JPH10160978A - Optical signal transmission and reception module and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical signal transmission and reception module which is simplified in stages and is reduced in man-hours and in its cost by elimination of the need for adjusting the positioning at the time of chip mounting and a process for producing the same. SOLUTION: An Si substrate 12 has a V-groove 14 having the depth successively increasing toward the end face exclusive of a flat part on the surface. The LD chip 11 has a solder bump 13 on one side of the flat part of the Si substrate 12. The solder bump on one side is eliminated. The solder bump exists on the V-groove 14 and comes into contact with the surface of the Si substrate 12. An optical fiber 15 is arranged in the V-groove 14 in such a manner that the chip is positioned in correspondence to the one side of the LD chip 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an optical transmitter having an electric signal / optical signal conversion function and an optical receiver having an optical signal / electric signal conversion function, which are used in an optical data transmission apparatus. The present invention relates to a structure of an integrated optical transceiver module and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, techniques in such a field include:
For example, the document title: 1995 IEICE Electronics Society Conference SC-1-12, 331
On page 332. FIG. 5 is an overall perspective view showing such a conventional LD chip mounted state, and FIG.
7 is a sectional view taken along line AA of FIG. 7, and FIG.
FIG. 8 is a plan view of an i-substrate, and FIG.
FIG. 9 is a plan view showing a mounting surface of a chip, and FIG. 9 is a diagram showing recognition marks on a mounting surface of an LD chip of a conventional optical transmission module.

In these figures, 1 is an LD chip, 2
Is a silicon substrate (hereinafter, Si substrate), 3 is a V-groove, 4 is a solder, 5a is a Si substrate side recognition mark, 5b is an LD chip side recognition mark, 6a is a Si substrate side electrode pattern, and 6b is an LD chip side electrode pattern. Is shown. The mounting of the LD chip 1 on the Si substrate 2 is performed by a visual method as shown in FIG.
As shown in FIG. 8, with respect to the Si substrate side recognition mark 5a shown in the Si substrate plan view, as shown in FIG. As a result, the LD chip 1 is mounted on the Si substrate 2, and the Si substrate side electrode pattern 6 a provided on the Si substrate 2 and the LD chip side electrode pattern 6 b provided on the LD chip mounting surface are soldered 4. The connection was made.

[0004]

However, the above-described conventional chip mounting structure of the optical transceiver module has the following problems. (1) Since the positioning adjustment at the time of mounting the chip is required, the process becomes complicated, and the manufacturing thereof requires many man-hours and costs.

(2) Accurate positioning is difficult because the recognition mark for positioning is difficult to recognize. (3) Positioning cannot be performed with high accuracy in the height axis direction. The present invention eliminates the above problems and simplifies the process by eliminating the need for positioning at the time of chip mounting, thereby reducing the number of steps and reducing the cost, and a method of manufacturing the same. The purpose is to provide.

[0006]

In order to achieve the above object, the present invention provides: (1) an optical transceiver module having a V-groove whose depth gradually increases toward an end surface while leaving a flat portion on the surface. On the Si substrate and only one side of the flat portion of the Si substrate,
The side having no solder bumps is positioned on the V-groove, and is positioned corresponding to the optical semiconductor element contacting the surface of the Si substrate, and the side of the optical semiconductor element having no solder bumps. Thus, the optical fiber disposed in the V-groove is provided.

(2) In the optical transceiver module according to the above (1), the V-groove is formed so that the width gradually increases toward the end face. (3) In the method for manufacturing an optical transceiver module, V gradually increases in depth toward the end face while leaving a flat portion on the surface.
A step of preparing a Si substrate having a groove, a step of arranging a solder bump of an optical semiconductor element only on one side of a flat portion of the Si substrate, and contacting a side without the solder bump on the Si substrate; Arranging an optical fiber in the V-groove so as to be positioned corresponding to the end face of the semiconductor element on the side where the solder bump is not provided.

(4) In the optical transmitting and receiving module, a Si substrate having a recess toward one end surface except for a flat portion on the surface and a V-groove toward the other end surface;
An optical semiconductor element having a solder bump in a defect of the substrate, eliminating the solder bump on the other end face side, and contacting the side without the solder bump with a flat portion of the Si substrate; An optical fiber arranged in the V-groove is provided so as to be positioned on the end face on the side without the bump.

(5) In a method of manufacturing an optical transceiver module, a step of preparing a Si substrate having a recess toward one end surface and a V-groove toward the other end surface, leaving a flat portion on the surface; Placing a solder bump in a defect of the Si substrate, eliminating the solder bump on the other end surface side, and contacting the side without the solder bump with an optical semiconductor element to a flat portion of the Si substrate; Arranging the optical fiber in the V-groove so as to be positioned on the side of the light-emitting type optical semiconductor element where there is no solder bump.

[0010] With the above configuration, (A) the process is simplified by eliminating the adjustment of the positioning when mounting the chip, the man-hour can be reduced, and the cost can be reduced. (B) Chip mounting and connection in the XZ plane direction is achieved by flip chip mounting of the Si substrate and the chip, and high precision mounting and connection are possible by the self-alignment effect.
This makes it possible to stably mount an optical semiconductor element such as an optical transceiver module.

(C) Mounting and connecting the chip in the Y-axis direction makes the light emitting surface side where there is no solder bump on the Si substrate a contact state, so that the height becomes constant and high precision mounting and connection are possible. . Thus, a stable optical semiconductor element such as an optical transceiver module can be mounted.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows the first embodiment of the present invention.
FIG. 2 is a plan view of an optical transmission module showing an embodiment, and FIG. 2 is a sectional view taken along line AA of FIG. In these figures, 11 is LD
A chip, 12 is a Si substrate, 13 is a solder bump, 14 is a V groove, and 15 is an optical fiber. LD chip 11 is S
It is flip-chip mounted on the i-substrate 12.

The Si substrate 12 of the first embodiment has a V which gradually increases in depth toward the end surface, leaving a flat portion on the surface.
It has a groove 14. The LD chip 11 has a solder bump 13 on one side of the flat portion of the Si substrate 12,
The side having no solder bump on one side is located on the V groove 14 and contacts the surface of the Si substrate 12. Then, the optical fiber 15 is positioned corresponding to one side of the LD chip 11 and the optical fiber 15 is arranged in the V groove 14.

As described above, by contacting the light emitting surface without the solder bumps 13 on the Si substrate 12,
It is flip-chip mounted diagonally. When the optical semiconductor element is mounted with a tilt, the optical axis also tilts. If optical matching with the optical fiber 15 is performed in this state, the optical coupling efficiency decreases. Therefore, in order to make the optical fiber 15 have the same inclination as the inclination of the LD chip 11, the V-groove 14 on the Si substrate 12 is formed.
Are formed obliquely. It goes without saying that the use of the optical fiber 15 whose end face is obliquely angled can reduce the return light reflected at the end face of the optical fiber 15.

Here, what is important is that when mounting the LD chip 11, the solder bumps 13 are arranged only on one side,
By providing the light emitting surface side on the Si substrate 12 without providing a solder bump on the other side,
The point is that the positioning of the D chip 11 (the inclination of the LD chip) is performed accurately. That is, as in the conventional case, L
Die bonding with solder on the back of D chip (Fig. 6
), Or when both sides of the LD chip are connected by solder bumps, it is difficult to position the LD chip, and the efficiency of optical coupling to the optical fiber is degraded.

In this regard, in the present invention, when mounting the LD chip 11, the solder bumps 13 are arranged on only one side, and the light emitting surface is brought into contact with the Si substrate 12 without providing solder bumps on the other side. As a result, the LD chip 1
Positioning 1 (tilt of the LD chip) can be accurately performed only by considering the height of the solder bump 13 on one side.

By adopting such a structure, the LD chip 11 is self-aligned with good positional accuracy on the XZ plane by the solder bumps 13 on one side, and the light emitting surface side is the Si substrate 1.
By making contact with 2, the light emitting portion of the LD chip 11 has a constant height in the height (Y-axis) direction. Also, by giving the optical fiber 15 a similar inclination, a decrease in the optical coupling efficiency can be prevented.

Next, a second embodiment of the present invention will be described. FIG. 3 is a plan view of an optical transmission module according to a second embodiment of the present invention, and FIG. 4 is a sectional view taken along line AA of FIG. In these figures, 21 is an LD chip, 22 is a Si substrate, 23
Denotes a solder bump, 24 denotes a V groove, and 25 denotes an optical fiber. The LD chip 21 is flip-chip mounted on the Si substrate 22.

As described above, the LD chip 21 has the solder bumps 23 arranged only on one side and the missing (low) portion 22 B of the Si substrate 22. The LD chip 21 is horizontally flip-chip mounted by contacting the light emitting surface side without the solder bumps 23 with the protruding (high) portion 22A on the Si substrate 22. The optical fiber 25 is mounted horizontally by the V-groove 24. Reference numeral 22C denotes an inclined portion that transitions from the missing (low) portion 22B of the Si substrate 22 to the convex (high) portion 22A.

Also in this embodiment, only the height of the solder bump 23 on one side of the LD chip 21 is considered,
The position (horizontality) of the LD chip 21 can be determined, and the efficiency of optical coupling to an optical fiber can be increased.
By adopting such a structure, the LD chip 21 is self-aligned with good positional accuracy on the XZ plane by the solder bumps 23 on one side, and the light emitting surface side is brought into contact with the Si substrate 22 so that the LD chip 21 The height (Y-axis) direction of the light emitting portion is constant.

In the above embodiment, the mounting of the LD chip as the transmitting element has been described. However, the same can be applied to the mounting of the PD element as the receiving element. In this sense, the present invention relates to the mounting of an optical semiconductor element (chip), and relates to an optical transceiver module. Further, the present invention is not limited to the above-described embodiments, and various modifications are possible based on the gist of the present invention, and these are not excluded from the scope of the present invention.

[0022]

As described above, according to the present invention, the following effects can be obtained. (A) The non-adjustment of the positioning at the time of mounting the chip simplifies the process, reduces man-hours, and reduces costs.

(B) Mounting and connecting the chip in the XZ plane direction, the Si substrate and the chip are flip-chip mounted, so that high-precision mounting and connection are possible by the self-alignment effect. This makes it possible to stably mount an optical semiconductor element such as an optical transceiver module. (C) In mounting and connecting the chip in the Y-axis direction, the light emitting surface side where there is no solder bump on the Si substrate is in a contact state, so that the height is constant, and high precision mounting and connection are possible. Thus, a stable optical semiconductor element such as an optical transceiver module can be mounted.

[Brief description of the drawings]

FIG. 1 is a plan view of an optical transmission module according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a plan view of an optical transmission module according to a second embodiment of the present invention.

FIG. 4 is a sectional view taken along line AA of FIG. 3;

FIG. 5 is an overall perspective view showing a conventional LD chip mounted state.

FIG. 6 is a sectional view taken along line AA of FIG. 5;

FIG. 7 is a plan view of a Si substrate of a conventional optical transmission module.

FIG. 8 is a plan view showing a mounting surface of an LD chip of a conventional optical transmission module.

FIG. 9 is a diagram showing a recognition mark on a mounting surface of an LD chip of a conventional optical transmission module.

[Explanation of symbols]

 11, 21 LD chip 12, 22 Si substrate 13, 23 Solder bump 14, 24 V groove 15, 25 Optical fiber 22A Convex (high) portion on Si substrate 22B Missing (low) portion of Si substrate 22C On Si substrate Inclined part

Claims (5)

[Claims] 1. An optical transceiver module comprising: (a) a Si substrate having a V-groove whose depth gradually increases toward an end surface while leaving a flat portion on the surface; and (b) one side of the flat portion of the Si substrate. An optical semiconductor device having solder bumps only on the V-groove and contacting the surface of the Si substrate with no solder bumps; and (c) corresponding to the optical semiconductor device without solder bumps. An optical fiber disposed in the V-groove so as to be positioned as described above. 2. The optical transceiver module according to claim 1, wherein said V-groove is formed so that a width thereof is gradually increased toward an end face. 3. A method for manufacturing an optical transceiver module, comprising: (a) preparing a Si substrate having a V-groove whose depth gradually increases toward an end surface while leaving a flat portion on the surface; and (b) forming the Si substrate. Placing a solder bump of the optical semiconductor element on only one side of the flat portion of the substrate, and contacting the side without the solder bump on the Si substrate; and (c) placing the solder bump on the end face of the optical semiconductor element without the solder bump. Arranging an optical fiber in the V-groove so as to be positioned correspondingly. 4. An optical transceiver module, comprising: (a) a Si substrate having a recess toward one end surface, leaving a flat portion on the surface, and a V-groove toward the other end surface;
(C) an optical semiconductor element having a solder bump in a defect of the Si substrate, eliminating the solder bump on the other end face side, and contacting the side without the solder bump with a flat portion of the Si substrate; An optical transceiver module comprising: an optical fiber disposed in the V-groove so as to be positioned on an end surface of the optical semiconductor element on a side where no solder bump is provided. 5. A method for manufacturing an optical transceiver module, comprising: (a) preparing a Si substrate having a recess toward one end surface and a V-groove toward the other end surface, leaving a flat portion on the surface; (B) arranging a solder bump in a defect of the Si substrate, eliminating the solder bump on the other end surface side, and contacting the optical semiconductor element with a flat portion of the Si substrate on the side without the solder bump. The process of
(C) arranging an optical fiber in the V-groove so as to be positioned on the side of the edge-emitting optical semiconductor element where no solder bump is provided.