JPH0999488A - Bonding of adhesive applied polyimide tape and stainless steel plate - Google Patents
Bonding of adhesive applied polyimide tape and stainless steel plateInfo
- Publication number
- JPH0999488A JPH0999488A JP7260004A JP26000495A JPH0999488A JP H0999488 A JPH0999488 A JP H0999488A JP 7260004 A JP7260004 A JP 7260004A JP 26000495 A JP26000495 A JP 26000495A JP H0999488 A JPH0999488 A JP H0999488A
- Authority
- JP
- Japan
- Prior art keywords
- stainless steel
- steel plate
- polyimide tape
- adhesive
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- ing And Chemical Polishing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】本発明は接着剤付きポリイミドテープとス
テンレス鋼板とを接着する場合に、密着性を向上させる
為、ステンレス鋼板に対して表面処理を行なった接着方
法に関する。[0001] The present invention relates to a bonding method in which a surface treatment is performed on a stainless steel plate in order to improve adhesion when bonding a polyimide tape with an adhesive and a stainless steel plate.
【０００２】[0002]
【従来の技術】ステンレス鋼板は耐熱性、耐食性に優れ
ており、その中でもオーステナイト系ステンレス鋼板は
非磁性である性質を生かし磁気シールド材料としても利
用されている。一般にステンレス鋼板を複合材料として
使用する場合、表面が平滑であるため高い接着強度を得
ることは困難である。その為、従来所望の接着強度を安
定して耐久性よく得る為、ステンレス鋼板に化学処理ま
たは機械処理がなされている。また、他方接着剤付きポ
リイミドテープは耐熱性、電気絶縁性、機械的強度、耐
薬品性及び加工特性に優れており、ＴＡＢ用の配線材料
として用いられるに至っているがステンレス鋼板を用い
る場合、ステンレス鋼板の表面濡れ性が悪い為、満足出
来る接着強度は得られなかった。2. Description of the Related Art Stainless steel sheets are excellent in heat resistance and corrosion resistance. Among them, austenitic stainless steel sheets are used as a magnetic shield material by taking advantage of the nonmagnetic property. Generally, when a stainless steel plate is used as a composite material, it is difficult to obtain high adhesive strength because the surface is smooth. Therefore, in order to stably obtain desired adhesive strength with good durability, stainless steel sheets have been chemically or mechanically treated. On the other hand, the adhesive-attached polyimide tape is excellent in heat resistance, electrical insulation, mechanical strength, chemical resistance, and processing characteristics, and has come to be used as a wiring material for TAB. Since the surface wettability of the steel sheet was poor, satisfactory adhesive strength could not be obtained.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記の接着剤
付きポリイミドテープとステンレス鋼板との接着時の問
題を解決する為になされたものである。接着剤付きポリ
イミドテープとステンレス鋼板の接着強度を高めること
が可能な接着方法を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problem at the time of bonding the adhesive-attached polyimide tape and the stainless steel plate. An object of the present invention is to provide a bonding method capable of increasing the bonding strength between a polyimide tape with an adhesive and a stainless steel plate.
【０００４】[0004]
【課題を解決するための手段】本発明は接着剤付きポリ
イミドテープとステンレス鋼板との接着方法に関して予
めステンレス鋼板に表面処理を施して接着することを特
徴とする。本発明による第一の方法は接着剤付きポリイ
ミドテープとステンレス鋼板との接着方法に於いて、ス
テンレス鋼板を予めショットブラスト、研磨等の機械的
手段により表面に巨視的凹凸（平均粗さＲａ３μｍ）を
つけることを特徴とする。研磨剤粒子は無機系粒子が好
ましくアルミナ、ガラス等の使用が望ましい。研磨処理
は最初にステンレス鋼板表面に巨視的凹凸をつくり、次
に微視的凹凸（平均粗さＲａ０．３μｍ）をその上に設
けることで一層高い接着強度を得ることが可能である。The present invention relates to a method for adhering a polyimide tape with an adhesive and a stainless steel plate, which is characterized in that the stainless steel plate is surface-treated in advance and adhered. A first method according to the present invention is a method for adhering a polyimide tape with an adhesive and a stainless steel plate, wherein the stainless steel plate is previously provided with macroscopic unevenness (average roughness Ra 3 μm) on the surface by mechanical means such as shot blasting and polishing. It is characterized by putting on. The abrasive particles are preferably inorganic particles, and alumina, glass or the like is preferably used. In the polishing treatment, macroscopic irregularities are first formed on the surface of the stainless steel plate, and then microscopic irregularities (average roughness Ra 0.3 μm) are provided thereon, whereby higher adhesive strength can be obtained.
【０００５】本発明による第二の方法は接着剤付きポリ
イミドテープとステンレス鋼板との接着方法に於いて、
ステンレス鋼板を予め塩化第二鉄と塩酸を含有する水溶
液（以下、処理液）で表面処理し、水洗、乾燥すること
を特徴とする。このような処理液にステンレス鋼板を３
０〜４０℃の温度で１０秒から１分間程度、浸漬或いは
スプレー処理することで接着剤付きポリイミドテープを
ステンレス鋼板の処理面に強固に接着することが可能で
ある。A second method according to the present invention is a method of bonding a polyimide tape with an adhesive and a stainless steel plate,
It is characterized in that a stainless steel plate is surface-treated in advance with an aqueous solution containing ferric chloride and hydrochloric acid (hereinafter referred to as a treatment liquid), washed with water and dried. Stainless steel plate is added to such treatment liquid.
The adhesive-attached polyimide tape can be firmly adhered to the treated surface of the stainless steel plate by immersion or spray treatment at a temperature of 0 to 40 ° C. for about 10 seconds to 1 minute.
【０００６】本発明による第三の方法は接着剤付きポリ
イミドテープとステンレス鋼板の接着方法に於いて、第
一の方法の機械的処理を行った後に第二の方法の湿式処
理を行うことで接着剤付きポリイミドテープをステンレ
ス鋼板へ一層強固に接着することが可能である。この機
械的処理後の湿式処理に用いる溶液は市水、蒸留水やア
セトン、ＭＥＫ等有機溶媒を用いることも有効である。
また、湿式処理に高圧水によるジェット水洗や超音波処
理を併用することで高い接着強度をバラツキが小さく得
ることが可能である。以上の方法を用いて作られたポリ
イミドテープ／接着剤／ステンレス鋼板は高い接着強度
と電気絶縁性を有し、ＴＡＢ以外に磁気シールド用の配
線材料として用いることが可能である。A third method according to the present invention is a method for bonding a polyimide tape with an adhesive and a stainless steel plate, which comprises mechanically treating the first method and then performing a wet treatment of the second method. It is possible to more firmly bond the agent-attached polyimide tape to the stainless steel plate. As the solution used for the wet treatment after the mechanical treatment, it is effective to use city water, distilled water, or an organic solvent such as acetone or MEK.
In addition, it is possible to obtain high adhesive strength with less variation by using jet washing with high-pressure water and ultrasonic treatment together with wet treatment. The polyimide tape / adhesive / stainless steel sheet produced by the above method has high adhesive strength and electrical insulation, and can be used as a wiring material for magnetic shield other than TAB.
【０００７】[0007]
【実施例】以下に実施例を挙げて本発明の内容を具体的
に説明するが、本発明はこれら実施例によってなんら限
定されるものではない。 ［実施例１］ステンレス鋼板ＳＵＳ３０４．２Ｂ仕上げ
の冷間圧延材（板厚０．１ｍｍ、サイズ３５ｍｍ×３０
０ｍｍ）をアルミナビ−ズを原料にしたショットブラス
ターを用いて表面処理（平均粗さＲａ３μｍ）した後、
接着剤１３μｍのエポキシ樹脂（鐘淵化学工業製 ＫＢ
接着剤）とポリイミドテープ（鐘淵化学工業製 アピカ
ルＮＰＩ ５０μｍ）からなる接着剤付きポリイミドテ
ープ（以下、ＦＣテープ）にはさみサーマルラミネータ
ーを用い、ロール温度１５０℃、面圧力１０〜２０Kg/
ｃｍ2で加熱圧着し複合基板を得た。この複合基板に於
ける接着力を第１表に示す。 ［実施例２］６０部の塩化第二鉄に５０ｖｏｌ％の塩酸
４０部を加えて処理液とした。この処理液に実施例１と
同じステンレス鋼板を３０〜４０℃の温度で１分間浸漬
した後、蒸留水で十分洗浄し、１００℃の恒温槽内にて
３０分間乾燥させた。次いでこのように処理したステン
レス鋼板を実施例１と同じＦＣテープとを用いて複合基
板をえた。この複合基板に於ける接着力を第１表に示
す。 ［実施例３］実施例１の表面処理を行ったステンレス鋼
板を連続して実施例２の表面処理を行い、実施例１と同
じＦＣテープを用いて複合基板を得た。この複合基板に
於ける接着力を第１表に示す。 ［比較例１］実施例１と同じ冷間圧延ステンレス鋼板を
表面処理なしで実施例１と同じＦＣテープを用いて複合
基板を得た。この複合基板に於ける接着力を第１表に示
す。EXAMPLES The contents of the present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. [Example 1] Stainless steel plate SUS304.2B finish cold rolled material (sheet thickness 0.1 mm, size 35 mm x 30)
0 mm) was surface-treated (average roughness Ra 3 μm) using a shot blaster using alumina beads as a raw material,
Epoxy resin with 13 μm adhesive (Kanefuchi Chemical Industry KB
Adhesive polyimide tape (hereinafter, FC tape) consisting of adhesive tape and polyimide tape (Kanefuchi Chemical Co., Ltd. Apical NPI 50 μm) using a scissors thermal laminator, roll temperature 150 ° C., surface pressure 10-20 Kg /
A composite substrate was obtained by thermocompression bonding at cm 2 . The adhesive strength of this composite substrate is shown in Table 1. Example 2 To 60 parts of ferric chloride was added 40 parts of 50 vol% hydrochloric acid to prepare a treatment liquid. The same stainless steel plate as in Example 1 was immersed in this treatment solution for 1 minute at a temperature of 30 to 40 ° C., thoroughly washed with distilled water, and dried in a constant temperature bath at 100 ° C. for 30 minutes. Then, using the stainless steel plate thus treated and the same FC tape as in Example 1, a composite substrate was obtained. The adhesive strength of this composite substrate is shown in Table 1. [Example 3] A stainless steel plate subjected to the surface treatment of Example 1 was continuously subjected to the surface treatment of Example 2, and the same FC tape as in Example 1 was used to obtain a composite substrate. The adhesive strength of this composite substrate is shown in Table 1. [Comparative Example 1] The same cold rolled stainless steel sheet as in Example 1 was used without surface treatment and the same FC tape as in Example 1 was used to obtain a composite substrate. The adhesive strength of this composite substrate is shown in Table 1.
【０００８】[0008]
【表１】 [Table 1]
【０００９】[0009]
【発明の効果】本発明を用いれば、ステンレス鋼板に接
着剤付きポリイミドテープを強固に接着することが可能
である。また、接着剤付きポリイミドテープ以外の熱可
塑性ポリイミド樹脂や塗料等のコートに際しても有効な
前処理方法である。According to the present invention, it is possible to firmly bond an adhesive-attached polyimide tape to a stainless steel plate. It is also an effective pretreatment method when coating a thermoplastic polyimide resin other than the adhesive-attached polyimide tape, a paint, or the like.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｋ 79:00 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification code Office reference number FI technical display area // B29K 79:00
Claims (3)
ス鋼板との接着に於いて、張り合わせ前にステンレス鋼
板を無機系粒子を用いたショットブラスト、研磨等で表
面処理することを特徴とするステンレス鋼板と接着剤付
きポリイミドテ−プとの接着方法。1. Adhesion between a polyimide tape with an adhesive and a stainless steel plate, which comprises subjecting the stainless steel plate to surface treatment by shot blasting, polishing, etc. using inorganic particles before bonding. Adhesion method with polyimide tape with agent.
ス鋼板との接着に於いて、張り合わせ前にステンレス鋼
板を塩化第二鉄と塩酸とを含有する水溶液で表面処理し
水洗、乾燥することを特徴とするステンレス鋼板と接着
剤付きポリイミドテ−プとの接着方法。2. A method for bonding a polyimide tape with an adhesive and a stainless steel plate, characterized in that the stainless steel plate is surface-treated with an aqueous solution containing ferric chloride and hydrochloric acid, washed with water, and dried before bonding. A method for bonding a stainless steel plate and a polyimide tape with an adhesive.
表面処理を併用して表面処理を行うことを特徴とするス
テンレス鋼板と接着剤付きポリイミドテ−プとの接着方
法。3. A method for adhering a stainless steel sheet and a polyimide tape with an adhesive, wherein the surface treatment is performed by using the surface treatment according to claim 1 and the surface treatment according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7260004A JPH0999488A (en) | 1995-10-06 | 1995-10-06 | Bonding of adhesive applied polyimide tape and stainless steel plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7260004A JPH0999488A (en) | 1995-10-06 | 1995-10-06 | Bonding of adhesive applied polyimide tape and stainless steel plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0999488A true JPH0999488A (en) | 1997-04-15 |
Family
ID=17341971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7260004A Pending JPH0999488A (en) | 1995-10-06 | 1995-10-06 | Bonding of adhesive applied polyimide tape and stainless steel plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0999488A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100018045A1 (en) * | 2008-07-23 | 2010-01-28 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Method for manufacturing anti-electromagnetic interference shields |
| TWI447563B (en) * | 2009-01-09 | 2014-08-01 | Hon Hai Prec Ind Co Ltd | Method for producing emi slice |
-
1995
- 1995-10-06 JP JP7260004A patent/JPH0999488A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100018045A1 (en) * | 2008-07-23 | 2010-01-28 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd | Method for manufacturing anti-electromagnetic interference shields |
| US8261430B2 (en) * | 2008-07-23 | 2012-09-11 | Hong Fu Jin Precision Industry (Shenzhen)Co., Ltd. | Method for manufacturing anti-electromagnetic interference shields |
| TWI447563B (en) * | 2009-01-09 | 2014-08-01 | Hon Hai Prec Ind Co Ltd | Method for producing emi slice |
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