JPH10120875A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPH10120875A
JPH10120875A JP30858996A JP30858996A JPH10120875A JP H10120875 A JPH10120875 A JP H10120875A JP 30858996 A JP30858996 A JP 30858996A JP 30858996 A JP30858996 A JP 30858996A JP H10120875 A JPH10120875 A JP H10120875A
Authority
JP
Japan
Prior art keywords
epoxy resin
formula
component
resin composition
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30858996A
Other languages
Japanese (ja)
Other versions
JP3656224B2 (en
Inventor
Chiaki Asano
千明 浅野
Hiroshi Sato
洋 佐藤
Masao Gunji
雅男 軍司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tohto Kasei Co Ltd
Original Assignee
Tohto Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohto Kasei Co Ltd filed Critical Tohto Kasei Co Ltd
Priority to JP30858996A priority Critical patent/JP3656224B2/en
Publication of JPH10120875A publication Critical patent/JPH10120875A/en
Application granted granted Critical
Publication of JP3656224B2 publication Critical patent/JP3656224B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtian a heat-resistant epoxy resin composition which can realize a low cost and very thin multilayer printed wiring board having by mixing an epoxy resin/acid anhydride adduct with an aromatic epoxy resin and a cure accelerator in a specified mixing ratio. SOLUTION: This composition is one having the ability to form a thermosetting insulation layer and comprising the three components: 20-75wt.% epoxy resin/acid anhydride adduct (A) represented by formula I (wherein R<1> and R<2> are each H, a 1-5C alkyl or a halogen; X is -SO2 -, -CH2 - or the like; 1 is 0 or 1; R<3> s are each H or a group represented by formula II (wherein Y is an acid anhydride residue; m is 1-3; and Z is a group represented by formula III or -R<3> ), provided that the rate of Rs which are hydrogen atoms is at most 85% based on the total R<3> s) and having a molecular weight of 10,000-200,000, a halogen content of 5-40wt.%, an epoxy/acid anhydride adduct having an acid value of 30-250mgKOH/g, an aromatic epoxy resin (B) and a cure accelerator (C).

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、内層回路への埋め込み
性に優れ、回路基板との接着性及びラミネート後の外層
回路の平滑性に優れたガラスクロスをほとんど用いず板
厚を極薄にでき、耐熱性のある多層プリント配線板用エ
ポキシ樹脂組成物に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultra-thin glass plate which is excellent in embedding into an inner layer circuit, has excellent adhesion to a circuit board, and has excellent smoothness of an outer layer circuit after lamination. The present invention relates to a heat-resistant epoxy resin composition for a multilayer printed wiring board.

【0002】[0002]

【従来の技術】従来、多層プリント配線板は回路形成さ
れた内装回路基板上に、ガラスクロスにエポキシ樹脂を
含浸させた後Bステージ化したプリプレグシートを重
ね、さらにその上に銅箔を重ね加圧加熱一体成形を行う
という製造方法をとっている。しかし、この方法ではガ
ラスクロスにエポキシ樹脂を含浸させBステージ化して
プリプレグを作成するのにまず設備と時間がかかり、さ
らに多層化する為に銅箔を重ねて加圧加熱一体成形する
のに設備と時間がかかるというように、膨大な設備と時
間が掛かっており、高コストであった。又、ガラスクロ
スを用いる為に層間厚さを極薄化ができなかった。
2. Description of the Related Art Conventionally, a multilayer printed wiring board has a B-staged prepreg sheet formed by impregnating a glass cloth with an epoxy resin on an interior circuit board on which a circuit has been formed, and further laminating a copper foil thereon. A manufacturing method of performing pressure heating integral molding is employed. However, in this method, it takes time and equipment to prepare a prepreg by impregnating epoxy resin into a glass cloth and making it into a B-stage, and furthermore, it is necessary to add copper foil to form a multilayer and press-heat and integrally mold. It took a lot of equipment and time, and it was expensive. Further, the use of a glass cloth did not allow the interlayer thickness to be extremely thin.

【0003】[0003]

【発明が解決しようとする課題】本発明は従来の技術で
はなし得なかった、多層プリント配線板の低コスト化、
及び極薄化が可能で耐熱性のあるエポキシ樹脂組成物を
提供することを目的とする。
SUMMARY OF THE INVENTION The present invention provides a multi-layer printed wiring board with a low cost, which could not be achieved by the prior art.
Another object of the present invention is to provide a heat-resistant epoxy resin composition which can be made extremely thin.

【0004】[0004]

【課題を解決する為の手段及び作用】本発明は上記課題
を解決したもので、(A)成分が下記式1(化1)で表
され、分子量範囲が10,000〜200,000(ゲ
ルパーミエーションクロマトグラフィー測定、標準ポリ
スチレン換算による、重量平均分子量、以下分子量とい
うのはこの測定法による重量平均分子量を言う)、ハロ
ゲン含有量が5重量%〜40重量%、酸価が30mgK
OH/g〜250mgKOH/gのエポキシ樹脂−酸無
水物付加物であり、(B)成分がエポキシ当量4500
g/eq〜100g/eqの芳香族系エポキシ樹脂、
(C)成分が硬化促進剤から構成される組成物であっ
て、場合によっては粘度調整の為の有機溶剤と有機、無
機充填剤とを含有する熱硬化型絶縁層形成能を有するエ
ポキシ樹脂組成物であり、(A)成分の割合が(A)+
(B)に対して75重量%〜20重量%であるエポキシ
樹脂組成物、及びこのエポキシ樹脂組成物を銅箔に塗布
してなるプリント配線板用接着剤付き銅箔である。そし
てこの接着剤付き銅箔は内層回路基板にラミネート後熱
硬化させることにより極薄の、低コストで耐熱性のある
多層プリント配線板に用いられる。
The present invention has solved the above-mentioned problems, and has a component (A) represented by the following formula (1) and a molecular weight range of 10,000 to 200,000 (gel). The weight average molecular weight in terms of permeation chromatography measurement and standard polystyrene conversion; hereinafter, the molecular weight means the weight average molecular weight by this measurement method), the halogen content is 5% by weight to 40% by weight, and the acid value is 30 mgK.
OH / g to 250 mgKOH / g epoxy resin-anhydride adduct, wherein component (B) has an epoxy equivalent of 4500
g / eq to 100 g / eq of an aromatic epoxy resin,
(C) an epoxy resin composition having a thermosetting insulating layer-forming ability, wherein the composition comprises a curing accelerator, and optionally contains an organic solvent for adjusting viscosity and an organic or inorganic filler. And the proportion of the component (A) is (A) +
An epoxy resin composition in an amount of 75% by weight to 20% by weight with respect to (B), and a copper foil with an adhesive for printed wiring boards obtained by applying the epoxy resin composition to a copper foil. The copper foil with the adhesive is used for ultra-thin, low-cost, heat-resistant multilayer printed wiring boards by laminating on an inner layer circuit board and heat-curing.

【化1】(式1中R、Rは水素原子、炭素数1〜5
のアルキル基、ハロゲン原子のいずれかであり、Xは−
SO−、−CH−、−C(CH−、−O−で
あり、lは0または1を表す。Rは水素原子又は式2
(化2)のいずれかであり、水素原子である割合が全R
の85%以下である。
(Wherein R 1 and R 2 are a hydrogen atom and a carbon number of 1 to 5)
Is an alkyl group or a halogen atom, and X is-
SO 2 —, —CH 2 —, —C (CH 3 ) 2 —, —O—, and 1 represents 0 or 1. R 3 is a hydrogen atom or formula 2
Wherein the proportion of hydrogen atoms is any of R
3 or less than 85%.

【化2】式2中Yは酸無水物残基を表し、m=1〜3の
整数である。Zは式3(化3)又は−Rのいずれかを
示す。
Embedded image In Formula 2, Y represents an acid anhydride residue, and m is an integer of 1 to 3. Z represents any one of Formula 3 (Formula 3) and -R 3 .

【化3】)Embedded image

【0005】本発明に於けるエポキシ樹脂組成物は当然
のことながら、ガラスエポキシ回路基板と同等の耐熱
性、難燃性、電気絶縁性等の様々な特性を満足し、且
つ、銅箔に塗布した場合は、溶剤揮発後の銅箔カール
や、裁断時の粉落ちが無いようにしなければならない。
又、内層回路基板にラミネートした時は、内層回路埋め
込み性がなければならない。
The epoxy resin composition of the present invention, of course, satisfies various properties such as heat resistance, flame retardancy, and electrical insulation equivalent to glass epoxy circuit boards, and is applied to a copper foil. In such a case, it is necessary to prevent the copper foil from curling after the solvent is volatilized and the powder from dropping during cutting.
Also, when laminated on the inner layer circuit board, the inner layer circuit must be embedded.

【0006】(A)成分の分子量が10,000未満で
は、そのエポキシ樹脂組成物を、銅箔に塗布し乾燥した
後の接着剤付き銅箔が、銅箔カールや裁断時の粉落ち等
を起こし、不良品となる。又、分子量が200,000
を越えると、溶剤で希釈溶解しても、通常の溶媒量であ
る70重量%〜40重量%では、溶液粘度が高すぎ、銅
箔に塗布することが困難となる。銅箔に塗布可能な溶液
粘度にするには、あまり好ましくない溶剤を大量に加え
なければならず、不経済であり、環境に対しても良くな
い。尚、(A)成分の分子量は好ましくは15,000
〜160,000、より好ましくは20,000〜10
0,000である。
If the molecular weight of the component (A) is less than 10,000, the copper foil with the adhesive after the epoxy resin composition is applied to the copper foil and dried, may cause the copper foil to curl or to lose powder during cutting. Wake up and become defective. In addition, the molecular weight is 200,000
If it exceeds 70%, the solution viscosity is too high at a normal solvent amount of 70% by weight to 40% by weight even when diluted and dissolved with a solvent, and it is difficult to apply the solution to a copper foil. In order to obtain a solution viscosity that can be applied to a copper foil, a large amount of a less preferable solvent must be added, which is uneconomical and not good for the environment. The molecular weight of the component (A) is preferably 15,000.
~ 160,000, more preferably 20,000 ~ 10
It is 0000.

【0007】(A)成分のハロゲン含有量が5重量%未
満では、本発明のエポキシ樹脂組成物に於いて、十分な
難燃性を付与できず、又、40重量%以下で十分に難燃
性を付与できる為、40重量%を越えるものは必要では
ない。
When the halogen content of the component (A) is less than 5% by weight, the epoxy resin composition of the present invention cannot provide sufficient flame retardancy, and when the halogen content is 40% by weight or less, it is not sufficiently flame retardant. It is not necessary for the content to exceed 40% by weight because the property can be imparted.

【0008】(A)成分の酸価が30mgKOH/g未
満では、硬化した時の架橋密度が低くなり希望する耐熱
性が出ない。又、250mgKOH/gを越えた樹脂を
合成しようとした場合、2官能以上の酸無水物を大量に
使用しなければならず、エポキシ樹脂−酸無水物
((A)成分)の合成時に付加重合反応を起こし、ゲル
化してしまい、合成が非常に困難である。
If the acid value of component (A) is less than 30 mg KOH / g, the crosslink density at the time of curing becomes low, and the desired heat resistance cannot be obtained. Further, when trying to synthesize a resin exceeding 250 mg KOH / g, a large amount of bifunctional or higher acid anhydride must be used, and addition polymerization is required during the synthesis of epoxy resin-acid anhydride (component (A)). It causes a reaction and gels, making synthesis very difficult.

【0009】(A)成分の樹脂を合成するには、酸無水
物の分子量も考慮しなければならないが、比較的高分子
量のエポキシ樹脂を用いなければならない。比較的高分
子量のエポキシ樹脂はビスフェノールA(BPA)又は
/及びテトラブロムビスフェノールA(TBA)とエピ
クロルヒドリンの直接反応によるか、BPA又は/及び
TBAのジグリシジルエーテルとBPA又は/及びTB
Aの付加重合による方法が知られているが、いずれの方
法によるものであっても良い。又、前記高分子のエポキ
シ樹脂の両末端がエポキシ基(この場合式1の末端基は
式3で表される基となる)であるか、又は末端基の一部
又は全部がフェノール性水酸基(この場合式1の末端基
はRとなる)となっている変性高分子エポキシ樹脂で
あっても良い。
In order to synthesize the resin of the component (A), the molecular weight of the acid anhydride must be taken into consideration, but an epoxy resin having a relatively high molecular weight must be used. Relatively high molecular weight epoxy resins can be obtained by the direct reaction of bisphenol A (BPA) or / and tetrabromobisphenol A (TBA) with epichlorohydrin, or by the diglycidyl ether of BPA or / and TBA and BPA or / and TB
A method by addition polymerization of A is known, but any method may be used. Further, both ends of the polymer epoxy resin are epoxy groups (in this case, the terminal group of the formula 1 is a group represented by the formula 3), or a part or all of the terminal groups are phenolic hydroxyl groups ( In this case, the modified polymer epoxy resin in which the terminal group of formula 1 is R 3 ) may be used.

【0010】又、エポキシ樹脂組成物の(A)成分と
(B)成分の配合比率は(A)成分のカルボン酸基と
(B)成分のエポキシ基の当量比で1:1が一番好まし
く、(A)+(B)成分中の(A)成分の割合が75重
量%を越える場合は、通常の溶剤量である70重量%〜
40重量%では溶液粘度が高すぎ、あまり好ましくない
溶剤を多量に加えなければならず不経済であり、環境に
も良くない。又、20重量%を下回る場合は、硬化した
時の耐熱性が不足し、且つ、接着剤付き銅箔の塗膜性能
が悪化し、銅箔カールや裁断時の粉落ち等の現象を生じ
る事になる。具体的には、酸無水物付加用エポキシ樹脂
としては、ビスフェノールA型、F型、S型等の単一ま
たはそれぞれの共縮合型エポキシ樹脂で、難燃性を持た
す為にそれぞれの一部又は、全てがハロゲン化されたも
のが用いられる。
The mixing ratio of component (A) to component (B) in the epoxy resin composition is most preferably 1: 1 in terms of the equivalent ratio of the carboxylic acid group of component (A) to the epoxy group of component (B). When the proportion of the component (A) in the components (A) and (B) exceeds 75% by weight, the usual solvent amount of 70% by weight to
At 40% by weight, the solution viscosity is too high and a large amount of a less preferable solvent must be added, which is uneconomical and not good for the environment. If the content is less than 20% by weight, the heat resistance when cured is insufficient, the coating performance of the copper foil with an adhesive is deteriorated, and phenomena such as curling of the copper foil and powder dropping during cutting may occur. become. Specifically, the epoxy resin for adding an acid anhydride is a single or each co-condensation type epoxy resin such as bisphenol A type, F type, and S type. Used are all halogenated.

【0011】酸無水物としては、無水マレイン酸、無水
コハク酸、無水フタル酸、無水テトラヒドロフタル酸、
無水ヘキサヒドロフタル酸、メチルテトラヒドロ無水フ
タル酸、無水ピロメリット酸、ベンゾフェノンテトラカ
ルボン酸二無水物、ビフェニルテトラカルボン酸二無水
物、ビフェニルエーテルテトラカルボン酸二無水物等が
用いられる。
Examples of the acid anhydride include maleic anhydride, succinic anhydride, phthalic anhydride, tetrahydrophthalic anhydride,
Hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, biphenylethertetracarboxylic dianhydride and the like are used.

【0012】エポキシ樹脂と酸無水物の反応は不活性な
溶媒、例えばキシレン、トルエン、メチルエチルケト
ン、ジエチルセロソルブ、メチルセロソルブアセテー
ト、メチルエチルカルビトール等を単独に又は混合した
ものにエポキシ樹脂を溶かし、酸無水物を一括、又は、
分割して加えて反応させる。この時、触媒を加える場合
はエポキシの合成に使用される一般的な触媒で良く、イ
ミダゾール、トリフェニールフォスフィン、フォスフォ
ニウム塩等の触媒が用いられる。又、反応温度は90℃
〜150℃、好ましくは115℃〜125℃である。
The reaction between the epoxy resin and the acid anhydride is carried out by dissolving the epoxy resin in an inert solvent such as xylene, toluene, methyl ethyl ketone, diethyl cellosolve, methyl cellosolve acetate, methyl ethyl carbitol, or a mixture thereof. Anhydrous at once, or
Add and divide to react. At this time, when a catalyst is added, a general catalyst used for the synthesis of epoxy may be used, and a catalyst such as imidazole, triphenylphosphine, and phosphonium salt is used. The reaction temperature is 90 ° C
To 150 ° C, preferably 115 ° C to 125 ° C.

【0013】この様にして合成されたエポキシ樹脂−酸
無水物付加物((A)成分)はそれのみで、成型時の樹
脂流れが少なく、回路埋め込み性が良く、可とう性、難
燃性のある物質であるが、耐熱性がやや不足する。従っ
て、耐熱性を持たす為に、さらにエポキシ樹脂を加えて
加熱硬化させることが必要である。
The epoxy resin-acid anhydride adduct (component (A)) synthesized in this manner alone is used. The resin flow during molding is small, the circuit embedding property is good, the flexibility and the flame retardancy are good. Although it is a substance with heat, its heat resistance is slightly insufficient. Therefore, in order to have heat resistance, it is necessary to further add an epoxy resin and heat and cure.

【0014】(B)成分であるエポキシ樹脂としては、
硬化後の可とう性等の物性を落とさず耐熱性を上げるも
ので、芳香族系で且つエポキシ当量が4500g/eq
〜100g/eqのものが良い。エポキシ当量が450
0g/eqを越えると、加えるエポキシ樹脂の量が多く
なり、エポキシ樹脂−酸無水物付加物((A)成分)の
物性を損なう事になり、且つ、架橋密度が低くなり望ま
しい耐熱性のある硬化膜が得られないことがある。又、
脂肪族系のエポキシ樹脂では可とう性は出ても耐熱性が
出ないことがある。又、エポキシ当量が100g/eq
未満では加えるエポキシ樹脂の量が少なくなり、硬化物
の架橋密度が密となり、固くて脆いものとなり、可とう
性がなくなってしまう。尚、(B)成分のエポキシ当量
は好ましくは、150g/eq〜3500g/eq、よ
り好ましくは200g/eq〜2500g/eqであ
る。本発明組成物に適したエポキシ樹脂を例示すると、
ビスフェノールA型エポキシ樹脂、ビスフェノールF型
エポキシ樹脂、ビスフェノールA,F共縮合型エポキシ
樹脂、ノボラック型エポキシ樹脂、ビフェニル型エポキ
シ樹脂、ジシクロペンタジエン−フェノール系共縮合型
エポキシ樹脂、、及びそれらのハロゲン置換体等が挙げ
られる。
The epoxy resin as the component (B) includes:
It is intended to increase heat resistance without deteriorating physical properties such as flexibility after curing. It is aromatic and has an epoxy equivalent of 4500 g / eq.
It is preferable that the thickness is up to 100 g / eq. Epoxy equivalent is 450
If it exceeds 0 g / eq, the amount of the epoxy resin to be added will increase, and the physical properties of the epoxy resin-anhydride adduct (component (A)) will be impaired, and the crosslink density will be low, resulting in desirable heat resistance. A cured film may not be obtained. or,
An aliphatic epoxy resin may exhibit flexibility but not heat resistance. In addition, the epoxy equivalent is 100 g / eq.
If the amount is less than the above, the amount of the epoxy resin to be added becomes small, the crosslink density of the cured product becomes high, the material becomes hard and brittle, and the flexibility is lost. The epoxy equivalent of the component (B) is preferably 150 g / eq to 3500 g / eq, more preferably 200 g / eq to 2500 g / eq. Illustrating an epoxy resin suitable for the composition of the present invention,
Bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol A, F co-condensation type epoxy resin, novolak type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene-phenol type co-condensation type epoxy resin, and halogen substitution thereof Body and the like.

【0015】本発明に於けるエポキシ樹脂組成物には、
銅箔に塗布する時に適度の粘性を保つ為に、溶剤を用い
ても良い。粘度調整用の溶剤としては、100℃〜15
0℃の溶剤乾燥時にエポキシ樹脂組成物中に残存しない
もので、トルエン、キシレン、メチルエチルケトン、メ
チルイソブチルケトン、ジオキサン、エタノール、イソ
プロピルアルコール、メチルセルソルブ、エチルセルソ
ルブ、シクロヘキサノン等が挙げられる。
The epoxy resin composition according to the present invention comprises:
A solvent may be used in order to maintain an appropriate viscosity when applying to a copper foil. As a solvent for adjusting viscosity, 100 ° C. to 15
It does not remain in the epoxy resin composition when the solvent is dried at 0 ° C., and examples thereof include toluene, xylene, methyl ethyl ketone, methyl isobutyl ketone, dioxane, ethanol, isopropyl alcohol, methyl cellosolve, ethyl cellosolve, and cyclohexanone.

【0016】本発明のエポキシ樹脂組成物では、耐熱
性、難燃性の付与、低線膨張率化等の為に、シリカ、炭
酸カルシウム、タルク、水酸化アルミニウム、アルミ
ナ、マイカ等を、又、接着力改善の為にエポキシシラン
カップリング剤や、ゴム成分等をエポキシ樹脂組成物の
硬化物物性を落とさない程度に加えても良い。
In the epoxy resin composition of the present invention, silica, calcium carbonate, talc, aluminum hydroxide, alumina, mica and the like are used for the purpose of imparting heat resistance, flame retardancy and low coefficient of linear expansion. In order to improve the adhesive strength, an epoxy silane coupling agent or a rubber component may be added to such an extent that the physical properties of the cured epoxy resin composition are not deteriorated.

【0017】本発明に用いられる硬化促進剤((C)成
分)は、エポキシ樹脂に一般的に使用される促進剤で良
く、アミン系、イミダゾール系、トリフェニルフォスフ
ォニウム、フォスフォニウム塩系等が用いられる。
(C)成分の使用量は、(A)成分+(B)成分に対し
て、50ppm〜50,000ppmが良く、好ましく
は100ppm〜10000ppm、より好ましくは2
00ppm〜5000ppmである。硬化促進剤
((C)成分)の量が50ppmより少ないと加熱硬化
時間が長くなりすぎ、不経済である。50,000pp
mより多いと、接着剤付き銅箔としての貯蔵安定性がな
くなり、商品価値がなくなってしまう。
The curing accelerator (component (C)) used in the present invention may be an accelerator generally used in epoxy resins, and may be an amine-based, imidazole-based, triphenylphosphonium, or phosphonium salt-based accelerator. Are used.
The amount of the component (C) used is preferably 50 ppm to 50,000 ppm, more preferably 100 ppm to 10,000 ppm, and more preferably 2 ppm, based on the component (A) + the component (B).
It is from 00 ppm to 5000 ppm. If the amount of the curing accelerator (component (C)) is less than 50 ppm, the heat curing time is too long, which is uneconomical. 50,000pp
If it is larger than m, the storage stability of the copper foil with the adhesive will be lost, and the commercial value will be lost.

【0018】本発明のエポキシ樹脂組成物を前述した様
な溶剤で15000cps以下望ましくは10000c
ps以下の粘度に調整し、一定の硬化時間を持つように
調整された適量の硬化促進剤を加えてワニス化し銅箔に
塗布し90℃〜150℃で溶剤を揮発させ接着剤付き銅
箔を得る。得られた接着剤付き銅箔を、ドライラミネー
ター等により内層回路基板にラミネートし加熱硬化させ
ることにより、外層銅箔を有する多層プリント配線板を
作成することが出来る。
The epoxy resin composition of the present invention is dissolved in the solvent as described above in a solvent of 15,000 cps or less, preferably 10,000 cps or less.
Adjusted to a viscosity of less than ps, varnished by adding an appropriate amount of a curing accelerator adjusted to have a certain curing time, applied to a copper foil, and evaporated at 90 ° C to 150 ° C to evaporate the solvent to form a copper foil with an adhesive. obtain. By laminating the obtained copper foil with adhesive on an inner circuit board with a dry laminator or the like and curing by heating, a multilayer printed wiring board having an outer copper foil can be prepared.

【0019】[0019]

【実施例、比較例】以下、合成例、実施例及び比較例に
基づき本発明を具体的に説明する。尚、以下の合成例、
実施例及び比較例に於いて、「部」は「重量部」を示
す。尚、合成例1、2及び比較合成例で使用した触媒は
そのまま実施例、比較例における硬化促進剤として作用
するものである。
Examples and Comparative Examples Hereinafter, the present invention will be specifically described based on Synthesis Examples, Examples and Comparative Examples. The following synthesis example,
In Examples and Comparative Examples, "parts" indicates "parts by weight". The catalysts used in Synthesis Examples 1 and 2 and Comparative Synthesis Example serve as curing accelerators in Examples and Comparative Examples as they are.

【0020】合成例1 ビスフェノールAジグリシジルエーテルとテトラブロム
ビスフェノールAの共縮合物である臭素化ビスフェノー
ルA型エポキシ樹脂、具体的にはYPB−40A40
(東都化成製、水酸基当量364.7g/eq、エポキ
シ当量13500g/eq、臭素含有量25%、シクロ
ヘキサノン溶媒、固形分濃度40.9%、以下NV.と
略す、重量平均分子量30000)を600部、メチル
ヘキサヒドロ無水フタル酸(無水酸当量:168g/e
q)を50部、触媒として2エチル4メチルイミダゾー
ル0.7部を1lのセパラブルフラスコに仕込み、撹拌
しながら110℃まで徐々に昇温していった。反応温度
105℃〜125℃を保ちながら7時間撹拌した後、シ
クロヘキサノン88.5部を加え、酸価57.2KOH
mg/g、NV.40.0%のエポキシ樹脂−酸無水物
付加物のシクロヘキサノンワニスを738.5部得た。
この樹脂を合成樹脂ワニスIとした。この樹脂の性状を
表1に示した。
Synthesis Example 1 Brominated bisphenol A type epoxy resin which is a co-condensate of bisphenol A diglycidyl ether and tetrabromobisphenol A, specifically YPB-40A40
(Toto Kasei, hydroxyl equivalent 364.7 g / eq, epoxy equivalent 13500 g / eq, bromine content 25%, cyclohexanone solvent, solid content concentration 40.9%, hereinafter abbreviated as NV, weight average molecular weight 30,000) 600 parts , Methyl hexahydrophthalic anhydride (acid equivalent: 168 g / e
50 parts of q) and 0.7 parts of 2-ethyl 4-methylimidazole as a catalyst were charged into a 1 l separable flask, and the temperature was gradually raised to 110 ° C. while stirring. After stirring for 7 hours while maintaining the reaction temperature at 105 ° C to 125 ° C, 88.5 parts of cyclohexanone was added, and the acid value was 57.2 KOH.
mg / g, NV. 738.5 parts of cyclohexanone varnish of 40.0% epoxy resin-acid anhydride adduct was obtained.
This resin was designated as synthetic resin varnish I. Table 1 shows the properties of this resin.

【0021】合成例2 ビスフェノールAジグリシジルエーテルとテトラブロム
ビスフェノールAの共縮合物である臭素化ビスフェノー
ルA型エポキシ樹脂、具体的にはYPB−40XM40
(東都化成製、水酸基当量365.5g/eq、エポキ
シ当量13000g/eq、臭素含有量25%、キシレ
ン、MEK溶媒、NV.40.5%、重量平均分子量3
0000)を600部、メチルヘキサヒドロ無水フタル
酸(酸無水当量:168g/eq)を30部、n−ブチ
ルトリフェニルフォスフォニウムブロマイドを1.3部
を1lのセパラブルフラスコに仕込み、撹拌しながら1
10℃まで徐々に昇温していった。反応温度105℃〜
125℃を保ちながら4時間撹拌した後、ベンゾフェノ
ンテトラカルボン酸二無水物(酸無水当量:225g/
eq)を20部加えさらに4時間撹拌し、水を5部添加
してさらに1時間撹拌した後MEKを77.5部加え、
酸価85.3KOHmg/g、NV.40.0%のエポ
キシ樹脂−酸無水物付加物のキシレン、MEKワニスを
732.5部得た。この樹脂を合成樹脂ワニスIIとし
た。この樹脂の性状を表1に示した。
Synthesis Example 2 Brominated bisphenol A type epoxy resin which is a cocondensate of bisphenol A diglycidyl ether and tetrabromobisphenol A, specifically YPB-40XM40
(Toho Kasei, hydroxyl equivalent 365.5 g / eq, epoxy equivalent 13000 g / eq, bromine content 25%, xylene, MEK solvent, NV 40.5%, weight average molecular weight 3
0000), 30 parts of methylhexahydrophthalic anhydride (acid equivalent: 168 g / eq), and 1.3 parts of n-butyltriphenylphosphonium bromide in a 1 l separable flask, and stirred. While 1
The temperature was gradually raised to 10 ° C. Reaction temperature 105 ° C ~
After stirring for 4 hours while maintaining 125 ° C., benzophenonetetracarboxylic dianhydride (acid anhydride equivalent: 225 g /
eq) was added, and the mixture was further stirred for 4 hours. 5 parts of water was added, and the mixture was further stirred for 1 hour.
Acid value 85.3 KOHmg / g, NV. 732.5 parts of 40.0% xylene of an epoxy resin-anhydride adduct and MEK varnish were obtained. This resin was designated as synthetic resin varnish II. Table 1 shows the properties of this resin.

【0022】合成例3 ビスフェノールAジグリシジルエーテルとテトラブロム
ビスフェノールAの共縮合物である臭素化ビスフェノー
ルA型エポキシ樹脂、具体的にはYPB−40XM40
(前述)を600部、トリメリット酸無水物(酸無水当
量:192g/eq)を51部、トリエチレンジアミン
0.5部を1lのセパラブルフラスコに仕込み、撹拌し
ながら110℃まで徐々に昇温していった。反応温度1
05℃〜125℃を保ちながら5時間撹拌した後MEK
を84部加え、酸価102KOHmg/g、NV.4
0.0%のエポキシ樹脂−酸無水物付加物のキシレン、
MEKワニス735部を得た。この樹脂を合成樹脂ワニ
スIIIとした。この樹脂の性状を表1に示した。
Synthesis Example 3 Brominated bisphenol A type epoxy resin which is a cocondensate of bisphenol A diglycidyl ether and tetrabromobisphenol A, specifically YPB-40XM40
600 parts (described above), 51 parts of trimellitic anhydride (acid anhydride equivalent: 192 g / eq) and 0.5 parts of triethylenediamine were charged into a 1-liter separable flask, and the temperature was gradually raised to 110 ° C. while stirring. It began to. Reaction temperature 1
After stirring for 5 hours while maintaining the temperature between 05 ° C and 125 ° C, MEK
, And an acid value of 102 KOH mg / g, NV. 4
0.0% of an epoxy resin-anhydride adduct xylene,
735 parts of MEK varnish were obtained. This resin was designated as synthetic resin varnish III. Table 1 shows the properties of this resin.

【0023】比較合成例 ビスフェノールAジグリシジルエーテルとテトラブロム
ビスフェノールAの共縮合物である臭素化ビスフェノー
ルA型エポキシ樹脂、具体的にはYPB−40XM40
(前述)を600部、メチルヘキサヒドロ無水フタル酸
(無水酸当量:168g/eq)を23部、触媒として
2エチル4メチルイミダゾールを0.7部を1lのセパ
ラブルフラスコに仕込み、撹拌しながら110℃まで徐
々に昇温していった。反応温度105℃〜125℃を保
ちながら7時間撹拌した後MEKを42部加え、酸価2
8.6KOHmg/g、NV.40.0%のエポキシ樹
脂−酸無水物付加物のキシレン、MEKワニスを665
部得た。この樹脂を合成樹脂ワニスIVとした。この樹
脂の性状を表1に示した。
Comparative Synthesis Example A brominated bisphenol A type epoxy resin which is a cocondensate of bisphenol A diglycidyl ether and tetrabromobisphenol A, specifically YPB-40XM40
600 parts of the above (described above), 23 parts of methylhexahydrophthalic anhydride (acid equivalent: 168 g / eq), and 0.7 parts of 2-ethyl-4-methylimidazole as a catalyst were charged into a 1-liter separable flask and stirred. The temperature was gradually raised to 110 ° C. After stirring for 7 hours while maintaining the reaction temperature at 105 ° C. to 125 ° C., 42 parts of MEK was added, and the acid value was 2.
8.6 KOH mg / g, NV. Xylene of 40.0% epoxy resin-acid anhydride adduct, MEK varnish was 665
I got a copy. This resin was designated as synthetic resin varnish IV. Table 1 shows the properties of this resin.

【0024】[0024]

【表1】 [Table 1]

【0025】実施例1 合成例1で得られた合成樹脂ワニスIを227.5部、
YD−014(東都化成製、エポキシ当量954g/e
q、軟化点98℃、ビスフェノールA型エポキシ樹脂)
を50部、YDB−400(東都化成製、エポキシ当量
405g/eq、軟化点70℃、臭素含有量48.5
%、臭素化ビスフェノールA型エポキシ樹脂)を16.
3部加え、均一に撹拌混合し、エポキシ樹脂組成物ワニ
スを得た。このワニスを厚さ35μmの銅箔のアンカー
面に溶剤乾燥後の樹脂厚みが60μmになるようにロー
ラーコーターにて塗布し、130℃〜140℃、15分
で溶剤乾燥を行って接着剤付き銅箔を得た。一方、模擬
内層回路基板として、線間200μmピッチの銅黒化処
理済みのガラスエポキシ銅張両面板積層板を用いた。こ
の模擬内層回路基板の両面に前記の接着剤付き銅箔をド
ライラミネーターでラミネートし、175℃、1時間加
熱硬化させて、4層のプリント配線板を得た。
Example 1 227.5 parts of the synthetic resin varnish I obtained in Synthesis Example 1 was
YD-014 (Toto Kasei, epoxy equivalent 954 g / e
q, softening point 98 ° C, bisphenol A type epoxy resin)
50 parts, YDB-400 (manufactured by Toto Kasei, epoxy equivalent 405 g / eq, softening point 70 ° C., bromine content 48.5)
%, Brominated bisphenol A type epoxy resin).
3 parts were added and uniformly stirred and mixed to obtain an epoxy resin composition varnish. This varnish is applied to the anchor surface of a copper foil having a thickness of 35 μm using a roller coater so that the resin thickness after solvent drying is 60 μm, and the solvent is dried at 130 ° C. to 140 ° C. for 15 minutes to form a copper with adhesive. A foil was obtained. On the other hand, a glass-epoxy-copper-clad double-sided laminated board having a copper blackening treatment with a pitch of 200 μm was used as a simulated inner-layer circuit board. The copper foil with the adhesive was laminated on both sides of the simulated inner layer circuit board with a dry laminator, and heated and cured at 175 ° C. for 1 hour to obtain a four-layer printed wiring board.

【0026】実施例2 合成例1で得られた合成樹脂ワニスIを227.5部、
YDB−500EK80(東都化成製、エポキシ当量5
15g/eq、臭素含有量20.5%、MEKワニス、
NV.80%)を59.7部加え均一に撹拌混合し、エ
ポキシ樹脂組成物ワニスを得た。このワニスを厚さ35
μmの銅箔のアンカー面に溶剤乾燥後の樹脂厚みが60
μmになるようにローラーコーターにて塗布し、溶剤乾
燥を行って接着剤付き銅箔を得た以外は実施例1と全く
同様にしてプリント配線板を得た。
Example 2 227.5 parts of the synthetic resin varnish I obtained in Synthesis Example 1 was
YDB-500EK80 (Toto Kasei, epoxy equivalent 5
15g / eq, bromine content 20.5%, MEK varnish,
NV. (80%) was uniformly mixed with stirring to obtain an epoxy resin composition varnish. Apply this varnish to a thickness of 35
Resin thickness after solvent drying is 60 μm on anchor surface of copper foil of μm.
A printed wiring board was obtained in exactly the same manner as in Example 1 except that the coating was performed with a roller coater so as to have a thickness of μm, and the solvent was dried to obtain a copper foil with an adhesive.

【0027】実施例3 合成例1で得られた合成樹脂ワニスIを227.5部、
YD−014(前述)を50部、YDB−400(前
述)を16.3部、熔融シリカ(電気化学製 FD−2
01S)を30部加え、均一に撹拌混合し、エポキシ樹
脂組成物ワニスを得た以外は実施例1と全く同様にして
プリント配線板を得た。
Example 3 227.5 parts of the synthetic resin varnish I obtained in Synthesis Example 1 was
50 parts of YD-014 (described above), 16.3 parts of YDB-400 (described above), fused silica (FD-2 manufactured by Denki Kagaku)
01S) was added and uniformly stirred and mixed to obtain a printed wiring board in exactly the same manner as in Example 1 except that an epoxy resin composition varnish was obtained.

【0028】実施例4 合成例2で得られた合成樹脂ワニスIIを224部、Y
D−014(前述)を50部、YDB−400(前述)
を20部、YDF−170(東都化成製、エポキシ当量
173g/eq、ビスフェノールF型エポキシ樹脂)を
6部、トリフェニルフォスフィンを0.7部加え均一に
撹拌混合し、エポキシ樹脂組成物ワニスを得た以外は実
施例1と全く同様にしてプリント配線板を得た。
Example 4 224 parts of the synthetic resin varnish II obtained in Synthesis Example 2, Y
50 parts of D-014 (described above), YDB-400 (described above)
, 20 parts of YDF-170 (manufactured by Toto Kasei Co., Ltd., epoxy equivalent 173 g / eq, bisphenol F type epoxy resin), and 0.7 parts of triphenylphosphine, and uniformly stirred and mixed to obtain an epoxy resin composition varnish. A printed wiring board was obtained in exactly the same manner as in Example 1 except for obtaining the printed wiring board.

【0029】実施例5 合成例2で得られた合成樹脂ワニスIIを224部、Y
DB−500EK80(前述)を87.8部、トリフェ
ニルフォスフィンを0.5部加え均一に撹拌混合し、エ
ポキシ樹脂組成物ワニスを得た以外は実施例1と全く同
様にしてプリント配線板を得た。
Example 5 224 parts of the synthetic resin varnish II obtained in Synthesis Example 2, Y
87.8 parts of DB-500EK80 (described above) and 0.5 part of triphenylphosphine were added and uniformly stirred and mixed to obtain a printed wiring board in exactly the same manner as in Example 1 except that an epoxy resin composition varnish was obtained. Obtained.

【0030】実施例6 合成例3で得られた合成樹脂ワニスIIIを226部、
YDB−500EK80(前述)を105.8部加え均
一に撹拌混合し、エポキシ樹脂組成物ワニスを得た以外
は実施例1と全く同様にしてプリント配線板を得た。
Example 6 226 parts of the synthetic resin varnish III obtained in Synthesis Example 3 was used.
105.8 parts of YDB-500EK80 (described above) was added and uniformly stirred and mixed to obtain a printed wiring board in exactly the same manner as in Example 1 except that an epoxy resin composition varnish was obtained.

【0031】実施例7 合成例3で得られた合成樹脂ワニスIIIを226部、
YDB−400(前述)を25部、YD−128(東都
化成製、エポキシ当量185g/eq、ビスフェノール
A型エポキシ樹脂)を19部、MEKを50部加え均一
に撹拌混合し、エポキシ樹脂組成物ワニスを得た以外は
実施例1と全く同様にしてプリント配線板を得た。
Example 7 226 parts of the synthetic resin varnish III obtained in Synthesis Example 3 was used,
25 parts of YDB-400 (described above), 19 parts of YD-128 (manufactured by Toto Kasei, epoxy equivalent: 185 g / eq, bisphenol A type epoxy resin) and 50 parts of MEK were added, and the mixture was uniformly stirred and mixed. A printed wiring board was obtained in exactly the same manner as in Example 1 except that the above was obtained.

【0032】比較例1 比較合成例で得られた合成樹脂ワニスIVを214部、
YDB−500EK80(前述)を28.1部加え均一
に撹拌混合し、エポキシ樹脂組成物ワニスを得た以外は
実施例1と全く同様にしてプリント配線板を得た。
Comparative Example 1 214 parts of the synthetic resin varnish IV obtained in the Comparative Synthesis Example
A printed wiring board was obtained in exactly the same manner as in Example 1 except that 28.1 parts of YDB-500EK80 (described above) was added and uniformly stirred and mixed to obtain an epoxy resin composition varnish.

【0033】比較例2 合成例1で得られた合成樹脂ワニスIを227.5部、
YD−020(東都化成製、エポキシ当量4850g/
eq、軟化点143℃、ビスフェノールA型エポキシ樹
脂)のNV.60%MEK溶液750部を加え均一に撹
拌混合し、エポキシ樹脂組成物ワニスを得た以外は実施
例1と全く同様にしてプリント配線板を得た。
Comparative Example 2 227.5 parts of the synthetic resin varnish I obtained in Synthesis Example 1 was
YD-020 (Toto Kasei, epoxy equivalent 4850 g /
eq, softening point 143 ° C, bisphenol A epoxy resin). A printed wiring board was obtained in exactly the same manner as in Example 1 except that 750 parts of a 60% MEK solution was added and uniformly stirred and mixed to obtain an epoxy resin composition varnish.

【0034】以上のようにして作成した多層プリント配
線板の特性値を表2に示した。
Table 2 shows the characteristic values of the multilayer printed wiring board prepared as described above.

【0035】[0035]

【表2】 [Table 2]

【0036】(試験方法) 半田耐熱性試験:100℃、2時間煮沸後のサンプル
を、n=5で、260℃の半田浴に浸け、全て20秒以
上膨れや剥がれを生じなかったものを〇とした。 回路埋め込み性:外層銅箔を剥がした後の内層回路に、
樹脂が埋め込まれているものを○とした。 ガラス転移温度:接着剤付き銅箔をラミネートせずにそ
のまま加熱硬化させて、銅箔を剥がしたフィルムでTM
A測定を行った。
(Test Method) Solder heat resistance test: A sample after boiling at 100 ° C. for 2 hours was immersed in a solder bath at 260 ° C. at n = 5, and all samples that did not swell or peel for 20 seconds or more were evaluated. And Circuit embedding: In the inner layer circuit after peeling the outer layer copper foil,
The one in which the resin was embedded was evaluated as ○. Glass transition temperature: heat-cured without laminating copper foil with adhesive, and peeled copper foil for TM
A measurement was performed.

【0037】[0037]

【発明の効果】本発明によるエポキシ樹脂組成物を用い
ると、ガラスクロスを用いたプリプレグを作成せずに、
単に接着剤付き銅箔をラミネートするだけで外層銅箔を
有する耐熱性の有る多層プリント配線板を作成でき、製
造工程の単純化や製造コストの低減化が可能となる。一
方、ガラスクロスを用いない為、極薄の多層プリント配
線板を作成することが可能となる。
By using the epoxy resin composition according to the present invention, a prepreg using a glass cloth can be prepared without using a prepreg.
By simply laminating a copper foil with an adhesive, a heat-resistant multilayer printed wiring board having an outer copper foil can be produced, and the manufacturing process can be simplified and the manufacturing cost can be reduced. On the other hand, since no glass cloth is used, an extremely thin multilayer printed wiring board can be produced.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI // C08G 65/28 C08G 65/28 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI // C08G 65/28 C08G 65/28

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 (A)成分が下記式1(化1)で表さ
れ、分子量範囲が10,000から200,000、ハ
ロゲン含有量が5重量%から40重量%、酸価が30m
gKOH/gから250mgKOH/gのエポキシ樹脂
−酸無水物付加物であり、(B)成分がエポキシ樹脂、
(C)成分が硬化促進剤から構成される組成物であっ
て、(A)成分の含有量が20から75重量%からなる
熱硬化型絶縁層形成能を有するエポキシ樹脂組成物。 【化1】 (式1中R、Rは水素原子、炭素数1〜5のアルキ
ル基、ハロゲン原子のいずれかであり、Xは−SO
−、−CH−、−C(CH−、−O−であ
り、lは0または1を表す。Rは水素原子又は式2
(化2)のいずれかであり、水素原子である割合が全R
の85%以下である。 【化2】 式2中Yは酸無水物残基を表し、m=1〜3の整数であ
る。Zは式3(化3)又は−Rのいずれかを示す。 【化3】
(1) The component (A) is represented by the following formula (1), has a molecular weight of 10,000 to 200,000, a halogen content of 5 to 40% by weight, and an acid value of 30 m
an epoxy resin-anhydride anhydride adduct of gKOH / g to 250 mgKOH / g, wherein the component (B) is an epoxy resin,
An epoxy resin composition having a thermosetting insulating layer-forming ability, wherein the component (C) is a composition comprising a curing accelerator, and the content of the component (A) is 20 to 75% by weight. Embedded image (In Formula 1, R 1 and R 2 are any of a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, and a halogen atom, and X is —SO
2 -, - CH 2 -, - C (CH 3) 2 -, - a O-, l represents 0 or 1. R 3 is a hydrogen atom or formula 2
Wherein the proportion of hydrogen atoms is any of R
3 or less than 85%. Embedded image In Formula 2, Y represents an acid anhydride residue, and m is an integer of 1 to 3. Z represents any one of Formula 3 (Formula 3) and -R 3 . Embedded image )
【請求項2】 請求項第1項記載の(B)成分のエポキ
シ樹脂が芳香族系エポキシ樹脂であり、エポキシ当量が
4500g/eq〜100g/eqのものである事を特
徴とする請求項第1項記載のエポキシ樹脂組成物。
2. The epoxy resin according to claim 1, wherein the epoxy resin as the component (B) is an aromatic epoxy resin having an epoxy equivalent of 4500 g / eq to 100 g / eq. 2. The epoxy resin composition according to claim 1.
【請求項3】 請求項第1項又は第2項に記載のエポキ
シ樹脂組成物を銅箔に塗布してなることを特徴とするプ
リント配線板用接着剤付き銅箔。
3. A copper foil with an adhesive for printed wiring boards, wherein the epoxy resin composition according to claim 1 is applied to the copper foil.
JP30858996A 1996-10-14 1996-10-14 Epoxy resin composition Expired - Fee Related JP3656224B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30858996A JP3656224B2 (en) 1996-10-14 1996-10-14 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30858996A JP3656224B2 (en) 1996-10-14 1996-10-14 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPH10120875A true JPH10120875A (en) 1998-05-12
JP3656224B2 JP3656224B2 (en) 2005-06-08

Family

ID=17982863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30858996A Expired - Fee Related JP3656224B2 (en) 1996-10-14 1996-10-14 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JP3656224B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009161629A (en) * 2007-12-28 2009-07-23 Toto Kasei Co Ltd Novel phosphorus-containing flame retardant resin, epoxy resin composition containing the same and cured product thereof
WO2015001764A1 (en) * 2013-07-04 2015-01-08 パナソニックIpマネジメント株式会社 Resin composition, prepreg and laminate board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009161629A (en) * 2007-12-28 2009-07-23 Toto Kasei Co Ltd Novel phosphorus-containing flame retardant resin, epoxy resin composition containing the same and cured product thereof
WO2015001764A1 (en) * 2013-07-04 2015-01-08 パナソニックIpマネジメント株式会社 Resin composition, prepreg and laminate board
JP5967558B2 (en) * 2013-07-04 2016-08-10 パナソニックIpマネジメント株式会社 Resin composition, prepreg and laminate
US10017601B2 (en) 2013-07-04 2018-07-10 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg and laminate board

Also Published As

Publication number Publication date
JP3656224B2 (en) 2005-06-08

Similar Documents

Publication Publication Date Title
JP4530187B2 (en) Curable resin composition containing thermoplastic polyhydroxypolyether resin
JP2001261789A (en) High-molecular weight epoxy resin and resin composition for printed wiring board
EP0858725B1 (en) Multilayer printed circuit board and process for producing the same
JP3809273B2 (en) Epoxy resin composition
US5976699A (en) Insulating adhesive for multilayer printed circuit board
JPH11100562A (en) Interlayer insulation adhesive for multilayer printed wiring board and copper foil
JP3669663B2 (en) Interlayer insulation adhesive for multilayer printed wiring boards
JP3656224B2 (en) Epoxy resin composition
JP3658649B2 (en) Epoxy resin composition
JP4027066B2 (en) Polyhydroxy polyether resin composition, curable resin composition containing the polyhydroxy polyether resin, metal foil with resin, resin film
JP3084351B2 (en) Interlayer insulating adhesive for multilayer printed wiring boards
TW200404864A (en) Epoxy resin composition
JPH11158251A (en) Epoxy resin composition for laminate and prepreg and laminate prepared by using the same
JP3265871B2 (en) Epoxy resin composition for laminated board
JP3703143B2 (en) Interlayer insulating adhesive for multilayer printed wiring board and copper foil with interlayer insulating adhesive for multilayer printed wiring board
JP3305030B2 (en) Epoxy resin composition for electric laminate
JP2826091B2 (en) Insulating adhesive for multilayer printed wiring boards
JPH0971762A (en) Interlaminar insulating adhesive for multilayered printed circuit board
JP3331222B2 (en) Epoxy resin and epoxy resin composition
JP2997945B2 (en) Manufacturing method of epoxy resin
JP2001214147A (en) Interlayer insulating adhesive for multi-layered printed-wiring board
JP2002047334A (en) Epoxy resin composition and electric laminated board
JP3305031B2 (en) Epoxy resin and epoxy resin composition
JP2000239639A (en) Insulating adhesive for additive plating
JP3632823B2 (en) Interlayer insulation adhesive for multilayer printed wiring boards

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040827

A131 Notification of reasons for refusal

Effective date: 20041005

Free format text: JAPANESE INTERMEDIATE CODE: A131

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20050222

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050225

R150 Certificate of patent (=grant) or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees