JPH10156838A - Die surface cleaning device - Google Patents

Die surface cleaning device

Info

Publication number
JPH10156838A
JPH10156838A JP8334558A JP33455896A JPH10156838A JP H10156838 A JPH10156838 A JP H10156838A JP 8334558 A JP8334558 A JP 8334558A JP 33455896 A JP33455896 A JP 33455896A JP H10156838 A JPH10156838 A JP H10156838A
Authority
JP
Japan
Prior art keywords
die
resin
scraping plate
plate
scraper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8334558A
Other languages
Japanese (ja)
Other versions
JP3312855B2 (en
Inventor
Sumimasa Asada
純正 浅田
Tomo Kotani
供 小谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Priority to JP33455896A priority Critical patent/JP3312855B2/en
Publication of JPH10156838A publication Critical patent/JPH10156838A/en
Application granted granted Critical
Publication of JP3312855B2 publication Critical patent/JP3312855B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a die surface cleaning device which can scrape off the lower surface of a die in the narrow space of the discharge part of a reactor by a scraper for every batch without manual operation at a constant angle and under a constant pressure as if done by a skilled operator to clean the surface promptly and remove resin adherent to the scraper at an appropriate chance. SOLUTION: An apparatus is equipped with a knife-shaped scraper 20 which contacts the lower surface of a die 27 having holes fixed to the discharge part on the lower side of a reactor holding a viscous molten resin by the end part of one side and has a prescribed contact angle, a pressurizing means 22 which is installed near the scraper 20 and pressurizes the scraper 20 upward to the lower surface of the die 27, a moving means 30 which holds the scraper 20 and moves the side end part of the scraper 20 along the holes 26 of the lower surface of the die 27, a position moving means 30 having a guide means which scrapes off the resin hanging from the holes 26 of the die 27 or the residual resin by the side end part of the scraper 20 to clean the lower surface of the die 27 and guides the moving means 30 movably between a work position and a waiting position, and an adherent resin removing means.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ダイ表面清掃装置
に関し、特にポリエステルやポリアミドなど空気中にお
ける加熱により劣化する合成樹脂のバッチ式重合製造法
において、反応釜の下側に設けられた排出部のダイ表面
を清掃するダイ表面清掃装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cleaning a die surface, and more particularly, to a discharge section provided below a reactor in a batch polymerization production method of synthetic resin such as polyester or polyamide which is deteriorated by heating in air. And a die surface cleaning device for cleaning the die surface.

【0002】[0002]

【従来の技術】従来、ポリエステルたとえば、ポリブチ
レンテレフタレート(PBT)等の製造において、反応
が終了した粘調な樹脂は反応釜の排出部から多孔性ダイ
ヘッドの孔を通過してストランドとして加圧垂下させ、
規定寸法に裁断する成形法がある。このような成形法で
バッチ式の場合、反応釜から溶融樹脂を排出完了する
際、ダイヘッドに至る排出部流路に付帯されている閉止
機構を閉止する。このとき流路内に残留した樹脂は垂直
構造の特徴から閉止機構からの漏洩が免れない。したが
って、次回の新樹脂の下降垂下時までにこれら漏洩樹脂
はダイヘッドまわりに糸状を含め涙滴状、薄膜状等幾多
の形状を呈し付着する。場合によっては、漏洩樹脂の量
を抑制するため、あるいは漏洩樹脂の空気被爆による劣
化を抑止するため等の理由により、ダイヘッドの孔はシ
ャッタ弁により閉鎖することもある。このときにもダイ
ヘッドとシャッタ弁との間の僅かな隙間に樹脂が糸状ま
たは不定形状に残留しダイの下表面に付着する。いずれ
にせよ排出部流路内およびダイ表面に付着した残留樹脂
は、次回の新樹脂の加圧垂下時までには加熱され、酸化
劣化する。
2. Description of the Related Art Conventionally, in the production of polyester, for example, polybutylene terephthalate (PBT), a viscous resin after the reaction is passed through a hole of a porous die head from a discharge portion of a reaction vessel, and is drooped under pressure as a strand. Let
There is a molding method for cutting to a specified size. In the case of a batch method using such a molding method, when the discharge of the molten resin from the reaction vessel is completed, the closing mechanism attached to the discharge section flow path to the die head is closed. At this time, the resin remaining in the flow passage is inevitably leaked from the closing mechanism due to the feature of the vertical structure. Therefore, by the time the new resin descends and drops next time, these leaked resins adhere to the die head in a number of shapes such as teardrops, thin films, etc., including threads. In some cases, the hole in the die head may be closed by a shutter valve for reasons such as controlling the amount of leaked resin or suppressing deterioration of the leaked resin due to exposure to air. Also at this time, the resin remains in a small gap between the die head and the shutter valve in a thread-like or irregular shape and adheres to the lower surface of the die. In any case, the residual resin adhered to the inside of the discharge channel and to the die surface is heated and oxidized and deteriorated by the time of the next dripping of the new resin.

【0003】このためダイの下表面に付着した残留樹脂
や劣化した樹脂は、次のバッチ開始時には除去しない
と、良品の樹脂内に混入し、糸状を含む涙滴状物質に起
因して形状不良や残留による過反応残留物を発生し、新
たに垂下する良品樹脂のストランドに混在し物性や外観
の低下を引き起こす。これを防ぐために人手によりダイ
下表面の掻き取りをして清掃する作業を行っている。
[0003] For this reason, the residual resin or the deteriorated resin adhering to the lower surface of the die must be removed at the start of the next batch. And overreacted residue due to the residue, which is mixed with the strand of the newly formed non-defective resin and causes deterioration in physical properties and appearance. In order to prevent this, the lower surface of the die is manually scraped and cleaned.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、人手に
よるダイ下表面の清掃作業は毎バッチごとに、新たな樹
脂の加圧垂下時に実施しなければならず、また、清掃作
業は反応釜の下側でバルブ、加熱器(ヒータ)、配管や
次工程の設備等が配置され、狭い空間の中でかつ上向き
の無理な姿勢で実施しなければならず、安全性に問題が
あり、かつ作業性が悪く長時間を要し生産性を低下させ
るという問題点がある。また、ダイの下表面は長方形で
あり、加圧垂下する樹脂の掻き取りは、人手により金属
性のヘラでダイの長手方向にダイ下表面に対してほぼ一
定の角度で、かつ掻き取り速度350〜940mm/s
ecで実施するが、ダイの下表面は孔も凹凸もあり作業
者により角度も変化し掻き取り状態が異なり、常に清浄
に清掃するには熟練を要するという問題点がある。
However, the cleaning work on the lower surface of the die by hand must be performed for each batch at the time of dripping new resin, and the cleaning work must be performed on the lower side of the reactor. The valve, heater (heater), piping, equipment for the next process, etc. are arranged, and must be carried out in a tight space and in an upward unreasonable posture, which poses safety problems and poor workability. There is a problem that it takes a long time to worsen and lowers productivity. The lower surface of the die is rectangular, and scraping of the resin that hangs under pressure is manually performed with a metallic spatula at a substantially constant angle with respect to the lower surface of the die in the longitudinal direction of the die at a scraping speed of 350. ~ 940mm / s
However, there is a problem in that the lower surface of the die has holes and irregularities, the angle varies depending on the operator, the scraping state is different, and skill is always required to clean the die.

【0005】本発明の目的は、狭いスペースにあるダイ
の下表面を清浄にするのに、人手をかけずに、かつ熟練
作業者と同様に掻き取り板によりダイの下表面に対して
一定の角度で、かつ一定の加圧力で毎バッチごとに垂下
樹脂および付着樹脂を掻き取り、迅速に清浄に清掃する
とともに掻き取り板に付着した付着樹脂をタイミングを
計って簡単に迅速に掻き取り板から除去することを目的
にする。
It is an object of the present invention to clean the lower surface of a die in a narrow space without manual intervention, and by means of a scraping plate, as with a skilled worker, a constant lower surface of the die. Scrap the dripping resin and adhered resin every batch at an angle and with a constant pressing force, clean quickly and cleanly, and easily and quickly remove the adhered resin adhered to the scraping plate from the scraping plate The purpose is to remove.

【0006】[0006]

【課題を解決するための手段】本発明者らは、狭い設置
スペースと補修のためのスペースを考慮し、かつ待機位
置まで移動可能な多軸マニピュレータを支持台に登載す
るとともに、ダイの下表面を掻き取る掻き取り板の材
質、最適接触角、加圧力、表面処理法を見出し、さら
に、掻き取り板に付着した付着樹脂を除去する最適タイ
ミングとその除去手段を見いだし、上記問題点を解決し
うることが解り、本発明を完成するに至った。
SUMMARY OF THE INVENTION The present inventors consider a narrow installation space and a space for repair, mount a multi-axis manipulator movable to a standby position on a support table, and provide a lower surface of a die. To solve the above problems by finding the material, optimal contact angle, pressing force, and surface treatment method of the scraping plate, and finding the optimal timing for removing the resin adhered to the scraping plate and its removing means. It was understood that it was possible to complete the present invention.

【0007】すなわち本発明は、粘性溶融樹脂を保有す
る反応釜の下側の排出部に設けられ複数の孔を有するダ
イの下表面に一辺の辺端部を接し所定の接触角を有する
ヘラ状の掻き取り板と、該掻き取り板の近傍に設けられ
掻き取り板を前記ダイの下表面に加圧する加圧手段と、
前記掻き取り板を保持するとともに掻き取り板の辺端部
を前記ダイの下表面の複数の孔に沿って移動させる移動
手段とを備え、前記掻き取り板の辺端部により、前記ダ
イの孔より垂下する粘性溶融樹脂または残留樹脂を掻き
取り、ダイの下表面を清掃するダイ表面清掃装置を提供
するものである。
That is, according to the present invention, a spatula having a predetermined contact angle is formed by contacting one end of a side with a lower surface of a die provided with a plurality of holes and provided at a lower discharge portion of a reaction vessel holding a viscous molten resin. A scraping plate, and pressing means provided near the scraping plate to press the scraping plate against the lower surface of the die,
Moving means for holding the scraping plate and moving a side edge of the scraping plate along a plurality of holes on a lower surface of the die, wherein a hole of the die is formed by a side edge of the scraping plate. An object of the present invention is to provide a die surface cleaning device for scraping a dripping viscous molten resin or a residual resin and cleaning a lower surface of the die.

【0008】また、本発明は、移動手段および加圧手段
を支持する支持台と、支持台に連結し支持台を作業位置
と待機位置との間を移動可能に案内する案内手段とを有
する位置移動手段とを備えるダイ表面清掃装置を提供す
るものである。
Further, the present invention provides a position having a support for supporting the moving means and the pressurizing means, and a guide connected to the support and guiding the support to be movable between a working position and a standby position. The present invention provides a die surface cleaning device including a moving unit.

【0009】また、本発明は、2個の板状体を断面ハ字
状で、対向する2辺が一定間隔の間隙を形成し、対向す
る2つの板面のなす交差角が所定の角度をなすよう支持
する支持部材と、掻き取り板を前記対向する2つの板面
間を通り前記間隙間を通過するよう移動させる通過手段
とを有する付着樹脂除去手段を備え、掻き取り板に付着
した付着樹脂を除くダイ表面清掃装置を提供するもので
ある。
Further, according to the present invention, two plate-like members are formed in a C-shaped cross section, two opposing sides form a gap with a constant interval, and the intersection angle formed by the two opposing plate surfaces forms a predetermined angle. An adhesive resin removing means having a support member for supporting the scraping plate and a passing means for moving the scraping plate so as to pass through the gap between the two opposing plate surfaces; An object of the present invention is to provide a die surface cleaning device for removing resin.

【0010】また、本発明は、移動手段は通過手段の機
能を兼ねることを特徴とするダイ表面清掃装置を提供す
るものである。
[0010] The present invention also provides a die surface cleaning device, wherein the moving means also functions as a passing means.

【0011】また、本発明は、付着樹脂が付着した掻き
取り板は付着樹脂が剥離可能になるまで固化した後に付
着樹脂除去手段の間隙を通過させるダイ表面清掃装置を
提供するものである。
Further, the present invention provides a die surface cleaning apparatus in which a scraping plate to which the adhered resin adheres is solidified until the adhered resin can be peeled off, and then passes through a gap of the adhered resin removing means.

【0012】[0012]

【発明の実施の形態】掻き取り板20は図4〜6に示す
ように、偏平なヘラ状の平板でその一辺の辺端部がダイ
の下表面27aに圧接でき、ダイの孔より垂下する粘性
溶融樹脂51およびダイの下表面に付着した付着樹脂5
0を除去できるものであればよい。また、掻き取り板の
形状は辺端部の近傍で掻き取り板の中央側から辺端部に
向かって断面楔状にするのが好ましい。掻き取り板の材
質は、ダイの下表面を傷つけないもの、例えば、ダイの
材質より硬度の低い銅系金属が望ましく、例えば、黄
銅、燐青銅でダイ下表面に密接するよう弾性を有するも
のが好ましい。掻き取り板の板厚Dは0.5〜2.0m
mが望ましく、特に1.2mmがダイ下表面への接面性
もよく好ましい。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIGS. 4 to 6, a scraping plate 20 is a flat spatula-shaped flat plate, one end of which can be pressed against a lower surface 27a of a die and hangs down from a hole of the die. Viscous molten resin 51 and adhered resin 5 adhered to the lower surface of die
Anything that can remove 0 can be used. Further, the shape of the scraping plate is preferably a wedge-shaped cross section from the center side of the scraping plate toward the side end near the side end. The material of the scraping plate is one that does not damage the lower surface of the die, for example, a copper-based metal having a lower hardness than the material of the die is desirable, for example, brass, phosphor bronze that has elasticity so as to be in close contact with the lower surface of the die. preferable. The thickness D of the scraper is 0.5 to 2.0m
m is desirable, and especially 1.2 mm is preferable because of good contact with the lower surface of the die.

【0013】掻き取り板の接触角Bはダイ下表面と掻き
取り板の板面とのなす角度(鋭角)(図5参照)であ
り、接触角は0度〜60度が望ましく、好ましくは30
度〜45度である。60度〜90度では掻き取り板が操
作時にふらついたり、ダイ面の凸凹にひっかかりが生じ
るなどのため掻き取り効果が十分でない。
The contact angle B of the scraping plate is an angle (a sharp angle) between the lower surface of the die and the plate surface of the scraping plate (see FIG. 5), and the contact angle is desirably 0 to 60 degrees, preferably 30.
Degrees to 45 degrees. When the angle is 60 to 90 degrees, the scraping effect is not sufficient because the scraping plate fluctuates during operation, and irregularities on the die surface are caught.

【0014】掻き取り板は掻き取りの際に粘性溶融樹脂
または残留樹脂を容易に除去できればよく、また、表面
処理することも望ましい。表面処理は付着樹脂との親和
性の小さくなる処理が好ましく、例えば黄銅表面への物
理蒸着によるチタンカーバイト(TIC)処理などがあ
る。そして、バフNo400でバフ仕上げすることが望
ましい。また、付着樹脂の適正な剥離飛散を行わせるた
めに、掻き取り板の板厚を調整し前記の最適板厚1.2
mmを見出した。
The scraping plate only needs to be able to easily remove the viscous molten resin or the residual resin at the time of scraping, and it is also desirable to perform a surface treatment. The surface treatment is preferably a treatment that reduces the affinity with the adhered resin, such as a titanium carbide (TIC) treatment by physical vapor deposition on the brass surface. Then, it is desirable to finish buffing with buff No. 400. Further, in order to perform the proper peeling and scattering of the adhered resin, the thickness of the scraping plate is adjusted, and the optimum
mm.

【0015】移動手段は、狭い設置スペースで人手によ
るダイの下表面の掻き取り作業と同様にかつ再現性よく
操作するために、図1に示すような、エアー駆動するX
YZ3軸マニピュレータ18を用いた。そして掻き取り
板20をZ軸のエアシリンダのシャフトの先端部16に
回動自在に取り付け、他のXY2軸のエアシリンダとの
連動操作により人手と同一の動作を行わせるようにし
た。掻き取り速度はX軸のエアシリンダへのエアの供給
により、X軸上の移動速度と等値となる。移動速度は樹
脂の粘度にもよるが300〜1200mm/secの範
囲が望ましく、好ましくは1000mm/secであ
る。駆動は電動、油圧その他でも良いのは勿論である。
The moving means is a pneumatically driven X as shown in FIG. 1 in order to operate similarly to the scraping operation of the lower surface of the die manually with good reproducibility in a small installation space.
The YZ three-axis manipulator 18 was used. Then, the scraping plate 20 is rotatably attached to the tip end portion 16 of the shaft of the Z-axis air cylinder, and the same operation as a manual operation is performed by interlocking operation with another XY two-axis air cylinder. The scraping speed becomes equal to the moving speed on the X-axis by supplying air to the X-axis air cylinder. The moving speed depends on the viscosity of the resin, but is preferably in the range of 300 to 1200 mm / sec, and more preferably 1000 mm / sec. Of course, the drive may be electric, hydraulic, or the like.

【0016】加圧手段は、図1、6に示すように、Z軸
のエアシリンダのシャフトの先端部で掻き取り板20の
近傍にカム機構22を設けることにより構成されてい
る。そしてZ軸エアシリンダの上下運動はカム機構で回
転運動に変換され、カムに接続された掻き取り板が常時
上方に適正に加圧させるようになされている。加圧力は
掻き取り板の材質にもよるが4〜7Kg/cm2でする
のが望ましい。上方への加圧はカム機構に限らずエアー
や油圧でもよいし、弾性部材(例えば、スプリング、ゴ
ム)や電気的手段(例えば、電磁コイルによる反発)で
もよいのは勿論である。
The pressurizing means is constituted by providing a cam mechanism 22 near the scraping plate 20 at the tip of the shaft of the Z-axis air cylinder as shown in FIGS. The vertical movement of the Z-axis air cylinder is converted into a rotational movement by a cam mechanism, so that the scraping plate connected to the cam always appropriately presses upward. The pressing force depends on the material of the scraping plate, but is desirably 4 to 7 kg / cm 2 . The upward pressure is not limited to the cam mechanism but may be air or hydraulic pressure, or may be an elastic member (for example, a spring or rubber) or an electric means (for example, repulsion by an electromagnetic coil).

【0017】位置移動手段30は、図2,3に示すよう
に、掻き取り板により掻き取り作業をする作業位置Lの
狭い設置スペースと補修のためのスペースおよび待機位
置Mを考慮し、固定された支持軸31に支持され支持軸
の回りを回動可能な回動フレーム32と、回動フレーム
の先端部に連結し位置を大きく移動可能な移動フレーム
35とを組み合わせることにより構成している。固定支
柱37は移動フレーム35の反支持軸側の先端部35A
の底面を着脱自在に支持しており、床面から移動フレー
ム底までの高さを有する。移動フレームは掻き取り板2
0が掻き取り作業を行う作業位置Lにおいて固定支柱3
7の柱頭に乗る格好で静止させ、セットボルトで支持台
である固定支柱に固定される。
As shown in FIGS. 2 and 3, the position moving means 30 is fixed in consideration of a narrow installation space, a space for repair, and a standby position M of a work position L for performing a scraping operation by a scraping plate. The rotating frame 32 is supported by the supporting shaft 31 and is rotatable around the supporting shaft. The moving frame 35 is connected to the distal end of the rotating frame and can move the position greatly. The fixed support 37 is a distal end 35A on the side opposite to the support shaft of the moving frame 35.
Is detachably supported, and has a height from the floor surface to the bottom of the moving frame. The moving frame is a scraping plate 2
0 is the fixed support 3 at the work position L where the scraping work is performed.
7. Stand still on the capital of No. 7 and fixed to the fixed support which is the support base with set bolts.

【0018】位置移動手段30はこの移動フレーム上に
移動手段である3軸マニピュレータ18を登載し、掻き
取り板が掻き取り作業をする作業位置Lと補修の容易な
待機位置M間を容易にかつ迅速に回動移動可能にしてい
る。回動フレームを支持する支持軸及び回動フレームの
先端部にモータ等を設けて回動フレーム及び移動フレー
ムの回動・移動を容易にしてもよい。支柱は支持台を構
成し、支持軸,移動フレーム、回動フレーム,モータは
案内手段を構成する。位置移動手段は前述の回動運動の
他に、移動フレームに車輪または車軸を付与させ、回転
ハンドルやモータを設けてレール上を移動フレームが回
動・往復することで、3軸マニピュレータを作業位置か
ら待機位置までの間を回動・往復運動させてもよい。
The position moving means 30 has a three-axis manipulator 18 as a moving means mounted on the moving frame, and easily and easily moves between a working position L where the scraping plate performs a scraping operation and a standby position M where repair is easy. It is possible to turn quickly. A motor or the like may be provided on the support shaft that supports the rotating frame and the tip of the rotating frame to facilitate rotation and movement of the rotating frame and the moving frame. The column forms a support base, and the support shaft, the moving frame, the rotating frame, and the motor form guide means. In addition to the above-described rotational movement, the position moving means provides a wheel or axle to the moving frame, and provides a rotating handle or a motor to rotate and reciprocate the moving frame on the rail to move the three-axis manipulator to the working position. May be rotated and reciprocated between the position and the standby position.

【0019】付着樹脂除去手段40は、例えば、図1、
7、8に示すように、掻き取り板20がダイ27の長手
方向(X’軸)に移動する直前の掻き取り板を水平にし
た状態の軸(Y'軸)上の点Y’DNに設けられてい
る。付着樹脂除去手段40は上下2個の板状体41,4
2を断面ハ字状にかつ板状体の対向する2辺41a、4
2aの間隔が5mm以下の一定間隙Sを形成し、対向す
る板面のなす交差角Cが160度をなすように支持する
支持部材43を有している。また、板状体は対向する2
辺の近傍で、それぞれ辺側に向かって断面楔状に形成さ
れている。なお、付着樹脂除去手段は上記と同様にして
X'’軸上またはY'’軸上、場合によってはX''’軸上
に設けてもよい。
The attached resin removing means 40 is, for example, as shown in FIG.
As shown in FIGS. 7 and 8, immediately before the scraping plate 20 moves in the longitudinal direction (X 'axis) of the die 27, a point Y'DN on the horizontal axis (Y' axis) of the scraping plate is set. Is provided. The adhering resin removing means 40 includes upper and lower two plate-like bodies 41 and 4.
2 in the form of a C-shaped cross section and two opposite sides 41a, 4
There is a support member 43 that forms a constant gap S with an interval 2a of 5 mm or less and that supports an intersection angle C between the opposing plate surfaces of 160 degrees. In addition, the plate-like body is
In the vicinity of the side, each is formed in a wedge-shaped cross section toward the side. Incidentally, the adhered resin removing means may be provided on the X "axis or the Y" axis, and in some cases, on the X "'axis in the same manner as described above.

【0020】板状体の対向する2辺の間隙Sは、板状体
の板厚が1.2mmの場合、3.0mm〜5mmが好ま
しい。5mmを超えると付着樹脂への衝撃が少なく、付
着樹脂の除去が難しく、3.0mm未満では通過する掻
き取り板との干渉が発生する恐れがある。また、交差角
Cは140〜180度が望ましく、好ましくは160〜
170度である。140度未満では付着樹脂の除去が難
しくなる。また、断面楔状にしたのは付着樹脂に適度の
衝撃を加え飛散させるためである。
The gap S between two opposing sides of the plate is preferably 3.0 mm to 5 mm when the plate has a thickness of 1.2 mm. If it exceeds 5 mm, the impact to the adhered resin is small, and it is difficult to remove the adhered resin. If it is less than 3.0 mm, interference with the scraping plate that passes therethrough may occur. Also, the intersection angle C is desirably 140 to 180 degrees, preferably 160 to 180 degrees.
170 degrees. If it is less than 140 degrees, it becomes difficult to remove the adhered resin. Further, the reason why the cross section is formed in a wedge shape is to apply an appropriate impact to the adhered resin to scatter it.

【0021】掻き取り板はダイ下表面の垂下粘性樹脂ま
たは残留樹脂を掻き取り、付着した付着樹脂が時間の経
過とともに冷却して結晶化して固化し、あるいは非結晶
性樹脂も同様に剥離可能になるまで固化した後に、通過
手段により付着樹脂除去手段の間隙を通過移動させる。
掻き取り後の経過時間が短く付着樹脂の結晶化が進んで
いないと、掻き取り板から付着樹脂の除去が十分にでき
ない。掻き取り後、付着樹脂が適度に固化するまでのタ
イミングTは樹脂の種類にもよるが、例えば樹脂がポリ
ブチレンテレフタレート(PBT)のときは常温冷却で
3分以上が望ましく、好ましくは5〜45分である。タ
イミングTを3分以上としたのは、3分未満では樹脂の
結晶化および固化が十分に進まず、掻き取り板からの剥
離が難しくなるからである。なお、タイミングTは長い
ほど固化が進行し、剥離しやすくなる一方であるので、
実質的に上限はないが、作業効率の点から、通常180
分である。さらに、移動手段18が通過手段の機能を兼
ねるようにさせてもよい。
The scraping plate scrapes the dripping viscous resin or residual resin on the lower surface of the die, cools the adhered resin with time, crystallizes and solidifies, or removes the non-crystalline resin similarly. After solidification to a certain extent, the liquid is passed through the gap between the adhering resin removing means by the passing means.
If the elapsed time after the scraping is short and the crystallization of the adhered resin has not progressed, the adhered resin cannot be sufficiently removed from the scraping plate. After the scraping, the timing T until the adhered resin is appropriately solidified depends on the type of the resin. For example, when the resin is polybutylene terephthalate (PBT), it is preferably at least 3 minutes at room temperature cooling, and more preferably 5 to 45 minutes. Minutes. The reason for setting the timing T to 3 minutes or more is that if the time T is less than 3 minutes, crystallization and solidification of the resin do not sufficiently proceed, and it becomes difficult to separate the resin from the scraping plate. The longer the timing T, the more the solidification proceeds and the easier it is to peel off.
Although there is no practical upper limit, usually 180
Minutes. Further, the moving means 18 may also have the function of the passing means.

【0022】[0022]

【実施例】以下、実施例により本発明を具体的に説明す
るが、本発明はこれらに限定されるものではない。図1
〜8は本発明の一実施例を示す図である。図1におい
て、10は3軸マニピュレータ18を用いたダイ表面清
掃装置である。ダイ表面清掃装置10は、X軸方向に配
置された第1エアシリンダ11と、第1エアシリンダ1
1のシャフト先端部に固定されX軸方向に移動可能な第
1ヘッド12と、第1ヘッド12に固定されY軸方向に
配置された第2エアシリンダ13と、第2エアシリンダ
13のシャフト先端部に固定されY軸方向に移動可能な
第2ヘッド14と、第2ヘッド14に固定されZ軸方向
に配置された第3エアシリンダ15と、第3エアシリン
ダ15のシャフト先端部に固定された第3ヘッド16が
設けられている。
EXAMPLES The present invention will now be described specifically with reference to examples, but the present invention is not limited to these examples. FIG.
8 are diagrams showing one embodiment of the present invention. In FIG. 1, reference numeral 10 denotes a die surface cleaning device using a three-axis manipulator 18. The die surface cleaning device 10 includes a first air cylinder 11 disposed in the X-axis direction and a first air cylinder 1.
A first head 12 fixed to the tip of one shaft and movable in the X-axis direction, a second air cylinder 13 fixed to the first head 12 and arranged in the Y-axis direction, and a shaft tip of the second air cylinder 13 A second head 14 fixed to the section and movable in the Y-axis direction, a third air cylinder 15 fixed to the second head 14 and arranged in the Z-axis direction, and fixed to a shaft tip of the third air cylinder 15 A third head 16 is provided.

【0023】第3ヘッド16の位置は第1〜3エアシリ
ンダ11,13,15へのエア量を調整することにより
それぞれXYZ軸上の位置を変更可能である。また、第
2,3エアシリンダを固定し第1エアシリンダ11にの
みエアを導入することのより、第3ヘッド16をX軸方
向に平行に移動可能である。第1,2,3エアシリンダ
11,13,15および第1,2,3ヘッド12,1
4,16は移動手段である3軸マニピュレータ18を構
成している。
The position of the third head 16 can be changed on the XYZ axes by adjusting the amount of air to the first to third air cylinders 11, 13, and 15, respectively. Further, since the second and third air cylinders are fixed and air is introduced only into the first air cylinder 11, the third head 16 can be moved in parallel with the X-axis direction. First, second, third air cylinders 11, 13, 15 and first, second, third heads 12, 1
Reference numerals 4 and 16 constitute a three-axis manipulator 18 as moving means.

【0024】第3ヘッド16にはY軸に平行に支持軸2
1が設けられている。支持軸21は長方形の掻き取り板
20をその一辺の辺端部20aが後述のダイの下表面2
7aに接触するように、辺端部20aに対向する辺端部
20bを回動自在に軸支している。また、支持軸の近傍
には掻き取り板の上側の板面20cとダイの下表面27
aに対応する水平面Aとのなす接触角Bを約0〜90度
まで調整可能な角度調整機構23が設けられている。ま
た、第3ヘッドには加圧手段であるカム機構22が設け
られ、第3ヘッドの上下運動と連動し、掻き取り板の辺
端部20aを水平面A側に常時加圧力4〜7Kg/cm
2で加圧可能になされている。また、掻き取り板20は
黄銅からなり、板厚1.2mmで、ダイ幅と等寸法の板
幅を有する。掻き取り板20は表面処理としてテフロン
処理加工がなされた後に、No400のバフ仕上げがな
されていてもよい。
The third head 16 has a support shaft 2 parallel to the Y axis.
1 is provided. The support shaft 21 is a rectangular scraping plate 20 whose one edge 20a is a lower surface 2 of a die to be described later.
A side end 20b facing the side end 20a is pivotally supported so as to be in contact with 7a. In the vicinity of the support shaft, the upper plate surface 20c of the scraping plate and the lower surface 27 of the die are provided.
An angle adjusting mechanism 23 capable of adjusting a contact angle B with the horizontal plane A corresponding to a from about 0 to 90 degrees is provided. Further, the third head is provided with a cam mechanism 22 as a pressing means, and in conjunction with the vertical movement of the third head, constantly presses the edge 20a of the scraping plate to the horizontal plane A side with a pressure of 4 to 7 kg / cm.
Pressurization is possible with 2 . The scraping plate 20 is made of brass, has a plate thickness of 1.2 mm, and has a plate width equal to the die width. The scraping plate 20 may be subjected to a Teflon treatment as a surface treatment, and then a No. 400 buff finish.

【0025】25は粘性溶融樹脂であるポリブチレンテ
レフタレートの重合生成物を保有する反応釜の下側の排
出部であり、図1では排出部25を上方より透視的にみ
た場合を示している。排出部25には反応釜内のポリブ
チレンテレフタレート(以下樹脂という)をストランド
として垂下させる複数の孔26(この場合2列に約60
個の孔)を有するダイ27と、ダイのほぼ水平な下表面
27aの孔26を閉鎖する図示していないシャッタ弁と
が設けられている。孔26は長方形のダイ27の長手方
向でX軸に平行なX'軸に沿って設けられている。
Reference numeral 25 denotes a lower discharge portion of a reaction vessel holding a polymerization product of polybutylene terephthalate, which is a viscous molten resin. FIG. 1 shows a case where the discharge portion 25 is seen from above. A plurality of holes 26 (in this case, about 60 rows in two rows) through which polybutylene terephthalate (hereinafter referred to as resin) in the reactor is suspended as strands are provided in the discharge section 25.
And a shutter valve (not shown) that closes the hole 26 in the substantially horizontal lower surface 27a of the die. The hole 26 is provided along the X ′ axis parallel to the X axis in the longitudinal direction of the rectangular die 27.

【0026】本実施例では、第1,2,3エアシリンダ
へのエア量を調整することにより、掻き取り板の辺端部
20aがダイの下表面27aに位置するようにされてい
る。また、掻き取り板20はダイの下表面27aに支持
軸21により接触角Bが45度で接するように調整され
ている。さらに、カム機構22は辺端部20bに平行な
一辺の辺端部20aを上方に加圧力5Kg/cm2で加
圧している。また、第1エアシリンダにエアを供給する
ことのより、掻き取り板20をX'軸方向に速度300
から1200mm/secで移動可能である。この実施
例では最適速度1000mm/secに調整されてい
る。
In this embodiment, by adjusting the amount of air to the first, second, and third air cylinders, the edge 20a of the scraping plate is positioned on the lower surface 27a of the die. The scraping plate 20 is adjusted by the support shaft 21 so that the contact angle B contacts the lower surface 27a of the die at 45 degrees. Further, the cam mechanism 22 presses one side end 20a parallel to the side end 20b upward with a pressing force of 5 kg / cm 2 . Further, by supplying air to the first air cylinder, the scraping plate 20 is moved at a speed of 300 in the X′-axis direction.
From 1200mm / sec. In this embodiment, the optimum speed is adjusted to 1000 mm / sec.

【0027】図2,3において、30は位置移動手段で
ある移動架台であり、移動架台30は固定された支持軸
31と、支持軸31の回りに回動自在に支持された長さ
約30cmの短い回動フレーム32と、回動フレームの
先端部32aに回動可能に連結され床面33上を移動可
能な長さ約1mの移動フレーム35とを有している。移
動フレームには長手方向に等間隔に3個の補助フレーム
36が設けられている。固定支柱37は移動フレーム3
5の反支持軸側の先端部35Aの底面を着脱自在に支持
しており、床面33から移動フレーム底までの高さを有
する。移動フレームは掻き取り板20が掻き取り作業を
行う作業位置Lにおいて固定支柱37の柱頭に乗る格好
に静止させる。そして、移動フレーム35はセットボル
トで固定支柱37に固定される。固定支柱37は床面と
補修・修理作業の便を考慮し脱着可能となっているが、
車輪等を設けて移動を容易にしてもよい。38はストッ
パであり、移動時に作業位置を固定する。回動フレーム
の先端部32aの底面は固定支柱37と同様な支柱39
に支持されている。
In FIGS. 2 and 3, reference numeral 30 denotes a movable gantry as a position moving means. The movable gantry 30 has a fixed support shaft 31 and a length of about 30 cm rotatably supported around the support shaft 31. And a moving frame 35 having a length of about 1 m, which is rotatably connected to the tip 32a of the rotating frame and is movable on the floor surface 33. The movable frame is provided with three auxiliary frames 36 at equal intervals in the longitudinal direction. The fixed support 37 is the moving frame 3
5 detachably supports the bottom surface of the distal end portion 35A on the side opposite to the support shaft, and has a height from the floor surface 33 to the bottom of the moving frame. The moving frame rests on the stigma of the fixed column 37 at the working position L where the scraping plate 20 performs the scraping operation. Then, the moving frame 35 is fixed to the fixed column 37 with set bolts. The fixed column 37 is detachable in consideration of the floor and the convenience of repair and repair work.
Wheels or the like may be provided to facilitate movement. Reference numeral 38 denotes a stopper, which fixes the working position when moving. The bottom surface of the tip 32a of the rotating frame has a support 39 similar to the fixed support 37.
It is supported by.

【0028】移動フレーム35の上には3軸マニピュレ
ータ18の第1エアシリンダ11が登載され、移動フレ
ーム35はX軸に平行な図3のX''''軸上の作業位置L
からY''''軸上の補修容易な待機位置Mまで回動移動可
能である。この移動は反応釜の排出部の近傍が樹脂の閉
止弁、加熱ジャケット,ダイヒータ、ダイノズル、ダイ
の孔のシャッタ弁、これらの機器への配管および配線等
で、作業位置Lでの設置スペースが少ないために、ま
た、補修時に十分なスペースを確保するため、干渉もな
く十分な作業ができるようにしたものである。すなわ
ち、移動フレーム35はX''''軸に平行な作業位置Lか
ら支持軸31を中心に回動フレーム32のみが回動して
移動フレーム35を平行移動させた後、回動フレームの
先端部32aを中心に移動フレーム35が回動しY''''
軸に平行な待機位置Mに移動するようになされている。
待機位置Mから作業位置Lに移動するときには上記と逆
の動きをする。ストッパ38は移動フレーム35が作業
位置に設置されるときの位置を規定する。
The first air cylinder 11 of the three-axis manipulator 18 is mounted on the moving frame 35, and the moving frame 35 is moved to the working position L on the X '''' axis in FIG. 3 parallel to the X axis.
To a standby position M on the Y "" axis where repair is easy. This movement is due to the resin closing valve, heating jacket, die heater, die nozzle, die hole shutter valve near the discharge part of the reaction vessel, piping and wiring to these devices, etc., and the installation space at the working position L is small. Therefore, in order to secure a sufficient space at the time of repair, sufficient work can be performed without interference. That is, the moving frame 35 is moved only from the working position L parallel to the X ″ ″ axis around the support shaft 31 so that only the turning frame 32 turns to move the moving frame 35 in parallel. The moving frame 35 rotates about the portion 32a, and Y ″ ″
It is adapted to move to a standby position M parallel to the axis.
When moving from the standby position M to the work position L, the movement is reversed. The stopper 38 defines a position when the moving frame 35 is installed at the working position.

【0029】図8は、掻き取り板20のダイの下表面の
清掃動作を説明する座標軸図である。掻き取り板20の
掻き取り動作点を点X’US→点X’UNで示し、掻き
取り板20の水平状態での復帰動作点を点X’DN→点
X’DSで示す。また、掻き取り板20の水平への移動
および復帰を点X’UN→点X’DNおよび点X’DS
→点X’USで示している。また、図8の座標図の要部
を図1に示している。図1,7、8において、40は付
着樹脂除去手段である付着樹脂除去機構であり、付着樹
脂除去機構40は掻き取り板20の辺端部20aがダイ
の下表面27aに接してダイの長手方向すなわちX'軸
方向に移動して下表面27aの付着樹脂50を掻き取っ
た後、次バッチ開始まで原点(XDS)で待機し、掻き
取り板20がダイの下表面27aの長手方向に移動する
直前で掻き取り板20を水平にした状態の軸(Y’軸)
上(例えば、Y’DN)に設けられている。(図1で
は、付着樹脂除去機構40は点Y’DNから離して示し
ている。)付着樹脂除去機構40は上下2個の板状体で
ある除去板41,42を断面ハ字状にかつ除去板の対向
する2辺41a,42aの間隔が4mmの一定間隙Sを
形成している。また、対向する板面41b,42bのな
す交差角Cが160度をなすように支持アーム43に支
持されている。また、除去板41,42は対向する2辺
41a,42aの近傍で、それぞれ辺41a,42a側
に向かって断面楔状に形成されている。また、水平状態
の掻き取り板20は第3エアシリンダのシャフト先端部
(第3ヘッド15)に固定されており、通過手段でもあ
る第2エアシリンダ13にエアを供給し、第2ヘッド1
4をY’軸上を移動させることにより、掻き取り板20
が図7に示すように、間隙S間を通過するようになされ
ている。支持アーム43は移動フレーム35が作業位置
Lから待機位置Mに移動するとき、同時に支持アーム4
3に連結する連結アーム45とともに待機位置に移動す
るようになされている。
FIG. 8 is a coordinate axis diagram for explaining the cleaning operation of the lower surface of the die of the scraping plate 20. The scraping operation point of the scraping plate 20 is indicated by a point X′US → point X′UN, and the returning operation point of the scraping plate 20 in a horizontal state is indicated by a point X′DN → point X′DS. Further, the horizontal movement and return of the scraping plate 20 are defined by the points X'UN → X'DN and X'DS.
→ Shown by point X'US. FIG. 1 shows a main part of the coordinate diagram of FIG. 1, 7 and 8, reference numeral 40 denotes an adhesion resin removing mechanism which is an adhesion resin removing means. The adhesion resin removing mechanism 40 is configured such that the edge 20a of the scraping plate 20 contacts the lower surface 27a of the die and the length of the die is reduced. After moving in the direction of the X 'axis to scrape off the adhered resin 50 on the lower surface 27a, it waits at the origin (XDS) until the next batch starts, and the scraping plate 20 moves in the longitudinal direction of the lower surface 27a of the die. (Y 'axis) with the scraping plate 20 horizontal just before
It is provided above (for example, Y′DN). (In FIG. 1, the attached resin removing mechanism 40 is shown away from the point Y′DN.) The attached resin removing mechanism 40 is formed by removing upper and lower two plate-like removing plates 41 and 42 into a C-shaped cross section. A constant gap S where the interval between the two opposite sides 41a and 42a of the removing plate is 4 mm is formed. Further, the support arm 43 supports the intersection angle C between the opposed plate surfaces 41b and 42b so as to form 160 degrees. The removal plates 41 and 42 are formed in a wedge-shaped cross section toward the sides 41a and 42a in the vicinity of the two opposing sides 41a and 42a, respectively. Further, the horizontal scraping plate 20 is fixed to the tip of the shaft (third head 15) of the third air cylinder, and supplies air to the second air cylinder 13 which is also a passage means, and the second head 1
4 is moved on the Y′-axis, so that the scraping plate 20 is moved.
Are passed between the gaps S as shown in FIG. When the moving frame 35 moves from the work position L to the standby position M, the support arm 43
It moves to the standby position together with the connecting arm 45 connected to the third arm 3.

【0030】次に、ダイの下表面の清掃動作につき説明
する(図1、8参照)。反応釜のダイの下表面はシャッ
タ弁で閉鎖されている。反応釜での重合反応が終了し樹
脂垂下の開始時点になると、図示してないシャッタ弁が
ダイの孔26を開放する。この時点では重合反応の終了
した新しい(正規)樹脂は反応釜の排出弁が閉止してい
るため、ダイに至る流路に流れ落ちていない。シャッタ
弁開放の信号S1を受信すると、3軸マニピュレータ1
8の第1エアシリンダ11にエアーが供給され、第1ヘ
ッド12はX軸を原点Oから点XNに移動し、掻き取り
板20は待機位置である原点XDSから点XDNに移動
する。点XDNでは第1エアシリンダ11内に装着され
たリミットスイッチが蹴られ、当地点に到達した信号S
2を発信する。この信号S2により、3軸マニピュレー
タ18の第2エアシリンダ13にエアーが供給され第2
ヘッド14が移動し、掻き取り板20は点X’DNへ移
動する。この間に前バッチで掻き取られ、適度に固化す
るタイミングT25分を経過した掻き取り板20上の付
着樹脂は、付着樹脂除去機構40の除去板41、42が
形成する間隙S間を通過し、その際に発生する衝撃力に
より掻き取り板20から完全に剥される。
Next, the operation of cleaning the lower surface of the die will be described (see FIGS. 1 and 8). The lower surface of the die of the reactor is closed with a shutter valve. When the polymerization reaction in the reactor is completed and the resin drooping starts, a shutter valve (not shown) opens the hole 26 of the die. At this point, the new (regular) resin after the polymerization reaction has not flowed down to the flow path leading to the die because the discharge valve of the reactor is closed. Upon receiving the shutter valve opening signal S1, the three-axis manipulator 1
Air is supplied to the first air cylinder 11 of No. 8, the first head 12 moves the X axis from the origin O to the point XN, and the scraping plate 20 moves from the origin XDS, which is the standby position, to the point XDN. At the point XDN, the limit switch mounted in the first air cylinder 11 is kicked, and the signal S reaching the point is reached.
Send 2. By this signal S2, air is supplied to the second air cylinder 13 of the three-axis manipulator 18 and the second
The head 14 moves, and the scraping plate 20 moves to the point X′DN. During this time, the adhered resin on the scraping plate 20 that has been scraped off in the previous batch and has passed the timing T25 of appropriately solidifying passes through the gap S formed by the removal plates 41 and 42 of the adhered resin removing mechanism 40, The impact force generated at that time completely peels off the scraping plate 20.

【0031】掻き取り板20が点X’DNに到達すると
その到達信号S3により第1シリンダ11にエアが供給
され、第1ヘッド12は原点O側に移動し、掻き取り板
20は点X’DSに向け移動する。掻き取り板20が点
X’DSに到達すると第1エアシリンダ内のリミットス
イッチが蹴られ、その到達信号S4が反応釜の排出弁か
らダイに至る流路内のダイ間近にあるスリットコック弁
の開放を命じ、流路内に残留した前バッチの品質不良な
樹脂の垂下を始める。この品質不良な樹脂の垂下の開始
から一定時間経過後、その経時信号S5を受信すると、
第3エアシリンダ15にエアが供給され、第3ヘッドが
上昇し第3ヘッド16上のカム機構での駆動力変換によ
り掻き取り板20の辺端部20aがダイ27へ接触角B
45度、加圧力5Kg/cm2で押圧される。この押圧
を掻き取り板20の点X’US到達信号S6として受信
し第1エアシリンダ11に再びエアが供給され、第1ヘ
ッド12は点XNに移動し、掻き取り板20は点X’U
Nに向け所定の移動速度1000mm/secで移動す
る。この移動により、掻き取り板20の辺端部20aは
ダイ27の下表面27aを清掃する。その後、掻き取り
板20は図1、8に示す経路、点X’UN→点X’DN
→点X’DS→点X’US→点X’UNを所定の回数だ
け繰り返し、掻き取り動作を繰り返す。
When the scraping plate 20 reaches the point X'DN, air is supplied to the first cylinder 11 by the arrival signal S3, the first head 12 moves to the origin O side, and the scraping plate 20 moves to the point X'DN. Move towards DS. When the scraping plate 20 reaches the point X'DS, the limit switch in the first air cylinder is kicked, and the reaching signal S4 is output from the slit cock valve near the die in the flow path from the discharge valve of the reactor to the die. Order to open and start dripping of poor quality resin of previous batch remaining in the flow path. After a lapse of a certain time from the start of dripping of the poor quality resin, when the time signal S5 is received,
The air is supplied to the third air cylinder 15, the third head rises, and the driving force conversion by the cam mechanism on the third head 16 causes the side end 20 a of the scraping plate 20 to contact the die 27 with the contact angle B.
It is pressed at 45 degrees with a pressure of 5 kg / cm 2 . This pressure is received as the point X'US arrival signal S6 of the scraping plate 20, and the air is supplied again to the first air cylinder 11, the first head 12 moves to the point XN, and the scraping plate 20 moves to the point X'U.
It moves toward N at a predetermined moving speed of 1000 mm / sec. By this movement, the edge 20a of the scraping plate 20 cleans the lower surface 27a of the die 27. After that, the scraping plate 20 moves along the path shown in FIGS.
→ Point X′DS → Point X′US → Point X′UN are repeated a predetermined number of times, and the scraping operation is repeated.

【0032】点X’UN→点X’DNおよび点X’DS
→点X’USの動作は掻き取り板20が各々の到達点に
達した信号S7,S8を受信することでダイ27への押
圧とその復旧動作である掻き取り板20が水平状態にな
ることを示す。こうしてダイの孔26の周囲に付着した
残留樹脂および品質不良な樹脂の垂下で生じた涙滴状・
糸状の漏洩樹脂はダイ面から一掃される。掻き取り動作
は所定時間だけ繰り返されるようにセットされており、
その時間が終了すると、掻き取り板20は原点であるX
DSへ戻る。この戻り信号S9を受信すると、反応釜か
ら正規樹脂の排出が排出弁の開放により成される。な
お、3軸マニピュレータ18の一連の動作および反応釜
の排出弁、スリコットコック弁の開閉、ダイのシャッタ
弁開閉動作はシーケンサにより制御されている。又、3
軸マニピュレータ18はこのシーケンサから切り離し、
単独で各軸の動作が可能な様にも制御されている。
Point X'UN → point X'DN and point X'DS
→ The operation of the point X'US is that the scraping plate 20 receives the signals S7 and S8 that have reached the respective arrival points, thereby pressing the die 27 and returning the scraping plate 20 to a horizontal state. Is shown. Thus, teardrops formed by dripping of residual resin and poor quality resin adhered around the hole 26 of the die.
The thread-like leaking resin is swept away from the die surface. The scraping operation is set to be repeated for a predetermined time,
At the end of that time, the scraping plate 20 is moved to the origin X
Return to DS. Upon receiving the return signal S9, the discharge of the regular resin from the reaction vessel is performed by opening the discharge valve. A sequencer controls the series of operations of the three-axis manipulator 18, the opening and closing of the discharge valve and the slicott cock valve of the reactor, and the opening and closing of the die shutter valve. 3
The axis manipulator 18 is disconnected from this sequencer,
It is controlled so that each axis can operate independently.

【0033】以上説明したように、ダイの下表面の近傍
は狭いスペースしかないが、掻き取り板20は移動架台
30により、すなわち移動フレーム35および回動フレ
ーム32により、待機位置Mから作業位置Lまで移動
し、さらに3軸マニピュレータ18により移動するの
で、反応釜の下部における多くの機器や部材と干渉する
ことなく掻き取り開始位置Nに移動することができる。
また、第3ヘッド16には、角度調整機構23およびカ
ム機構22が設けられ、かつ、掻き取り板20が好適の
形状および板厚の黄銅からなり、さらにシーケンサによ
り移動速度、その他の動作が制御されているので、掻き
取り板20は、最適の接触角および加圧力でダイの下表
面に圧接し、掻き取り動作を繰り返すことができる。
As described above, although there is only a small space near the lower surface of the die, the scraping plate 20 is moved from the standby position M to the working position L by the movable frame 30, that is, by the movable frame 35 and the rotating frame 32. To the scraping start position N without interfering with many devices and members in the lower part of the reaction vessel.
Further, the third head 16 is provided with an angle adjusting mechanism 23 and a cam mechanism 22, and the scraping plate 20 is made of brass of a suitable shape and thickness, and the movement speed and other operations are controlled by a sequencer. Thus, the scraping plate 20 can be pressed against the lower surface of the die at an optimum contact angle and pressure to repeat the scraping operation.

【0034】これにより、図4に示すように、垂下樹脂
51または残留樹脂50はすべて清浄に掻き取ることが
でき、掻き取り板の辺端部20aの近傍に付着する。掻
き取り板20に付着した付着樹脂50は固化するタイミ
ングTを経過した後、図7に示すように、付着樹脂除去
機構40の間隙Sを通過する。
As a result, as shown in FIG. 4, the dripping resin 51 or the residual resin 50 can all be wiped cleanly and adheres to the vicinity of the side edge 20a of the scraping plate. After the elapse of the solidification timing T, the adhered resin 50 adhered to the scraping plate 20 passes through the gap S of the adhered resin removing mechanism 40 as shown in FIG.

【0035】掻き取り板20はテフロン表面処理されか
つ好適な仕上げがなされており、さらに、付着樹脂除去
機構40は好適な形状でかつ好適な間隙4mm,交差角
160度を有しているので、間隙を通過時の除去板4
1,42との僅かの衝撃により、付着樹脂50は掻き取
り板20から剥離し破壊し周囲に飛散する。このため、
人手を使わずに迅速に清浄にダイの下表面の清掃ができ
るとともに掻き取り板20の付着樹脂50の除去が極め
て容易にかつ迅速にできる。
Since the scraping plate 20 has a Teflon surface treatment and has a suitable finish, and the adhesion resin removing mechanism 40 has a suitable shape, a suitable gap of 4 mm, and a crossing angle of 160 degrees, Removal plate 4 when passing through the gap
Due to a slight impact with 1, 42, the adhered resin 50 is separated from the scraping plate 20, broken, and scattered around. For this reason,
The lower surface of the die can be quickly and cleanly cleaned without using humans, and the removal of the adhered resin 50 on the scraping plate 20 can be performed very easily and quickly.

【0036】[0036]

【発明の効果】以上説明したように、本発明によれば、
狭いスペースにあるダイの下表面を清浄にするのに、人
手をかけずに、かつ熟練作業者と同様に特定の材質、特
定の表面処理した掻き取り板により、ダイの下表面に対
して一定の角度で、かつ一定の加圧力で毎バッチごとに
垂下樹脂および付着樹脂を掻き取り、迅速に清浄に清掃
することができるとともに掻き取り板に付着した付着樹
脂をタイミングを計って簡単に迅速に除去することがで
きる。
As described above, according to the present invention,
To clean the lower surface of the die in a narrow space, it is fixed to the lower surface of the die without manual labor and with a specific material and a specific surface treated scraping plate like a skilled worker The dripping resin and adhered resin can be scraped every batch at an angle and with a constant pressing force, and can be cleaned quickly and cleanly, and the adhered resin adhered to the scraping plate can be easily and quickly measured by timing. Can be removed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係わるダイ表面清掃装置の3軸マニピ
ュレータ及び付着樹脂除去機構の概略斜視図。
FIG. 1 is a schematic perspective view of a three-axis manipulator and an attached resin removing mechanism of a die surface cleaning device according to the present invention.

【図2】本発明の3軸マニピュレータを登載した移動架
台の正面図。
FIG. 2 is a front view of a movable base on which the three-axis manipulator of the present invention is mounted.

【図3】図2に示す移動架台の平面図。FIG. 3 is a plan view of the movable gantry shown in FIG. 2;

【図4】掻き取り板の掻き取り状態を示し、(a)は樹
脂の垂下時、(b)は粘性溶融樹脂または残留樹脂を掻
き取り時、(c)は掻き取り終了時の断面図。
4A and 4B are cross-sectional views illustrating a scraping state of a scraping plate, wherein FIG. 4A is a diagram when a resin is drooped, FIG. 4B is a diagram when a viscous molten resin or a residual resin is scraped, and FIG.

【図5】掻き取り板のダイの下表面への接触角を示す断
面図。
FIG. 5 is a sectional view showing a contact angle of a scraping plate with a lower surface of a die.

【図6】掻き取り板のダイの下表面への加圧状態を示す
断面図。
FIG. 6 is a cross-sectional view showing a state where a scraping plate is pressed against a lower surface of a die.

【図7】掻き取り板が付着樹脂除去機構の間隙通過の状
態を示す断面図。
FIG. 7 is a sectional view showing a state in which the scraping plate passes through a gap of the adhesion resin removing mechanism.

【図8】ダイの下表面の清掃動作を説明する座標軸図。FIG. 8 is a coordinate axis diagram for explaining a cleaning operation of the lower surface of the die.

【符号の説明】[Explanation of symbols]

10 ダイ表面清掃装置 11 第1エアシリンダ(通過手段) 18 3軸マニピュレータ(移動手段) 20 掻き取り板 22 カム機構(加圧手段) 26 孔 27 ダイ 30 移動架台(位置移動手段) 40 付着樹脂除去機構(付着樹脂除去手段) 41,42 除去板(板状体) 43 支持アーム(支持部材) 50 付着樹脂 B 接触角 C 交差角 S 間隙 Reference Signs List 10 die surface cleaning device 11 first air cylinder (passing means) 18 3-axis manipulator (moving means) 20 scraping plate 22 cam mechanism (pressing means) 26 hole 27 die 30 moving gantry (position moving means) 40 removal of adhered resin Mechanism (adhesive resin removing means) 41, 42 Removal plate (plate-like body) 43 Support arm (support member) 50 Adhesive resin B Contact angle C Intersection angle S Gap

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 粘性溶融樹脂を保有する反応釜の下側の
排出部に設けられ複数の孔を有するダイの下表面に一辺
の辺端部を接し所定の接触角を有するヘラ状の掻き取り
板と、 該掻き取り板の近傍に設けられ掻き取り板を前記ダイの
下表面に加圧する加圧手段と、 前記掻き取り板を保持するとともに掻き取り板の辺端部
を前記ダイの下表面の複数の孔に沿って移動させる移動
手段とを備え、 前記掻き取り板の辺端部により、前記ダイの孔より垂下
する粘性溶融樹脂または残留樹脂を掻き取り、ダイの下
表面を清掃することを特徴とするダイ表面清掃装置。
1. A spatula-shaped scraper having a predetermined contact angle by contacting one side edge to a lower surface of a die provided with a plurality of holes and provided at a lower discharge portion of a reaction vessel holding a viscous molten resin. Plate, pressing means provided in the vicinity of the scraping plate for pressing the scraping plate against the lower surface of the die, holding the scraping plate and holding the edge of the scraping plate at the lower surface of the die. Moving means for moving along the plurality of holes, and scraping viscous molten resin or residual resin dripping from the holes of the die by means of a side edge of the scraping plate to clean the lower surface of the die. A die surface cleaning device.
【請求項2】 移動手段および加圧手段を支持する支持
台と、支持台に連結し支持台を作業位置と待機位置との
間を移動可能に案内する案内手段とを有する位置移動手
段とを備えることを特徴とする請求項1記載のダイ表面
清掃装置。
2. A position moving means having a support for supporting the moving means and the pressurizing means, and a guide connected to the support and guiding the support so as to be movable between a working position and a standby position. The die surface cleaning device according to claim 1, further comprising:
【請求項3】 2個の板状体を断面ハ字状で、該板状体
の対向する2辺が一定間隔の間隙を形成し、対向する2
つの板面のなす交差角が所定の角度をなすよう支持する
支持部材と、 掻き取り板を前記対向する2つの板面間を通り前記間隙
間を通過するよう移動させる通過手段とを有する付着樹
脂除去手段を備え、掻き取り板に付着した付着樹脂を除
くことを特徴とする請求項1または2記載のダイ表面清
掃装置。
3. The two plate-shaped members have a C-shaped cross section, and two opposing sides of the plate-shaped members form a gap with a constant interval, and the two opposing plates have a C-shape.
An adhering resin having a support member for supporting an intersection angle between two plate surfaces to form a predetermined angle, and a passage means for moving a scraping plate so as to pass through the gap between the two opposing plate surfaces. The die surface cleaning apparatus according to claim 1 or 2, further comprising a removing means for removing the resin adhered to the scraping plate.
【請求項4】 移動手段は前記通過手段の機能を兼ねる
ことを特徴とする請求項1乃至3のいずれか一項に記載
のダイ表面清掃装置。
4. The die surface cleaning apparatus according to claim 1, wherein the moving unit has a function of the passing unit.
【請求項5】 付着樹脂が付着した掻き取り板は付着樹
脂が剥離可能になるまで固化した後に付着樹脂除去手段
の間隙を通過させることを特徴とする請求項1乃至4の
いずれか一項に記載のダイ表面清掃装置。
5. The scraping plate to which the adhered resin has adhered is solidified until the adhered resin can be peeled off, and then passes through a gap of the adhered resin removing means. A die surface cleaning device as described.
JP33455896A 1996-11-29 1996-11-29 Die surface cleaning device Expired - Fee Related JP3312855B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33455896A JP3312855B2 (en) 1996-11-29 1996-11-29 Die surface cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33455896A JP3312855B2 (en) 1996-11-29 1996-11-29 Die surface cleaning device

Publications (2)

Publication Number Publication Date
JPH10156838A true JPH10156838A (en) 1998-06-16
JP3312855B2 JP3312855B2 (en) 2002-08-12

Family

ID=18278755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33455896A Expired - Fee Related JP3312855B2 (en) 1996-11-29 1996-11-29 Die surface cleaning device

Country Status (1)

Country Link
JP (1) JP3312855B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008265178A (en) * 2007-04-23 2008-11-06 Japan Steel Works Ltd:The Cleaning device of die lip, and cleaning method of die lip
JP2009269298A (en) * 2008-05-08 2009-11-19 Japan Steel Works Ltd:The Equipment and method of cleaning surface of dice
JP2013086370A (en) * 2011-10-18 2013-05-13 Japan Steel Works Ltd:The Cleaning device of t-die discharge opening, and manufacturing method of sheet-like resin molding using the same
CN112917795A (en) * 2021-03-05 2021-06-08 宋京泽 Cleaning device for plastic brick pressing die in surrounding mode

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008265178A (en) * 2007-04-23 2008-11-06 Japan Steel Works Ltd:The Cleaning device of die lip, and cleaning method of die lip
JP2009269298A (en) * 2008-05-08 2009-11-19 Japan Steel Works Ltd:The Equipment and method of cleaning surface of dice
JP2013086370A (en) * 2011-10-18 2013-05-13 Japan Steel Works Ltd:The Cleaning device of t-die discharge opening, and manufacturing method of sheet-like resin molding using the same
CN112917795A (en) * 2021-03-05 2021-06-08 宋京泽 Cleaning device for plastic brick pressing die in surrounding mode
CN112917795B (en) * 2021-03-05 2023-06-20 深圳市成元科技有限公司 Surrounding type cleaning device for plastic brick pressing mold

Also Published As

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