JPH10115527A - Resonator - Google Patents

Resonator

Info

Publication number
JPH10115527A
JPH10115527A JP9331159A JP33115997A JPH10115527A JP H10115527 A JPH10115527 A JP H10115527A JP 9331159 A JP9331159 A JP 9331159A JP 33115997 A JP33115997 A JP 33115997A JP H10115527 A JPH10115527 A JP H10115527A
Authority
JP
Japan
Prior art keywords
vibrating body
electrostatic
resonator
impressing
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9331159A
Other languages
Japanese (ja)
Other versions
JP3351325B2 (en
Inventor
Kenichi Atsuji
健一 厚地
Katsuhiko Tanaka
克彦 田中
Yoichi Mochida
洋一 持田
Kazufumi Moriya
和文 森屋
Tomoyasu Hasegawa
友保 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP33115997A priority Critical patent/JP3351325B2/en
Publication of JPH10115527A publication Critical patent/JPH10115527A/en
Application granted granted Critical
Publication of JP3351325B2 publication Critical patent/JP3351325B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To improve detection sensitivity and make a resonator compact by arranging an electrostatic impressing means for impressing an electrostatic bending tension to a vibration body composed of a weight part and a beam to face the vibrating body via a gap. SOLUTION: An electrostatic impressing means for impressing an electrostatic attraction 15 is arranged to face via a gap 9 a vibrating body 10 formed of a weight part 2 fixed at both ends thereof and a beam 3 by dry etching of a silicon substrate 1 or the like manner. The electrostatic impressing means is constituted of a conductive layer 12 and connected to a conductive pad 14 via a conductive pattern 13. A d.c. voltage is applied to the conductive layer 12 via the conductive pad 14, thereby impressing a force attracting the vibrating body 10 opposed to the conductive layer 12 towards the substrate 1 by an electrostatic attraction. A resonant frequency of the vibrating body is accordingly agreed with a resonant frequency at the design stage. Since the electrostatic attraction is adjusted and the resonant frequency of the vibrating body 10 is adjusted to agree with the resonant frequency set beforehand at the design stage, the resonator 10 is enhanced in sensitivity.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ジャイロ等の共振
子に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resonator such as a gyro.

【0002】[0002]

【従来の技術】図3には、従来の共振子の斜視図が示さ
れている。この共振子16は、従来のシリコンのマイクロ
マシニング技術等を利用して作製した微細素子の共振子
16である。同図において、シリコン基板1上には窒化膜
7およびポリシリコン膜5が形成され、この窒化膜7お
よびポリシリコン膜5を、例えば、ドライエッチング等
によりシリコン基板1の両端固定の重り部2と梁3から
なる振動体10が形成されている。
2. Description of the Related Art FIG. 3 is a perspective view of a conventional resonator. The resonator 16 is a microelement resonator manufactured using a conventional silicon micromachining technology or the like.
It is 16. Referring to FIG. 1, a nitride film 7 and a polysilicon film 5 are formed on a silicon substrate 1. A vibrating body 10 composed of the beam 3 is formed.

【0003】この振動体10の中央部の重り部2の両側に
は、横方向(梁3に対して直交方向)の外側に向かって
櫛形電極6Bが形成されており、櫛形電極6Bと対向す
る位置、すなわち、両側のポリシリコン膜5側の位置
に、横方向の内側に向かって櫛形電極6Aが櫛形電極6
Bに噛み合う状態で配置されている。これら櫛形電極6
A,6Bには、駆動用導体層11A,11Bが接続されてお
り、図示しない導体パターンを介して外部の電極パッド
(図示せず)に接続されて励振器4を形成している。こ
の励振器4の駆動用導体層11A,11Bに交流電圧を印加
すると、櫛形電極6A,6B間に静電力が発生し、この
静電力により重り部2と梁3からなる振動体10は、矢印
Fの横方向(梁3に対して直交方向)に振動するように
なっている。
[0003] On both sides of the weight portion 2 at the center of the vibrating body 10, a comb-shaped electrode 6B is formed outwardly in the horizontal direction (perpendicular to the beam 3), and faces the comb-shaped electrode 6B. At the position, that is, at the position on both sides of the polysilicon film 5, the comb-shaped electrode 6 </ b> A
B are arranged so as to mesh with each other. These comb-shaped electrodes 6
Drive conductor layers 11A and 11B are connected to A and 6B, respectively, and are connected to external electrode pads (not shown) via conductor patterns (not shown) to form the exciter 4. When an AC voltage is applied to the driving conductor layers 11A and 11B of the exciter 4, an electrostatic force is generated between the comb-shaped electrodes 6A and 6B, and the vibrating body 10 composed of the weight 2 and the beam 3 is caused by the electrostatic force. It vibrates in the lateral direction of F (in the direction perpendicular to the beam 3).

【0004】上記構成の共振子16の櫛形電極6A,6B
を駆動して、重り部2と梁3からなる振動体10を横方向
に振動し、この共振子16をZ軸を回転軸として回転させ
ると、図3の紙面に垂直方向にコリオリ力が発生し、こ
のコリオリ力が重り部2と梁3からなる振動体10に加え
られ、振動体10はコリオリ力の方向に振動する。このと
きの振動体10のコリオリ力による振動振幅の大きさに対
応する電気信号を測定することで、例えば、回転の角速
度の大きさを検知するものである。
[0004] Comb-shaped electrodes 6A, 6B of the resonator 16 having the above configuration.
Is driven to vibrate the vibrating body 10 composed of the weight 2 and the beam 3 in the lateral direction, and when the resonator 16 is rotated about the Z axis as a rotation axis, a Coriolis force is generated in a direction perpendicular to the plane of FIG. Then, this Coriolis force is applied to the vibrating body 10 composed of the weight 2 and the beam 3, and the vibrating body 10 vibrates in the direction of the Coriolis force. By measuring an electric signal corresponding to the magnitude of the vibration amplitude due to the Coriolis force of the vibrating body 10 at this time, for example, the magnitude of the angular velocity of rotation is detected.

【0005】[0005]

【発明が解決しようとする課題】ところで、共振子16を
作製する場合、振動体10のコリオリ力の方向(紙面に垂
直方向)の周波数を、予め設計段階で共振周波数に設定
して、振動体10の形状、寸法、重量等をその共振周波数
になるように設計製作するが、振動体10の形状、寸法、
重量等は、シリコンのマイクロマシニング技術の加工精
度により設計通りに作製されない場合が度々あり、振動
体10の共振周波数が設計上の周波数からずれることが度
々発生する。振動体10の振動が共振状態ならば、構造的
に起因するQ(Quality Factor)の値により振幅が飛躍
的に増幅されるが、周波数がずれると増幅が殆どされ
ず、共振子の感度も著しく低下するという問題がある。
そのため、重り部2や梁3を、例えば、面倒な機械加工
等によるトリミングを行い、振動体10の共振周波数を設
計の設定周波数に調整する必要がある。
When the resonator 16 is manufactured, the frequency in the direction of the Coriolis force (perpendicular to the paper surface) of the vibrating body 10 is set to the resonance frequency in the design stage in advance, and the vibrating body 16 is set. The shape, size, weight, etc. of 10 are designed and manufactured so as to be at the resonance frequency.
The weight or the like is often not produced as designed due to the processing accuracy of the silicon micromachining technology, and the resonance frequency of the vibrating body 10 often deviates from the designed frequency. If the vibration of the vibrating body 10 is in a resonance state, the amplitude is dramatically increased by the value of Q (Quality Factor) due to the structure. However, when the frequency is shifted, the amplification is hardly caused, and the sensitivity of the resonator is remarkably increased. There is a problem of lowering.
For this reason, it is necessary to trim the weight portion 2 and the beam 3 by, for example, troublesome machining or the like, and adjust the resonance frequency of the vibrating body 10 to a design frequency.

【0006】しかしながら、前記共振子16は、シリコン
のマイクロマシニング技術を応用して作製した微細な共
振子16のため、機械加工を利用して所望の共振周波数を
得るために必要な微小のトリミング調整部分をトリミン
グしようとしても、面倒な機械加工では加工精度上から
微細な重り部2や梁3を所望の寸法、形状、重量等に削
り加工することは殆ど不可能である。したがって、共振
子16の共振周波数を設定の値に調整することは極めて困
難であった。
However, since the resonator 16 is a fine resonator 16 manufactured by applying a silicon micromachining technique, a minute trimming adjustment necessary for obtaining a desired resonance frequency by using machining is used. Even if an attempt is made to trim the portion, it is almost impossible to cut the fine weight portion 2 or the beam 3 into a desired size, shape, weight, etc. from the viewpoint of processing accuracy by complicated machining. Therefore, it was extremely difficult to adjust the resonance frequency of the resonator 16 to the set value.

【0007】本発明は、上記課題を解決するためになさ
れたものであり、その目的は、面倒なトリミング加工を
行う必要がなく、検知感度が良好で、かつ、極めて小型
の共振子を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an extremely small-sized resonator which does not require troublesome trimming processing, has good detection sensitivity, and has a good detection sensitivity. It is in.

【0008】[0008]

【課題を解決するための手段】本発明は上記目的を達成
するために、次のように構成されている。すなわち、本
発明の共振子は、基板に浮いた状態に配置された重り部
と、この重り部を両側から支持する梁と、重り部を梁の
長さ方向に対して直交する方向に振動する励振器とを有
する共振子において、前記重り部と梁とからなる振動体
に静電曲げ張力を付与する静電印加手段が振動体に間隙
を介して対向配設されていることを特徴として構成され
ている。
The present invention is configured as follows to achieve the above object. That is, the resonator of the present invention has a weight portion arranged in a floating state on the substrate, a beam supporting the weight portion from both sides, and vibrating the weight portion in a direction orthogonal to the length direction of the beam. A resonator having an exciter, wherein electrostatic applying means for applying an electrostatic bending tension to the vibrating body composed of the weight portion and the beam is provided opposite to the vibrating body via a gap. Have been.

【0009】本発明においては、重り部と梁とからなる
振動体に、静電力を付与する静電印加手段を振動体に間
隙を介して対向配設する。この静電印加手段を駆動し、
振動体に静電力を付与すると、振動体は静電印加手段側
に引っ張られ、振動体の共振周波数を低める方向とな
る。したがって、静電印加手段の静電力を制御すること
により、振動体を所望の共振周波数に調整し、共振子の
感度を高める。
In the present invention, an electrostatic applying means for applying an electrostatic force is provided on a vibrating body comprising a weight portion and a beam so as to face the vibrating body with a gap therebetween. By driving this electrostatic application means,
When an electrostatic force is applied to the vibrating body, the vibrating body is pulled toward the electrostatic application unit, and the direction of the vibration body decreases. Therefore, by controlling the electrostatic force of the electrostatic application means, the vibrating body is adjusted to a desired resonance frequency, and the sensitivity of the resonator is increased.

【0010】[0010]

【発明の実施の形態】以下、本発明の実施形態例を図面
に基づいて説明する。図1には、本実施形態例の共振子
が示されている。本実施形態例の説明において、従来例
と同一の名称部分には同一符号を付し、その詳細な重複
説明は省略する。本実施形態例の共振子16は、従来例と
同様に、シリコンのマイクロマシニング技術等を利用し
て作製した微細な素子の共振子である。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a resonator according to this embodiment. In the description of the present embodiment, the same reference numerals are given to the same names as those in the conventional example, and detailed description thereof will be omitted. The resonator 16 of the present embodiment is a fine element resonator manufactured using a silicon micromachining technique or the like, similarly to the conventional example.

【0011】本実施形態例の共振子16は、従来例と同様
に、ドライエッチング等により、シリコン基板1の両端
固定の重り部2と梁3とからなる振動体10を形成し、こ
の振動体10の両側には、重り部2を梁3の長さ方向に対
して直交する方向に振動する櫛形電極6A,6Bの静電
力を利用した励振器4を備えている。
In the resonator 16 of this embodiment, the vibrating body 10 composed of the weights 2 and the beams 3 fixed to both ends of the silicon substrate 1 is formed by dry etching or the like as in the conventional example. On both sides of 10, there are provided exciters 4 using the electrostatic force of the comb-shaped electrodes 6 </ b> A and 6 </ b> B that vibrate the weight 2 in a direction perpendicular to the length direction of the beam 3.

【0012】本実施形態例の共振子16の特徴的なこと
は、シリコン基板1のドライエッチング等により形成し
た両端固定の重り部2と梁3とからなる振動体10に、図
1の(b)に示すように、静電引力15を付与する静電印
加手段を振動体10に間隙9を介して対向配置したことで
ある。この静電印加手段は導電層12からなり、図1の
(a)に示されるように、導電パターン13を介して導電
パッド14に接続されている。
The characteristic feature of the resonator 16 of this embodiment is that the vibrator 10 composed of the weights 2 and the beams 3 fixed at both ends and formed by dry etching of the silicon substrate 1 is shown in FIG. As shown in (1), the electrostatic applying means for applying the electrostatic attractive force 15 is arranged to face the vibrating body 10 with the gap 9 therebetween. This electrostatic application means is composed of a conductive layer 12 and is connected to a conductive pad 14 via a conductive pattern 13 as shown in FIG.

【0013】図2には、本実施形態例の共振子の作製プ
ロセスが示されている。まず、図2の(a)に示すよう
に、シリコン基板1上の外周側に窒化膜7を形成し、基
板1上の中央部には、リンPやボロンBをドープした静
電印加手段としての導電層12を形成する。この導電層12
上に、図2の(b)に示すように、外周側の窒化膜7に
跨った状態で酸化膜等の犠牲層8を形成する。次いで、
図2の(c)に示すように、窒化膜7および犠牲層8上
にポリシリコン膜5を形成し、図2の(d)に示すよう
に、例えば、ドライエッチング等により犠牲層8を除去
して、間隙9を介して振動体としての重り部2を基板1
に浮いた状態で導電層12に対向配置し、共振子16を作製
する。
FIG. 2 shows a manufacturing process of the resonator of this embodiment. First, as shown in FIG. 2A, a nitride film 7 is formed on the outer peripheral side on the silicon substrate 1, and a central portion on the substrate 1 is formed as an electrostatic application means doped with phosphorus P or boron B. Of the conductive layer 12 is formed. This conductive layer 12
As shown in FIG. 2B, a sacrificial layer 8 such as an oxide film is formed over the nitride film 7 on the outer peripheral side. Then
As shown in FIG. 2C, a polysilicon film 5 is formed on the nitride film 7 and the sacrificial layer 8, and as shown in FIG. 2D, the sacrificial layer 8 is removed by, for example, dry etching. Then, the weight 2 serving as a vibrating body is attached to the substrate 1 via the gap 9.
The resonator 16 is fabricated by being arranged opposite to the conductive layer 12 while floating.

【0014】本実施形態例の共振子16は振動体10のトリ
ミングを行う必要がなく、図1に示すように、導電パッ
ド14を介して導電層12に直流電圧を印加し、導電層12の
対向面の振動体10を、静電引力により基板1側に引っ張
る力を付与することにより、振動体10には基板1の方向
に変位するさらに大きな力で引っ張り、基板側と反対方
向に変位したときには引っ張る力が小さくなる。この力
により振動体の共振周波数を設計段階の共振周波数に合
わせられる構成となっている。したがって、前記静電印
加手段によって静電引力を調整し、振動体10の共振周波
数を、予め設計段階で設定した共振周波数になるように
調整することで、共振子16の感度が高められる。
The resonator 16 of the present embodiment does not require trimming of the vibrating body 10, and applies a DC voltage to the conductive layer 12 via the conductive pad 14 as shown in FIG. By applying a force to pull the vibrating body 10 on the opposing surface toward the substrate 1 by electrostatic attraction, the vibrating body 10 is pulled with a larger force displacing in the direction of the substrate 1 and displaced in the direction opposite to the substrate side. Sometimes the pulling force is small. With this force, the resonance frequency of the vibrator can be adjusted to the resonance frequency at the design stage. Therefore, the sensitivity of the resonator 16 can be enhanced by adjusting the electrostatic attractive force by the electrostatic application means and adjusting the resonance frequency of the vibrating body 10 to be the resonance frequency set in advance in the design stage.

【0015】この共振子16の励振器4を駆動して、振動
体10を梁3の長さに直交する方向(横方向)に振動し、
Z軸を回転軸として回転すると、図1の紙面に垂直方向
にコリオリ力が発生し、このコリオリ力が振動体10に加
えられ、振動体10はコリオリ力の方向に振幅する。この
振幅の大きさを測定することで、従来と同様に角速度を
検出するものである。
By driving the exciter 4 of the resonator 16, the vibrating body 10 vibrates in a direction (lateral direction) perpendicular to the length of the beam 3,
When rotated about the Z axis as a rotation axis, a Coriolis force is generated in a direction perpendicular to the plane of FIG. 1, and this Coriolis force is applied to the vibrating body 10, and the vibrating body 10 oscillates in the direction of the Coriolis force. By measuring the magnitude of this amplitude, the angular velocity is detected as in the conventional case.

【0016】本実施形態例によれば、重り部2と梁3と
からなる振動体10に、静電引力15を付与する静電印加手
段としての導電層12を振動体10に間隙を介して対向配設
したので、静電引力15を調整することにより、シリコン
マイクロマシニング技術で作成した微細な共振子16であ
っても、振動体10の垂直方向へ振動する共振周波数を予
め設計段階で設定した共振周波数に調整することができ
る。すなわち、振動体の垂直方向へ振動する共振周波数
を調整して横方向に振動する駆動周波数に近い周波数に
することによって、駆動周波数と同じ周波数で発生する
コリオリ力による垂直方向への振動が共振による増幅で
大きくなる。その結果、この共振子16は、その製造プロ
セスにおいて生じた誤差や使用環境の変化にとらわれる
ことがなく、高感度、高精度で、例えば、角速度検出が
可能となる。
According to this embodiment, the conductive layer 12 as an electrostatic application means for applying an electrostatic attraction 15 to the vibrating body 10 composed of the weight 2 and the beam 3 is interposed between the vibrating body 10 and the gap. Since it is arranged opposite, by adjusting the electrostatic attractive force 15, the resonance frequency that vibrates in the vertical direction of the vibrating body 10 is set in the design stage in advance even for the fine resonator 16 created by the silicon micromachining technology It can be adjusted to the resonance frequency. That is, by adjusting the resonance frequency of the vibrating body to vibrate in the vertical direction to a frequency close to the driving frequency of vibrating in the horizontal direction, the vibration in the vertical direction due to Coriolis force generated at the same frequency as the driving frequency is caused by resonance. Increased by amplification. As a result, the resonator 16 can detect angular velocity with high sensitivity and high accuracy, for example, irrespective of errors caused in the manufacturing process and changes in the use environment.

【0017】本発明は上記実施形態例に限定されること
はなく、様々な実施の態様を採り得る。例えば、上記実
施形態例では、基板1に浮いた状態で、重り部2と梁3
とからなる振動体10を両端固定する構成としたが、この
振動体10を片側固定方式(片持ち梁方式)としてもよ
い。
The present invention is not limited to the above embodiment, but can adopt various embodiments. For example, in the above embodiment, the weight 2 and the beam 3 are floated on the substrate 1.
Although the vibrating body 10 is fixed at both ends, the vibrating body 10 may be of a one-side fixed type (a cantilever type).

【0018】さらに、上記実施形態例では、ジャイロの
共振子について説明したが、本発明の共振子はジャイロ
以外の他の分野にも利用することができる。
Further, in the above embodiment, the gyro resonator has been described, but the resonator of the present invention can be used in other fields other than the gyro.

【0019】さらにまた、上記実施形態例では、静電印
加手段としての導電層12を振動体10の下側に位置する基
板1側に設けたが、この静電印加手段としての導電層12
を振動体10の上側に間隙を介して設けてもよい。
Furthermore, in the above embodiment, the conductive layer 12 as the electrostatic applying means is provided on the substrate 1 side located below the vibrating body 10, but the conductive layer 12 as the electrostatic applying means is provided.
May be provided above the vibrating body 10 with a gap therebetween.

【0020】[0020]

【発明の効果】本発明は、重り部と梁とからなる振動体
に、静電力を付与する静電印加手段を振動体に間隙を介
して対向配設する構成としたので、静電力を調整するこ
とにより、シリコンマイクロマシニング技術で作製した
微細な共振子であっても、所望の共振周波数に調整する
ことができ、この共振子はその製造プロセスにおいて生
じた誤差や使用環境の変化にとらわれることがなく、高
感度、高精度の、例えば、角速度の検出が可能となる。
According to the present invention, the electrostatic force is applied to the vibrating body consisting of the weight and the beam by providing the electrostatic applying means for applying an electrostatic force to the vibrating body with a gap therebetween. By doing so, even a fine resonator manufactured by silicon micromachining technology can be adjusted to the desired resonance frequency, and this resonator is not subject to errors caused in the manufacturing process and changes in the use environment Thus, it is possible to detect, for example, angular velocity with high sensitivity and high accuracy, for example.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本実施形態例の共振子の説明図である。FIG. 1 is an explanatory diagram of a resonator according to an embodiment of the present invention.

【図2】本実施形態例の共振子の製造プロセスの説明図
である。
FIG. 2 is an explanatory diagram of a manufacturing process of the resonator of the embodiment.

【図3】従来の共振子の説明図である。FIG. 3 is an explanatory diagram of a conventional resonator.

【符号の説明】[Explanation of symbols]

1 シリコン基板 2 重り部 3 梁 4 励振器 5 ポリシリコン膜 7 窒化膜 10 振動体 12 静電印加手段としての導電層 15 重り部、梁と静電印加手段との静電引力 DESCRIPTION OF SYMBOLS 1 Silicon substrate 2 Weight part 3 Beam 4 Exciter 5 Polysilicon film 7 Nitride film 10 Vibration body 12 Conductive layer as electrostatic applying means 15 Electrostatic attraction between weight part, beam and electrostatic applying means

───────────────────────────────────────────────────── フロントページの続き (72)発明者 森屋 和文 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 (72)発明者 長谷川 友保 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Kazufumi Moriya 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Stock Company Murata Manufacturing Co., Ltd. (72) Tomoho Hasegawa 2-26-10 Tenjin Nagaokakyo-city, Kyoto Stock Murata Manufacturing Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 基板に浮いた状態に配置された重り部お
よびこの重り部を両側から支持する梁とを備えた振動体
と、この振動体をその長さ方向に対して直交する方向に
振動する励振器と、前記振動体に間隔を介して対向配設
されるとともに、この振動体に静電引力を付与して振動
体の共振周波数を調整する静電印加手段とを備えた共振
子。
1. A vibrating body having a weight portion floating on a substrate and beams supporting the weight portion from both sides, and vibrating the vibrating body in a direction orthogonal to its length direction. A resonator comprising: an exciter to be driven; and an electrostatic applying means arranged opposite to the vibrating body with an interval therebetween, and applying electrostatic attraction to the vibrating body to adjust a resonance frequency of the vibrating body.
JP33115997A 1997-11-14 1997-11-14 Resonator Expired - Lifetime JP3351325B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33115997A JP3351325B2 (en) 1997-11-14 1997-11-14 Resonator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33115997A JP3351325B2 (en) 1997-11-14 1997-11-14 Resonator

Publications (2)

Publication Number Publication Date
JPH10115527A true JPH10115527A (en) 1998-05-06
JP3351325B2 JP3351325B2 (en) 2002-11-25

Family

ID=18240541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33115997A Expired - Lifetime JP3351325B2 (en) 1997-11-14 1997-11-14 Resonator

Country Status (1)

Country Link
JP (1) JP3351325B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005510108A (en) * 2001-11-15 2005-04-14 サントル ナシオナル ドゥ ラ ルシェルシェサイアンティフィク(セエヌエールエス) Method for gap adjustment of two mechanical elements of a substantially planar micromechanical structure and corresponding electromechanical resonator
JP2008200758A (en) * 2007-02-16 2008-09-04 Seiko Epson Corp Mems element, and method for manufacturing thereof
JP2009006479A (en) * 2008-09-30 2009-01-15 Seiko Epson Corp Mems element, and method for manufacturing thereof
JP2012244349A (en) * 2011-05-18 2012-12-10 Nippon Telegr & Teleph Corp <Ntt> Micro mechanical vibrator and method of manufacturing the same
JP2014011532A (en) * 2012-06-28 2014-01-20 Seiko Epson Corp Vibration device, electronic apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005510108A (en) * 2001-11-15 2005-04-14 サントル ナシオナル ドゥ ラ ルシェルシェサイアンティフィク(セエヌエールエス) Method for gap adjustment of two mechanical elements of a substantially planar micromechanical structure and corresponding electromechanical resonator
JP2008200758A (en) * 2007-02-16 2008-09-04 Seiko Epson Corp Mems element, and method for manufacturing thereof
JP2009006479A (en) * 2008-09-30 2009-01-15 Seiko Epson Corp Mems element, and method for manufacturing thereof
JP2012244349A (en) * 2011-05-18 2012-12-10 Nippon Telegr & Teleph Corp <Ntt> Micro mechanical vibrator and method of manufacturing the same
JP2014011532A (en) * 2012-06-28 2014-01-20 Seiko Epson Corp Vibration device, electronic apparatus

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