JPH10106754A - Distributed electroluminescent element wiring board and illuminating switch unit using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an EL(ElectroLuminescent) element board and an illuminating switch unit using it for the purpose of being employed in a display part, an operation part and the like of various types of electronic equipment, and to provide inexpensive products in such a manner that uniform illumination is achieved, electrical connection between contacts can be surely established, and a simple structure of a thin shape enhances its productivity. SOLUTION: A back electrode layer 20, a dielectric layer 21, an illuminant layer 22, a transparent electrode layer 23, and a first transparent insulating coat layer 24 are formed by lamination printing on an insulating substrate 19 in that order. A transparent conductor pattern layer 27 having a transparent fixed contact 25 and a conducting pattern 26 are formed by printing on the first transparent insulating coat layer 24. Thereafter, while the fixed contact 25 is exposed, a second transparent insulating coat layer 28 covering the conductor pattern 26 is formed by printing. As a result, a thin EL element wiring board 29 is constituted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a distributed electroluminescent element (hereinafter, referred to as EL element) wiring board used for a display section and an input operation section of various electronic devices, and an illuminated switch unit using the same. (Hereinafter, referred to as a switch unit).

[0002]

2. Description of the Related Art A conventional EL element and a switch unit using the same will be described below with reference to FIGS.

FIG. 13 is a cross-sectional view of a main part of a conventional EL element 1. As shown in FIG. 13, a thin film forming technique such as sputtering is formed on the back surface of an insulating substrate 2 made of a transparent resin film having a thickness of about 100 μm. A transparent electrode layer 3 was formed, and a luminescent layer 4, a dielectric layer 5, a back electrode layer 6, and an insulating layer 7 were sequentially laminated thereon to form an EL element 1 having a total thickness of about 0.3 mm.

[0004] The operation of the EL element 1 having such a configuration is such that an AC voltage or a DC pulse voltage is applied to the transparent electrode layer 3 and the back electrode layer 6 through a drive circuit to form a transparent resin on the surface of the EL element 1. Light was emitted on the film-made insulating substrate 2 side.

[0005] The EL element 1 thus constructed
FIG. 14 is a cross-sectional view of a main part of the switch unit 8 using the above.

As shown in FIG. 1, the movable contact 10 is formed by printing a resin film on the back surface.
The upper insulating substrate 9 and the lower insulating substrate 11 made of a resin film having a fixed contact 12 printed on the surface thereof are moved to the movable contact 1.
0 and the fixed contact 12 are fixed to each other via a spacer 13 formed by applying an adhesive material to both surfaces of the resin film so that the fixed contact 12 is opposed to the fixed contact 12 at a predetermined interval.
4 were configured.

An EL element 1 having a driving circuit independent of the membrane switch section 14 and having a total thickness of about 0.3 mm is disposed on the membrane switch section 14, and a transparent element is provided on the EL element 1. Alternatively, a surface sheet 17 made of a transparent resin film having a push button 15 which is a semi-transparent resin molded product adhered to the back surface thereof with an adhesive 16 may be used as a spacer formed by applying an adhesive to both surfaces of a transparent resin film. The switch unit 8 is configured by being fixed via the switch 18.

Next, the operation of the conventional switch unit 8 configured as described above will be described.
7. By pressing a predetermined position on the upper surface, the push button 15 is lowered to press the EL element 1, and the pressed portion of the EL element 1 is depressed, and the movable contact of the upper insulating substrate 9 of the membrane switch portion 14 on the lower surface is depressed. 10 is pushed down, and the lower insulating substrate 11
The contact is made electrically by contacting with the fixed contact 12 of FIG.

[0009]

However, in the configuration of the switch unit 8 using the conventional EL element 1 described above, the illumination of the EL element 1 becomes uneven on the topsheet 17 due to the influence of the push button 15 and the spacer 18. ,Also,
Since the total thickness of the upper insulating substrate 9 of the EL element 1 and the membrane switch section 14 which is pressed by the push button 15 is as thick as about 0.4 mm, the flexibility is poor, and the movable contact 10 and the fixed contact 12 are brought into contact. A high pressing force is required to make an electrical connection. To improve this, if the bending range is widened, the size becomes large, and the structure is complicated. It had problems such as high price.

SUMMARY OF THE INVENTION The present invention solves such a conventional problem, and provides a distributed electroluminescent element wiring board which can provide uniform illumination, has a simple structure with a thin shape, and is excellent in productivity. It is an object of the present invention to provide an illuminated switch unit using the same.

[0011]

According to the present invention, a back electrode layer having a predetermined pattern is formed on an insulating substrate, and a dielectric layer, a luminescent layer, a transparent electrode layer, The first transparent insulating coat layer is sequentially printed and formed, and a transparent conductive pattern layer having a transparent fixed contact is printed and formed on the first transparent insulating coat layer. A transparent insulating coat layer is formed by printing to form an EL element wiring board, and the EL element wiring board and a flexible transparent insulating substrate having a transparent movable contact formed on the back surface are fixed via a spacer. Thus, a switch unit is constituted.

According to the present invention, it is possible to obtain uniform illumination with a simple structure and to obtain an EL element wiring board excellent in productivity and a thin contact using the EL element wiring board with light pressing. A small and small switch unit can be provided.

[0013]

DETAILED DESCRIPTION OF THE INVENTION According to the first aspect of the present invention, a back electrode layer having a predetermined pattern is formed on an insulating substrate by printing or using a metal thin film conductor, and a dielectric layer,
A luminescent body layer, a transparent electrode layer, and a first transparent insulating coat layer are sequentially printed and formed in a predetermined pattern, and a transparent conductive pattern layer having a transparent fixed contact at least partially on the first transparent insulating coat layer Is formed by printing in a predetermined pattern, and the transparent fixed contact is exposed thereon, and the second transparent insulating coat layer is formed by printing in a predetermined pattern. It has the effect of being able to provide a low-cost EL element wiring board which is thin and can be efficiently illuminated uniformly and which is excellent in productivity.

According to a second aspect of the present invention, in the first aspect of the invention, at least a part of the transparent conductive pattern layer except for the transparent fixed contact is formed as a non-transparent conductive pattern. In addition to the function of the invention described in Item 1, there is an effect that the entire conductive pattern can be formed at low cost due to a large price difference between the transparent conductive pattern and the non-transmissive conductive pattern, and therefore, an inexpensive EL element wiring board can be provided.

According to a third aspect of the present invention, in the first or second aspect, the first transparent insulating coating layer and the first transparent insulating coating layer are provided.
Between the transparent conductive pattern layer of at least one of the second transparent conductive pattern layer and the third transparent insulating coat layer is formed by printing in a predetermined pattern,
In addition to the functions of the invention described in claim 1 or 2, a part of the electronic circuit constituting the electronic device is incorporated in the second transparent conductive pattern layer and the third transparent insulating coat layer on the EL element wiring board. Therefore, the electronic circuit has an effect of being compactly formed.

According to a fourth aspect of the present invention, in the first aspect of the present invention, at least one conductive pattern layer and the first insulating layer are provided between the insulating substrate and the back electrode layer. It has a structure in which the layers are formed in a predetermined pattern, and has the same function as the above-mentioned invention.

According to a fifth aspect of the present invention, in the first aspect of the present invention, a predetermined pattern is provided between the first transparent insulating coat layer and the first transparent conductive pattern layer. A transparent electromagnetic shield layer is formed by printing, and a fourth transparent insulating coating layer is formed by printing on the transparent electromagnetic shielding layer. In addition to the function of the invention according to any one of claims 1 to 4, And a back electrode layer, a dielectric layer, a luminescent layer, a transparent electrode layer, and a first transparent insulating coat layer.
Electromagnetic waves generated at the time of light emission of the L element portion can be shielded, and the electromagnetic interference due to electromagnetic waves such as malfunction of external electronic equipment and noise can be greatly reduced.

According to a sixth aspect of the present invention, in the first aspect of the invention, an electromagnetic shield layer having a predetermined pattern is formed between the insulating substrate and the back electrode layer. It has a configuration in which a first insulating layer is formed thereon. In addition to the function of the invention according to any one of claims 1 to 3, the electromagnetic wave generated at the time of light emission of the EL element portion is generated. Shielding is possible, and mainly has the effect of greatly reducing electromagnetic interference due to electromagnetic waves such as malfunctions and noise of electronic equipment using this EL element wiring board.

According to a seventh aspect of the present invention, in the fourth aspect of the present invention, an electromagnetic shield layer having a predetermined pattern is formed between the first insulating layer and the back electrode layer, and the second shield layer is formed thereon. And an electromagnetic wave generated when the EL element emits light, in addition to the effect of the invention described in claim 4, and can prevent malfunction of electronic equipment using the EL element substrate. This has the effect of greatly reducing electromagnetic interference caused by electromagnetic waves such as noise.

According to an eighth aspect of the present invention, in the first aspect, at least one insulating reinforcing layer is formed by printing between the transparent electrode layer and the back electrode layer. In addition to the effect of the invention described in any one of claims 1 to 7, there is an effect that high withstand voltage characteristics between the transparent electrode layer and the back electrode layer can be obtained.

According to a ninth aspect of the present invention, there is provided the EL element wiring board according to any one of the first to eighth aspects, and a flexible transparent insulating substrate having a transparent movable contact formed on a back surface thereof. The movable contact and the fixed contact are fixed to each other via a spacer such that the movable contact and the fixed contact face each other at a predetermined interval, and are configured as a switch unit, and the operation of the invention according to any one of claims 1 to 8 is achieved. In addition, it has the effect of providing a switch unit that can provide uniform illumination and has a thin, simple structure and excellent productivity.

According to a tenth aspect of the present invention, in accordance with the ninth aspect of the present invention, a transparent convex portion is formed on the back surface of the transparent insulating substrate, and a transparent movable contact is formed on the protruding surface of the convex portion. In addition to the effect of the invention described in claim 9, a switch unit can be easily adjusted, and a switch unit with more reliable electrical connection between the movable contact and the fixed contact can be obtained. It has the action of

The eleventh aspect of the present invention relates to the first to eighth aspects.
A dome-shaped movable contact having a transparent contact inside a vertex formed by drawing a transparent flexible insulating resin film into a dome shape, and a fixed contact and a movable contact. Are concentric and pasted so as to face each other at a predetermined interval to form a switch unit. In addition to the operation of the ninth aspect of the present invention,
This has the effect of providing a switch unit with a crisp switch operation moderation feel.

The twelfth aspect of the present invention provides the first to eighth aspects.
A push button having a transparent or milky white rubber base material and a transparent movable contact on the back surface is provided on the EL element wiring board according to any one of the above, the fixed contact and the movable contact are concentric, and a predetermined interval is provided. The switch unit is configured so as to be held and opposed to each other. In addition to the effect of the above-described ninth aspect, the present invention has an operation of providing a switch unit that is easy to operate.

The invention according to claim 13 is the invention according to claims 1 to 8
On the EL element wiring board according to any one of the above, a transparent or milky rubber dome-shaped push button having a transparent movable contact inside the vertex, a fixed contact and a movable contact are concentric, and a predetermined 2. The switch unit according to claim 1, wherein the switch units are arranged so as to face each other at an interval.
In addition to the effect of the invention described in 1, the present invention has an effect of providing a switch unit which is easy to operate.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. (Embodiment 1) FIG. 1 shows a dispersion-type electroluminescence element wiring board (hereinafter referred to as E) according to a first embodiment of the present invention.
L element wiring board). As shown in the figure, a back electrode layer 20 is formed on a resin film insulating substrate 19 having a thickness of about 100 μm by using a carbon resin-based conductive paste. A dielectric layer 21 is formed by printing using a paste obtained by stirring and dispersing barium titanate powder in an insulating resin (hereinafter, referred to as a binder resin), and a zinc sulfide phosphor powder is formed on the dielectric layer 21 by printing. The luminous body layer 22 is formed by printing using a paste which is stirred and dispersed in a resin, and the transparent electrode layer 23 is formed using a dispersion type light transmitting conductive paste in which indium tin oxide powder is added and dispersed in a transparent binder resin. Is formed thereon, and a first transparent insulating coat layer 24 is formed thereon by printing using a transparent vinyl acetate-vinyl chloride-based resist (hereinafter, referred to as an insulating resist). And a first transparent conductive pattern layer 27 having a transparent fixed contact 25 and a transparent conductive pattern 26 using a dispersion-type light-transmitting conductive paste in which indium tin oxide powder is added and dispersed in a transparent binder resin. Then, the fixed contact 25 is exposed on the first transparent conductive pattern layer 27, and the second transparent insulating coat layer 28 is printed using a transparent insulating resist so as to cover the transparent conductive pattern 26. Formed, total thickness about 0.3mm
The first EL element wiring board 29 is formed.

The operation of the first EL element wiring board 29 thus configured is performed by applying an AC voltage or a DC pulse voltage to the transparent electrode layer 23 and the back electrode layer 20 via a driving circuit. The first surface side of the wiring board 29
This emits light on the transparent conductive pattern layer 27 side.

With the above structure, an inexpensive EL element wiring board having good flexibility, uniform illumination, simple structure and excellent productivity can be obtained because the total thickness is as thin as about 0.3 mm. What you can get.

(Embodiment 2) FIG. 2 is a cross-sectional view of a principal part of an EL element wiring board according to a second embodiment of the present invention. As shown in FIG. In the same configuration as in the first embodiment, the transparent fixed contact 25 is formed by printing using a dispersion-type light-transmitting conductive paste in which indium tin oxide powder is added to and dispersed in a transparent binder resin, and a non-transmitting conductive pattern is formed. The transparent conductive pattern layer 31 is formed by printing and forming the non-transparent conductive pattern 30 on the first transparent conductive pattern layer 31 by printing using a silver resin-based conductive paste. The second EL element wiring board 32 is formed by printing and forming the second transparent insulating coating layer 28 using a transparent resist so as to cover the second EL element wiring board 32.

According to this configuration, in addition to the same effects as in the first embodiment, the transparent conductive pattern 26 formed by printing using the dispersed light transmitting conductive paste and the printing formed by using the silver resin-based conductive paste are used. (Transparent) conductive pattern layer 3
1 can be formed inexpensively, and the inexpensive second EL
The element wiring board 32 can be provided.

(Embodiment 3) FIG. 3 is a cross-sectional view of an essential part of an EL element wiring board according to a third embodiment of the present invention. As shown in FIG. 1 and the first transparent insulating coat layer 24 and the first transparent insulating coat layer 24.
An electronic device is configured using a dispersion-type light-transmitting conductive paste in which indium tin oxide powder is added to and dispersed in a transparent binder resin on the first transparent insulating coating layer 24 between the transparent conductive pattern layer 27 and the transparent conductive pattern layer 27. A second transparent conductive pattern layer 33 incorporating a part of the electronic circuit to be printed is formed by printing, and a third transparent insulating coat layer 34 is formed by printing using a transparent insulating resist to form a third EL element wiring board. 35.

According to this configuration, in addition to the same effects as in the first embodiment, a part of the electronic circuit can be divided into the second transparent conductive pattern layer 33 on the third EL element wiring board 35 and the third Since the electronic circuit can be formed by taking it into the transparent insulating coat layer 34, the entire electronic circuit can be formed compactly.

(Embodiment 4) FIG. 4 is a cross-sectional view of a main part of an EL element wiring board according to a fourth embodiment of the present invention. As shown in FIG. In addition to the same configuration as in the first embodiment, before forming the back electrode layer 20, a conductive pattern layer 36 is formed by printing using a silver resin-based conductive paste on the insulating substrate 19 in a predetermined pattern. The fourth EL element wiring board 38 is formed by printing and forming the insulating coat layer 37 using the above method.

With this configuration, the same effects as in the third embodiment can be obtained. (Embodiment 5) FIG. 5 is a cross-sectional view of a principal part of an EL element wiring board according to a fifth embodiment of the present invention. As shown in FIG. In addition to the above configuration, the indium tin oxide powder is provided in a predetermined pattern on the first transparent insulating coat layer 24 between the first transparent insulating coat layer 24 and the first transparent conductive pattern layer 27 in a transparent manner. A transparent electromagnetic shielding layer 39 is formed by printing using a dispersion-type light transmitting conductive paste added and dispersed in a binder resin, and a fourth transparent insulating coating layer 40 is formed by printing thereon using a transparent insulating resist. To form a fifth EL element wiring board 41.

With this configuration, in addition to the same effects as in the first embodiment, when the transparent electromagnetic shield layer 39 is connected to the ground line of the electronic circuit constituting the electronic device, the transparent electromagnetic shield layer 39 Since electromagnetic waves generated when the fifth EL element wiring board 41 is issued can be shielded, electromagnetic interference due to electromagnetic waves such as malfunction of external electronic devices and noise can be greatly reduced.

(Embodiment 6) FIG. 6 is a cross-sectional view of a main part of an EL element wiring board according to a sixth embodiment of the present invention. As shown in FIG. 5, a conductive pattern layer 42 is formed by printing using a silver resin-based conductive paste in a predetermined pattern on the insulating substrate 19 between the insulating substrate 19 and the back electrode layer 20. A first insulating layer 43 is formed by printing using an insulating resist thereon, and an electromagnetic shielding layer 44 is formed by printing using a silver resin-based conductive paste thereon. The sixth EL element wiring board 46 is formed by printing and forming the second insulating layer 45 using the above.

With this configuration, the sixth EL element wiring board 4
Electromagnetic waves in all directions generated at the time of light emission of the sixth embodiment can be shielded to a higher degree than in the fifth embodiment, and can be formed by taking in a part of an electronic circuit constituting an electronic device.

(Embodiment 7) FIG. 7 is a cross-sectional view of a main part of an EL element wiring board according to a seventh embodiment of the present invention. As shown in FIG. In addition to the same structure as in the first embodiment, an insulating reinforcing layer 47 is printed and formed in a predetermined pattern between the back electrode layer 20 and the dielectric layer 21 using a fluorine resin paste to form a seventh EL element wiring board. 4
8.

With this configuration, in addition to the same effects as in the first embodiment, the transparent electrode layer 23 and the back electrode layer 2
A high withstand voltage characteristic between 0 and 0 can be obtained.

(Eighth Embodiment) FIG. 8 is a sectional view of a main part of an illuminated switch unit (hereinafter referred to as a switch unit) according to an eighth embodiment of the present invention. As shown in FIG. Is the first E described in the first embodiment.
First switch unit 53 using L element wiring board 29
A dispersion-type light-transmitting conductive paste in which indium tin oxide powder is added to and dispersed in a transparent binder resin in a predetermined pattern on the back surface of a transparent insulating substrate 49 made of a transparent resin film having a total thickness of about 80 μm. The transparent movable contact 50 is formed by printing using the above method, and the opening 51 for exposing the fixed contact 25 and the movable contact 50 so that the transparent fixed contact 25 and the transparent movable contact 50 face each other at a predetermined interval.
Through a transparent spacer 52 formed by applying a transparent adhesive material on both sides of a transparent resin film provided with the first EL.
This is configured by fixing the element wiring board 29 and the transparent insulating substrate 49.

The first embodiment of the present embodiment thus configured
In FIG. 8, the operation of the switch unit 53 is performed by pressing the opposite surface of the transparent movable contact 50 of the transparent insulating substrate 49 so that the pressed portion is depressed and the movable contact 50 is pressed.
Is pressed down, and is brought into contact with a transparent fixed contact 25 formed on the upper surface of the first EL element wiring board 29 for electrical connection.

With this configuration, the first EL element wiring board 2
Since there is no component on the first EL element wiring board 29 that disturbs the illumination, the total thickness of the transparent insulating substrate 49 is as thin as about 80 μm and the flexibility is good. Therefore, the bending strength of the pressed portion (concave portion) of the transparent insulating substrate 49 is low, and a reliable electrical connection between the transparent movable contact 50 and the transparent fixed contact 25 can be obtained even with light pressing.

(Embodiment 9) FIG. 9 is a sectional view showing a main part of a switch unit according to a ninth embodiment of the present invention.
As shown in the figure, the present embodiment is a second switch unit 55 using the first EL element wiring board 29 described in the first embodiment. A transparent movable contact 50 is provided on the protruding surface of the projection 54 formed by printing using a paste of a system resin, and a predetermined distance from the transparent fixed contact 25 formed on the upper surface of the first EL element wiring board 29. An opening 51 similar to that of the first embodiment is provided so as to face each other, and is fixed via a transparent spacer 52 having a transparent adhesive on both surfaces.

With this configuration, the switch operation stroke can be adjusted more easily than in the case of the eighth embodiment, and even if the position where the transparent insulating substrate 49 is pushed is slightly shifted, the transparent movable contact 50 and the transparent movable contact 50 can be moved. Reliable electrical connection with the fixed contact 25 can be obtained.

(Embodiment 10) FIG. 10 shows a first embodiment of the present invention.
FIG. 9 is a cross-sectional view of a main part of a switch unit according to an embodiment of the present invention. As shown in the figure, the present embodiment is directed to a third switch using the first EL element wiring board 29 described in the embodiment 1. The unit 61 is squeezed into a dome shape by thermoforming on a transparent insulating substrate 56 made of a transparent resin film having a thickness of about 100 μm and facing the transparent fixed contact 25 at a predetermined interval. A dome-shaped part 57 is formed, and a transparent movable paste is formed on the inner apex surface of the dome-shaped part 57 by using a dispersion-type light-transmitting conductive paste in which indium tin oxide powder is added and dispersed in a transparent binder resin in a predetermined pattern. A transparent spacer formed by printing and forming a contact 58 and applying a transparent adhesive material to both surfaces of a transparent resin film having an opening 59 so as to expose the fixed contact 25 and the dome-shaped portion 57. Through 0, in which it is fixed a first EL element wiring board 29 and the transparent insulating substrate 56 is configured.

According to this configuration, in addition to the same effects as those of the first embodiment, it is possible to obtain a more crisp operation moderation feel.

(Embodiment 11) FIG. 11 shows a first embodiment of the present invention.
FIG. 14 is a cross-sectional view of a main part of a switch unit according to the first embodiment. As shown in the drawing, this embodiment has the same configuration as that of the eighth embodiment, except that a transparent or milky rubber convex portion is provided. A fourth switch unit 64 is formed by printing and forming a transparent movable contact 50 on the back surface of a push button 63 provided with 62.

With this configuration, it is possible to obtain an easily operable switch unit in addition to the same effects as in the eighth embodiment.

(Embodiment 12) FIG. 12 shows a first embodiment of the present invention.
FIG. 14 is a cross-sectional view of a main part of a switch unit according to a second embodiment. As shown in the figure, in the present embodiment, in addition to the same configuration as in the eleventh embodiment, a transparent or milky rubber convex portion is provided. A fifth switch unit 68 is formed by forming a dome-shaped portion 67 below a push button 66 provided with 65, and forming a transparent movable contact 50 on an apex surface inside the dome-shaped portion 67.

According to this configuration, in addition to the same effects as in the eleventh embodiment, a more crisp operation moderation feel can be obtained.

In each of the switch units described in the eighth to twelfth embodiments, the first embodiment is used.
Of the first EL element wiring board 29 of the second to seventh embodiments described in the second to seventh embodiments.
EL element wiring boards 32, 35, 38, 41, 46, 48
Of course, may be used.

[0052]

As described above, according to the present invention, an EL element wiring board which can obtain uniform illumination with a thin and simple structure, and which is excellent in productivity, and a light pressing using the same. It is possible to provide a thin and small switch unit capable of obtaining reliable electrical connection of contacts.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a main part of a dispersion-type electroluminescent element wiring board according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a main part of a dispersion-type electroluminescent element wiring board according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional view of a main part of a dispersion-type electroluminescent element wiring board according to a third embodiment of the present invention.

FIG. 4 is a cross-sectional view of a main part of a dispersion-type electroluminescent element wiring board according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view of a main part of a distributed electroluminescent element wiring board according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view of a main part of a distributed electroluminescence element wiring board according to a sixth embodiment of the present invention.

FIG. 7 is a sectional view of a main part of a distributed electroluminescent element wiring board according to a seventh embodiment of the present invention.

FIG. 8 is a sectional view of a main part of an illuminated switch unit according to an eighth embodiment of the present invention;

FIG. 9 is a sectional view of a main part of an illuminated switch unit according to a ninth embodiment of the present invention;

FIG. 10 is a sectional view of a main part of an illuminated switch unit according to a tenth embodiment of the present invention;

FIG. 11 is a sectional view of a main part of an illuminated switch unit according to an eleventh embodiment of the present invention;

FIG. 12 is a sectional view of a main part of an illuminated switch unit according to a twelfth embodiment of the present invention;

FIG. 13 is a cross-sectional view of a main part of a conventional dispersion-type electroluminescent element.

FIG. 14 is a sectional view of a main part of a conventional illuminated switch unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 19 Insulating substrate 20 Back electrode layer 21 Dielectric layer 22 Light emitting layer 23 Transparent electrode layer 24 First transparent insulating coat layer 25 Transparent fixed contact 26 Transparent conductive pattern 27 First transparent conductive pattern layer 28 Second transparent Insulation coat layer 29 First EL element wiring board 30 Non-permeable conductive pattern 31 Transparent conductive pattern layer 32 Second EL element wiring board 33 Second transparent conductive pattern layer 34 Third transparent insulating coat layer 35 Third EL element wiring board 36, 42 conductive pattern layer 37 insulating coating layer 38 fourth EL element wiring board 39 transparent electromagnetic shield layer 40 fourth transparent insulating coating layer 41 fifth EL element wiring board 43 first insulating layer 44 Electromagnetic shield layer 45 Second insulating layer 46 Sixth EL element wiring board 47 Insulation reinforcing layer 48 Seventh EL element wiring board 49, 56 Transparent insulating substrate 0,58 Transparent movable contact 51,59 Opening 52,60 Transparent spacer 53 First switch unit 54,62,65 Convex 55 Second switch unit 57,67 Dome-shaped part 61 Third switch unit 63, 66 push button 64 fourth switch unit 68 fifth switch unit

Claims (13)

[Claims] 1. A back electrode layer having a predetermined pattern is formed on an insulating substrate by printing or using a metal thin film conductor, and a dielectric layer, a light emitting layer, a transparent electrode layer, and a first transparent insulating coat layer are formed thereon. Are sequentially printed and formed in a predetermined pattern, and the first
Forming a first transparent conductive pattern layer having a transparent fixed contact at least partially on a transparent insulating coat layer in a predetermined pattern, and exposing the transparent fixed contact thereon to form a second transparent insulating layer. A dispersion-type electroluminescent element wiring board formed by printing and forming a coat layer in a predetermined pattern. 2. The dispersion-type electroluminescent element wiring board according to claim 1, wherein at least a part of the transparent conductive pattern layer other than the transparent fixed contact is a non-transparent conductive pattern. 3. At least one second transparent conductive pattern layer and at least one third transparent insulating coat layer are printed and formed in a predetermined pattern between the first transparent insulating coat layer and the first transparent conductive pattern layer. 3. The dispersion-type electroluminescent element wiring board according to claim 1, wherein 4. The dispersion type according to claim 1, wherein at least one conductive pattern layer and at least one first insulating layer are formed in a predetermined pattern between the insulating substrate and the back electrode layer. Electroluminescent element wiring board. 5. A transparent electromagnetic shield layer having a predetermined pattern is printed and formed between the first transparent insulating coat layer and the first transparent conductive pattern layer, and a fourth transparent insulating coat layer is printed thereon. The dispersion-type electroluminescent element wiring board according to claim 1, wherein the wiring board is formed. 6. The method according to claim 1, wherein an electromagnetic shield layer having a predetermined pattern is formed between the insulating substrate and the back electrode layer, and a first insulating layer is formed thereon. Of the dispersion type electroluminescent element wiring board. 7. The distributed electroluminescence according to claim 4, wherein an electromagnetic shield layer having a predetermined pattern is formed between the first insulating layer and the back electrode layer, and a second insulating layer is formed thereon. Element wiring board. 8. The dispersion-type electroluminescent element wiring board according to claim 1, wherein at least one insulating reinforcing layer is formed by printing between the transparent electrode layer and the back electrode layer. 9. The dispersion-type electroluminescent element wiring board according to claim 1, and a flexible transparent insulating substrate having a transparent movable contact formed on a back surface thereof.
An illuminated switch unit in which a movable contact and a fixed contact are fixed via a spacer so as to face each other with a predetermined interval. 10. The illuminated switch unit according to claim 9, wherein a transparent convex portion is formed on the back surface of the transparent insulating substrate, and a transparent movable contact is formed on a projecting surface of the convex portion. 11. A dispersion-type electroluminescent element wiring board according to claim 1, and a transparent inside of a vertex formed by drawing a transparent flexible insulating resin film into a dome shape. A dome-shaped movable contact having a contact,
An illuminated switch unit in which a fixed contact and a movable contact are attached concentrically and facing each other at a predetermined interval. 12. A push button having a transparent or milky white rubber base material and a transparent movable contact on the back surface of the dispersion type electroluminescent element wiring board according to any one of claims 1 to 8, An illuminated switch unit in which a fixed contact and a movable contact are concentric and arranged so as to face each other at a predetermined interval. 13. A transparent or milky white rubber dome-shaped push button having a transparent movable contact inside a vertex on the distributed electroluminescent element wiring board according to claim 1. Description: An illuminated switch unit in which a fixed contact and a movable contact are arranged concentrically and facing each other at a predetermined interval.