JPH10160790A - Apparatus and method for test of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a contact mistake and to relieve a good IC by a method wherein a pusher which is used to come into contact with every measuring place is provided and a housed defective IC is sucked by using an identical hand. SOLUTION: In an IC feed part 4, a tray in which unmeasured ICs are housed is taken out so as to be pushed out, and a suction hand 3 sucks four ICs collectively so as to be conveyed to a measuring part 6. The measuring part 6 in which test boards A, B provided with four IC sockets 9 are installed measures the ICs alternately on either side. That is to say, the hand 3 which is mounted on, and attached to, the socket 9 on the side of the test board A is returned to the feed part 4, and it sucks the unmeasured ICs so as to be mounted on, and attached to, the socket 9 on the side of the test board B. Then, the ICs whose measured results are good are mounted and, and attached to, an IC socket 12, the ICs which are defective are mounted on, and attached to, a defective-product housing part 5, and this operation is repeated. At this time, a contact pusher 13 presses four ICs each on the test boards A, B individually so as to reduce a contact mistake. In addition, the suction hand 3 feeds the once housed defective ICs again to the measuring part 6 so as to be retested, and the relief rate of good ICs amount to several %.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor test apparatus and a test method for sending an IC whose electrical characteristics have been measured to the next aging step.

[0002]

2. Description of the Related Art Conventionally, a handler used for measuring the electrical characteristics of an IC has automatically housed the IC whose measurement has been completed in a magazine case or tray. The magazine case and the tray are selectively used depending on the shape of the IC package.

Incidentally, the step of measuring the electrical characteristics of the IC is not the last step, and it is necessary to perform aging called burn-in as the next step. When performing the burn-in, the IC is used in an electric circuit called a BT printed board. It is necessary to attach to the board formed. In the conventional handler, the IC whose electrical characteristics have been finally measured is stored in a magazine case or a tray.
When C is inserted, a dedicated device must be used, and there is a disadvantage that the insertion requires a great deal of man-hour.

[0004] As a prior art, for example,
Reference numeral 26 (FIG. 3) denotes a handler used to measure the electrical characteristics of the IC, a transport mechanism for transporting the IC whose electrical characteristics have been measured to the loading unit, and a BT at the loading position of the IC.
A feeding mechanism for feeding the printed board, and an IC from the loading unit
And a transfer mechanism for mounting the same on a BT printed board.

According to this conventional example, the IC for which the measurement of the electric characteristics has been completed in the past is directly transferred to the B for burn-in in the next process.
Mounted on a T printed board. ICs are supplied from a magazine case in the IC supply unit 1, and the ICs are conveyed to the measuring unit 4 via the rail 2, the movable rail 3, and the rail 5a, and are measured there. When the measurement is completed, the IC passes through the rail 5b to the loading section 12, where it is held by the insertion head 6, and the IC on the BT printed board 8 is passed through the guide rail 7.
Inserted into C socket. The inserted BT printed board 8 is stored in the BT printed board storage unit 10 by the transport head 9.

After measuring the electric characteristics, the IC is connected to the rail 5.
b to the stopper 12a, the insertion head 6
If the time required for the vertical movement and the horizontal movement of the IC and the time for adding the IC are set so as to correspond to the time of 2 to 3 seconds required for measuring the electrical characteristics of one IC, B apparently
The time for inserting the IC into the T printed board can be reduced to zero.

However, in this conventional example, an IC in which terminal pins (hereinafter referred to as leads) are led out from four sides of a package.
In this case, the rail cannot be slid because the rail is used to move to the measurement unit for measuring the electrical characteristics to the transfer mechanism. If an IC whose leads are led out from four sides is slid on a rail, the lead of the package hits the inner wall of the rail and the lead is bent, leading to a deterioration in quality.

[0008] In the measurement results of the electrical characteristics, only good products
Although it is configured to be mounted on a T-printed board, treatment of defective products is not clarified by measuring electrical characteristics. If the defective product is measured again in the measurement of the electrical characteristics, the defective product must be resupplied to the unloading section, so that the work efficiency is low.

Further, the package sliding on the rail 5a arrives at the measuring section, and the electrical characteristics are measured for the first time. However, depending on the state in which the package is mounted on the IC socket of the measuring section, the normal electrical properties can be measured. It may not be able to do enough. Normally, when the package is tilted or shifted with respect to the IC socket, an IC that should be determined as a non-defective product may be determined as a defective product. In addition, the production capacity is low because the number of measurements is one.

As a method of transporting an IC in which leads are led out from four sides of a package, for example, Japanese Unexamined Utility Model Publication No.
There are two. In this conventional example, one IC is mounted on an IC socket, measured, and then discharged.
A mechanism that can be performed in a short cycle until it is mounted on the C socket and improves the measurement speed is described. For this reason, two sets of linear driving devices are provided as suction heads for discharging and mounting ICs to and from the IC socket, and the IC suction heads are separately operated by these two sets of linear driving devices.
An unmeasured IC is alternately supplied to the IC socket by one IC suction head, and the measured IC is alternately discharged from the IC socket to the IC discharging device. However, the method of adsorbing the IC to the adsorption head by the adsorption force of the air, moving the IC, and transporting the IC is a generally used method, and therefore has no novelty. Further, when two sets of linear driving devices are provided, the linear driving device can be used only for movement on a straight line, that is, only on the X axis, but there is no versatility in the directions of the X axis and the Y axis.
There is no versatility for attaching and detaching to and from sockets and BT printed boards.

[0011]

As described above, in the prior art, mounting / detachment of an IC into / from a socket and transfer of the IC have been automated. No consideration was given to
For this reason, there are drawbacks such as an increase in the number of work steps, a decrease in the product quality of the electrical characteristics, and no improvement in productivity.

[0012]

The semiconductor test apparatus of the present invention has a function of measuring and measuring electric characteristics and a function of inserting / extracting an IC with respect to a BT printed board and a function of transporting the IC. And a hand having a function of taking out the IC once stored in the storage unit for automation of re-measurement.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings. FIG. 1A is a top view showing an embodiment of the semiconductor test apparatus of the present invention. A tray supply unit 4 for supplying a tray containing ICs, a storage unit 5 for storing defective electrical characteristics in the tray, a measurement unit 6 for measuring electrical characteristics, and an IC for which electrical characteristics have been measured And a hand of a transport mechanism that can move horizontally in the XY axis, and transport the IC to the storage unit, transport the IC to the BT printed board, and take out the IC from the supply unit.
It has a contact pusher 13 for contacting the IC with the socket, and a feeding mechanism 2 for feeding the IC to the BT printed board IC mounting position.

The IC supply unit 4 stacks up and down a plurality of trays containing unmeasured ICs, cuts out the trays one by one, and pushes out the trays in a horizontal direction. It is transported to the unit 6. When the removal of one IC from the tray is completed, the empty trays are stacked up and down and sent downward, and the next tray containing the unmeasured IC is sent out. The trays containing the unmeasured ICs stacked in a plurality of stages are sequentially supplied.

The measuring section 6 is provided with two sets of test boards A and B having four IC sockets 9 adjacent to each other. The measurement of the electrical characteristics is performed alternately on one of the two sets of test boards A and B. First, the IC sucked and transported by the hand 3 from the supply unit 4 is transferred to the IC socket 9 on the A-side test board.
Attach to Next, the hand 3 returns to the supply unit 4 and again sucks four unmeasured ICs at the same time and mounts them on the IC socket 9 on the B-side test board. During this time, the electrical characteristics of only the A-side test board are measured.

I to the IC socket 9 on the test board B side
After completing the C mounting, the hand 3 moves to the test board A side, and based on the measurement result of the electrical characteristics, the non-defective IC is placed in the IC socket 12 on the BT printed board 11, and the defective IC is stored in the defective product storage unit 5. To each tray. After the mounting is completed, an unmeasured IC is supplied and mounted on the test board A from the supply unit 4 again. When the supply / attachment to the test board A is completed, the hand 3 moves to the test board B,
The above operation is repeated.

Further, when an unmeasured IC is mounted on the IC sockets of the test boards A and B and measurement is performed, a contact pusher 13 for improving the contact between the contact terminals of the IC socket 9 and the leads of the IC is provided. Is provided.
The contact pusher 13 is a mechanism that individually suppresses each of the four ICs of the test boards A and B, and operates individually in the vertical direction with respect to each IC socket. At the beginning of the test program for measuring electrical characteristics, an item for only electrical contact is provided to determine the quality of the contact, and if the contact is negative, the corresponding test boards A, B Upper IC
Only the contact pusher 13 of the socket 9 is automatically lifted and lowered again to contact the contact terminal of the IC socket 9. The mechanism for operating the contact pushers 13 individually is to maintain the contact state between the IC socket 9 which has become a non-defective product only by the above-described contact test and the IC being measured, and the contact terminal of the IC socket 9 of the defective IC. Is to change the state of contact with the contact pusher 13 by the vertical movement of the contact pusher 13.

Here, the number of IC sockets of the measuring section and the number of vacuum suction nozzles of the hand are set and described. However, if the number of IC sockets and the number of hand suctions are set to the same number, eight can be achieved.

IC determined to be defective by measurement of electrical characteristics
Are stored in the tray 5 in the same storage form as the supply unit. Only electrically good products are mounted on the IC socket 12 of the BT printed board 11.

When the IC sucked by the hand 3 is mounted on the socket 9 of the test boards A and B, the contact pusher 13 moves backward by a distance D1 shown in FIG. Prevent interference. FIG. 1A shows a state in which the contact pusher 13 has moved backward.

A mechanism for feeding the BT printed board 11 and a BT
The description of the method of mounting to the IC socket 12 on the printed board 11 is the same as in the prior art, and will not be repeated.

When the supply of a certain amount of unmeasured ICs is completed, the setting of the program for controlling the operation of the suction hand 3 is switched so that the measured and electrically defective products once stored in the tray of the defective product storage unit 5 are switched. The IC is supplied to the measuring unit 6 again. Since the supply unit 4 and the storage unit 5 are installed adjacent to each other and the storage mode is the same, the suction hand 3 can be easily taken out and supplied to the IC socket 9 of the measurement unit, and a normal test can be performed again.

The ratio of remedying defective products as good products in re-measurement is several percent.

According to this embodiment, the IC for which the measurement of the electric characteristics has been completed in the prior art is not only directly mounted on the BT printed board 11 for the burn-in of the next process, but also is measured by the measuring unit I.
The occurrence of poor contact of the C socket 9 is suppressed, and the automatic re-measurement is automated. In addition, four IC sockets 9 for the test boards A and B are installed, and the IC is mounted on the IC socket on the BT printed board based on the measurement result, the unmeasured IC is supplied from the supply unit, and the defective product storage unit is provided. The electrical characteristics can be measured by switching the test boards A and B efficiently by making the time required to store the data equivalent to the measurement time.

FIG. 2 is a top view showing a semiconductor test apparatus according to a second embodiment of the present invention. Before the burn-in process, B
Before mounting the IC on the T printed board 11, the electrical characteristics are measured, and only electrically good products are mounted on the BT printed board. When the burn-in process is completed, the IC must be necessarily removed from the BT printed board 11. If the number of storage sections for storing ICs is increased by one, and the ICs are extracted from the IC sockets 12 on the BT printed board 11 by the hand 3, the ICs after the burn-in process can be easily handled by the present semiconductor test apparatus. . The reason why many storage units are provided is to perform removal while classifying the storage units based on the results of the electrical test in the burn-in process. Other structures and operation mechanisms are common to those in FIG.

In the above-described embodiment, the IC storage mode is described using a tray. However, even if a magazine case is installed in the supply section and the defective product storage section, since the vacuum suction hand is mounted, the measurement section is used. , And BT printed board.

[0027]

As described above, according to the present invention, it is possible to reduce a contact error by providing a pusher for making a contact with each of the measurement points, and furthermore, it is possible to set a defective product storage position of the electric characteristic in the supply unit. By installing the IC card next to or near and storing it in the same form as the magazine or tray to be set in the supply unit, the IC once stored can be sucked by the same hand. For this reason, there is an effect that it is possible to relieve non-defective ICs and reduce the number of work steps.

[Brief description of the drawings]

FIG. 1A is a top view of a semiconductor test apparatus according to a first embodiment of the present invention. (B) is a side view showing a measuring part and a contact pusher of the semiconductor test device of the present invention.

FIG. 2 is a top view of a semiconductor test apparatus according to a second embodiment of the present invention.

FIG. 3 is a side view showing a prior art handler.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Test device main body 2 XY-axis drive device 3 Vacuum suction hand 4 Supply unit 5 Defective product storage unit 6 Measurement unit A Test board A B Test board B 9, 12 IC socket 10 BT printed board feeding unit 11 BT printed board 13 Contact pusher 14a, 14b, 14c BT completion IC storage section

Claims (9)

[Claims] 1. An IC storage unit, a measurement unit for simultaneously testing a predetermined number of ICs in an installation unit and an electrical characteristic test, and simultaneously installing a predetermined number of ICs stored in the IC storage unit in the measurement unit. A hand unit to be transported and mounted on the unit, a contact pusher that suppresses a predetermined number of ICs installed in the installation unit of the measurement unit from above at the time of testing the electrical characteristics, and that the suppression operation is controlled for each IC, A semiconductor test apparatus comprising: a BT printed board on which an IC determined to be non-defective by the measuring section is transported and mounted by the hand section. 2. The semiconductor test according to claim 1, wherein the contact pusher performs the operation of suppressing the IC having poor contact again as a result of the determination of the quality of the contact of the IC by the measuring unit. apparatus. 3. A defective product storage part provided adjacent to the IC storage part and transporting and storing the IC determined to be defective by the measuring part by the hand part. The semiconductor test apparatus according to the above. 4. The semiconductor test apparatus according to claim 3, wherein the hand unit simultaneously transports and mounts a predetermined number of ICs stored in the defective product storage unit to the installation unit of the measurement unit at a predetermined timing. 5. An IC storage section, a measurement section for simultaneously testing a predetermined number of ICs in an installation section, and a measurement section for simultaneously testing a predetermined number of ICs stored in the IC storage section. A hand unit to be transported and mounted on the unit, a BT printed board to be transported and mounted by the hand unit for an IC determined to be good by the measuring unit, and an IC determined to be defective by the measuring unit by the hand unit. A defective product storage unit for transporting and storing the defective product storage unit, wherein the hand unit simultaneously transports and mounts a predetermined number of ICs stored in the defective product storage unit to the installation unit of the measurement unit again at a predetermined timing. Semiconductor test equipment. 6. A step of simultaneously mounting a predetermined number of ICs from the IC storage section to the installation section of the measurement section, a step of holding down the predetermined number of ICs mounted on the installation section of the measurement section from above, and the measurement section Determining the electrical contactability of the IC mounted on the installation portion, re-pressing only the IC determined to be defective by the electrical contactability from above, and installing the measurement portion. A test method comprising: a step of measuring electrical characteristics of an IC mounted on a unit; and a step of transporting and mounting an IC determined to be non-defective by the measurement of the electrical characteristics to a BT printed board. 7. An IC determined to be defective by the measuring unit.
7. The test method according to claim 6, further comprising the step of transporting and storing the defective product in a defective product storage unit. 8. A predetermined number of ICs stored in the defective product storage unit at a predetermined timing are simultaneously transferred to and mounted on the installation unit of the measurement unit, and the measurement unit again determines the electrical contact property and the electrical characteristics. The test method according to claim 7, further comprising a step of making a judgment. 9. A step of simultaneously mounting a predetermined number of ICs from an IC storage section to an installation section of a measurement section, a step of measuring electrical characteristics of the ICs installed in the installation section of the measurement section, and Transporting and mounting the IC determined to be non-defective on the BT printed board by the measurement of the characteristics, and transporting and storing the IC determined to be defective by the measurement unit to the defective product storage unit; A test method comprising a step of simultaneously transporting and mounting a predetermined number of ICs stored in a non-defective product storage section to an installation section of the measurement section, and re-determining the electrical characteristics by the measurement section.