JPH10104665A - Manufacture of active substrate for liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an electric short circuit from being formed when a means which improves visual angle dependency is adopted for a two-terminal nonlinear resistance element by making a 2nd inter-digital electrode which is closed to a 1st inter-digital electrode cross a wiring electrode through a nonlinear resistance layer. SOLUTION: The plane pattern of the 1st inter-digital electrode and 2nd wiring electrode, and a 1st electrode consists of the F shape and island shape shown by the solid lines 41, and an etching removal part is shaped as shown by dotted lines 50. The plane pattern shape of a 2nd electrode and the 2nd inter-digital electrode 20, and a 3rd electrode and a 2nd wiring electrode consists of the L shape and fallen T shape shown by the alternate long and short dash lines 43 and 44. The 1st inter-digital electrode and 2nd inter-digital electrode 20 are formed having a gap of 6μm. Consequently, the active substrate for a liquid crystal display device is obtained which has the 1st inter-digital electrode and 2nd inter-digital electrode 20 and can prevent electric short-circuiting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an active substrate for a liquid crystal display device, and more particularly to a method for forming an active substrate having a first electrode and a second electrode on a substrate and having a thick film formed on the first electrode. A second nonlinear resistance layer having a small thickness formed on the first nonlinear resistance layer and the second electrode; a nonlinear resistance element is formed using the second nonlinear resistance layer; This is for improving the insulating property between the first electrode and the fourth electrode which intersects by using the insulating property. As the non-linear resistance layer, an anodic oxide film of the first electrode or the second electrode is used.

[0002]

2. Description of the Related Art In recent years, the display capacity of a liquid crystal display device using a liquid crystal panel has been steadily increasing. Means using multiplex driving in a liquid crystal display device having a simple matrix configuration causes a decrease in contrast or a decrease in response speed as time division is increased. In the case of having about 200 scanning lines, sufficient contrast is obtained. It becomes difficult to obtain.

In order to eliminate such a drawback, an active matrix liquid crystal display panel in which switching elements are provided in individual pixels has been employed. The active matrix liquid crystal display panel is roughly classified into a three-terminal system using a thin film transistor and a two-terminal system using a non-linear resistance element. Among them, the two-terminal system is superior in that the structure and the manufacturing method are simple.

As the two-terminal switching element, a diode type, a varistor type, a thin film diode (TFD) type, and the like have been developed. Among them, the TFD type has a feature that the structure is particularly simple and the manufacturing process is short.

Further, the liquid crystal display panel is required to have high density and high definition, and it is necessary to reduce the area occupied by the switching elements. As means for the miniaturization, there are a photolithography technique and an etching technique which are semiconductor manufacturing techniques. However, it is a very difficult technique to perform fine processing on a large area and achieve low cost.

Here, a thin-film diode element (TFD) that can be miniaturized in a large area and is effective in reducing costs.
The structure will be described with reference to FIGS. FIG. 24 is a plan view showing a pixel portion of a liquid crystal display device using a nonlinear resistance element. FIG. 25 is a plan view of FIG.
It is sectional drawing which shows the cross section in the -A line. FIG. 24 and FIG.
The prior art will be described using 5 and 5 alternately.

On the first substrate 11, a lower electrode 61 made of a tantalum (Ta) film, a first electrode 13 having an island pattern, and the lower electrode 61 and the first electrode 13 are temporarily provided. An etching removal unit 50 to be connected is provided. Further, on the lower electrode 61 and the first electrode 13, a tantalum oxide film (Ta2 O5), which is an anodic oxide film of the tantalum film 21, is provided as the first nonlinear resistance layer 15.

When the tantalum film is anodized, the lower electrode 61 and the first electrode 13 are separated from each other by the etching removal portion 50.
Connected by After the anodic oxidation, the etching removing section 50 is removed from the first substrate 11.

Further, an upper electrode 62 made of an indium tin oxide film (ITO), which is a transparent conductive film, is
Provided above. A third electrode made of an ITO film is
Are connected, and overlap on the nonlinear resistance layer 15 on the first electrode 13. The ITO film, the nonlinear resistance layer 15 and the island-shaped first electrode 13 form a first nonlinear resistance element 38.

Further, a display electrode 63 made of an ITO film is provided on the first substrate 1. Further, a second electrode 17 connected to the display electrode 63 and overlapping the nonlinear resistance layer 15 on the first electrode 13 is provided. Second electrode 1
7, the nonlinear resistance layer 15 and the island-shaped first electrode 13 constitute a second nonlinear resistance element 39. The first nonlinear resistance element 38 and the second nonlinear resistance element 39 are connected in series.

Further, on a second substrate 10 provided to face the first substrate 11 to constitute a liquid crystal display device, light from a gap between display electrodes 63 formed on the first substrate 11 is provided. In order to prevent leakage, a black matrix 71 made of a chromium film is provided.

Further, a display electrode 63 is provided on the second substrate 10.
A counter electrode 72 made of an indium tin oxide film (ITO), which is a transparent conductive film, is provided via an insulating film 73 made of a polyimide resin so as to be in contact with the black matrix 71 and not to be short-circuited. Furthermore, a first wiring electrode (not shown) for applying a signal of an external circuit is connected to the counter electrode 72.

The display electrode 63 is arranged so as to overlap with the counter electrode 72 via the liquid crystal 81, thereby forming a display pixel portion of the liquid crystal display device. Further, each of the first substrate 11 and the second substrate 10 is provided with an alignment film 82 as a processing layer for regularly arranging the molecules of the liquid crystal 81.

Further, by means of a spacer (not shown),
The first substrate 11 and the second substrate 10 are opposed to each other with a predetermined gap size, and a liquid crystal 81 is sealed between the first substrate 11 and the second substrate 10.

Further, a polarizing plate 83 is provided on the first substrate 11, and a polarizing plate 84 and a light source unit (not shown) are provided on the second substrate 10. Since the liquid crystal display device does not emit light by itself, a light source unit as an external light source is required. The liquid crystal display device performs a predetermined display using the light from the light source unit and further using the change in the optical characteristics of the liquid crystal 81.

As described above, the display electrode 63 of the first substrate 11
And the opposing electrode 72 of the second substrate 10 are opposed via the liquid crystal 81. A voltage is applied between the display electrode 63 and the counter electrode 72 to cause an optical change in the liquid crystal 81, and the polarizing plate 83
Use for display by using.

[0017]

By the way, display quality such as contrast changes depending on the viewing direction of the liquid crystal display device, that is, so-called viewing angle dependency of display quality occurs. This phenomenon occurs due to the relationship between the direction of the molecules in the liquid crystal layer and the direction viewed by the observer.

As a method of improving the viewing angle dependency, there is a means for correcting the phase difference in the direction of the molecules of the liquid crystal display device using a phase compensator, or a means for devising the orientation direction of the molecules. However, means using a phase compensator has a small improvement in viewing angle dependency. Means for devising the orientation direction of the molecules do not have good orientation stability of the molecules.

Therefore, there is a means for providing a set of comb-shaped electrodes on an active substrate on which a non-linear resistance element is formed and applying a voltage between the comb-shaped electrodes to control the direction of liquid crystal molecules.
This means will be described with reference to FIG. As shown in FIG. 26, a first comb-shaped electrode 12 and a second comb-shaped electrode 20 are arranged on a first substrate with a certain gap.

When a small voltage is applied between the first comb-shaped electrode 12 and the second comb-shaped electrode 20, the liquid crystal molecules 91 cause the first comb-shaped electrode 12 and the second comb-shaped electrode 12, as shown in FIG. Between the comb-shaped electrodes 20. When a large voltage is applied, the liquid crystal molecules 92 rotate while maintaining an angle of 45 ° between the first comb-shaped electrode 12 and the second comb-shaped electrode 20. The liquid crystal molecules 91 and the liquid crystal molecules 92 move in parallel with the first substrate 1 with almost no pretilt with the first substrate 1.

However, when the means having the comb-tooth electrode is used for an active substrate on which a two-terminal nonlinear resistance element is formed, the first and second comb-tooth electrodes 20 and 20 are used.
Need to cross each other. In the case of a two-terminal nonlinear resistance element, there is no intersection of the electrodes as shown in the prior art. Therefore, it is necessary to devise an intersection to prevent an electrical short circuit between the two types of electrodes.

An object of the present invention is to provide a liquid crystal display device capable of preventing an electric short circuit when a means for improving the viewing angle dependency using a comb-shaped electrode is employed in a two-terminal nonlinear resistance element. To provide a method of manufacturing an active substrate.

[0023]

Means for Solving the Problems In order to achieve the above object, the following manufacturing method is adopted for the active substrate for a liquid crystal display device of the present invention.

According to the method of manufacturing an active substrate for a liquid crystal display device of the present invention, a first comb-shaped electrode, a first wiring electrode connected to the first comb-shaped electrode, and an island-shaped first electrode are formed on the substrate. The first
Forming a pattern using the first photoresist as an etching mask, forming a first non-linear resistive layer over the entire surface of the substrate, and forming a second non-linear resistive layer on the first wiring electrode using a second photo resist. Forming a pattern by using as an etching mask, a second electrode connected to the first electrode via the first non-linear resistance layer, and a second electrode connected to the second electrode and close to the first comb-shaped electrode. A second comb electrode, a third electrode connected to the first electrode via the first nonlinear resistance layer, a third electrode connected to the third electrode, and a first wiring electrode and the second nonlinear resistance layer via the second nonlinear resistance layer. Forming a pattern using the third photoresist as an etching mask.

According to the method of manufacturing an active substrate for a liquid crystal display device of the present invention, a first comb-shaped electrode, a first wiring electrode connected to the first comb-shaped electrode, and an island-shaped first electrode are formed on the substrate. The first
Forming a pattern using the first photoresist as an etching mask, forming a first non-linear resistance layer on the entire surface of the substrate, and forming a first non-linear resistance layer on the first electrode using a second photoresist.
Forming a second non-linear resistance layer thinner than the first non-linear resistance layer; and a second electrode connected to the first electrode via the first non-linear resistance layer; a second electrode connected to the second electrode; A second comb electrode adjacent to the comb electrode; a third electrode connected to the first electrode via the first nonlinear resistance layer; a third electrode connected to the third electrode; Forming a pattern with the second wiring electrode crossing via the second nonlinear resistance layer using the third photoresist as an etching mask.

According to the method of manufacturing an active substrate for a liquid crystal display device of the present invention, a first comb-shaped electrode, a first wiring electrode connected to the first comb-shaped electrode, and a first comb-shaped electrode are temporarily formed on the substrate. A step of forming a pattern with the first electrode to be connected using the first photoresist as an etching mask; a first comb-shaped electrode; a first wiring electrode connected to the first comb-shaped electrode; and a first electrode Forming a first non-linear resistance layer thereon by anodic oxidation, separating the first comb-shaped electrode and the first electrode into islands using the second photoresist as an etching mask, Forming a second non-linear resistance layer on the first wiring electrode by using the third photoresist as an etching mask; and forming a second electrode connected to the first electrode via the first non-linear resistance layer. A second electrode connected to the second electrode and in proximity to the first comb electrode. A comb electrode, a third electrode connected to the first electrode via the first nonlinear resistance layer, a third electrode connected to the third electrode, and an intersection with the first wiring electrode via the second nonlinear resistance layer; Forming a pattern using the second wiring electrode and the fourth photoresist as an etching mask.

According to the method of manufacturing an active substrate for a liquid crystal display device of the present invention, a first comb-shaped electrode, a first wiring electrode connected to the first comb-shaped electrode, and a first comb-shaped electrode are temporarily formed on the substrate. Forming a pattern with a first electrode to be connected using a first photoresist as an etching mask; and forming a first comb-shaped electrode and a first wiring electrode connected to the first comb-shaped electrode.
Forming a first non-linear resistance layer on the first electrode by an anodic oxidation method, and separating the first comb-tooth electrode and the first electrode into islands using the second photoresist as an etching mask. Forming a third photoresist on the first non-linear resistive layer on the first electrode, forming a second non-linear resistive layer on the entire surface of the substrate; Lifting off the photoresist together with the second non-linear resistance layer, and connecting the second electrode to the first electrode via the first non-linear resistance layer, the first electrode connected to the second electrode, and the first comb-tooth electrode And a second comb-tooth electrode close to the first electrode and a first electrode
A third electrode connected to the third wiring via the non-linear resistance layer and a second wiring electrode connected to the third electrode and crossing the first wiring electrode via the second non-linear resistance layer are connected to the fourth photo. Forming a pattern using the resist as an etching mask.

According to the method of manufacturing an active substrate for a liquid crystal display device of the present invention, a second wiring electrode, a third electrode connected to the second wiring electrode, and a second wiring temporarily connected to the third electrode are formed on the substrate. And the second comb-tooth electrode connected to the second electrode
Forming a pattern using the first photoresist as an etching mask, forming a first non-linear resistance layer on the entire surface of the substrate, and forming a third non-linear resistance layer on the second electrode using the second photoresist.
Forming a first non-linear resistance layer thinner than the second non-linear resistance layer on the second electrode, and a first non-linear resistance layer on the second electrode and a first non-linear resistance layer on the third electrode And a second non-linear electrode on the second wiring electrode connected to the first comb electrode and the first comb electrode adjacent to the second comb electrode and connected to the first wiring via both of the first and second comb electrodes. Patterning the first wiring electrodes that intersect via the resistive layer using the third photoresist as an etching mask.

According to the method of manufacturing an active substrate for a liquid crystal display device of the present invention, a second wiring electrode, a third electrode connected to the second wiring electrode, a second electrode, and a connection to the second electrode are formed on the substrate. Forming a second comb-tooth electrode using the first photoresist as an etching mask, forming a first non-linear resistance layer on the entire surface of the substrate, and forming a second non-linear resistance layer on the second wiring electrode. Patterning the non-linear resistive layer using the second photoresist as an etching mask, and via both the first non-linear resistive layer on the second electrode and the first non-linear resistive layer on the third electrode A first electrode to be connected, a first comb electrode adjacent to the second comb electrode, and a second non-linear resistance layer connected to the first comb electrode and on the second wiring electrode; Intersecting first wiring electrode and third photoresist as etching mask And a step of patterning by.

In the method of manufacturing an active substrate for a liquid crystal display device according to the present invention, a second wiring electrode, a third electrode connected to the second wiring electrode, and a second electrode temporarily connected to the third electrode are formed on the substrate. And the second comb-tooth electrode connected to the second electrode
Forming a pattern using the photoresist as an etching mask, forming a first non-linear resistance layer on the second electrode and the third electrode by anodic oxidation, and forming a second electrode and a third electrode. Separating the second wiring using the second photoresist as an etching mask;
Patterning the non-linear resistive layer using the third photoresist as an etching mask, and via both the first non-linear resistive layer on the second electrode and the first non-linear resistive layer on the third electrode. A first electrode connected to the first comb electrode, a first comb electrode adjacent to the second comb electrode, and a second non-linear resistance layer on the second wiring electrode connected to the first comb electrode. Patterning the first wiring electrodes that intersect with each other using the fourth photoresist as an etching mask.

According to the method of manufacturing an active substrate for a liquid crystal display device of the present invention, a second wiring electrode, a third electrode connected to the second wiring electrode, and a second electrode temporarily connected to the third electrode are formed on the substrate. And the second comb-tooth electrode connected to the second electrode
Forming a pattern by using the photoresist as an etching mask, forming a first non-linear resistance layer on the second electrode and the third electrode by an anodic oxidation method,
Separating the third electrode from the third electrode using the second photoresist as an etching mask, and forming a third photoresist on the first non-linear resistance layer on the second electrode and the third electrode Performing a step of forming a second non-linear resistance layer on the entire surface of the substrate, a step of lifting off the third photoresist together with the second electrode and the second non-linear resistance layer on the third electrode, A first electrode connected through both the first non-linear resistance layer on the second electrode and the first non-linear resistance layer on the third electrode, and a first electrode close to the second comb electrode The first wiring electrode connected to the comb electrode and the first comb electrode and intersecting via the second non-linear resistance layer on the second wiring electrode is patterned using the fourth photoresist as an etching mask. And

[0032]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a liquid crystal display device in the best mode for carrying out the method for manufacturing an active substrate for a liquid crystal display device according to the present invention will be described below with reference to the drawings.

First, an embodiment of a method for manufacturing an active substrate for a liquid crystal display device according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 13 is a plan view showing a peripheral region of the nonlinear resistance element. FIGS. 1, 3, 5, 6, 8, 9, and 11 are cross-sectional views showing cross sections taken along line AA of the plan view of FIG. 13. 10 and 12 are cross-sectional views showing cross sections taken along line BB of FIG.

First, as shown in FIGS. 1 and 2, a film having a thickness of 25
A 0 nm tantalum film 21 is formed.

Thereafter, a positive photoresist is formed on the entire surface of the tantalum film 21 by a spin coating method, and exposure and development are performed using a first photomask to pattern the photoresist. Photoresist 2
Form 2

Next, as shown in FIGS. 1 and 2, sulfur hexafluoride is placed in an etching chamber of a parallel plate type electrode structure etching apparatus using a first photoresist 22 as an etching mask and using a dry etching method. 200cc
/ Min, helium at 20 cc / min, oxygen at 30 cc / min, the pressure is maintained at 50 mTorr, high frequency power of 1 kW is applied, the tantalum 21 is patterned, and as shown in FIG. A first electrode 13, an etching removal portion 31 for temporarily connecting the first comb-teeth electrode 12 and the first electrode 13, and a first comb-teeth electrode 1 as shown in FIG.
2 is formed. The planar pattern shape of the first comb-tooth electrode 12, the second wiring electrode 14, and the first electrode 13 is an F-shaped shape and an island shape as shown by a solid line 41 in FIG. Removal unit 3
1 has a shape as shown by a broken line 50 in FIG.

Next, as shown in FIG. 3 and FIG. 4, a 1% citric acid aqueous solution was used as an anodizing solution, and an anodic oxidation voltage of 18 V was applied to the first anodizing solution. Comb electrode 12, first electrode 13, and second wiring electrode 1
Tantalum oxide film (Ta2 O) having a thickness of 35 nm
5) to form the first nonlinear resistance layer 15.

Next, as shown in FIGS. 3 and 4, a positive type photoresist is formed on the entire surface by a spin coating method.
Exposure processing and development processing are performed by using a photomask, and the photoresist is patterned, and the second pattern is formed on the first electrode.
Is formed.

Next, as shown in FIGS. 3 and 4, sulfur hexafluoride is introduced into the etching chamber of the parallel plate type electrode structure etching apparatus by using the second photoresist 23 as an etching mask and using a dry etching method. 200cc
/ Min, helium is introduced at 20 cc / min, oxygen is introduced at 30 cc / min, the pressure is maintained at 50 mTorr, and high-frequency power of 1 kW is applied, the tantalum 21 is patterned, and as shown in FIG. The first electrode 13 is separated and the etching removal part 31 is removed.

Next, as shown in FIG. 5, a positive photoresist is formed on the entire surface by a spin coating method, and exposure and development are performed using a third photomask to pattern the photoresist. A third photoresist 24 is formed on one electrode.

Next, as shown in FIGS. 6 and 7, the film thickness is 200 to 300 nm over the entire surface by using a sputtering method.
A tantalum oxide film (Ta2 O5) 25 is formed.

Next, as shown in FIG. 8, the third photoresist 24 and the upper tantalum oxide film (Ta 2 O 5) 25 are mixed with sulfuric acid and hydrogen peroxide at a weight ratio of 12: 1 using a lift-off method. Then, peeling is performed using a peeling solution heated to a temperature of 100 ° C. to form a second nonlinear resistance layer 16. The plane pattern of the second nonlinear resistance layer has a shape excluding a portion surrounded by a two-dot chain line 42 in FIG.

Next, as shown in FIGS. 9 and 10, a chromium film (Cr) 26 having a thickness of 100 nm is formed on the entire surface by sputtering.

Thereafter, a positive type photoresist is formed on the entire surface of the chromium film (Cr) 26 by a spin coating method, and is exposed and developed using a third photomask to pattern the photoresist. A third photoresist 27 is formed.

Next, as shown in FIGS. 9 and 10, using the third photoresist 27 as an etching mask, a chromium film (Cr) is formed by wet etching using a mixed solution of perchloric acid and cerium ammonium nitrate. 26 is patterned to form a second wiring electrode 19 and a third electrode 18 as shown in FIG. 11 and a second wiring electrode 19 connected to the third electrode 18 as shown in FIG. Second electrode 17
To form a second comb-tooth electrode 20 connected to the second electrode. The planar pattern shapes of the second electrode 17 and the second comb electrode 20 and the third electrode 18 and the second wiring electrode 19 are L-shaped as shown by dashed lines 43 and 44 in FIG. It has a shape of a triangle.

The first comb-shaped electrode 12 and the second comb-shaped electrode 20 are formed with a gap of 6 μm. By the manufacturing method described above, the active substrate for a liquid crystal display device according to the first embodiment of the present invention can be formed.

Next, an embodiment of a method for manufacturing an active substrate for a liquid crystal display device according to the second embodiment of the present invention will be described.
This will be described with reference to FIGS. FIG. 23 is a plan view showing a peripheral region of the nonlinear resistance element. 14, 16,
18, 19, and 21 are cross-sectional views showing cross sections taken along line AA of the plan view of FIG. 23, and FIGS. 15, 17, 20, and 22 are cross sections taken along line BB of FIG. FIG.

First, as shown in FIGS. 14 and 15, a film thickness of 25 is formed on the first substrate 11 by using a sputtering method.
A 0 nm tantalum film 21 is formed.

Thereafter, a positive photoresist is formed on the entire surface of the tantalum film 21 by a spin coating method, and exposure and development are performed using a first photomask to pattern the photoresist. Photoresist 2
Form 2

Next, as shown in FIGS. 14 and 15, using the first photoresist 22 as an etching mask, a dry etching method is used to install sulfur hexafluoride in an etching chamber of a parallel plate type electrode structure etching apparatus. 20
0cc / min, helium 20cc / min, oxygen 30cc
/ Min, the pressure is maintained at 50 mTorr and the high frequency power 1
KW is input and the tantalum 21 is patterned, and FIG.
A first comb electrode 12 and a first electrode 13 as shown in FIG. 17 and a first wiring electrode 14 connected to the first comb electrode 12 as shown in FIG. 17 are formed. The first comb electrode 12 and the planar pattern of the first electrode 13 and the first wiring electrode 14 have an F-shaped shape and an island shape as shown by a solid line 41 in FIG.

Thereafter, as shown in FIGS. 16 and 17, the entire surface is formed to a thickness of 200 nm to 30 nm by sputtering.
A 0 nm tantalum oxide film (Ta2 O5) 27 is formed.

Thereafter, a positive type photoresist is formed on the entire surface of the tantalum oxide film (Ta 2 O 5) 27 by a spin coating method, and is exposed and developed using a second photomask to perform patterning of the photoresist. And the second
Is formed.

Then, as shown in FIG. 16 and FIG. 17, sulfur hexafluoride is placed in an etching chamber of a parallel plate type electrode structure etching apparatus using a dry etching method with the second photoresist 23 as an etching mask. 20
0cc / min, helium 20cc / min, oxygen 30cc
/ Min, the pressure is maintained at 50 mTorr and the high frequency power 1
KW is applied, the tantalum oxide film (Ta2 O5) 27 is patterned, and the first non-linear resistance layer 15 having a thickness of 35 nm as shown in FIG.
A second nonlinear resistance layer 16 having a thickness of 0 to 300 nm is formed.
The first nonlinear resistance layer 15 and the second nonlinear resistance layer 16
Is a rectangular shape as shown by a two-dot chain line 42 in FIG.

Next, as shown in FIGS. 19 and 20, a chromium film (Cr) 25 having a thickness of 100 nm is formed on the entire surface by sputtering.

Thereafter, a positive type photoresist is formed on the entire surface of the chromium film (Cr) 25 by a spin coating method, and is exposed and developed using a third photomask to pattern the photoresist. A third photoresist 24 is formed.

Next, as shown in FIG. 19 and FIG.
Using the photoresist 24 as an etching mask, the chrome film (Cr) 25 is patterned by a wet etching method using a mixed solution of perchloric acid and cerium ammonium nitrate to form the second electrode 17 as shown in FIG. The second wiring electrode 19 connected to the third electrode 18 and the third electrode 18 as shown in FIG. 22, and the second electrode 1 as shown in FIG.
The second comb-tooth electrode 20 connected to the second electrode 7 is formed. The planar pattern shapes of the second electrode 17 and the second comb electrode 20 and the third electrode 18 and the second wiring electrode 19 are L-shaped as shown by dashed lines 43 and 44 in FIG. It has a shape of a triangle.

The first comb-shaped electrode 12 and the second comb-shaped electrode 20 are formed with a gap of 6 μm. The active substrate for a liquid crystal display device according to the second embodiment of the present invention can be formed by the manufacturing method described above.

Then, the liquid crystal display device is formed by laminating an active substrate for a liquid crystal display device formed according to the embodiment of the present invention and a second substrate 10 having a counter electrode so as to secure a predetermined gap, and sealing the liquid crystal. it can. The display is performed by applying a voltage between the first comb-shaped electrode 12 and the second comb-shaped electrode 20, and changing the voltage to change the direction of the liquid crystal molecules.

Although the first non-linear resistance layer is formed by the anodic oxidation method in the first embodiment of the present invention described above, the first non-linear resistance layer may be formed by the sputtering method or the chemical vapor deposition (CVD) method. The same effect can be obtained. In this case, the same effect can be obtained even if a nonlinear resistance layer such as aluminum oxide (Al2 O3) or nitride (SiOx) is used.

In the first embodiment of the present invention,
Although a tantalum film is used for the first electrode, the first comb-tooth electrode, and the second wiring electrode, a metal material is used when the first nonlinear resistance layer is formed by a sputtering method or a CVD method. Has the same effect.

In the first embodiment of the present invention described above, tantalum oxide (Ta2
O5) was used, but the material used was aluminum oxide (Al2O).
The same effect can be obtained by using a non-linear resistance layer such as 3) or silicon nitride (SiNx).

In the first embodiment of the present invention,
Although the chromium film is used for the second electrode, the second comb electrode, and the first wiring electrode, the same effect can be obtained by using a metal material.

In the second embodiment of the present invention,
Although a tantalum film is used for the first electrode, the first comb-shaped electrode, and the second wiring electrode, the same effect can be obtained by using a metal material.

Although the first non-linear resistance layer is formed by the sputtering method in the second embodiment of the present invention, the same effect can be obtained by forming the first non-linear resistance layer by the anodic oxidation method.

In the second embodiment of the present invention described above, tantalum oxide (Ta 2) is added to the second nonlinear resistance layer.
O5) was used, but the material used was aluminum oxide (Al2O).
The same effect can be obtained by using a non-linear resistance layer such as 3) or silicon nitride (SiNx).

In the first embodiment of the present invention,
Although a chromium film is used for the second electrode, the second comb electrode, and the first wiring electrode, the same effect can be obtained by using a metal material.

[0067]

As is apparent from the above description, by using the method for manufacturing an active substrate for a liquid crystal display device of the present invention, an electric device having a first comb-shaped electrode and a second comb-shaped electrode is provided. It is possible to obtain a liquid crystal display active substrate capable of preventing a short circuit.

Further, by using the lift-off method to form the first non-linear resistance layer as in the first embodiment, it is possible to simplify the manufacturing process which has been conventionally performed by patterning using an etching method, and Efficiency can be improved.

Further, by forming the first nonlinear resistance layer and the second nonlinear resistance layer from the same film as in the second embodiment, the film forming step can be omitted and the manufacturing process can be simplified. Therefore, production efficiency can be improved.
Conventionally, a transparent conductive film had to be used for the pixel electrode. However, a metal material such as aluminum or chromium can be used, and the wiring resistance can be reduced.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the first embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the first embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating the method for manufacturing the active substrate for a liquid crystal display device according to the first embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating the method for manufacturing the active substrate for a liquid crystal display device according to the first embodiment of the present invention.

FIG. 8 is a cross-sectional view illustrating the method for manufacturing the active substrate for a liquid crystal display device according to the first embodiment of the present invention.

FIG. 9 is a cross-sectional view illustrating the method for manufacturing the active substrate for a liquid crystal display device according to the first embodiment of the present invention.

FIG. 10 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to a second embodiment of the present invention.

FIG. 11 is a cross-sectional view illustrating the method of manufacturing the active substrate for a liquid crystal display device according to the first embodiment of the present invention.

FIG. 12 is a sectional view illustrating the method for manufacturing the active substrate for a liquid crystal display device according to the first embodiment of the present invention.

FIG. 13 is a plan view illustrating the method for manufacturing the active substrate for the liquid crystal display device in the first embodiment of the present invention.

FIG. 14 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the second embodiment of the present invention.

FIG. 15 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the second embodiment of the present invention.

FIG. 16 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the second embodiment of the present invention.

FIG. 17 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the second embodiment of the present invention.

FIG. 18 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the second embodiment of the present invention.

FIG. 19 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the second embodiment of the present invention.

FIG. 20 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the second embodiment of the present invention.

FIG. 21 is a cross-sectional view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the second embodiment of the present invention.

FIG. 22 is a sectional view illustrating the method for manufacturing the active substrate for a liquid crystal display device according to the second embodiment of the present invention.

FIG. 23 is a plan view illustrating a method for manufacturing an active substrate for a liquid crystal display device according to the second embodiment of the present invention.

FIG. 24 is a plan view showing a liquid crystal display device according to the related art.

FIG. 25 is a cross-sectional view showing a liquid crystal display device according to the related art.

FIG. 26 is a plan view showing a partial region of a liquid crystal display device using a comb-shaped electrode.

DESCRIPTION OF SYMBOLS 12 First comb-tooth electrode 13 First electrode 14 First wiring electrode 15 First nonlinear resistance layer 16 Second nonlinear resistance layer 17 Second electrode 19 Second wiring electrode 20 Second comb-shaped electrode

Claims (8)

[Claims] 1. A pattern of a first comb-shaped electrode, a first wiring electrode connected to the first comb-shaped electrode, and an island-shaped first electrode on a substrate using a first photoresist as an etching mask. Forming, forming a first non-linear resistance layer on the entire surface of the substrate, and forming a pattern on the first wiring electrode using the second photoresist as an etching mask for the second non-linear resistance layer A second comb electrode connected to the first electrode via the first non-linear resistance layer, a second comb tooth electrode connected to the second electrode and proximate to the first comb tooth electrode; And a second wiring electrode connected to the third electrode via the first nonlinear resistance layer, and a second wiring electrode connected to the third electrode and crossing the first wiring electrode via the second nonlinear resistance layer. Forming a pattern using the third photoresist as an etching mask. And a method for manufacturing an active substrate for a liquid crystal display device. 2. A first comb-shaped electrode, a first wiring electrode connected to the first comb-shaped electrode, and an island-shaped first electrode are patterned on a substrate by using a first photoresist as an etching mask. Forming a first non-linear resistance layer over the entire surface of the substrate and forming a second non-linear resistance layer thinner than the first non-linear resistance layer on the first electrode using a second photoresist A second electrode connected to the first electrode via the first nonlinear resistance layer, a second comb electrode connected to the second electrode and adjacent to the first comb electrode, A third electrode connected to the first electrode via the first nonlinear resistance layer, and a second wiring electrode connected to the third electrode and crossing the first wiring electrode via the second nonlinear resistance layer Forming a pattern using the third photoresist as an etching mask. Of manufacturing an active substrate for a liquid crystal display device. 3. A first photo-electrode comprising a first comb-shaped electrode, a first wiring electrode connected to the first comb-shaped electrode, and a first electrode temporarily connected to the first comb-shaped electrode on a substrate. Forming a pattern using a resist as an etching mask, anodizing a first non-linear resistance layer on the first comb-tooth electrode, a first wiring electrode connected to the first comb-tooth electrode, and the first electrode; Forming the first comb-shaped electrode and the first electrode in an island shape using the second photoresist as an etching mask; and forming a second non-linear resistance layer on the first wiring electrode. Forming a pattern using a third photoresist as an etching mask, a second electrode connected to the first electrode via a first nonlinear resistance layer, and a first comb tooth connected to the second electrode. A second comb-shaped electrode close to the electrode, and a first non-linear resistance layer connected to the first electrode. The third electrode connected to the third electrode and the second wiring electrode connected to the third electrode and intersecting with the first wiring electrode via the second nonlinear resistance layer are formed using the fourth photoresist as an etching mask. Forming an active substrate for a liquid crystal display device. 4. A first photo-electrode comprising: a first comb-shaped electrode; a first wiring electrode connected to the first comb-shaped electrode; and a first electrode temporarily connected to the first comb-shaped electrode, on a substrate. Forming a pattern using a resist as an etching mask, anodizing a first non-linear resistance layer on the first comb-tooth electrode, a first wiring electrode connected to the first comb-tooth electrode, and the first electrode; Forming the first comb-tooth electrode and the first electrode in an island shape using the second photoresist as an etching mask; and forming the island on the first nonlinear resistance layer on the first electrode. Forming a second non-linear resistance layer on the entire surface of the substrate, and lifting off the third photoresist on the first electrode together with the second non-linear resistance layer And a second electrode connected to the first electrode via a first nonlinear resistance layer. A second comb electrode connected to the second electrode and adjacent to the first comb electrode; a third electrode and a third electrode connected to the first electrode via a first non-linear resistance layer; And forming a pattern between the first wiring electrode and the second wiring electrode intersecting via the second nonlinear resistance layer using the fourth photoresist as an etching mask. A method for manufacturing an active substrate for a liquid crystal display device. 5. A second wiring electrode, a third electrode connected to the second wiring electrode, a second electrode temporarily connected to the third electrode, and a second electrode connected to the second electrode on the substrate. Forming a pattern using the first photoresist as an etching mask, forming a first non-linear resistance layer on the entire surface of the substrate, and forming a second resist on the second electrode using a second photoresist. Forming a first nonlinear resistance layer thinner than the second nonlinear resistance layer on the third electrode; and a first nonlinear resistance layer on the second electrode and a first nonlinear resistance on the third electrode. A first electrode connected through both of the layers, a first comb electrode adjacent to the second comb electrode, and a second electrode connected to the first comb electrode and on the second wiring electrode. First crossing through a non-linear resistance layer
Forming a pattern of the wiring electrodes using the third photoresist as an etching mask. 6. A second wiring electrode, a third electrode connected to the second wiring electrode, a second electrode, and a second comb-tooth electrode connected to the second electrode on a substrate, the first photo-electrode being provided on the substrate. Forming a pattern using the resist as an etching mask, forming a first non-linear resistance layer over the entire surface of the substrate, and forming a second non-linear resistance layer on the second wiring electrode using a second photoresist as an etching mask Forming a pattern, and a first electrode connected via both the first nonlinear resistance layer on the second electrode and the first nonlinear resistance layer on the third electrode;
A first comb electrode adjacent to the first comb electrode and a first wiring electrode connected to the first comb electrode and intersecting via a second non-linear resistance layer on the second wiring electrode; Forming a pattern using the photoresist as an etching mask. 7. A second wiring electrode, a third electrode connected to the second wiring electrode, a second electrode temporarily connected to the third electrode, and a second electrode connected to the second electrode on the substrate. Forming a pattern using the first photoresist as an etching mask, forming a first non-linear resistance layer on the second electrode and the third electrode by an anodic oxidation method, Separating the third electrode from the third electrode using the second photoresist as an etching mask, and forming a second non-linear resistance layer on the second wiring electrode using the third photoresist as an etching mask. A first electrode connected through both the first nonlinear resistance layer on the second electrode and the first nonlinear resistance layer on the third electrode; A first comb electrode and a second wiring electrode connected to the first comb electrode Forming a pattern using a fourth photoresist as an etching mask with the first wiring electrode intersecting via the second non-linear resistance layer above. . 8. A second wiring electrode, a third electrode connected to the second wiring electrode, a second electrode temporarily connected to the third electrode, and a second electrode connected to the second electrode on the substrate. Forming a pattern using the first photoresist as an etching mask, forming a first non-linear resistance layer on the second electrode and the third electrode by an anodic oxidation method, Separating the third electrode from the third electrode using the second photoresist as an etching mask, and forming a third photoresist on the first non-linear resistance layer on the second electrode and the third electrode Performing a step of forming a second non-linear resistance layer on the entire surface of the substrate, a step of lifting off the third photoresist together with the second electrode and the second non-linear resistance layer on the third electrode, A first nonlinear resistance layer on the second electrode and a third
A first electrode connected through both of the first non-linear resistance layers on the first electrode, a first comb electrode adjacent to the second comb electrode, and a first electrode connected to the first comb electrode and Forming a pattern using a fourth photoresist as an etching mask with a first wiring electrode intersecting via a second non-linear resistance layer on the second wiring electrode. Substrate manufacturing method.