JPH10119062A - Mold for forming watertight structure and method for forming molding for forming watertight structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce an unnecessary mold part by providing a cavity mold having a recession for wrapping the wrapped part of a subject apparatus while forming a space for the thickness of the apparatus and a mold by the recession of a positioning mold. SOLUTION: A subject apparatus is installed in the recession K3 of a positioning mold 13. Next, a primary cavity mold 11 is installed on the upper side of the mold 13. Molding liquid such as urethane is injected from an injection port P1 into a recession K1 to form a primary molding. The positioning mold 13 is removed. The primary cavity mold is turned over, and a secondary cavity mold 12 is placed on the upper side of the primary cavity mold 11. The molding liquid is injected from an injection port P2 into a recession K2 to form a secondary molding. The recession K2 wraps up the subject apparatus forming a space for the thickness of the molding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold for forming a watertight structure and a mold for forming a watertight structure used for forming a watertight structure in a connector portion of an underwater ultrasonic transducer, a connector of an underwater cable with a connector, and the like. About the method.

[0002]

2. Description of the Related Art In a conventional method of forming a mold for forming a watertight structure, for example, a target device such as an underwater ultrasonic transducer is arranged at the center of a cylindrical mold, and the center of the object is stopped by a stopper pin. After that, a mold liquid such as urethane is injected from an injection port provided on the upper surface of the mold to form a primary mold, and after removing the mold, a mold liquid is formed on the convex portion formed by the stopper pin. Again to form a secondary mold to obtain a watertight structure for the target device.

[0003]

However, in the method for forming a mold for forming a watertight structure according to the above structure, it is necessary to provide a positioning structure such as a stopper pin in the mold, and the size of the positioning structure is inevitably large. There is a problem that the shape of the mold becomes large by that much, and the handling of the mold becomes inconvenient.

Further, since the injection port for injecting the molding liquid is on the upper surface of the mold, air bubbles remain on the back side (lower side) of the target device, and a complete watertight structure cannot be obtained. Therefore, an object of the present invention is to provide a mold for forming a watertight structure and a method for forming a mold for forming a watertight structure, which can reduce unnecessary mold portions and obtain a complete watertight structure.

[0005]

In order to achieve the above object, the present invention provides a watertight structure forming mold for forming a target device in a watertight structure, having a recess for partially enclosing the target device. A positioning die, for wrapping a portion of the target device that is not wrapped by the recess of the positioning die and having an injection port for injecting a molding liquid, with an interval corresponding to the thickness of the target device and the mold. A primary cavity mold having a recess, and a portion having an injection port for injecting a molding liquid and enclosing the target device by the recess of the positioning die is spaced apart from the target device by the thickness of the mold. And a secondary cavity mold having a recess for enclosing the mold while opening the mold.

[0006] In the mold for forming a watertight structure, the target device can be positioned by enclosing it in the recess of the positioning die. Therefore, a positioning structure is not required, and the miniaturization of the mold can be realized.
In order to achieve the above object, the present invention provides a watertight structure forming method for forming a target device into a watertight structure, wherein the positioning type recess having a recess for enclosing a part of the target device is provided. Encloses the target device, and then has an injection port for injecting molding liquid and spaces the unenclosed portion of the target device by the recess of the positioning mold by the thickness of the target device and the mold. A primary cavity mold having a cavity for wrapping is placed, and a molding liquid is injected into the space from the inlet of the primary cavity mold to form a primary mold, and then a molding liquid of the primary mold is formed. When the fluid loses fluidity, the positioning mold is removed, and then the mold has an injection port for injecting a molding liquid and the recess is formed in the positioning mold. A secondary cavity mold having a cavity for enclosing the wrapped portion of the device with the target device at an interval corresponding to the thickness of the mold is installed, and the mold is molded from the inlet of the secondary cavity mold to the space. A method for forming a mold for forming a watertight structure, characterized by forming a secondary mold continuous with the primary mold by injecting a liquid.

In the molding method for forming a watertight structure,
When forming the next mold, the molding liquid is injected from the injection port of the primary cavity type, and when forming the secondary mold, the molding liquid is injected from the injection port of the secondary cavity type. It will be formed on the side. When forming the primary mold, the positioning mold is on the lower side and the primary cavity mold is on the upper side. When forming the secondary mold, the primary mold is on the lower side and the secondary cavity mold is on the upper side. For example, since the mold is always formed only on the upper side, air bubbles hardly remain, and a complete watertight structure can be obtained without air bubbles remaining on the back side of the target device.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in more detail with reference to the embodiments shown in the drawings. Note that the present invention is not limited by this. FIG. 1 is an exploded sectional view of a mold for forming a watertight structure according to an embodiment of the present invention.

The mold 10 for forming a watertight structure has the following features.
It comprises a secondary cavity mold 11, a secondary cavity mold 12, and a positioning mold 13. The primary cavity 11
Is made of, for example, metal, and has a recess K1 for forming a mold.
And an inlet P1 connected to the recess K1. The secondary cavity 12, like the primary cavity mold 11, is made of, for example, metal and has a cavity K2 for forming a mold and an injection port P2 connected to the cavity K2.

The positioning die 13 is made of metal or Teflon resin or silicon resin or nylon resin or nylon rubber or silicon rubber coated with Teflon or silicon so as to ensure release properties without using a release agent. And has a recess K3 for enclosing a part of a target device such as an underwater ultrasonic transducer or a connector portion of an underwater cable with a connector.

Next, the mold 10 for forming the watertight structure is described.
In the following, a molding method for forming a watertight structure will be described. First, as shown in FIG. 2A, the target device 14 is installed in the depression K3 of the positioning die 13. Thereby, the target device 14 is positioned. In addition, c is a cable.

Next, as shown in FIG. 2B, the primary cavity mold 11 is placed above the positioning mold 13. The depression K1 is shaped so as to wrap the target device 14 with an interval corresponding to the thickness of the mold. Next, as shown in FIG. 2C, a molding liquid L1 such as urethane is injected from the injection port P1 into the depression K1 to form a primary mold.

Next, when the molding liquid L1 loses fluidity, as shown in FIG.
Remove. When the molding liquid L1 is urethane, it is generally completely cured in about 5 hours at 60 ° C, but loses fluidity in about 1 to 2 hours at 60 ° C. Next, as shown in FIG. 3B, the primary cavity mold is turned over, and the secondary cavity mold 12 is placed above the primary cavity mold 11. The depression K2 is shaped so as to surround the target device 14 with an interval corresponding to the thickness of the mold.

Next, as shown in FIG. 3 (c), a molding liquid L2 such as urethane is injected from the injection port P2 into the recess K2.
To form a secondary mold. In this state, the mold liquids L1 and L2 are completely cured and the primary cavity mold 1
The primary and secondary cavity molds 12 are removed. Thereby, a watertight structure is formed in the target device.

Since the surface of the positioning mold 13 is not coated with the release agent, sufficient adhesion is obtained at the interface between the target device 14 and the secondary mold, and the watertightness is improved. Also, since the molding liquid L2 is injected into the secondary cavity mold before the molding liquid L1 is completely cured (when the molding liquid loses fluidity), sufficient chemical bonding is performed at the interface between the primary mold and the secondary mold. And watertightness is improved.

According to the mold 10 for forming a watertight structure, a part of the target device 14 is formed by the depression K3 of the positioning die 13.
Since positioning can be performed by enclosing the mold, unnecessary mold portions can be reduced. Also, when forming the primary mold, the molding liquid L1 is injected from the injection port P1 of the primary cavity mold 11, and when forming the secondary mold, the molding liquid L2 is injected from the injection port L2 of the secondary cavity mold 12. Therefore, the mold is always formed only on the upper side, and no bubbles remain on the back side of the target device 14.

[0017]

As described above, the present invention provides a positioning mold having a recess for enclosing a part of a target device, and an injection port for injecting a molding liquid and having the recess of the positioning mold. A primary cavity mold having a cavity for enclosing an unenclosed portion of a target device with the target device at an interval corresponding to the thickness of the mold, and a positioning die having an injection port for injecting a molding liquid and A mold for forming a water-tight structure, comprising: a secondary cavity mold having a cavity for enclosing a portion of the target device wrapped by the recess at a distance corresponding to the thickness of the mold with the target device. To form Thus, since the target device can be positioned by being wrapped in the positioning-type recess, it is not necessary to separately provide a configuration for positioning, an unnecessary mold portion can be reduced, and the size of the mold can be reduced.

[Brief description of the drawings]

FIG. 1 is an exploded cross-sectional view of a mold for forming a watertight structure according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of forming a primary mold.

FIG. 3 is an explanatory view of forming a primary mold.

[Explanation of symbols]

 Reference Signs List 10 Mold for forming watertight structure 11 Primary cavity mold 12 Secondary cavity mold 13 Positioning mold K1, K2, K3 Recess P1, P2 Inlet 14 Target device

Claims (3)

[Claims] 1. A mold for forming a watertight structure for making a target device a watertight structure, comprising: a positioning die having a recess for enclosing a part of the target device; and an injection port for injecting a molding liquid; A primary cavity mold having a cavity for enclosing a part of the target device which is not wrapped by the cavity of the positioning mold with an interval corresponding to a thickness of the mold with the target device; A secondary cavity mold having an inlet and having a recess for enclosing the portion of the target device wrapped by the recess of the positioning mold at a distance corresponding to the thickness of the target device and the mold; A mold for forming a watertight structure, characterized in that: 2. The mold for forming a watertight structure according to claim 1, wherein the positioning mold is made of Teflon or silicon-coated metal, Teflon resin, silicon resin, nylon resin, or silicon rubber. Characteristic mold for forming watertight structure. 3. A method for forming a watertight structure for forming a target device in a watertight structure, wherein the target device is wrapped in a positioning-type recess having a recess for partially enclosing the target device. 1 having a cavity for injecting a molding liquid and having a cavity for wrapping an unenclosed portion of the target device by the cavity of the positioning mold with an interval corresponding to a thickness of the mold with the target device. A primary cavity mold is installed, and a molding liquid is injected into the space from the injection port of the primary cavity mold to form a primary mold. Next, when the molding liquid of the primary mold loses fluidity, The positioning mold is removed. Next, the mold has an inlet for injecting a molding liquid, and the target device is wrapped by the recess of the positioning mold. A secondary cavity mold having a cavity for enclosing the part with an interval corresponding to the thickness of the target device and the mold, and injecting the molding liquid into the interval from the injection port of the secondary cavity mold, A method for forming a mold for forming a watertight structure, comprising forming a secondary mold continuous with a primary mold.