JPH1011809A - Method for molding optical disk and molding device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the cooling time in molding cycle and to improve the production efficiency by executing the molding stage for every independent stage and averting the receipt of the influence of temp. during the molding stage. SOLUTION: Metal molds are introduced in a prescribed temp. state and a clamped state by a prescribed mold clamping pressure to the packing stage. The metal molds right after the introduction to the packing stage are so adjusted as to have the positions respectively in contact with the stationary metal molds and the moving metal molds and the positional relations optimum for a plasticizing section 103 by tilt correcting mechanisms 101, 102. Hot water of 60 deg.C is supplied to the metal molds to rapidly drop the temp. of a molten resin material in the first cooling stage introduced right after the completion of the packing. The metal molds are thereafter introduced to the second cooling stage. The metal molds cooled to the prescribed temp. by the cooling stage are introduced to the molded substrate taking-out stage.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical disk molding method and an optical disk molding apparatus for molding an optical disk by injection molding, and more particularly, to performing each step for injection molding on an independent stage and controlling a mold temperature. TECHNICAL FIELD The present invention relates to a method of molding an optical disc and a molding apparatus for the same, in which process conditions such as the above can be adjusted for each process.

[0002]

2. Description of the Related Art Conventionally, an optical disk substrate is usually formed by an injection molding method or an injection molding compression molding method.
In these molding methods, a mold composed of two parts, a fixed side and a movable side, is used. For forming the optical disk substrate, an annular flat stamper on which preformat information is recorded as unevenness information is mounted on one of the fixed mold and the movable mold, and formed between the two molds. The molten resin material in the cavity (for example,
Polycarbonate resin) was injected, cooled and solidified, and then taken out as an optical disk substrate to perform molding.

At present, the CD-R substrate has a groove width of 0.4 to 0.6 μm, a groove depth of 1300 to 1700 °, and a track pitch of about 1.6 μm. In recent years, where a large capacity is required, the groove shape has been developed in a direction in which both the groove width and the track pitch are narrow and the groove depth is in a deep direction. Further, the relationship between the groove width and the width of the convex portion (referred to as a land portion) between the groove extends to groove width> land portion width.

[0004] However, when the groove shape is made fine as described above, there occurs a problem that the groove of the stamper becomes difficult to be transferred to the substrate during molding.

That is, during injection molding, molten resin is charged into the mold cavity under pressure. However, the molten resin does not easily flow into the narrow groove (recess) of the stamper, and the bottom of the recess is not filled with molten resin. . As a result, the projections and depressions of the substrate and the stamper are reversed, so that the projections of the substrate are low and the shoulders of the lands are sagged.

Further, in the above case, there is a problem that the reduction in the transfer rate appears particularly remarkably in the outer peripheral portion in the radial direction, or becomes non-uniform in the circumferential direction. Due to this problem, a predetermined signal level may not be obtained or noise may be generated on the signal.

Therefore, conventionally, in order to solve such a problem, the temperature of the mold is set high and the temperature of the molten resin at the time of filling is set high.

[0008]

As described above, in the prior art as described above, the flowability of the resin is increased by setting the temperature of the molten resin at the time of filling the mold and filling to increase the transferability. Has been improved. However, since the accuracy of the mechanical properties such as warpage and runout cannot be obtained,
A longer cooling time is required, so that a longer tact time is required, and a so-called molding cycle becomes longer, resulting in a problem of lowering production efficiency.

Further, as described above, as the cooling time is extended, as shown in FIG. 6, the amplitude width (fluctuation width) of the temperature transition in the mold increases, and the temperature distribution in the mold becomes uneven. Therefore, there is a problem that optical quality is deteriorated.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and in forming a large-capacity substrate, by maintaining a small fluctuation width of a temperature transition in a mold, required characteristics are maintained, and a molding tact time is maintained. The purpose is to maintain or shorten the time and improve the production efficiency.

[0011]

According to a first aspect of the present invention, there is provided a method for molding an optical disk, the method comprising the steps of: Is performed using an independent process stage.

In other words, by performing the molding process for each independent process stage, it is possible to avoid being affected by the temperature between each process in the molding process, so that the cooling time in the molding cycle is shortened and the production efficiency is reduced. As a result, the temperature fluctuation width in the mold is reduced, so that the molding quality suitable for a large capacity is maintained or improved.

According to a second aspect of the present invention, there is provided a molding apparatus having a vertical structure for molding an optical disk by injection molding, comprising: a plurality of dies; An adjusting mechanism and at least one injection mechanism are provided.

That is, in particular, by providing a plurality of temperature control mechanisms in the molding apparatus, it is possible to avoid being affected by the temperature between each step in the molding process. Efficiency is improved, and the temperature fluctuation width in the mold is reduced, so that molding quality suitable for large capacity is maintained or improved.

According to a third aspect of the present invention, there is provided an optical disk molding apparatus comprising: a molding stage for filling a resin material; a cooling stage for cooling a mold; It has a plurality of independent stages including a molded substrate take-out stage for taking out the substrate and a temperature raising stage for raising the temperature of the mold.

That is, a filling stage, a cooling stage,
By independently providing the molded substrate unloading stage and the temperature raising stage, it is possible to avoid the influence of temperature between each step in the molding process, so that the cooling time in the molding cycle is shortened and the production efficiency is reduced. In addition, the temperature fluctuation width in the mold is reduced, and the molding quality suitable for large capacity is maintained or improved.

According to a fourth aspect of the present invention, in the optical disk molding apparatus, the cooling stage and the temperature raising stage according to the third aspect use different temperature adjusting media for cooling and temperature raising respectively.

That is, when the temperature of the mold is controlled in the cooling stage and the heating stage, by using different temperature adjusting media for each of the cooling and the heating, the cooling and the heating can work efficiently and the handling of the medium is simple. Therefore, the conversion of the conventional equipment is simplified.

Further, in the optical disk molding apparatus according to the fifth aspect, the temperature adjusting medium according to the fourth aspect is characterized in that:
The cooling stage includes hot water, and the heating stage includes heating steam and hot water.

That is, when the temperature of the mold is controlled in the cooling stage and the heating stage, the cooling and heating are efficiently performed by using hot water for the cooling stage and heating steam and hot water for the heating stage. It works well, and the handling of the media is simple and the conversion of conventional equipment is easy.

Further, in the optical disk molding apparatus according to the sixth aspect, in the cooling stage according to the third aspect, the mold temperature is adjusted in multiple stages.

That is, when the temperature of the mold in the cooling stage is adjusted, the temperature of the mold is adjusted in multiple stages, so that unnecessary heat shock is not applied to the molded substrate. Temperature control becomes possible.

In the optical disk molding apparatus according to the seventh aspect, in the multi-stage cooling in the cooling stage according to the sixth aspect, at least the first stage (T1) and the second stage (T2) T1 <T1 <
This is set to T2.

That is, when performing mold temperature control in the cooling stage, the temperature relationship of the cooling temperature control medium is determined in the first stage (T
1) By setting two stages in the relationship of <second stage (T2), unnecessary heat shock is not applied to the molded substrate, so that quick and highly accurate temperature control can be performed.

Further, in the optical disk molding apparatus according to the eighth aspect, in the substrate take-out stage according to the third aspect, the mold temperature is adjusted at 70 ° C. or higher.

That is, by taking out the substrate at a mold temperature adjustment of 70 ° C. or more, the clearance between the sliding parts of the mold is secured, so that no contamination occurs due to the friction between the sliding parts. In addition, the life of the sliding parts is extended, the productivity is improved, and the cost for mold maintenance is reduced.

Further, in the optical disk molding apparatus according to the ninth aspect, in the temperature rising stage according to the third aspect, the mold temperature is adjusted in multiple stages.

That is, when the temperature of the mold is controlled in the heating stage, the temperature of the mold is adjusted in multiple stages, so that unnecessary heat shock is not applied to the molded substrate. Accurate temperature control becomes possible.

Further, in the optical disk molding apparatus according to the tenth aspect, in the multi-stage cooling in the cooling stage according to the ninth aspect, the temperature of the heating medium in the first stage is at least 130 ° C. or less. , The second stage (T3) and the third stage
The temperature relationship of the temperature-raising temperature control medium with the stage (T4) is expressed as T3> T
4 is set.

That is, when performing mold temperature control in the temperature raising stage, the temperature relation of the temperature control medium is set to 130 ° C. or less in the first stage, and the second stage (T3)> second stage
By setting three stages in relation to the stage (T4), unnecessary heat shock is not applied to the molded substrate, so that quick and highly accurate temperature control can be performed.

In the optical disk molding apparatus according to the eleventh aspect, in the cooling stage and the temperature raising stage according to the third aspect, the mold temperature control medium for heating steam and hot water is selectively used in the mold. Is to be supplied to

That is, in the cooling stage and the heating stage, by supplying the mold temperature control medium of the heating steam and the hot water to the mold selectively, unnecessary heat shock is not given to the molding substrate. Quick and
Highly accurate temperature control becomes possible.

According to a twelfth aspect of the present invention, in the molding method of the first aspect, the method further comprises the step of adjusting the mold temperature to a predetermined temperature with hot water before filling. .

That is, by providing a step of adjusting the mold temperature to a predetermined temperature with hot water before filling, the transferability of information of fine irregularities provided on the stamper is improved, and a high-quality substrate can be obtained. ， The productivity is stable.

According to a thirteenth aspect of the present invention, in the molding apparatus according to the third aspect, a mold temperature adjusting stage for adjusting a mold temperature to a predetermined temperature with hot water before filling. Is further provided.

That is, by providing a mold temperature adjusting stage for adjusting the mold temperature to a predetermined temperature with hot water before filling, the transferability of information of fine irregularities provided on the stamper is improved, and a high quality substrate is provided. And its productivity is stable.

According to a fourteenth aspect of the present invention, in the molding apparatus of the third aspect, the cooling stage and the temperature raising stage are three-dimensionally arranged.

That is, by arranging the cooling stage and the heating stage three-dimensionally, a space-saving molding apparatus is realized.

According to a fifteenth aspect of the present invention, there is provided the optical disk molding apparatus according to the second aspect, further comprising an identification code for identifying a plurality of dies.

That is, even if different stampers, that is, stampers having different groove shapes, are incorporated in the respective dies, a variety of types of substrate molding can be performed by identifying and judging each of the filling stage and the substrate unloading stage using the identification code. It can be produced with one molding device.

According to a sixteenth aspect of the present invention, there is provided the optical disk molding apparatus according to the fourteenth aspect, further comprising an identification code detecting means for detecting the identification code.

That is, even if different stampers, that is, stampers having different groove shapes are incorporated in the respective dies, identification and judgment are made by detecting the identification code by the identification code detecting means in each of the filling stage and the substrate unloading stage. This makes it possible to produce various types of substrate molding with one molding apparatus.

According to a seventeenth aspect of the present invention, there is provided an optical disk molding apparatus, further comprising an identification code detecting means for detecting the identification code according to the fifteenth aspect, in the molded substrate removal stage according to the third aspect. It is a thing.

That is, even if different stampers, that is, stampers having different groove shapes are incorporated in the respective dies, identification and judgment are made by detecting the identification code by the identification code detecting means in each of the filling stage and the substrate unloading stage. This makes it possible to produce various types of substrate molding with one molding apparatus.

An optical disk molding apparatus according to claim 18 is the molding apparatus according to any one of claims 2, 3, 15, and 16, wherein the filling conditions are varied for each mold. It is.

That is, by changing the filling conditions for each individual mold, it becomes possible to produce various kinds of substrate molding with one molding apparatus.

Also, in the optical disk molding apparatus according to the nineteenth aspect, in the molding apparatus according to any one of the second, third, fifteenth and sixteenth aspects, it is possible to sort substrates taken out from individual dies. It is something that is.

That is, since the substrates taken out from the individual molds can be sorted, it is possible to produce various types of substrate molding with one molding apparatus.

In the optical disk molding apparatus according to the twentieth aspect, the filling stage according to the third aspect is further provided with a mold position and tilt correcting means.

That is, by providing the mold position and tilt correcting means, the mold can be accurately arranged with respect to the plasticized portion, so that molding defects caused by the filling of the molten resin can be efficiently prevented. be able to.

According to a twenty-first aspect of the present invention, in the mold temperature adjusting stage according to the thirteenth aspect, a temperature detecting means for detecting that the mold has reached a predetermined temperature. Is further provided.

That is, by detecting that the mold has reached the predetermined temperature at the mold temperature adjustment stage for adjusting the mold temperature to the predetermined temperature with hot water before filling, accurate temperature control can be performed. Therefore, the transferability of the information of the fine irregularities provided on the stamper is improved, and a high-quality substrate is obtained, and the productivity is also stabilized.

[0053]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an optical disk molding method and an optical disk molding apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

[Embodiment] (Structure of Embodiment) FIG. 1 is an explanatory view showing a schematic structure of an injection molding apparatus according to an embodiment. Filling stage ~
FIG. 3 is an explanatory diagram showing up to a molded substrate take-out stage.

FIG. 2 is an explanatory diagram showing a schematic configuration of the injection molding apparatus according to the embodiment and a first mold heating stage to a mold temperature adjusting stage among the process stages.

Here, as will be described later, the stage is constituted by independent stages corresponding to each of four steps of a filling step, a cooling step, a product removing step, and a mold opening / closing step which constitute the injection molding step. In addition, the injection molding apparatus described above
It is called a molding device.

That is, in this molding apparatus, as the stages corresponding to each of the above four steps, a filling stage () for filling the molding material, a cooling stage (,), a molded substrate unloading stage (), a heating stage (-)
Are provided independently. In addition, a mold temperature adjusting stage () to be described later is independently provided.

The cooling and heating stages have a plurality of stages corresponding to the purpose of each stage.
Further, a mold for molding a substrate is installed on each stage, and the above-described injection molding apparatus has eight molds.

1 and 2, reference numeral 101 denotes a movable mold position and tilt correction mechanism as tilt correction means, 102 denotes a fixed mold position and tilt correction mechanism as tilt correction means, and 103 denotes a tilt correction mechanism. Plasticizing section, 10
4 is a filling control box, and 105 is for specifying a mold.
A mold identification sensor as identification code detection means for detecting an identification code (not shown) provided in the mold, 106 is a movable mold clamping mechanism, 107 is a fixed mold clamping mechanism, and 108 is a mold clamping mechanism. Movable optical disk mold, 109 is a fixed optical disk mold, 110 is a movable mold temperature adjustment pipe, 111 is a fixed mold temperature adjustment pipe, 112
Is a molded substrate, 113 is a molded sprue portion, 114 is a stamper on which preformat information is recorded as unevenness information,
Reference numeral 115 denotes a temperature sensor as temperature detecting means for detecting the temperature inside the mold, and 116 denotes a substrate removal control box, 117
Is an in-mold temperature monitoring unit for monitoring the temperature in the mold detected by the temperature sensor 115.

(Operation of Embodiment) Next, the operation of the injection molding apparatus having the above-described configuration during the actual molding process will be described for each of the following process stages.

Filling Stage First, the mold is introduced into the filling stage in a state where the mold is clamped at a predetermined temperature and a predetermined clamping pressure. Immediately after being introduced into this filling stage, the mold is a fixed mold,
Position in contact with each movable mold and tilt correction mechanism 1
01 and 102 are adjusted so that the plasticizer 103 has an optimal positional relationship.

Subsequently, the filling control box 104 identifies the mold by the mold identification sensor 105 and identifies the stamper 114 incorporated in the mold. By this identification operation, the filling mechanism fills the molten resin material under a preset filling condition.

Therefore, even if different stampers 114 are incorporated in each of a plurality of dies, this identification operation can be adapted to the stampers 114.

Cooling Stage The mold that has been completely filled by the filling stage is introduced into the cooling stage while being clamped at a predetermined pressure. This cooling stage includes a first cooling stage and a second cooling stage.

In the first cooling stage, which is introduced immediately after the completion of the filling, hot water of 60 ° C. is supplied to the mold to rapidly lower the temperature of the molten resin material. Thereafter, the mold is introduced into the second cooling stage.

In the second cooling stage, slightly higher temperature hot water is supplied to the hot water supplied in the first cooling stage. In this embodiment, 90 ° C. hot water is supplied. By this operation, the actual temperature of the mold is suppressed from unnecessarily lowering. FIG. 3 shows the actual temperature state of the mold at this time.

By this multi-stage cooling, the temperature of the molten resin material can be efficiently lowered without causing a large cooling distortion, that is, a large birefringence, in the molded substrate due to rapid cooling.

Molded substrate removal stage The mold cooled to a predetermined temperature by the cooling stage is introduced into the molded substrate removal stage. The mold introduced into the molded substrate removal stage is subjected to a mold opening operation for removing the molded substrate 112.

At this time, the board removal control BOX 116
Identifies the mold by the mold identification sensor 105 and determines the stamper 114 incorporated in the mold. By this discriminating operation, the molded substrate take-out hand transports the taken-out molded substrate 112 to a preset installation location and places it.

The temperature adjustment value of the mold at this time is 70
° C or higher. The reason is to ensure clearance between sliding parts in the mold and extend the life of the mold. After removing the molded substrate 112, the mold is shifted to a mold clamping operation, and a cavity is formed again.

Accordingly, even if a different stamper 114 is incorporated in each of a plurality of molds, it is possible to perform a suitable action for the stamper 114 by this discriminating operation.

Mold Heating Stage The mold whose substrate removal and mold clamping have been completed as described above is introduced into a mold heating stage. This mold heating stage is composed of three process stages: a first mold heating stage, a second mold heating stage, and a third mold heating stage.

In the first mold heating stage which is introduced immediately after the mold is clamped, hot water of 120 ° C. is supplied, and the temperature of the mold whose temperature is adjusted to around 90 ° C. is started. Thereafter, the mold is introduced into a second mold heating stage.

In the second mold heating stage, about 20
The heating steam of 0 ° C. is supplied to the mold, and the temperature of the mold is subsequently increased. Next, it is introduced into a third mold heating stage.
In the third mold heating stage, heating steam at about 150 ° C. is supplied to the mold, and the mold is further heated. FIG. 4 shows the actual temperature state of the mold at this time.

The temperature rise of the mold in multiple stages is performed based on the following reasons. In other words, when this injection molding apparatus was initially developed, the heating stage was composed of one stage, and the temperature was raised by using heated steam at about 250 ° C. to rapidly raise the temperature of the mold. . However, when molding was performed by such a heating method, various problems occurred in the components of the mold.

For example, punch rods that operate to form an inner hole in a substrate may be unevenly worn to prevent accurate operation, or a resin material may enter a clearance between components constituting a mirror surface of a mold. Phenomena such as deterioration of substrate quality occur.

As a result of a subsequent investigation, it was found that the above-mentioned problem was caused by a rapid rise in the temperature of the mold. That is,
Applying a heat shock to the mold in order to supply heated steam of approximately 250 ° C to a part (mirror surface temperature control part) of a plurality of mold parts whose temperature is controlled by hot water of approximately 90 ° C. As a result, the temperature distribution becomes unbalanced among the components, and this imbalance has caused the above-mentioned problem.

Therefore, based on the above-mentioned causes, the above-mentioned three heating stages, that is, the first mold heating stage, the second mold heating stage, and the third mold heating stage were invented. It is. Furthermore, in addition to the three heating stages, the temperature control medium used in each stage and the temperature of the medium are independently selected and controlled, so that the temperature distribution between the parts due to a rapid temperature change (heat shock) is hindered. It is possible to efficiently raise the temperature of the mold while maintaining the temperature at a level where there is no gap.

Mold Temperature Adjustment Stage The mold whose temperature has been raised is introduced into the mold temperature adjustment stage. This mold temperature adjustment stage is a series of process stages in the injection molding method of this embodiment, and corresponds to the final stage.

This mold temperature adjusting stage is required to strictly control the mold temperature in order to transfer information (pits and groups) from the stamper 114 incorporated in the mold faithfully. It is provided from.

Up to the third mold heating stage immediately before being introduced into the mold temperature adjustment stage, the actual mold temperature is monitored but not managed. The reason is that it largely depends on the characteristics of the heated steam used for the temperature control medium.

That is, even though the heating steam having a large heat capacity is suitable for rapidly increasing the temperature of the mold, the heat capacity of the heating steam is an obstacle to fine temperature control. For this reason, in this mold temperature adjusting stage, hot water of 140 ° C. is used as a temperature adjusting medium.

Therefore, the mold introduced into the mold temperature adjustment stage is supplied with hot water of 140 ° C.
Temperature adjustment is performed based on the actual mold temperature. For temperature adjustment, the actual temperature of the mold is detected by a temperature sensor 115 provided in the mold, and the temperature of the temperature control medium supplied into the mold is controlled based on the detected information.

Further, a judgment is made as to the correspondence of the mold temperature adjustment stage in the next filling step. That is, if the actual temperature of the mold does not converge within the predetermined temperature range within the time limit (tact), an alarm is issued to notify the operator of the occurrence of an abnormality, or the filling is not performed in the next filling step. After passing through a series of process stages, it is possible to take measures such as passing through a predetermined temperature raising process again in the mold temperature raising stage, then introducing again into the main stage, and returning to the original substrate forming process. .

As described in the above embodiment, in each stage of mold temperature control, when a deep groove / narrow pitch type substrate is formed, the mold temperature control suitable for the process is performed. As shown in FIG. 5, it was confirmed that the in-mold temperature fluctuation width was smaller than the conventional in-mold temperature fluctuation width (FIG. 6).

[0086]

As described above, according to the method of molding an optical disk according to the present invention (claim 1), the molding process is performed for each of the independent process stages, so that the process between each process in the molding process can be performed. Since the influence of temperature is avoided, the cooling time in the molding cycle is shortened,
The production efficiency is improved, and the temperature fluctuation width in the mold is reduced, so that the molding quality suitable for a large capacity is maintained or improved.

Further, according to the optical disk molding apparatus of the present invention (claim 2), in particular, by providing a plurality of temperature control mechanisms in the molding apparatus, the optical disk is affected by the temperature between each step in the molding process. Therefore, the cooling time in the molding cycle is shortened, the production efficiency is improved, and the temperature fluctuation width in the mold is reduced, so that the molding quality suitable for a large capacity is maintained or improved.

According to the optical disk molding apparatus of the present invention (claim 3), the filling stage, the cooling stage,
By independently providing the molded substrate unloading stage and the temperature raising stage, it is possible to avoid the influence of the temperature between each step in the molding process, so that the cooling time in the molding cycle is shortened and the production efficiency is reduced. In addition, the temperature fluctuation width in the mold is reduced, and the molding quality suitable for large capacity is maintained or improved.

According to the optical disk molding apparatus of the present invention (claim 4), when controlling the temperature of the mold in the cooling stage and the temperature raising stage, different temperature adjusting media are used for cooling / heating. In addition to efficient operation of cooling and heating, the handling of the medium is simple and the conversion of the conventional equipment is simplified.

According to the optical disk molding apparatus of the present invention (claim 5), when performing mold temperature control in the cooling stage and the heating stage, the cooling stage is heated water, and the heating stage is heated steam. In addition, the use of a temperature adjusting medium for hot water enables efficient cooling and heating, and also facilitates handling of the medium and diverting of conventional equipment.

Further, according to the optical disk molding apparatus of the present invention (claim 6), when the temperature of the mold in the cooling stage is adjusted, the mold temperature is adjusted in multiple stages, so that the molding substrate is required. Since the above-mentioned heat shock is not applied, quick and high-precision temperature control becomes possible.

Further, according to the optical disk molding apparatus of the present invention (claim 7), when performing mold temperature control in the cooling stage, the temperature relationship of the cooling temperature control medium is determined in the first stage (T
1) By setting two stages in the relationship of <second stage (T2), unnecessary heat shock is not applied to the molded substrate, so that quick and highly accurate temperature control becomes possible.

Further, according to the optical disk molding apparatus of the present invention (claim 8), the clearance between the sliding parts of the mold is ensured by taking out the substrate at a mold temperature adjustment of 70 ° C. or more. Therefore, contamination due to friction between the sliding parts does not occur, and the life of the sliding parts is prolonged, the productivity is improved, and the cost for mold maintenance is reduced.

According to the optical disk molding apparatus of the present invention (claim 9), when the temperature of the mold is controlled in the heating stage, the temperature of the mold is adjusted in multiple stages, so that the molding substrate is required. Since the above-mentioned heat shock is not applied, quick and high-precision temperature control becomes possible.

According to the optical disk molding apparatus of the present invention, when performing mold temperature control in the temperature raising stage, the temperature relationship of the temperature control medium is determined by the temperature of the temperature control medium in the first stage. Is set to 130 ° C. or less, and three stages are set in the relation of the second stage (T3)> the second stage (T4),
Since no excessive heat shock is applied to the molded substrate, rapid and highly accurate temperature control is possible.

According to the optical disk molding apparatus of the present invention, the cooling steam and the heating stage selectively supply a mold temperature control medium of heated steam and hot water to the mold. As a result, unnecessary heat shock is not applied to the molded substrate, so that quick and highly accurate temperature control can be performed.

Further, according to the optical disk molding method of the present invention (claim 12), the step of adjusting the mold temperature to a predetermined temperature with hot water before filling is provided, so that the fine irregularities provided on the stamper are reduced. The transferability of information is improved, a high-quality substrate is obtained, and the productivity is stabilized.

According to the optical disk molding apparatus of the present invention (claim 13), the mold temperature adjusting stage for adjusting the mold temperature to a predetermined temperature with hot water before filling is provided. The transferability of information with fine irregularities is improved, and a high-quality substrate is obtained, and the productivity is also stabilized.

Further, according to the optical disk molding apparatus of the present invention (claim 14), since the cooling stage and the heating stage are three-dimensionally arranged, a space-saving molding apparatus is realized.

According to the optical disk molding apparatus of the present invention (claim 15), even if different stampers, that is, stampers having different groove shapes are incorporated in the respective dies, the filling stage, the substrate, and the substrate can be identified by the identification code. Since identification and judgment are made at each of the take-out stages, it is possible to produce various types of substrate molding with one molding apparatus.

Further, according to the optical disk molding apparatus of the present invention (claim 16), even if different molds, that is, stampers having different groove shapes are incorporated in the respective dies, the filling stage and the substrate unloading stage can be used separately. Since the identification code is detected and detected by the identification code detection means in (1), it is possible to produce various types of substrate molding with one molding apparatus.

Further, according to the optical disk molding apparatus of the present invention (claim 17), even if different molds, that is, stampers having different groove shapes are incorporated in the respective dies, the filling stage and the substrate take-out stage can be used separately. Since the identification code is detected and detected by the identification code detection means in (1), it is possible to produce various types of substrate molding with one molding apparatus.

According to the optical disk molding apparatus of the present invention (claim 18), the filling conditions can be varied for each individual mold, so that various types of substrate molding can be produced by one molding apparatus. Becomes possible.

Further, according to the optical disk molding apparatus of the present invention (claim 19), it is possible to sort the substrates taken out from the individual dies, so that various types of substrate molding can be performed by one molding apparatus. It becomes possible to produce.

According to the optical disk molding apparatus of the present invention (claim 20), by providing the mold position and tilt correcting means, the mold can be accurately arranged with respect to the plasticized portion. Therefore, molding defects due to the filling of the molten resin can be efficiently prevented.

According to the optical disk molding apparatus of the present invention (claim 21), the mold reaches the predetermined temperature in the mold temperature adjustment stage for adjusting the mold temperature to a predetermined temperature with hot water before filling. By detecting that the stamping is performed, accurate temperature control becomes possible, improving the transferability of the information of fine irregularities provided on the stamper, and obtaining a high-quality substrate and stabilizing the productivity. I do.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a schematic configuration of an injection molding apparatus according to an embodiment and a stage from a filling stage to a stage of taking out a molded substrate among respective process stages.

FIG. 2 is an explanatory diagram illustrating a schematic configuration of an injection molding apparatus according to an embodiment and a first mold temperature rising stage to a mold temperature adjustment stage among each process stage.

FIG. 3 is a graph showing a transition of a mold temperature in a cooling stage according to the embodiment.

FIG. 4 is a graph showing a transition of a mold temperature in a mold heating stage according to the embodiment.

FIG. 5 is a graph showing a change in mold temperature when a deep groove / narrow pitch type optical disk is molded by the molding method according to the embodiment.

FIG. 6 is a graph showing changes in mold temperature when a deep groove / narrow pitch type optical disk is molded by a conventional molding method.

[Explanation of symbols]

 101 Movable mold position and tilt correction mechanism 102 Fixed mold position and tilt correction mechanism 105 Mold identification sensor 106 Movable mold clamping mechanism 107 Fixed mold clamping mechanism 108 Movable optical disk Mold 109 Fixed optical disk mold 112 Molded substrate 114 Stamper 115 Temperature sensor

Claims (21)

[Claims] 1. An optical disk molding method for molding an optical disk by injection molding, wherein each operation in a molding step is performed using an independent process stage. 2. A molding apparatus having a vertical structure for molding an optical disk by injection molding, comprising a plurality of dies, a plurality of mold clamping mechanisms, a plurality of temperature control mechanisms, and at least one injection mechanism. An optical disk molding apparatus characterized in that: 3. A molding apparatus according to claim 2, wherein a filling stage for filling a resin material, a cooling stage for cooling a mold, a molded substrate taking-out stage for taking out a molded substrate, and a temperature rise of the mold. An optical disc molding apparatus, comprising: a plurality of independent stages each including a temperature raising stage for performing a heating step. 4. An optical disk molding apparatus according to claim 3, wherein the cooling stage and the temperature raising stage use different temperature adjusting media for cooling and temperature raising, respectively. 5. The temperature control medium according to claim 4,
An optical disc molding apparatus characterized in that the cooling stage is hot water and the heating stage is heated steam and hot water. 6. An apparatus for molding an optical disk according to claim 3, wherein the temperature of the mold is adjusted in multiple stages in the cooling stage according to claim 3. 7. The multi-stage cooling in the cooling stage according to claim 6, wherein at least the temperature relationship of the cooling temperature control medium in the first stage (T1) and the second stage (T2) is T1 <.
An optical disk molding apparatus, wherein the apparatus is set to T2. 8. An optical disk molding apparatus according to claim 3, wherein the temperature of the mold is adjusted at 70 ° C. or higher in the substrate take-out stage. 9. An optical disk molding apparatus according to claim 3, wherein the temperature raising stage adjusts the mold temperature in multiple stages. 10. The multi-stage cooling in the cooling stage according to claim 9, wherein at least the temperature of the first-stage heating medium is set to 130 ° C. or less, and the second stage (T3) and the third stage
T3> T
An optical disk molding apparatus, wherein the number is set to 4. 11. An optical disc molding apparatus according to claim 3, wherein the cooling stage and the heating stage selectively supply a mold temperature control medium of heated steam and hot water to the mold. 12. The method of molding an optical disk according to claim 1, further comprising a step of adjusting a mold temperature to a predetermined temperature with hot water before filling. 13. The optical disk molding apparatus according to claim 3, further comprising a mold temperature adjusting stage for adjusting the mold temperature to a predetermined temperature with hot water before filling. 14. The molding apparatus according to claim 3, wherein a cooling stage and a heating stage are three-dimensionally arranged. 15. An optical disk molding apparatus according to claim 2, further comprising an identification code for identifying a plurality of dies. 16. An optical disk molding apparatus according to claim 14, further comprising an identification code detecting means for detecting said identification code. 17. An apparatus for molding an optical disk according to claim 3, further comprising an identification code detecting means for detecting the identification code according to claim 15, at the stage of taking out the molded substrate according to claim 3. 18. An optical disk molding apparatus according to claim 2, wherein a filling condition is varied for each mold. 19. An optical disk molding apparatus according to claim 2, wherein the substrates taken out of the individual molds can be sorted. 20. An optical disk molding apparatus according to claim 3, further comprising a mold position and tilt correcting means in the filling stage according to claim 3. 21. An optical disk molding apparatus according to claim 13, further comprising a temperature detecting means for detecting that the mold has reached a predetermined temperature in the mold temperature adjusting stage according to claim 13.