JPH0997741A - Electrolytic capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a reduction in the thickness of an electrolytic equipment and a miniaturization of the equipment possible by a method wherein it is made possible that an electrolytic capacitor, which can not be mounted excepting a mounting in the longitudinal direction, is laid down on a board and is mounted in the lateral direction, it is made possible that even a large-sized electrolytic capacitor is stably mounted to make the capacitor have resistance to vibrations and moreover, it is made possible that a printed board of a low mounting height is manufactured. SOLUTION: An electrolytic capacitor is formed into a constitution contrived so that a dummy lead 10a for fixing on a printed board by soldering to the board regardless of an electrical action is secured to the bottom 12a of a bottomed container on the opposite side to the lead wires 10c of the single-lead type electrolytic capacitor 10, the lead 10a is soldered to the printed board in a state that the capacitor 10 is laid down in the lateral direction and the capacitor 10 can be firmly mounted at three points of the two lead wires 10c and the dummy lead 10a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolytic capacitor, and in particular, it is soldered to a printed circuit board at the bottom of a bottomed container on the side opposite to the lead wire of a single-lead type aluminum electrolytic capacitor, regardless of electrical action. By fixing the dummy lead for fixing by fixing it, the electrolytic capacitor that could only be mounted in the vertical direction so far can be laid on the board and mounted in the horizontal direction, making it stable even for large electrolytic capacitors. The present invention relates to an electrolytic capacitor that is extremely effective for miniaturization of electronic devices by enabling a printed circuit board that is resistant to vibration and has a low mounting height to be manufactured so that it can be mounted.

[0002]

2. Description of the Related Art In an aluminum electrolytic capacitor, an electrode foil to which a lead wire is fixed and an electrolytic paper are superposed on each other and wound into a cylindrical shape, which is then stored in a bottomed container made of aluminum.
This electronic component is manufactured by impregnating it with an electrolytic solution and sealing the opening with a sealing rubber.Since the size increases in proportion to the capacitance of the capacitor, other electronic components are becoming smaller. It is one of the electronic parts that is difficult to miniaturize.

Electronic components are soldered and mounted on a printed circuit board, but aluminum electrolytic capacitors are conventionally soldered to the printed circuit board in an upright state, so that the height of the printed circuit board on which the electronic components are mounted becomes high. As a result, this has been a bottleneck in reducing the thickness and size of electronic devices mounted with a mounting board.

29 and 30, in order to solve the above problems, the electrolytic capacitor 1 is connected to the printed circuit board 2
The lead wire 1a is bent and formed in a state of being laid horizontally in the upper direction, inserted into the through hole 2a of the printed board 2 and soldered with the solder 3, or the lead wire 1a is bent and formed into a crank shape and printed board 2 Surface mounting is performed on the surface of and the solder 3 is soldered to reduce the mounting height.

However, in the electrolytic capacitor 1 mounted as described above, it is difficult to mount the cylindrical portion 1b in close contact with the printed circuit board 2, and the gap C between the cylindrical portion 1b and the printed circuit board 2 is inevitable. Since the cylindrical portion 1b has a cantilever structure in which it is fixed to the printed circuit board 2 only by the lead wire 1a, when the electronic device is vibrated, the cylindrical portion 1b having a large mass is supported only by the lead wire 1a. However, excessive repetitive bending stress is generated in the lead wire 1a, particularly at the root of the lead wire 1a, which deteriorates the electrical characteristics of the electrolytic capacitor 1, and in extreme cases, the lead wire 1a may be broken. there were.

In particular, in an electronic device mounted on a transportation facility such as a vehicle, when a vibration having a wide frequency acts on the electronic device and a vibration having a frequency close to the natural frequency of the electrolytic capacitor 1 acts, a resonance phenomenon occurs. As a result, the cylindrical portion 1b vibrates violently, resulting in a serious result.

Therefore, conventionally, as shown in FIG. 31, the adhesive 5 is applied to the gap C to form the cylindrical portion 1b and the printed circuit board 2.
However, there is a drawback that the cost of the printed circuit board 2 on which the electronic components are mounted is high because the bonding requires a different work from the soldering process. .

Further, when the adhesive 5 is peeled off from the printed circuit board 2 due to insufficient adhesive force during long-term use, the lead wire 1a is still subjected to the repeated bending stress caused by the above-mentioned vibration. It was insufficient to maintain stable performance for a long time.

[0009]

SUMMARY OF THE INVENTION The present invention has been made in order to eliminate the above-mentioned drawbacks of the prior art. The purpose of the present invention is to fix a dummy lead to the bottom of a bottomed container of an electrolytic capacitor. Then, the dummy lead is soldered to the printed circuit board so that the electrolytic capacitor can be mounted in a lying state, and thereby the mounting height of the electrolytic capacitor on the printed circuit board can be significantly reduced. Is.

Another object is to fix a dummy lead to the bottom of a bottomed container on the side opposite to the lead wire of a one-lead type electrolytic capacitor by welding and solder the dummy lead together with the lead wire to a printed board. By doing so, it is possible to firmly fix the electrolytic capacitor on the printed circuit board at the three points of the two lead wires and the dummy lead. Moreover, even if vibration is applied to the printed circuit board, the lead wire becomes excessive. It is to prevent the occurrence of such repeated bending stress, and to completely prevent the deterioration of the electrical characteristics of the electrolytic capacitor and the breakage of the lead wire.

Still another object is to bend and form a dummy lead fixed to the bottom of a bottomed container in the radial direction so that the lead wire and the dummy lead can be inserted into a through hole of a printed circuit board and soldered. The purpose is to prevent excessive repetitive bending stress from being generated in the lead wire, and to prevent deterioration of the electrical characteristics of the electrolytic capacitor so that stable performance can be maintained for a long period of time.

Another object is to bend and form a dummy lead fixed to the bottom of a bottomed container into a crank shape so that the electrolytic capacitor can be surface-mounted in a laterally lying state. In addition, this is to significantly reduce the height of the mounting board, and further, to allow the electrolytic capacitor to be firmly mounted on the printed board.

Still another object is to mount a dummy lead having a flat plate-shaped soldering portion for soldering to a printed circuit board on the bottom of a bottomed container, so that the flat plate portion can be soldered and mounted on the printed circuit board. This also makes it possible to fix the electrolytic capacitor very firmly to the printed circuit board in a wide area of the lead wire and dummy lead, and has a low mounting height and strong vibration resistance. It is to be able to manufacture a small electronic device having excellent properties.

Still another object is to mount a plate-shaped dummy lead on the bottom of a bottomed container by soldering, welding or adhering, and then solder the plate-shaped dummy lead to a printed circuit board to form an electrolytic capacitor. It can be firmly fixed to the printed circuit board while lying down so that the electrolytic capacitor does not resonate and vibrate even when vibration acts on the printed circuit board, and the deterioration of the electrical characteristics of the electrolytic capacitor is prevented. Is.

[0015]

SUMMARY OF THE INVENTION In summary, the present invention (Claim 1) is a one-lead type electrolytic capacitor in which lead wires of the anode and the cathode are drawn out from the opening of the bottomed container, and the lead of the anode and the cathode. It is characterized in that a dummy lead for fixing by soldering to a printed circuit board is fixed to the bottom of the bottomed container on the side opposite to the line, regardless of electrical action.

According to the present invention (claim 2), an electrolytic capacitor element in which an electrode foil to which a lead wire is fixed and an electrolytic paper are superposed on each other and wound in a cylindrical shape and the lead wire is pulled out from one side is made of aluminum. In an aluminum electrolytic capacitor which is housed in a bottomed container and whose opening is sealed with a sealing rubber, a dummy lead for soldering and fixing to a printed circuit board is irrelevant to an electrical action. It is characterized by being welded to the bottom of a bottomed container.

According to the present invention (claim 3), in a single lead type electrolytic capacitor in which lead wires for the anode and the cathode are drawn out from the opening of the bottomed container, the lead wire for the anode and the cathode is provided on the opposite side. A dummy lead for soldering and fixing to a printed circuit board is fixed to the bottom of the bottomed container regardless of electric action, and the cylindrical part of the bottomed container is mounted on the printed circuit board in a state of being laid on the printed circuit board. The anode and cathode lead wires and the dummy lead are radially bent and formed so that the anode and cathode lead wires and the dummy lead can be inserted into the through holes formed in .

According to the present invention (claim 4), an electrolytic capacitor element in which an electrode foil to which a lead wire is fixed and an electrolytic paper are superposed and wound in a cylindrical shape and the lead wire is pulled out from one side is made of aluminum. In an aluminum electrolytic capacitor which is housed in a bottomed container and whose opening is sealed with a sealing rubber, a dummy lead for soldering and fixing to a printed circuit board is irrelevant to an electrical action. The anode and cathode lead wires and the dummy leads are fixed to the cylindrical portion of the bottomed container, the cylindrical portion of the bottomed container is mounted on the printed board in a state of being laid down, and the anode and the cathode lead wires and the dummy lead are surface-mounted on the printed board. It is characterized by being bent and formed into a crank shape.

According to the present invention (claim 5), an electrolytic capacitor element in which an electrode foil to which a lead wire is fixed and an electrolytic paper are superposed on each other and wound in a cylindrical shape and the lead wire is pulled out from one side is made of aluminum. In an aluminum electrolytic capacitor housed in a bottomed container of which the opening is sealed with a sealing rubber, the aluminum electrolytic capacitor is bent and formed into a crank shape and the soldering portion to the printed circuit board is formed into a flat plate shape. The lead wire and the bottom portion of the bottomed container are bent and formed into a crank shape, and the soldering portion to the printed circuit board is formed into a flat plate shape and is soldered to the printed circuit board regardless of an electrical action. A dummy lead for attaching and fixing is provided, and the dummy lead is mounted on the printed circuit board in a lying state and can be surface-mounted on the printed circuit board. Than it is.

According to the present invention (claim 6), an electrolytic capacitor element in which an electrode foil to which a lead wire is fixed and an electrolytic paper are superposed on each other and wound in a cylindrical shape and the lead wire is pulled out from one side is made of aluminum. In an aluminum electrolytic capacitor which is housed in a bottomed container and whose opening is sealed with a sealing rubber, a dummy lead for soldering and fixing to a printed circuit board is irrelevant to an electrical action. The dummy lead is fixed to the bottom of the bottomed container, and the dummy lead is a plate-shaped member.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to embodiments shown in the drawings. The electrolytic capacitor 10 according to the first embodiment of the present invention is similar to that shown in FIGS.
a.

The dummy lead 10a is the electrolytic capacitor 1
0 is firmly fixed to the printed circuit board 11 and is made of the same material as the lead wire 10c (so-called CP wire) obtained by tinning soft iron, for example, soft iron being tin-plated or zinc-plated. It may be copper, brass, or the like. In short, a material that can be welded or adhered and has good solderability is used, and is welded or adhered to the bottom portion 12a of the bottomed container 12 made of aluminum, for example, by a welding material 13. The structure is fixed and has no relation to the electrical action of the electrolytic capacitor 10.

An example of the manufacturing process of the electrolytic capacitor 10 will be described with reference to FIGS. 4 to 9. In FIG. 4, the electrode foil 14 in which the lead wire 10c is fixed by a gusseting process or the like is shown.
And the electrolytic paper 15 are overlapped and wound up to manufacture an electrolytic capacitor element 16 as shown in FIG.

In FIG. 6, a tape 18 is wrapped around the electrolytic capacitor element 16 for taping, then impregnated with an electrolytic solution, inserted into a bottomed container 12 made of aluminum, and a lead wire 10c is inserted through a sealing rubber 19. It is pressed into the opening 12b of the bottomed container 12.

In FIG. 7, the opening 12 of the bottomed container 12 is shown.
Curling is performed near b to form a recess 12c, and the opening 12b is sealed with a sealing rubber 19, and then a cylindrical heat-shrinkable tube 20 is inserted into the bottomed container 12 in the direction of arrow A in FIG. And heat-shrink tube 2 with hot air
0 is contracted so that it closely fits to the bottomed container 12, and then in FIG. 9, the dummy lead 10a is brought into contact with the bottom portion 12a in the direction of arrow B and welded or soldered to fix.

The shape of the dummy lead 10a is such that the bottom 1
The bottom portion 1 is formed in a headed pin shape (not shown) in which the diameter of the joint portion with 2a is formed to be large to allow a large area.
You may make it adhere | attach on 2a.

Another example of the manufacturing process of the electrolytic capacitor 10 is shown in FIGS. 10 to 13, in which the dummy lead 10a is first brought into contact with the bottom 12a of the bottomed container 12 in the direction of arrow D and welded with the welding material 13. After being fixed (FIGS. 10 and 11), an electrolytic capacitor element 1 manufactured in the same manner as above
6 into the bottomed container 12 and the lead wire 1 on the sealing rubber 19.
It can be manufactured by inserting 0c into the opening 12b of the bottomed container 12 (FIG. 12), covering the heat-shrinkable tube 20 (FIG. 13), and shrinking the heat-shrinkable tube 20 with hot air. The later shape is the electrolytic capacitor 1 described above.
It has exactly the same shape as 0.

The shape of the dummy lead 10a has been described as using a metal wire, but the dummy lead 10a is irrelevant to the electrical action of the electrolytic capacitor 10, and the electrolytic capacitor 10 is simply connected to the printed circuit board. 11
Any shape may be used as long as it can be firmly fixed to the printed circuit board 11. For convenience of soldering with the printed circuit board 11, for example, as shown in FIGS. 23 to 26, the soldering portion 10f is formed in a flat plate shape. The dummy lead 10d may be the formed dummy lead 10d or the plate-shaped dummy lead 10e as shown in FIG. 27 or 28.

The present invention is configured as described above,
The operation will be described below. In the first embodiment of the present invention, the lead wire 10c and the dummy lead 10a are formed by bending the lead wire 10c and the dummy lead 10a in the radial direction in FIGS.
Also, the dummy lead 10a is inserted into the through hole 11a, soldered with solder 21 by applying an automatic soldering device (not shown), and fixed to the printed circuit board 11 at two points of the two lead wires 10c and the dummy lead 10a. Implement.

As described above, the electrolytic capacitor 10 is
Since the two lead wires 10c and the dummy leads 10a are firmly fixed to the printed board 11 at three points, even if vibration is applied to the printed board 11, excessive repetitive bending stress is not generated in the lead wire 10c. In addition, even a large-capacity large electrolytic capacitor 10 can be laterally arranged on the printed circuit board 11 to keep the mounting height low.

In the second embodiment, in FIGS. 19 to 22, the lead wire 10c and the dummy lead 10a are formed into a crank shape, and the lead wire 10c is formed on the pattern 11b of the printed circuit board 11 on which the cream solder 22 is applied. Alternatively, the dummy leads 10a may be placed and mounted on a reflow automatic soldering device (not shown) for soldering for surface mounting.

When another electronic component (not shown) to be mounted is a chip type electronic component, it can be mounted on the printed circuit board 11 at the same time as the electronic component, and the manufacturing process can be simplified. This is extremely advantageous for cost reduction.

As the surface mount electrolytic capacitor 10,
23 to 26, by soldering the soldering portion 10f to the printed circuit board 11 with the dummy lead 10d formed in a flat plate shape, the dummy lead 10d can be soldered to the printed circuit board 11 with the cream solder 22 in a wider area. The electrolytic capacitor 10 and the printed circuit board 11
Can be very firmly fixed to.

27 and 28, the bottomed container 1 is manufactured by forming the dummy lead 10e from a metal plate.
The dummy lead 10e can be fixed to the bottom portion 12a of the second die by any method such as welding, soldering or adhesion, and the area of the joint with the printed circuit board 11 is made wider than that of the dummy lead 10a manufactured from a wire rod. Therefore, the electrolytic capacitor 10 can be more firmly fixed to the printed circuit board 11
Can be fixed to.

[0035]

As described above, according to the present invention, the dummy lead is fixed to the bottom of the bottomed container of the electrolytic capacitor, and the dummy lead is soldered to the printed circuit board. Can be implemented,
As a result, the mounting height of the electrolytic capacitor on the printed circuit board can be significantly reduced.

Further, the dummy lead is fixed by welding to the bottom of the bottomed container on the side opposite to the lead wire of the one-lead type electrolytic capacitor, and the dummy lead is soldered together with the lead wire to the printed board at the time of mounting. There is an effect that the electrolytic capacitor can be firmly fixed on the printed circuit board at three points of the two lead wires and the dummy lead, and as a result, excessive repetitive bending stress is generated in the lead wire even if the printed circuit board is vibrated. Therefore, there is an effect that the deterioration of the electrical characteristics of the electrolytic capacitor and the breakage of the lead wire can be completely prevented.

Further, since the dummy lead fixed to the bottom of the bottomed container is bent and formed in the radial direction,
Since lead wires and dummy leads can be inserted into the through holes of the printed circuit board and soldered, excessive repeated bending stress can be prevented from occurring in the lead wires, and as a result, deterioration of the electrical characteristics of the electrolytic capacitor can be prevented. In addition, it has an effect of maintaining stable performance for a long period of time.

Further, since the dummy lead fixed to the bottom of the bottomed container is formed by bending into a crank shape, there is an effect that the electrolytic capacitor can be surface-mounted in a state of lying sideways, and as a result, mounting There is an effect that the height of the board can be greatly reduced and the electrolytic capacitor can be firmly mounted on the printed board.

Further, since the dummy lead having a flat plate-shaped soldering portion to the printed board is fixed to the bottom of the bottomed container, the flat plate portion can be soldered and mounted on the printed board. As a result, it is possible to fix the electrolytic capacitor very firmly to the printed circuit board in a wide area of the lead wire and the dummy lead, and also to have a small mounting height, vibration resistance, and small electronic equipment with excellent reliability. The effect that it can be produced is obtained.

Further, the plate-shaped dummy leads are soldered to the bottom of the bottomed container and fixed by a method such as welding or adhesion, and the plate-shaped dummy leads are soldered to the printed circuit board. Since it can be firmly fixed to the printed circuit board in the state, it is possible to prevent the electrolytic capacitor from resonating and vibrating even when vibration is applied to the printed circuit board, and it is possible to prevent deterioration of the electrical characteristics of the electrolytic capacitor. .

[Brief description of drawings]

FIG. 1 is a perspective view of an electrolytic capacitor viewed from a dummy lead side.

FIG. 2 is a perspective view of the electrolytic capacitor viewed from the lead wire side.

FIG. 3 is a vertical sectional view of an electrolytic capacitor.

4 to 9 relate to a first embodiment of a process for manufacturing an electrolytic capacitor, and FIG. 4 is a perspective view showing a state in which an electrode foil and electrolytic paper are superposed and wound up.

FIG. 5 is a perspective view of an electrolytic capacitor element completed by winding up an electrode foil and electrolytic paper.

FIG. 6 is a perspective view showing a state in which an electrolytic capacitor element is inserted into a bottomed container and a sealing rubber is attached.

FIG. 7 is a perspective view showing a state where the curling process is completed and the electrolytic capacitor element is sealed.

FIG. 8 is a perspective view showing a state in which a heat-shrinkable tube is put on a bottomed container.

FIG. 9 is a perspective view showing a state in which the dummy lead is fixed to the bottom of the bottomed container.

10 to 13 relate to a second embodiment of the manufacturing process of the electrolytic capacitor, and FIG. 10 is a perspective view showing a state in which the dummy lead is fixed to the bottom of the bottomed container.

FIG. 11 is a vertical cross-sectional view of a bottomed container to which dummy leads are fixed.

FIG. 12 is a perspective view showing a state in which an electrolytic capacitor element is inserted into a bottomed container to which dummy leads have been fixed and a sealing rubber is mounted.

FIG. 13 is a perspective view showing a state in which a heat-shrinkable tube is put on a bottomed container.

14 to 18 relate to a first embodiment of a mounting process on a printed board, and FIG. 14 is a perspective view showing a state in which lead wires and dummy leads are inserted into through holes of the printed board.

FIG. 15 is a plan view showing a state in which a lead wire and a dummy lead are inserted into a through hole of a printed board.

FIG. 16 is a vertical cross-sectional view showing a state where a lead wire and a dummy lead are inserted into a through hole of a printed board and soldering is completed.

FIG. 17 is a vertical sectional view seen from the lead wire side showing a state in which the lead wire is inserted into a through hole of a printed circuit board and soldered.

FIG. 18 is a vertical cross-sectional view seen from the dummy lead side showing a state in which the dummy lead is inserted into a through hole of the printed board and soldered.

19 to 22 relate to a second embodiment of a mounting process on a printed board, and FIG. 19 is a cross-sectional view showing a state where an electrolytic capacitor is surface-mounted on the printed board.

FIG. 20 is a vertical cross-sectional view showing a state in which an electrolytic capacitor is surface-mounted on a printed board.

FIG. 21 is a vertical cross-sectional view showing a state in which an electrolytic capacitor is surface-mounted on a printed board, as viewed from the lead wire side.

FIG. 22 is a vertical cross-sectional view seen from the dummy lead side showing a state where the electrolytic capacitor is surface-mounted on the printed board.

23 to 26 relate to a third embodiment of a mounting process on a printed board, and FIG. 23 is a cross-sectional view showing a state where an electrolytic capacitor is surface-mounted on the printed board.

FIG. 24 is a vertical cross-sectional view showing a state in which an electrolytic capacitor is surface-mounted on a printed board.

FIG. 25 is a vertical cross-sectional view showing a state in which an electrolytic capacitor is surface-mounted on a printed circuit board as seen from the lead wire side.

FIG. 26 is a vertical cross-sectional view showing a state in which an electrolytic capacitor is surface-mounted on a printed circuit board as seen from the dummy lead side.

27 and 28 relate to a fourth embodiment of the mounting process on a printed circuit board, and FIG. 27 is a vertical cross-sectional view showing a state in which an electrolytic capacitor using plate-shaped dummy leads is surface-mounted.

FIG. 28 is a perspective view of an electrolytic capacitor using a plate-shaped dummy lead.

29 to 31 relate to a conventional example, and FIG. 29 is a longitudinal sectional view showing a state in which a lead wire is bent at a right angle and an electrolytic capacitor is mounted on a printed circuit board through a through hole.

FIG. 30 is a vertical cross-sectional view showing a state in which a lead wire is bent in a crank shape and an electrolytic capacitor is surface-mounted on a printed circuit board.

FIG. 31 is a vertical cross-sectional view showing a state in which the cylindrical portion is bonded and fixed to the printed board in the state shown in FIG. 30.

[Explanation of symbols]

 10 Electrolytic Capacitor 10a Dummy Lead 10c Lead Wire 10e Plate Dummy Lead 10f Soldering Part 11 Printed Circuit Board 11a Through Hole 12 Bottomed Container 12a Bottom 12b Opening 14 Electrode Foil 15 Electrolytic Paper 16 Electrolytic Capacitor Element 19 Sealing Rubber

Claims (6)

[Claims] 1. A single-lead type electrolytic capacitor in which lead wires for an anode and a cathode are drawn out from an opening portion of a bottomed container, and an electrical capacitor is provided on a bottom portion of the bottomed container opposite to the lead wires for the anode and the cathode. An electrolytic capacitor characterized in that dummy leads for fixing by soldering to a printed circuit board are fixed regardless of the action. 2. An electrolytic capacitor element in which an electrode foil to which a lead wire is fixed and an electrolytic paper are superposed and rolled up in a cylindrical shape, and the lead wire is pulled out from one side is housed in an aluminum bottomed container. In an aluminum electrolytic capacitor in which the opening of the bottomed container is sealed with a sealing rubber, a dummy lead for soldering and fixing to a printed circuit board is welded to the bottom of the bottomed container regardless of electrical action. Aluminum electrolytic capacitor characterized by the following. 3. A single-lead type electrolytic capacitor in which lead wires for an anode and a cathode are drawn out from an opening portion of a bottomed container, and an electrical capacitor is provided on a bottom portion of the bottomed container opposite to the lead wires for the anode and the cathode. Irrespective of the action, fix the dummy lead for soldering and fixing to the printed circuit board,
The cylindrical portion of the bottomed container is mounted on a printed circuit board in a lying state, and the anode and cathode lead wires and the dummy lead wires are inserted so that the anode and cathode lead wires and the dummy leads can be inserted into through holes formed in the printed board. And an electrolytic capacitor formed by bending the dummy lead in a radial direction. 4. An electrolytic capacitor element in which an electrode foil having a lead wire fixed thereto and electrolytic paper are superposed on each other and wound in a cylindrical shape, and the lead wire is pulled out from one side is housed in a bottomed container made of aluminum. In an aluminum electrolytic capacitor in which the opening of the bottomed container is sealed with a sealing rubber, dummy leads for fixing by soldering to a printed circuit board are fixed to the cylindrical part of the bottomed container regardless of electrical action. Then
The cylindrical portion of the bottomed container is mounted on the printed board in a lying state, and the anode and cathode lead wires and the dummy lead are formed by bending in a crank shape so that they can be surface-mounted on the printed board. And aluminum electrolytic capacitor. 5. An electrolytic capacitor element in which an electrode foil to which a lead wire is fixed and an electrolytic paper are superposed and rolled up in a cylindrical shape and the lead wire is pulled out from one side is housed in a bottomed container made of aluminum. In an aluminum electrolytic capacitor in which the opening of the bottomed container is sealed with a sealing rubber, the lead wire formed by bending in a crank shape and having a soldering portion to a printed circuit board formed in a flat plate shape; A dummy fixed to the bottom of the bottom container, bent and formed into a crank shape, and a soldering portion to the printed board is formed in a flat plate shape and soldered and fixed to the printed board regardless of electrical action. An aluminum electrolytic capacitor comprising a lead, which is mounted on the printed circuit board in a lying state and can be surface-mounted on the printed circuit board. . 6. An electrolytic capacitor element in which an electrode foil to which a lead wire is fixed and an electrolytic paper are superposed on each other and wound in a cylindrical shape and the lead wire is pulled out from one side is housed in a bottomed container made of aluminum. In an aluminum electrolytic capacitor in which the opening of the bottomed container is sealed with a sealing rubber, a dummy lead for fixing by soldering to a printed circuit board is fixed to the bottom of the bottomed container regardless of electrical action. In the aluminum electrolytic capacitor, the dummy lead is a plate member.