. As a result, when the exposure laser beam 21A is reflected by these concave portions 26C, ITO on substrate 15
The resist pattern formed on the film corresponding to the address electrode 16 may be exposed excessively, and may cause a pattern abnormality.

Conventionally, a stage having a flat surface and no unevenness such as the concave portion 26A is used for exposing the substrate 15, and the alignment apparatus shown in FIG. 10 is used only for exposing the substrate 11. Was. However, in this case, it is necessary to change the exposure device depending on the substrate to be exposed,
Even if this is done, the problem described with reference to FIG. 13 cannot be avoided.

Therefore, the present invention has solved the above-mentioned problems.
A general object is to provide a new and useful method and apparatus for manufacturing a PDP device. A more specific object of the present invention is to provide a method of manufacturing a PDP device having a high resolution and a manufacturing apparatus used in the manufacturing method.

[0016]

According to the present invention, there is provided a transparent substrate, a transparent electrode pattern formed on the transparent substrate, and a transparent electrode pattern formed on the transparent electrode pattern. In the method for manufacturing a flat panel display device including the formed opaque electrode pattern, a step of forming a transparent conductive film on the transparent substrate, the transparent substrate,
A flat main surface, a concave portion formed on the main surface, a light source disposed in the concave portion, and a first state and a second state on substantially the same plane as the main surface. Movably holding the shutter on the stage having a shutter that covers the recess in the first state and exposes the recess in the second state; and setting the shutter to the first state. Exposing the transparent conductive film to form the transparent electrode pattern and the alignment mark pattern on the transparent substrate; and covering the transparent electrode pattern and the alignment mark pattern on the transparent substrate. Forming an opaque conductive film, and using a pattern formed in the opaque conductive film corresponding to the alignment mark pattern as an alignment mark; Forming the opaque electrode pattern by a method of manufacturing a flat panel display device, or as described in claim 2, a transparent substrate, and an opaque electrode pattern formed on the transparent substrate, In a method of manufacturing a flat panel display device including another pattern formed on the opaque electrode pattern, a step of forming an opaque conductive film on the transparent substrate,
The transparent substrate, a flat main surface, a concave portion formed on the main surface, a light source disposed in the concave portion, a first state on a substantially same plane as the main surface, 2 is free to move between the states, and covers the recess in the first state,
Holding on a stage having a shutter that exposes the concave portion in the state described above, patterning the opaque conductive film to form the opaque electrode pattern and the alignment mark pattern, Forming a film so as to cover the region where the opaque electrode pattern is formed, setting the shutter to the second state, patterning the film using the alignment mark pattern as an alignment mark, The method of manufacturing a flat panel display device according to claim 3, wherein the film is made of an insulator, and the another pattern forms a rib structure. 3. The method according to claim 2, wherein
A first transparent substrate, a transparent electrode pattern formed on the first transparent substrate, and a transparent electrode pattern formed on the electrode transparent pattern by the method for manufacturing a flat panel display device according to the present invention. A first opaque electrode pattern formed, a second transparent substrate, a second opaque electrode pattern formed on the second transparent substrate, and a rib formed on the second opaque electrode pattern And a method of manufacturing a flat panel display device including a pattern.
Forming a transparent conductive film on a transparent substrate,
A transparent main substrate, a flat main surface, a concave portion formed on the main surface, a light source disposed in the concave portion, and a first state and a second position substantially on the same plane as the main surface. Moving between the two states, covering the recess in the first state, and holding the shutter on a stage having a shutter exposing the recess in the second state; and Setting the state to 1 and exposing the transparent conductive film to form the transparent electrode pattern and the first alignment mark pattern on the first transparent substrate; Forming a first opaque conductive film so as to cover the transparent electrode pattern and the first alignment mark pattern; and forming a first opaque conductive film corresponding to the first alignment mark pattern in the first opaque conductive film. The pattern formed on Forming a first opaque electrode pattern on the transparent electrode pattern using as a line mark, forming a second opaque conductive film on the second transparent substrate, Holding the substrate on the stage, patterning the second opaque conductive film to form the second opaque electrode pattern and the second alignment mark pattern, and Forming an insulating film so as to cover a region where the second opaque electrode pattern is formed, and setting the shutter to the second state, and aligning the second alignment mark pattern. A method for manufacturing a flat panel display device, wherein the rib pattern is formed by patterning the insulating film using the mark as a mark. Or claim 5
As described in the above, a stage having a flat main surface, an alignment light source disposed in a recess on the main surface, an exposure light source for exposing a substrate held on the main surface, and the exposure light source In an exposure apparatus comprising an exposure optical system for exposing the substrate by the formed light beam, the stage further includes a first position exposing the concave portion on substantially the same plane as the main surface. 7. An exposure apparatus having a shutter movable between a second position covering the concave portion and the shutter, wherein the shutter is substantially aligned with the main surface of the stage. The exposure apparatus according to claim 5, wherein the stage main surface and the shutter have an antireflection film formed thereon. The exposure device according to claim 5 or 6, or as described in claim 8, a concave portion for receiving a part of the transfer device for transferring the substrate is provided on the main surface. The exposure apparatus according to any one of claims 5 to 7, wherein the concave portion is formed so as not to reach an exposure area in the substrate along a substrate contour. . [Operation] In the present invention, the reflected light from the stage, which is generated when repeatedly exposing a plurality of patterns on the transparent substrate held on the stage of the exposure apparatus, particularly the transmission type alignment light source required for such exposure is provided. The problem of the distortion of the exposure pattern due to the light reflected from the concave portion formed on the stage is described below. The first position and the concave portion on the stage that cover the concave portion on substantially the same plane as the stage main surface are exposed. A shutter movable to and from a second position, the shutter is set to the first position when exposing a transparent pattern on the substrate, and only when alignment using an opaque alignment mark pattern is performed. The problem is solved by setting the shutter to the second position. In particular, by covering the shutter and the main surface of the stage with an antireflection film having substantially the same reflectance, the problem of distortion of the exposure pattern can be effectively avoided. When the shutter is not provided, the transmissive alignment light source is exposed in the concave portion, so that an antireflection film cannot be formed.

The present invention is particularly useful for manufacturing a flat panel display device such as a plasma display device that repeatedly exposes a plurality of patterns on a glass substrate.

[0018]

FIG. 1 shows the configuration of an exposure apparatus 30 according to a first embodiment of the present invention. However, in FIG. 1, the parts described above are denoted by the same reference numerals, and description thereof will be omitted. Referring to FIG. 1, in an exposure apparatus 30, a movable shutter 3 that covers a concave portion 26A formed on the stage 26 is provided.
1A is formed. The shutter 31A has a first position covering the concave portion 26A and a second position exposing the concave portion 26 by a driving device such as a motor 31 provided in the stage 26.
The shutter 31A is provided with the same anti-reflection film as the main surface of the stage 26. Also,
The motor 31 forms a substantially same surface as the main surface of the stage 26 in the stage 26.

FIG. 2 is a plan view showing the motor 31 and the shutter 32 of FIG. 1 in more detail. Referring to FIG. 2, the motor 31 is connected to the shutter 32 by a screw rod 31A, and the shutter 32 is moved in the direction of the arrow according to the rotation of the motor 31.

FIGS. 3A to 3D show a configuration in which the front glass substrate 15 is exposed using the exposure apparatus shown in FIG. Referring to FIG. 3A, the substrate 15 is placed on the stage 26 so as to engage with positioning pins 26D formed on the stage 26. In this state, the ITO film on the substrate 15 is Is patterned by wet etching using an acrylic resist to form the transparent display electrode 16 and the ITO pattern 16A.
The transparent display electrode 16 and the ITO pattern 16A
Typically, it has a thickness of 0.2 μm.

In the step of FIG. 3A, since the transparent film is patterned, the shutter 32 is set at the first position covering the concave portion 26A as shown by an arrow in FIG. As a result, there is no dimensional difference in the exposure pattern due to the reflection of the exposure laser beam from the recess 26A. In the wet etching of the ITO film, the development of the resist is performed with Na ₂ CO ₃ , and the etching is performed with aqua regia.

Next, in the step of FIG.
On the ITO pattern obtained in the step (A), the conductive film 17 having the Cr / Cu / Cr structure described above is uniformly deposited, typically to a thickness of 2.2 μm. As a result of the deposition of the conductive film 17, as described above with reference to FIG. 3A, a protrusion 17A is formed on the conductive film 17 corresponding to the ITO pattern 16A as a reflective alignment mark 15A.

Further, in the step of FIG. 3C, a resist film is applied on the structure of FIG. 3B, and the substrate 15 is formed using the reflective alignment marks 15A formed in the step of FIG. 3B. The alignment is performed, and then the conductive film 17 is patterned by photolithography to form the bus electrode 17. In the step of FIG. 3C, since the layer 17 to be patterned is a metal conductive film, the reflected light from the stage 26 does not pose a problem,
May be opened or closed as shown in FIG. 3 (A). In the step of FIG.
The patterning of the acrylic resist is performed using the Na ₂ C
It is performed by photolithography developed with O ₃ .

Further, in the step of FIG.
An insulating film 18 made of low-melting glass and a protective film 19 made of MgO are sequentially deposited on the structure obtained in the step. FIG. 4 shows the front glass substrate 15 obtained in the step of FIG. However, illustration of the transparent display electrode 16 is omitted. As can be seen from FIG.
A is formed at the four corners of the glass substrate 15. However, the position where the ITO pattern 16 is formed is not limited to the four corners shown in FIG. 10, but may be any position on the stage 26 corresponding to a position where a movable shutter mechanism can be formed.

FIGS. 5A to 5E show a method of forming a pattern on the rear glass substrate 11. FIG. Referring to FIG. 5A, the glass substrate 11 on which the conductive layer having the Cr / Cu / Cr structure described above is formed is mounted on the stage 26.
(Not shown), and by patterning the conductive layer, an address electrode pattern 12 and an alignment mark pattern 12A are formed. Since the conductive layer 12 is an opaque film such as a metal having a high reflectance, FIG.
In the step (A), the shutter 32 in the stage 26 is used.
Can be open or closed. The address electrode 12 and the alignment mark pattern 12A
Is formed to a thickness of about 1.5 μm.

Next, in the step of FIG. 5B, a dielectric layer 13 made of low melting glass is formed on the structure of FIG.
Is formed to a thickness of about 10 μm, and a rib layer 14 made of low-melting glass is formed on the dielectric layer 13 to a thickness of about 200 μm in the step of FIG. In the step of FIG. 5C, an acrylic dry resist film 14A is formed on the rib layer 14, and the dry resist film 14A is exposed and developed by photolithography. For the development, for example, a Na ₂ CO ₃ -based developer is used.

Further, in the step of FIG. 5D, the rib layer 14 is sand-blasted using the dry resist film pattern as a mask to form a rib pattern 14, and then in the step of FIG. The phosphors R, G, B are screen-printed between the rib patterns 14. FIG. 6 shows the glass substrate 11 thus formed.

Referring to FIG. 6, alignment mark patterns 12A are formed at four corners on the glass substrate 11, and the rib pattern 14 is formed in an inner region of the glass substrate 11. The address electrode is formed below the rib pattern 14. FIG.
Shows the configuration of the stage 40 according to the second embodiment of the present invention.

Referring to FIG. 7, the stage 40 is provided with a concave portion 26C formed to receive a transfer device such as a robot hand in the conventional stage 26 shown in FIG. It is formed so as to correspond only to the peripheral portion of 11 or 15, and does not reach the pattern formation region in the glass substrate 11 or 15. For this reason, in the exposure step using the stage having the configuration shown in FIG. 7, the problem of distortion of the exposure pattern due to the concave portion 26C can be avoided.

The configuration shown in FIG. 7 is, of course, the exposure apparatus 3 shown in FIG.
Can be used for 0. Further, a shutter similar to the shutter 32 may be provided so as to cover the concave portion 26C.
Further, the present invention is not limited to the above embodiments, and various changes _and modifications can be made within the gist of the present invention described in the claims.

[0031]

According to the features of the present invention as set forth in claims 1 to 8, a first position on the stage of the exposure apparatus that exposes the concave portion on substantially the same plane as the main surface of the stage. Providing a shutter movable between a second position covering the concave portion, and setting the shutter to the second position when exposing a transparent pattern on the substrate; and performing alignment using an opaque alignment mark pattern. Only when the shutter is set to the first position, reflected light from the stage when repeatedly exposing a plurality of patterns on the transparent substrate held on the stage of the exposure apparatus, particularly necessary for such exposure The problem that the exposure pattern is distorted by the reflected light from the concave portion formed on the stage for accommodating the transmission type alignment light source to be solved is solved. In particular, by covering the shutter and the main surface of the stage with an antireflection film having substantially the same reflectance, the problem of distortion of the exposure pattern can be effectively avoided. The present invention is particularly useful for manufacturing a flat panel display device such as a plasma display device that repeatedly exposes a plurality of patterns on a glass substrate.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an exposure apparatus according to a first embodiment of the present invention.

FIG. 2 shows a part of the device of FIG. 1;

3 (A) to 3 (D) are views showing a part of a process of manufacturing a front substrate of a plasma display device performed using the device of FIG. 1;

FIG. 4 is a diagram showing a front substrate manufactured in the steps of FIGS. 3 (A) to 3 (D).

5 (A) to 5 (E) are views showing a part of a manufacturing process of a rear substrate of a plasma display device performed using the device of FIG. 1;

FIG. 6 is a diagram showing a back substrate manufactured in the steps of FIGS.

FIG. 7 is a diagram showing a configuration of a stage according to a second embodiment of the present invention.

FIG. 8 is a diagram showing a configuration of a conventional plasma display device.

FIG. 9 is a view showing a configuration of an exposure apparatus used for manufacturing the plasma display device of FIG.

FIG. 10 is a diagram showing a configuration of an alignment apparatus used in the exposure apparatus of FIG.

FIGS. 11A and 11B are diagrams showing examples of alignment marks used in the plasma display device of FIG. 8;

FIG. 12 is a diagram illustrating a problem that occurs in exposure using an alignment mark.

FIG. 13 is a diagram showing a configuration of a stage of a conventional exposure apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 plasma display device 11 rear substrate 11A alignment mark 11P substrate pattern forming area 12 address electrode (opaque) 12A alignment mark pattern 13, 18 dielectric layer 14 rib pattern 14A resist 15 front substrate 15A alignment mark 16 display electrode 16A alignment mark pattern 17 Bus electrode 17A Alignment mark pattern 17B Resist 19 Protective film 20 Exposure device 21 Exposure light source 21A Exposure beam 22 Acoustic light modulator 23 Polygonal mirror 24 Lens 25 Condenser lens 26, 40 Stage 26A Recess 26B LED 26b Alignment beam 26C Robot hand receiving recess 26D Positioning pin 27 Substrate 28A, 28B CCD camera 29 Image processing device 30 Alignment device 31 Motor 31A Screw rod 32 Shutter

Claims (8)

[Claims] 1. A method of manufacturing a flat panel display device comprising: a transparent substrate; a transparent electrode pattern formed on the transparent substrate; and an opaque electrode pattern formed on the transparent electrode pattern. Forming a transparent conductive film on the transparent substrate, a flat main surface, a concave portion formed on the main surface, a light source disposed in the concave portion, substantially the main surface The first state is movable on the same plane between a first state and a second state, and covers the recess in the first state.
Holding on a stage having a shutter that exposes the concave portion in the state described above; and setting the shutter in the first state, exposing the transparent conductive film, and exposing the transparent electrode pattern and the alignment mark pattern. A step of forming an opaque conductive film on the transparent substrate so as to cover the transparent electrode pattern and the alignment mark pattern on the transparent substrate; and Forming the opaque electrode pattern on the transparent electrode pattern using a pattern formed in the opaque conductive film as an alignment mark. 2. A method of manufacturing a flat panel display device comprising: a transparent substrate; an opaque electrode pattern formed on the transparent substrate; and another pattern formed on the opaque electrode pattern. Forming a non-transparent conductive film on the transparent substrate, a flat main surface, a concave portion formed on the main surface, a light source disposed in the concave portion, substantially the main surface The first state is movable on the same plane between a first state and a second state, and covers the recess in the first state.
Holding on a stage provided with a shutter that exposes the concave portion in the state described above; patterning the opaque conductive film to form the opaque electrode pattern and the alignment mark pattern; Forming a film so as to cover an area where the opaque electrode pattern is formed; and setting the shutter to the second state, patterning the film using the alignment mark pattern as an alignment mark. Forming the different pattern by using the method described above. 3. The method according to claim 2, wherein the film is formed of an insulator, and the another pattern forms a rib structure. 4. A first transparent substrate, a transparent electrode pattern formed on the first transparent substrate, a first opaque electrode pattern formed on the electrode transparent pattern, and a second
And a second transparent substrate formed on the second transparent substrate.
A method of manufacturing a flat panel display device including: an opaque electrode pattern; and a rib pattern formed on the second opaque electrode pattern, wherein a step of forming a transparent conductive film on the first transparent substrate; A first transparent substrate having a flat main surface, a concave portion formed on the main surface, a light source disposed in the concave portion, and a first state substantially flush with the main surface; Moving between the first and second states, covering the recess in the first state, and holding the shutter on a stage having a shutter exposing the recess in the second state; and Setting the first state, exposing the transparent conductive film, and forming the transparent electrode pattern and the first alignment mark pattern on the first transparent substrate; On the substrate, the transparent electrode pattern Forming a first opaque conductive film so as to cover the first alignment mark pattern; and forming a pattern formed in the first opaque conductive film corresponding to the first alignment mark pattern. A step of forming the first opaque electrode pattern on the transparent electrode pattern to be used as an alignment mark; a step of forming a second opaque conductive film on the second transparent substrate; Holding on the stage, patterning the second opaque conductive film,
Forming an opaque electrode pattern and a second alignment mark pattern, and forming an insulating film on the second transparent substrate so as to cover a region where the second opaque electrode pattern is formed. And a step of setting the shutter to the second state, using the second alignment mark pattern as an alignment mark, and patterning the insulating film to form the rib pattern. Manufacturing method. 5. A stage having a flat main surface, an alignment light source disposed in a concave portion on the main surface, an exposure light source for exposing a substrate held on the main surface, and the exposure light source. An exposure optical system configured to expose the substrate with the light beam, wherein the stage further includes a first position exposing the concave portion on substantially the same plane as the main surface and the concave portion. An exposure apparatus provided with a shutter movable between a second position and a second position covering the first position. 6. The stage according to claim 5, wherein the shutter has substantially the same reflectance as the main surface of the stage.
Exposure apparatus according to the above. 7. The exposure apparatus according to claim 5, wherein the stage main surface and the shutter are formed with an anti-reflection film. 8. The main surface has a concave portion for receiving a part of a transfer device for conveying the substrate, and the concave portion does not reach an exposure area in the substrate along a contour of the substrate on the main surface. 6. The semiconductor device according to claim 5, wherein:
The exposure apparatus according to any one of Items 1 to 7,