JPH098526A - Structure and manufacture of built-in antenna for portable telephone set - Google Patents

Abstract

PURPOSE: To shorten the assembling time with simple assembling and to make the antenna performance stable. CONSTITUTION: A radiation plate 33 and a ground pattern 32 are formed to a desired position of a dielectric material 31 of an antenna element 3 by partial plating processing to form a stereoscopic structure antenna. A seat 34 to locate a matching circuit section is provided to a surface of the dielectric material 31 of the antenna element 3, the matching circuit section is soldered to soldering pattern sections 34a, 34b, 34c of the dielectric material 31 and fixed to the dielectric material 31. A metallic plating is applied to the entire face of a shield case and a U-shaped rib engaging with each of tongue projections 32a, 32b, 32c, 32d of a ground pattern 32 of the antenna element 3 is formed to an upper side. The antenna element 3 is bonded to the shield case mechanically and electrically by soldering the tongue projections 32a, 32b, 32c, 32d to the ribs.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a built-in antenna structure and manufacturing method for a mobile phone, and more particularly to a three-dimensional antenna structure and manufacturing method for a mobile phone having a patch antenna such as an inverted F antenna as a built-in antenna.

[0002]

2. Description of the Related Art FIG. 17 is an exploded perspective view showing an entire structure of a conventional mobile phone, and FIG. 18 is an exploded perspective view of components of a matching circuit and an antenna element in the conventional mobile phone.

As shown in FIG. 17, in a mobile phone, a mobile phone case 1 comprises an upper lid and a lower lid. The shield case 2 is housed in the mobile phone case 1. The shield case 2 is a housing that accommodates a circuit 23 having a transmission / reception unit, a logic unit, and the like. Further, an antenna element 3 of a patch antenna such as an inverted F-shaped antenna is placed on the shield case 2. Further, the built-in antenna coaxial wire 5 is arranged on the shield case 2,
It passes under the ground mounting bracket 39 and is routed to the front surface, and is electrically connected to the radiation plate 33 of the antenna element 3. Further, the external antenna feeding coaxial line 6 is used for the mobile phone case 1
Connected to the external antenna 11 formed on the upper cover of
Power is supplied to the external antenna 11. The other ends of the built-in antenna coaxial line 5 and the external antenna feeding coaxial line 6 are respectively connected to a transmitting / receiving circuit.

The antenna element 3 is, as shown in FIG.
Ground mounting bracket 39, dielectric 31 fixed to ground mounting bracket 39, and radiation plate 33 bonded to the upper surface of dielectric 31.
And consisting of The antenna element is the ground mounting bracket 3
It is attached to the shield case 2 via 9. Therefore, the antenna element 3 is fixed to the shield case 2. Also,
The matching circuit section 4 is attached to the ground mounting bracket 39 by, for example, soldering. The matching circuit unit 4 is connected to the feeding point to the external antenna 11 and the external antenna feeding coaxial line 6 shown in FIG. 17, and adjusts the junction of the external antenna 11. The radiation plate 33 and the ground mounting bracket 39 are made of metal members.

Further, as shown in FIG. 17, the shield case 2 comprises an upper cover 21 and a lower cover 22. The upper cover 21 and the lower cover 22 are plated. Further, on both side surfaces in the longitudinal direction of the upper cover 21,
The convex portion 24a and the convex portions 24b and 24c are provided respectively. On the other hand, downwardly extending tabs 39a, 39b, 39c that engage with the protrusions 24a, 24b, 24c of the upper cover 21, respectively, are formed at the opposite ends of the ground mounting bracket 39. Further, as shown in FIG.
A spring portion 39d is formed on the. This spring part 39
Due to the repulsive force of d, the antenna element 3 is pressed against the shield case 2 and electrically connected. As a result, the shield case 2 also functions as the ground, and constitutes the built-in antenna together with the radiation plate 33 and the dielectric 31.

[0006]

However, in the built-in antenna structure of the conventional mobile phone having the above-described structure, the ground mounting bracket 39, the radiation plate 33, the dielectric 31 and the like are composed of individual parts (FIG. 18). reference). Therefore, the structure is complicated and the assembly is complicated, and the assembly takes a long time. Further, there is a possibility that the antenna characteristics may vary due to the assembly error.

Especially, since the ground mounting bracket 39 and the upper cover 21 constituting the shield case 2 are all connected by contact, the contact position may be unstable. In this case, the antenna characteristics greatly vary.

In order to correct the above variations,
Conventionally, a great deal of time and labor have been spent on test adjustment such as adjusting the position of the antenna feeding point.

The present invention has been made in view of the above problems, and an object of the present invention is to simplify the assembling and shorten the assembling time, and greatly reduce the variation in the assembling.
Another object of the present invention is to provide a built-in antenna structure of a mobile phone in which the ground connection position is fixed and the antenna performance is stable.
Furthermore, it is to provide a manufacturing method suitable for the present antenna element.

[0010]

In order to solve the above problems, the built-in antenna structure of the mobile phone according to the present invention has the following features.

(1) An antenna element on which a radiation plate is formed on the upper surface by partial plating of a dielectric and a ground pattern for grounding to a shield case is formed on the side surface and the bottom surface, and the antenna element is mounted, and at least the outer peripheral surface is mounted. And a shield case that is plated.

(2) In the built-in antenna structure described in (1) above, the dielectric and the shield case are made of a high heat resistant resin.

(3) In the built-in antenna structure according to the above (1) and (2), at least one tongue-like protrusion is further formed on the side surface of the dielectric, and the tongue-shaped projection is formed on the upper surface of the shield case. At least one rib that engages with the tongue-shaped projection, and the ground pattern is formed to cover the side surface of the dielectric body on which the tongue-shaped projection is formed and the tongue-shaped projection. There is.

(4) In the built-in antenna structure according to the above (1) or (2), at least one or more tongue-shaped projections formed on the side surface of the dielectric are joined to the tongue-shaped projections. A holding member in the form of a spring plate that is attached to the bottom surface of the antenna element, and the ground pattern includes a side surface of the dielectric member having the tongue-shaped projection formed thereon and the tongue-shaped projection. At least one protrusion is formed on the side surface of the shield case, and the holding metal member is formed with a downwardly extending leg that engages with the protrusion.

(5) In the built-in antenna structure according to (1) above, at least one or more protrusions are further formed on the side surface of the shield case, and the dielectric body is formed at the time of molding the dielectric body. It has at least one or more metal pieces that engage with the protrusions insert-molded on the bottom surface of the dielectric.

(6) In the built-in antenna structure according to any one of (1) to (5), the antenna element and the shield case are bonded with a conductive adhesive.

(7) In the built-in antenna structure according to (1) above, at least two or more substantially L-shaped leg portions integrally formed on the bottom surface of the dielectric body and at least two on the side surface of the shield case. And one or more recesses formed so that the legs can be slidably engaged.

(8) In the built-in antenna structure according to (7), at least one tongue-shaped projection is formed on the side surface of the dielectric, and at least one tongue-shaped projection is formed on the side surface of the dielectric. A housing part projectingly formed on the upper surface of the shield case for housing the tongue-shaped projection, and the ground pattern covers the side surface of the dielectric body on which the tongue-shaped projection is formed and the tongue-shaped projection. Is formed in.

(9) In the built-in antenna structure according to the above (1), at least two snap hooks integrally formed on the bottom surface of the dielectric body to form the ground pattern, and on the side surface of the shield case. At least 2
One or more recesses into which the snap hooks are fitted.

(10) In the built-in antenna structure according to the above (3), flaky solder is attached to the back surface of the tongue-shaped projection, and after the tongue-shaped projection and the rib are engaged with each other, the antenna element and the shield. The whole case is heated and both are soldered.

(11) In the built-in antenna structure according to any one of (1) to (3) above, after applying cream solder to the shield case side, the antenna element is placed on the shield case, The entire antenna element and shield case are heated to solder them together.

(12) In the built-in antenna structure described in (1) above, the dielectric and the shield case are integrally formed, and a plating layer is formed on the back surface of the shield case.

(13) In the built-in antenna structure according to (1), the antenna-related circuit board and the dielectric are integrally molded, and the dielectric is provided with a radiation plate on the upper surface and the side surface by partial plating. And a ground pattern for grounding the shield case is formed on the bottom surface, and a circuit pattern is formed on the antenna-related circuit board.

(14) In the built-in antenna structure according to (1) above, when the dielectric is molded, a feed line extending from the back surface to the front surface of the antenna element is integrally formed, and the feed line is connected to the feed line. Partial plating is performed to form a coaxial line.

The method of manufacturing the built-in antenna structure of the mobile phone according to the present invention has the following features.

(1) A molding step in which a portion to be plated is recessed as compared with other portions to form a plating-compatible member into a desired shape, a plating step to perform plating on the entire surface of a molded product, and a recess And a cutting step of cutting and removing the plating of the raised portion as compared with the dull portion, and forming a predetermined plating pattern.

(2) In the method of manufacturing a built-in antenna structure according to (1) above, the molded product is a dielectric contained in the antenna element, and the inner surface of the molded product is masked before the plating process. It has a masking step.

(3) Molding step for molding a plating compatible member into a desired shape, a resist coating step for coating anti-plating resist on a non-plating treated portion, and a plating treatment for plating the resist-coated molded article. A predetermined plating pattern is formed, including a step and a removing step of removing the resist.

[0029]

The operation according to the present invention is as follows.
According to the built-in antenna structure of the mobile phone of the present invention, since the radiation plate and the ground pattern are formed at desired positions by partial plating on the dielectric, the number of parts to be assembled can be significantly reduced. Here, the ground pattern forms part of the ground. Further, at least the outer peripheral surface of the shield case on which the antenna element is mounted is plated, so that the shield case acts as the ground by engaging with the ground pattern formed on the dielectric. Therefore, parts such as ground mounting metal fittings arranged on the bottom surface of the dielectric are not required, and the number of assembled parts can be greatly reduced.

According to the second aspect of the present invention, since the dielectric and the shield case are made of high heat resistant resin, after the solder is attached to the engaging portion of the dielectric and the shield case, both Both can be directly soldered by heating. Therefore, it is less likely that rattling or an assembly error will occur between the antenna and the shield case serving as the ground. Therefore, the antenna performance is stable.

According to the third aspect of the present invention, the tongue-shaped projection formed on the side surface of the dielectric and having the ground pattern is engaged with the rib formed on the plated shield case upper surface. By doing so, the antenna element can be stably fixed to the shield case, and the shield case can function as the ground. Therefore,
As a separate part, the ground mounting bracket is not required, and the number of parts can be reduced. Therefore, the assembling efficiency is improved.

According to the structure of the fourth aspect of the present invention, since the antenna element and the shield case are pressed against each other by the holding metal fitting, the antenna element and the shield case can be electrically connected with certainty.

According to the fifth aspect of the present invention, since the metal piece that engages with the protrusion of the shield case is insert-molded on the bottom surface of the dielectric at the time of molding the dielectric,
When mounting the antenna element in the shield case and grounding it, parts such as holding metal fittings are not required. Therefore, the number of parts can be reduced and the assembling time can be shortened.

According to the configuration of the invention described in claim 6, since the antenna element and the shield case are adhered by the conductive adhesive, the antenna element is easily grounded and the assembly efficiency is improved.

According to the seventh aspect of the present invention, the concave portion is formed so that the substantially L-shaped leg portion integrally formed on the bottom surface of the dielectric body is slidably engaged with the side surface of the shield case. Therefore, the dielectric can be assembled simply by sliding it on the shield case, and the assembling time can be shortened. Furthermore,
Since the assembly error is reduced, the antenna performance is stable.

According to the structure of the invention described in claim 8, the tongue-shaped projection formed on the side surface of the dielectric is simply inserted into the housing portion projectingly formed on the upper surface of the shield case for housing. The antenna element can be fixed to the shield case, rattling between the antenna element and the shield case can be prevented, and the assembly error is reduced, so that the antenna performance is stable.

According to the structure of the invention described in claim 9, the snap hook integrally formed on the bottom surface of the dielectric and plated is fitted into the recess formed on the side surface of the shield case, whereby the antenna element is formed. The rattling between the shield case and the shield case can be prevented, and the assembly error is reduced, so that the antenna performance is stable.

According to the configuration of the invention described in claim 10,
The dielectric and shield case are made of high heat resistant resin,
If you attach a piece of solder to the back of the tongue and engage the tongue and the ribs, then heat the entire antenna element and shield case to solder them together, the antenna element and shield case will be directly connected. Can be soldered. Therefore, rattling between the antenna element and the shield case can be prevented, and the assembly error can be reduced. Furthermore, since the grounding is reliable, the antenna performance is stable.

According to the configuration of the invention described in claim 11,
After applying the cream solder to the shield case side, the antenna element is placed on the shield case and the antenna element and the entire shield case are heated to solder them together, so the antenna element and the shield case are directly soldered. be able to. For this reason, rattling between the antenna element and the shield case can be prevented, and assembly error is reduced. Furthermore, since the grounding is reliable, the antenna performance is stable.

According to the structure of the invention described in claim 12,
Since the dielectric and the shield case are integrally molded and the plated layer is formed on the back surface of the shield case, this plated layer can be the ground of the antenna element. Therefore, the number of parts can be significantly reduced, and the assembly work time can be shortened. Moreover, the mold of the built-in antenna can be simplified.

According to the configuration of the invention described in claim 13,
An antenna-related circuit board and the dielectric are integrally molded, and then by partial plating, the dielectric is provided with a radiation plate on the upper surface,
Since the ground pattern for grounding the shield case is formed on the side surface and the bottom surface and the circuit pattern is formed on the antenna-related circuit board, the number of assembly parts can be significantly reduced. Further, the assembly error can be reduced as much as possible.
Further, the mold of the built-in antenna can be simplified.

According to the configuration of the invention described in claim 14,
When forming the dielectric, the feed line to the antenna element that extends from the back surface to the front surface is integrally formed, and the feed line is partially plated to form a coaxial line. You can balance the routing of the tracks. Therefore, variations in antenna performance can be suppressed.

According to the manufacturing method of the fifteenth aspect of the present invention, for example, when the radiation plate and the ground pattern are formed on the dielectric, if only the corresponding portions are recessed to form the dielectric in advance, then the plating is performed. By performing the treatment and cutting and removing the plating of the raised portion, the radiation plate and the ground pattern can be easily formed, and the number of assembled parts can be significantly reduced. Further, an assembly error can be eliminated.

According to the manufacturing method of the sixteenth aspect of the present invention, since the inner surface of the dielectric is masked, unnecessary portions are not plated.

According to the manufacturing method of the seventeenth aspect of the present invention, for example, when the radiation plate and the ground pattern are formed on the dielectric, the anti-plating resist may be applied to the portions other than the corresponding portions, and then the plating treatment may be performed. For example, the radiation plate and the ground pattern can be formed at desired locations. Further, the number of parts to be assembled can be significantly reduced, and further, an assembly error can be eliminated.

[0046]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings.

Embodiment 1 FIG. 1 is a perspective view showing an overall configuration of a first embodiment of a built-in antenna structure of a mobile phone according to the present invention. 2 is a perspective view showing the structure of the antenna element according to the first embodiment of the present invention, and FIG. 3 is a perspective view showing the back surface of the antenna element according to the first embodiment of the present invention. Furthermore, FIG. 4 is a cross-sectional view of the antenna element according to the first embodiment of the present invention. FIG. 5 is a top view showing a mounting state of the antenna element according to the first embodiment of the present invention. The same components as those of the built-in antenna structure of the mobile phone described above are designated by the same reference numerals, and the description thereof will be omitted.

In the structure of the built-in antenna of the mobile phone of this embodiment, as shown in FIG. 1, the antenna element 3 is placed on the shield case 2. The antenna element 3 in this embodiment is manufactured by the manufacturing method disclosed in, for example, Japanese Patent Publication No. 6-60416.

That is, as shown in FIG. 4, first, a thermoplastic resin 31a having plating incompatibility is used to injection-mold a primary molded product having the outer shape of the dielectric 31. Next, the primary molded product is inserted into the cavity of the mold, and the thermoplastic resin 31 having plating compatibility is inserted into the cavity.
b, for example, a liquid crystal polymer or the like is injected. In this molding process, the ground pattern 32 and the radiation plate 33 of the primary molded product
Thermoplastic resin 31b, which is a plating compatible material
Is molded. At this time, the tongue-shaped projections 32a, 32
b, 32c, and 32d are also simultaneously molded by the thermoplastic resin 31b. The thus obtained product is called a secondary molded product.

Next, after the secondary molded product is degreased, the surface of the secondary molded product is roughened by immersing it in an etching agent composed of, for example, ammonium acid fluoride / nitric acid at 40 ° C. for 5 minutes for etching. To do. Then, a catalyst is applied to the surface of the secondary molded product and dried. Next, a thermoplastic resin 31c having plating incompatibility is injection-molded on the portion corresponding to the front surface of the dielectric 31 by the same method as described above. This is called a tertiary molded product. After degreasing the tertiary molded product, for example, electroless copper plating is performed. As a result, the plating process is performed only on the thermoplastic resin 31b exposed on the outer surface of the tertiary molded product. From the above, the antenna element 3 of the present embodiment is
As shown in FIGS. 2 and 3, the antenna has a three-dimensional structure in which the radiation plate 33 and the ground pattern 32 are formed at a desired position of the dielectric 31 by the selective partial plating process. Therefore, it is not necessary to assemble the radiation plate 33 to the dielectric 31 as in the related art, and the number of assembled parts can be reduced.

Further, as shown in FIG. 2, in the antenna element 3 of this embodiment, a pedestal 34 for mounting the matching circuit section 4 shown in FIG. 1 is provided on the surface of the dielectric 31, and a soldering pattern section is further provided. 34a, 34b, 34c are provided. Therefore, the matching circuit unit 4 includes the soldering pattern units 34a, 34a.
Soldered with b and 34c and fixed to the dielectric 31.

On the other hand, in this embodiment, the shield case 2
Is molded with a thermoplastic resin having plating compatibility, and then metal plating is applied to the entire surface. Therefore, at the same time as playing the role of an electromagnetic shield of the circuit portion 23 housed in the shield case 2, the weight of the mobile phone can be reduced. On the upper surface of the shield case 2, as shown in FIG.
Tongue-shaped projections 32a of the ground pattern 32 of the antenna element 3,
U-shaped rib 21 that engages with 32b, 32c, 32d
a, 21b, 21c and 21d are formed. In addition,
The ribs 21a, 21b, 21c, 21d are also plated.

Further, the material of the upper cover 21 of the shield case 2 is a material which is compatible with plating and can withstand heating during soldering, and has a heat resistant temperature of 260 ° C.
Something, for example, thermoplastic resin SP of high heat resistant resin
It is preferable to use S (syndiotack polystyrene) (manufactured by Idemitsu Petrochemical Co., Ltd.).

In the present embodiment, when the antenna element 3 is placed on the shield case 2 and soldering is performed, as shown in FIG.
As shown in FIG. 1, first, ribs 21a, 21b, 21c, 21
The solder is placed in d and heated with a soldering iron or the like to melt the solder. Then, the tongue projections 32a, 32b, 32
The c and 32d are joined so as to correspond to the ribs 21a, 21b, 21c and 21d, respectively. As a result, the antenna element 3 is mechanically and electrically joined to the shield case 2. Further, the antenna element 3 can be easily positioned on the shield case 2, and the work at the time of soldering and joining becomes easy. Therefore, the assembly error is reduced and the antenna performance is stable.

The ground pattern 32 is a tongue-shaped projection 32.
Shield case 2 via a, 32b, 32c, 32d
Since it is electrically connected to the surface plating layer of, the surface plating layer becomes the ground of the antenna element 3. For this reason, parts such as the ground mounting metal fittings, which are conventionally arranged on the bottom surface of the dielectric 31, are not required, and the number of assembled parts can be significantly reduced. Further, in order to make the surface plating layer of the shield case 2 function as the ground, in consideration of the skin effect of radio waves, the plating treatment is performed to a thickness not less than the frequency depending on the frequency.

Example 2. FIG. 6 is an exploded perspective view showing the overall configuration of the second embodiment of the built-in antenna structure of the mobile phone according to the present invention. The same reference numerals are given to the same constituent elements as those of the built-in antenna structure of the mobile phone and the first embodiment described above, and the description thereof will be omitted.

The built-in antenna structure of this embodiment is the same as that of the first embodiment.
The antenna element 3 manufactured by the same manufacturing method as described above and the shield case 2 are not directly soldered, but the antenna element 3 is mounted on the shield case 2 via the holding metal fittings 35.

As shown in FIG. 6, projections 2 are formed on both side surfaces of the shield case 2 of this embodiment which extend in the longitudinal direction.
1e and 21f and a protrusion 21g are formed. Also,
The holding metal fitting 35 is a spring-like plate having fins, and is further provided with tongue-shaped projections 32 a, 32 b, 32 c, 3 of the antenna element 3.
Folded portions 35d, 35e, and 35f that are joined to 2d are formed. Further, feet 35a, 35b, 35c extending downward are formed at both ends of the holding metal fitting 35.
The protrusions 2 of the seal case 2 are respectively provided on 35b and 35c.
Holes that engage with the protrusions 1e, 21f and the protrusion 21g are formed.

Therefore, in the case of the present embodiment, the tongue-shaped projections 32a, 32b, 32c, 32d of the antenna element 3 are joined to the folded portions 35d, 35e, 35f of the holding metal fitting 35 so that the antenna element 3 is held. The antenna element 3 can be fixed to the shield case 2 by engaging the legs 35a, 35b, and 35c of the holding metal fitting 35 with the protrusions 21e, 21f, and 21g of the shield case 2 after being mounted on the shield case 35. In particular, the antenna element 3 is pressed against the shield case 2 and electrically connected by the repulsive force of the fin portion of the holding metal fitting 35. Further, since the holding metal fitting 35 is made of a metal member, the ground pattern 32 of the antenna element 3 is
Is electrically connected to the holding metal fitting 35 via the tongue-shaped projections 32a, 32b, 32c, 32d, and further connected to the surface plating layer of the shield case 2. Therefore, this surface plating layer becomes the ground of the antenna element 3.

Also in the case of the present embodiment, the matching circuit section 4 is mounted on the surface of the dielectric 31 of the antenna element 3 in the same manner as in the first embodiment.

Example 3. FIG. 7 is a perspective view showing the overall configuration of a third embodiment of the built-in antenna structure of the mobile phone according to the present invention, and FIG. 8 is a sectional view taken along the line AA of FIG. The same antenna elements as those of the first and second embodiments and the built-in antenna structure of the mobile phone described above are designated by the same reference numerals and the description thereof is omitted.

In the case of this embodiment, as shown in FIGS. 7 and 8, when the dielectric 31 is injection molded, a plurality of metal plate pieces 45 are inserted and molded. This metal plate piece 45
A hole is formed in each. Further, the radiation plate of the antenna element 3 is formed by the same method as in the first embodiment.

Therefore, the metal plate piece 45 is replaced with the projections 21e, 21f and the projection 2 of the shield case 2 described in the second embodiment.
When the antenna element 3 is engaged with 1 g, the metal plate piece 45
Is electrically connected to the surface plating layer of the shield case 2 via this, and this surface plating layer serves as the ground of the antenna element 3. Further, the number of assembled parts can be reduced, so that the work efficiency is improved. Further, it is not necessary to solder the antenna element 3 and the shield case 2, and the work is simplified.

Also in the case of this embodiment, the matching circuit section 4 is mounted on the surface of the dielectric 31 of the antenna element 3 in the same manner as in the above-mentioned first embodiment.

Example 4. FIG. 9 is a perspective view showing the overall configuration of the fourth embodiment of the built-in antenna structure of the mobile phone according to the present invention. In addition, the same reference numerals are given to the same constituent elements as the built-in antenna structure of the mobile phone and the first to third embodiments described above, and the description thereof will be omitted.

As shown in FIG. 9, in the antenna element 3 of this embodiment, in addition to the tongue-shaped projections 32a, 32b, 32c and 32d, a substantially L-shaped leg portion which slides and engages with the side surface of the shield case 2. It has 36a, 36b, 36c. The substantially L-shaped leg portions 36a, 36b, 36c are integrally formed when the dielectric 31 is injection-molded. The antenna element 3 of the present embodiment is subjected to selective selective plating by the manufacturing method similar to that of the first embodiment to form the ground pattern and the radiation plate on the dielectric.

On the other hand, on the side surface of the shield case 2, approximately L
Formed are recesses 21k, 21l, 21p into which the leg portions 36a, 36b, 36c are slidably fitted. In addition, on the upper surface of the shield case 2, storage parts 21h, 21i, 21j are provided.
Are formed to project. These storage parts 21h, 21i, 2
The tongue-shaped projections 32a, 32b, 32c, and 32d are inserted into and engaged with the 1j.

Therefore, the ground pattern 3 of the antenna element 3
2 is electrically connected to the surface plating layer of the shield case 2 via the tongue-shaped projections 32a, 32b, 32c, 32d, and this surface plating layer serves as the ground of the antenna element 3.
Therefore, the parts such as the ground mounting metal fittings, which are conventionally arranged on the bottom surface of the dielectric 31, are not required, and the number of assembled parts can be significantly reduced. Also, the substantially L-shaped legs 36a, 3
6b, 36c and the recesses 21k, 21l, 21p may be plated. As a result, the ground area between the antenna element 3 and the shield case 2 is increased, and the electrical connection between the antenna element 3 and the shield case 2 is improved.

Also in the case of this embodiment, the matching circuit section 4 is placed on the surface of the dielectric 31 of the antenna element 3 in the same manner as in the above-mentioned first embodiment.

Example 5. FIG. 10 is a perspective view showing the overall configuration of the fifth embodiment of the built-in antenna structure of the mobile phone according to the present invention. In addition, the same reference numerals are given to the same constituent elements as the built-in antenna structure of the mobile phone and the first to third embodiments described above, and the description thereof will be omitted. As shown in FIG. 10, in the antenna element 3 of the present embodiment, a radiation plate is formed by selective partial plating by the manufacturing method similar to that of the first embodiment, and further, a snap hook 37a fitted to the side surface of the shield case 2, It has 37b and 37c. The snap hooks 37a, 37b, 37c are integrally molded when the dielectric 31 is injection-molded. Furthermore, this snap hook 3
7a, 37b, and 37c are plated by the selective partial plating method similar to the above. On the other hand, on the side surface of the shield case 2, snap hooks 37a, 37b,
Recesses 21m, 21n, and 21o that fit with 37c are formed. The recesses 21m, 21n, and 21o have a substantially J-shaped cross section. Accordingly, the elasticity of the snap hooks 37a, 37b, 37c can be used to attach and join.

Thus, by fitting the snap hooks 37a, 37b, 37c of the antenna element 3 into the recesses 21m, 21n, 21o of the shield case 2, the antenna element 3 is grounded to the surface plating layer of the shield case 2. The surface plating layer of the shield case 2 becomes the ground of the antenna element 3. For this reason, parts such as the ground mounting metal fittings, which are conventionally arranged on the bottom surface of the dielectric 31, are not required, and the number of assembled parts can be significantly reduced. Further, it is not necessary to solder the antenna element 3 and the shield case 2.

Also in the case of this embodiment, the matching circuit section 4 is placed on the surface of the dielectric 31 of the antenna element 3 in the same manner as in the above-mentioned first embodiment.

Example 6. FIG. 11 is a partial sectional view of a sixth embodiment of the built-in antenna structure of the mobile phone according to the present invention. The same components as those of the built-in antenna structure of the mobile phone and the first embodiment described above are designated by the same reference numerals, and the description thereof will be omitted.

The shield cover 41 of this embodiment is shown in FIG.
As shown in, the dielectric of the antenna element and the upper cover of the shield case 2 are integrally formed. The shield cover 41 is manufactured by the same manufacturing method as in the first embodiment.
A radiation plate 33 and a ground pattern 32 are formed in a portion that functions as an antenna element by selective plating, while the plating layer 2 is formed on the back surface of the portion that serves as the upper cover.
1q is formed.

As a result, the plated layer 21q functions as the ground, and the number of assembled parts can be greatly reduced. Therefore, the assembly time is shortened. Moreover, since no assembly error occurs, the antenna performance is further stabilized.

Example 7. FIG. 12 is a process drawing showing the manufacturing method of the antenna element according to the present invention.

In the first embodiment, as a method of forming the radiation plate and the ground pattern on the antenna element 3 by selective plating, for example, the manufacturing method disclosed in Japanese Patent Publication No. 6-60416 is used. A description will be given of a manufacturing method using another selective partial plating method.

As shown in FIG. 12, a dielectric 31 is first obtained by injection-molding a thermoplastic resin having compatibility with plating.
Next, the anti-plating resist ink 5 is applied to the dielectric 31.
0 is applied to a portion not requiring plating, that is, a portion other than the portion where the reflector and the ground pattern are formed, by screen printing or the like. Then, a plating process is performed to form a plating layer 51. Then, the plating resistant resist ink 50 is removed. Thereby, the radiation plate and the ground pattern can be formed at desired positions on the dielectric 31. Moreover, since the number of resin molding dies can be reduced as compared with the manufacturing method disclosed in Japanese Patent Publication No. 6-60416,
The mold of the built-in antenna can be simplified. Furthermore,
Since two kinds of resins having different plating characteristics are not used, the molding operation becomes simple.

The antenna element and the like of the above-mentioned embodiment may be manufactured by using the manufacturing method of this embodiment.

Example 8. FIG. 13 is a process drawing showing another method of manufacturing the antenna element according to the present invention.

In the first embodiment, as a method of forming the radiation plate and the ground pattern on the antenna element 3 by selective plating, for example, the manufacturing method disclosed in Japanese Patent Publication No. 6-60416 is used. A description will be given of a manufacturing method using another selective partial plating method.

As shown in FIG. 13, the portion not requiring plating, that is, the portion other than the portion where the radiation plate and the ground pattern are formed, is slightly raised (for example, about 0.2 to 0.3 mm) as compared with the plated portion. Then, a thermoplastic resin having plating compatibility is injection-molded to obtain the dielectric 31.
That is, in this dielectric 31, the plated portion, that is, the portion forming the radiation plate and the ground pattern is formed as a depression. Next, the inner surface of the molded dielectric 31 is masked. After that, the entire surface is plated and the dielectric 31
A plating layer 51 is formed on the entire surface of the. Next, the plating layer 51 formed on the slightly raised portion is cut. Thereby, the radiation plate and the ground pattern can be formed at desired positions on the dielectric 31. In addition, Japanese Patent Publication No. 6-604
Compared with the manufacturing method disclosed in Japanese Patent No. 16, the number of resin molding dies can be reduced, so that the dies for the built-in antenna can be simplified. Further, since two kinds of resins having different plating characteristics are not used, the molding work is simplified.

The antenna element and the like of the above-mentioned embodiment may be manufactured by using the manufacturing method of this embodiment.

Example 9. 14 is a top view showing the overall configuration of the ninth embodiment of the built-in antenna structure of the mobile phone according to the present invention, and FIG. 15 is a side view of the built-in antenna structure shown in FIG. 15 (a) is a front view of FIG. 14, FIG. 15 (b) is a rear view of FIG. 14, and FIG. 15 (c) is a left side view of FIG.
FIG. 15D is a right side view of FIG. 14.

In each of the above embodiments, the antenna element 3 is used.
The matching circuit section 4 and the matching circuit section 4 are separate articles, but in this embodiment, as shown in FIG. 14, the dielectric of the antenna element and the substrate of the matching circuit section 4 are integrally molded. Then, using any one of the manufacturing methods described in Example 1, Example 7 or Example 8, selective partial plating is performed on the hatched portions of FIGS. 14 and 15, and a radiation plate is formed on the upper surface of the dielectric. A ground pattern for grounding the shield case is formed on the side surface and the bottom surface, and a circuit pattern is further formed on the substrate of the matching circuit unit 4. As a result, the number of assembled parts can be significantly reduced, and the assembly error can be reduced as much as possible. Therefore,
Antenna performance becomes more stable.

Example 10. FIG. 16 is a perspective view showing the structure of the tenth embodiment of the built-in antenna structure of the mobile phone according to the present invention.

In the first embodiment, the built-in antenna coaxial line 5 is connected to the radiation plate 33 of the antenna element 3 through the bottom of the antenna element 3, but as shown in FIG.
In this embodiment, when the dielectric is molded, at the same time, the feed line extending from the back surface to the front surface of the dielectric is formed. On this feed line, a coaxial line 38 formed of a microstrip line is formed by selective partial plating using any one of the methods of the above-described first, seventh, and eighth embodiments. The coaxial line 38 electrically connects the built-in antenna coaxial line 5 and the radiation plate 33. It should be noted that portions on both sides along the coaxial line 38 of a constant width are also plated by the selective portion plating process.

Therefore, it is possible to balance the routing of the coaxial line 38 in the portion near the antenna where the electric field strength is high. Therefore, variations in antenna performance can be suppressed.

Example 11. When the antenna element 3 in the above-described first embodiment is joined to the shield case 2 by soldering using a soldering iron or a solder ejector, the U-shaped rib 21a of the shield case 2 shown in FIG. 21
b, 21c, 21d, a square or circular plate-shaped solder having a size that can be inserted therein is placed, and the entire upper cover 21 of the shield case 2 is heated by, for example, a reflow furnace to melt the solder, and the antenna element 3 may be joined to the shield case 2. In the case of this embodiment, the upper cover 21
Is a material that can withstand heating during soldering and has a heat resistant temperature of about 260 ° C., for example, thermoplastic resin S ・ P ・ S (syndiotack polystyrene) of high heat resistant resin (Idemitsu Petrochemical Co., Ltd. )) Is preferably used.

As another soldering method, piece-shaped solder is attached to the back surface of the tongue-shaped projections 32a, 32b, 32c and 32d of the antenna element 3 and the tongue-shaped projections 32a, 32b and 32 are attached.
After the ribs 21a, 21b, 21c, and 21d are engaged with c and 32d, the entire antenna element 3 and the shield case 2 may be heated to directly solder them. In this case, the material of the dielectric 31 is also a material that can withstand heating during soldering and has a heat resistant temperature of about 260 ° C.
For example, it is preferable to use a thermoplastic resin S • P • S (Syndiotack polystyrene) (manufactured by Idemitsu Petrochemical Co., Ltd.) which is a high heat resistant resin.

As a result, rattling between the antenna element 3 and the shield case 2 can be prevented, and the assembly error can be reduced. Furthermore, since the grounding is reliable, the antenna performance is stable.

Example 12 Instead of the molded solder in Example 11, cream-like solder was used to form U-shaped ribs 21a, 21b, 21c, 21 of the shield case 2 shown in FIG.
Shield case 2 which is applied by printing or solder dispenser inside d
The entire upper cover 21 is heated by, for example, a reflow furnace,
The antenna element 3 may be joined to the shield case 2 by melting the solder. Also in the case of the present embodiment, the material of the upper cover 21 is a material that can withstand the heating during soldering and has a heat resistant temperature of about 260 ° C., for example, a thermoplastic resin SP of high heat resistant resin.・ S (Syndio Tack ・
Polystyrene) (manufactured by Idemitsu Petrochemical Co., Ltd.) is preferably used.

As another soldering method, cream-like solder is applied to the back surface of the tongue-shaped projections 32a, 32b, 32c, 32d of the antenna element 3 by printing or a solder ejecting machine, and the tongue-shaped projections 32a, 32b, 32c, 32d and ribs 21a, 21
b, 21c, 21d, and then the antenna element 3
Alternatively, the entire shield case 2 may be heated to directly solder the both. In this case, the material of the dielectric 31 is also a material that can withstand heating during soldering and has a heat resistant temperature of about 260 ° C., for example, a thermoplastic resin S ・ P ・ S (syndiotactic polystyrene) of a high heat resistant resin. (Manufactured by Idemitsu Petrochemical Co., Ltd.) is preferably used.

As a result, rattling between the antenna element 3 and the shield case 2 can be prevented, and the assembly error can be reduced. Furthermore, since the grounding is reliable, the antenna performance is stable.

Embodiment 13 FIG. The antenna element 3 and the shield case 2 may be bonded in the same manner as above using a conductive adhesive instead of the cream solder of the twelfth embodiment. In this case, the antenna element is easily grounded, and the assembling efficiency is improved.

[0096]

As described above, according to the built-in antenna structure of the mobile phone according to the first aspect of the present invention, the radiation plate and the ground pattern are formed at desired positions by partial plating on the dielectric. The number of assembled parts can be reduced significantly. Further, at least the outer peripheral surface of the shield case on which the antenna element is mounted is plated, so that the shield case can function as the ground by engaging with the ground pattern formed on the dielectric. Therefore, parts such as ground mounting metal fittings arranged on the bottom surface of the dielectric are not needed, and the number of assembled parts can be significantly reduced.

According to the second aspect of the present invention, since the dielectric and the shield case are made of a high heat resistant resin, after the solder is attached to the engaging portion of the dielectric and the shield case, Both can be directly soldered by heating. Therefore, it is less likely that rattling or an assembly error will occur between the antenna and the shield case serving as the ground. Therefore, the antenna performance is stable.

According to the third aspect of the present invention, the tongue-shaped projection formed on the side surface of the dielectric and having the ground pattern is engaged with the rib formed on the plated shield case upper surface. By doing so, the antenna element can be stably fixed to the shield case, and the shield case can function as the ground. Therefore, the ground mounting bracket is not required as a separate component, and the number of components can be reduced. Therefore, the assembling efficiency is improved.

According to the configuration of the invention described in claim 4, since the antenna element and the shield case are pressed into contact with each other by the holding metal fitting, the antenna element and the shield case can be electrically connected reliably.

According to the fifth aspect of the present invention, when the dielectric is molded, the metal piece that engages with the protrusion of the shield case is insert-molded on the bottom surface of the dielectric.
When mounting the antenna element in the shield case and grounding it, parts such as holding metal fittings are not required. Therefore, the number of parts can be reduced and the assembling time can be shortened.

According to the structure of the invention described in claim 6, since the antenna element and the shield case are bonded by the conductive adhesive, the antenna element is easily grounded and the assembly efficiency is improved.

According to the seventh aspect of the present invention, the substantially L-shaped leg portion integrally formed on the bottom surface of the dielectric and plated is recessed so as to be slidably engaged with the side surface of the shield case. Since it is formed, the assembling can be performed only by sliding the dielectric on the shield case, and the assembling time can be shortened. Further, since the assembly error is reduced, the antenna performance is stable.

According to the structure of the present invention as defined in claim 8, the tongue-shaped projection formed on the side surface of the dielectric body is further inserted into the housing portion projectingly formed on the upper surface of the shield case for housing. The antenna element can be fixed to the shield case, rattling can be prevented between the antenna element and the shield case, and the assembly error is reduced, so that the antenna performance is stable.

According to the ninth aspect of the present invention, the snap hook integrally formed on the bottom surface of the dielectric body and plated is fitted into the recess formed on the side surface of the shield case, whereby the antenna element is formed. The rattling between the shield case and the shield case can be prevented, and the assembly error is reduced, so that the antenna performance is stable.

According to the configuration of the invention described in claim 10,
The dielectric and shield case are made of high heat resistant resin,
If you attach a piece of solder to the back of the tongue and engage the tongue and the ribs, then heat the entire antenna element and shield case to solder them together, the antenna element and shield case will be directly connected. It can be soldered, rattling between the antenna element and the shield case can be prevented, and assembly error is reduced. Furthermore, since the grounding is reliable, the antenna performance is stable.

According to the configuration of the invention described in claim 11,
After applying the cream solder to the shield case side, the antenna element is placed on the shield case and the antenna element and the entire shield case are heated to solder them together, so the antenna element and the shield case are directly soldered. It is possible to prevent rattling between the antenna element and the shield case, and the assembly error is reduced. Furthermore, since the grounding is reliable, the antenna performance is stable.

According to the configuration of the invention described in claim 12,
Since the dielectric and the shield case are integrally molded and the plated layer is formed on the back surface of the shield case, this plated layer can be the ground of the antenna element. Therefore, the number of parts can be significantly reduced, and the assembly work time can be shortened. Moreover, the mold of the built-in antenna can be simplified.

According to the configuration of the invention described in claim 13,
An antenna-related circuit board and the dielectric are integrally molded, and then by partial plating, the dielectric is provided with a radiation plate on the upper surface,
Since the ground pattern for grounding the shield case is formed on the side surface and the bottom surface and the circuit pattern is formed on the antenna-related circuit board, the number of assembly parts can be significantly reduced and the assembly error can be reduced as much as possible. Moreover, the mold of the built-in antenna can be simplified.

According to the configuration of the invention described in claim 14,
When forming the dielectric, the feed line to the antenna element extending from the back surface to the front face is integrally formed, and the feed line is partially plated to form the coaxial line, so that the coaxial line in the portion with high electric field strength near the antenna is formed. You can balance the routing. Therefore, variations in antenna performance can be suppressed.

According to the manufacturing method of the fifteenth aspect of the present invention, for example, when the radiation plate and the ground pattern are formed on the dielectric, if only the corresponding portions are recessed to form the dielectric in advance, then the plating is performed. By performing the treatment and cutting and removing the plating of the raised portion, the radiation plate and the ground pattern can be easily formed, and the number of assembled parts can be significantly reduced. Furthermore, assembly errors can be eliminated.

According to the manufacturing method of the sixteenth aspect of the present invention, since the inner surface of the dielectric is masked, unnecessary portions are not plated.

According to the manufacturing method of the seventeenth aspect of the present invention, for example, when the radiation plate and the ground pattern are formed on the dielectric, the anti-plating resist may be applied to the portions other than the corresponding portions, and then the plating treatment may be performed. For example, the radiation plate and the ground pattern can be formed at desired locations. Further, the number of parts to be assembled can be significantly reduced, and further, an assembly error can be eliminated.

As described above, according to the built-in antenna structure and the manufacturing method of the mobile phone according to the present invention, an antenna element in which the radiation plate and the like are integrally formed is obtained by performing the selective plating process. Can be significantly reduced, and the assembly time can be shortened.

Further, since the antenna element and the shield case are formed by using the heat-resistant resin, when both are soldered, if solder is placed on one of them and both are heated, the soldering can be performed easily and directly. It can be performed. Therefore, the assembling time can be shortened and the assembling error can be eliminated. Therefore, it is possible to stabilize the antenna performance.

Further, according to the built-in antenna structure and the manufacturing method of the mobile phone according to the present invention, the structure is simplified,
The weight of the entire antenna element can be reduced, and as a result, the weight of the mobile phone itself can be reduced. Furthermore, the built-in antenna can be provided at low cost.

[Brief description of drawings]

FIG. 1 is a perspective view showing an overall configuration of a first embodiment of a built-in antenna structure of a mobile phone according to the present invention.

FIG. 2 is a perspective view showing the structure of the antenna element according to the first embodiment of the present invention.

FIG. 3 is a perspective view showing the back surface of the antenna element according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view of the antenna element according to the first embodiment of the present invention.

FIG. 5 is a top view showing a mounting state of the antenna element according to the first embodiment of the present invention.

FIG. 6 is an exploded perspective view showing the overall configuration of a second embodiment of the built-in antenna structure of the mobile phone according to the present invention.

FIG. 7 is a perspective view showing an overall configuration of a third embodiment of the built-in antenna structure of the mobile phone according to the present invention.

8 is a cross-sectional view taken along the line AA of FIG.

FIG. 9 is a perspective view showing an overall configuration of a fourth embodiment of the built-in antenna structure of the mobile phone according to the present invention.

FIG. 10 is a perspective view showing the overall configuration of a fifth embodiment of the built-in antenna structure of the mobile phone according to the present invention.

FIG. 11 is a partial sectional view of a sixth embodiment of the built-in antenna structure of the mobile phone according to the present invention.

FIG. 12 is a process drawing showing the manufacturing method of the antenna element according to the present invention.

FIG. 13 is a process drawing showing another manufacturing method of the antenna element according to the present invention.

FIG. 14 is a top view showing the overall configuration of a ninth embodiment of the built-in antenna structure of the mobile phone according to the present invention.

FIG. 15 is a side view of the built-in antenna structure shown in FIG.

FIG. 16 is a perspective view showing a structure of a tenth embodiment of a built-in antenna structure of a mobile phone according to the present invention.

FIG. 17 is an exploded perspective view showing the overall structure of a conventional mobile phone.

FIG. 18 is an exploded perspective view of components of a matching circuit and an antenna element in a conventional mobile phone.

[Explanation of symbols]

1 mobile phone case, 2 shield case, 3 antenna element, 4 matching circuit section, 5 built-in antenna coaxial wire,
6 External Antenna Feeding Coaxial Wire, 31 Dielectric Material, 32 Ground Pattern, 32a, 32b, 32c, 32d Tongue-like Protrusion, 33 Radiating Plate, 34 Pedestal, 34a, 34b, 34
c Solder pattern part.

Claims (17)

[Claims] 1. An antenna element in which a radiation plate is formed on the upper surface of the dielectric by partial plating, and a ground pattern for grounding the shield case is formed on the side surfaces and the bottom surface of the dielectric element, and the antenna element is mounted and at least the outer peripheral surface is formed. A built-in antenna structure for a mobile phone, comprising: a plated shield case. 2. The built-in antenna structure according to claim 1, wherein the dielectric and the shield case are made of high heat resistant resin. 3. The built-in antenna structure according to claim 1, further comprising at least one tongue-shaped projection formed on a side surface of the dielectric, and the tongue-shaped projection formed on an upper surface of the shield case. At least one rib that engages with a protrusion, and the ground pattern is formed to cover the side surface of the dielectric body on which the tongue-shaped protrusion is formed and the tongue-shaped protrusion. A built-in antenna structure for mobile phones. 4. The built-in antenna structure according to claim 1, further comprising at least one tongue-shaped projection formed on a side surface of the dielectric, and a joint portion that joins the tongue-shaped projection. A spring plate-like holding metal member formed and attached to the bottom surface of the antenna element,
The ground pattern is formed so as to cover the side surface of the dielectric having the tongue-shaped projections formed thereon and the tongue-shaped projections. A built-in antenna structure for a mobile phone, wherein a protrusion is formed, and a downwardly extending leg that engages with the protrusion is formed on the holding metal fitting. 5. The built-in antenna structure according to claim 1, further comprising at least one or more protrusions formed on a side surface of the shield case, wherein the dielectric body is formed by molding the dielectric body when the dielectric body is formed. A built-in antenna structure for a mobile phone, comprising: at least one metal piece that engages with the protrusion formed by insert molding on the bottom surface of the body. 6. The built-in antenna structure according to any one of claims 1 to 5, wherein the antenna element and the shield case are bonded by a conductive adhesive. Antenna structure. 7. The built-in antenna structure according to claim 1, wherein at least two or more substantially L-shaped legs integrally formed on the bottom surface of the dielectric body, and at least two or more on a side surface of the shield case. A built-in antenna structure for a mobile phone, comprising: a recess formed so that the leg can be slidably engaged. 8. The built-in antenna structure according to claim 7, further comprising at least one tongue-shaped projection formed on a side surface of the dielectric, and at least one tongue-shaped projection formed on a side surface of the dielectric. And a storage part projectingly formed on the upper surface of the shield case for storing the projection, wherein the ground pattern is formed to cover the side surface of the dielectric having the tongue-shaped projection and the tongue-shaped projection. Built-in antenna structure for mobile phones, which is characterized by 9. The built-in antenna structure according to claim 1, wherein at least two snap hooks integrally formed on the bottom surface of the dielectric body and formed with the ground pattern, and at least two snap hooks on the side surface of the shield case. A built-in antenna structure for a mobile phone, comprising: one or more recesses into which the snap hooks are fitted. 10. The built-in antenna structure according to claim 3, wherein piece-shaped solder is attached to the back surface of the tongue-shaped projection, and after the tongue-shaped projection and the rib are engaged with each other, the antenna element and the entire shield case are provided. A built-in antenna structure for a mobile phone, characterized in that the two are heated and soldered together. 11. The built-in antenna structure according to claim 1, wherein after applying cream solder to the shield case side,
A built-in antenna structure for a mobile phone, comprising placing the antenna element on the shield case, heating the entire antenna element and the shield case, and soldering both. 12. The built-in antenna structure according to claim 1, wherein the dielectric and the shield case are integrally molded, and a plating layer is formed on the back surface of the shield case. Construction. 13. The built-in antenna structure according to claim 1, wherein the antenna-related circuit board and the dielectric are integrally formed, and the dielectric is provided with a radiation plate on the upper surface, the side surface and the bottom surface by partial plating. A built-in antenna structure for a mobile phone, wherein a ground pattern for grounding the shield case is formed on the antenna, and a circuit pattern is formed on the antenna-related circuit board. 14. The built-in antenna structure according to claim 1, wherein a feed line extending from the back surface to the front surface to the antenna element is integrally formed when the dielectric body is formed, and the feed line is partially plated. A built-in antenna structure of a mobile phone, which is characterized by forming a coaxial line. 15. A molding step of forming a plating-compatible member into a desired shape by making a portion to be subjected to plating treatment recessed as compared with other portions; a plating treatment step to perform plating treatment on the entire surface of a molded product; A method of manufacturing a built-in antenna structure for a mobile phone, comprising: forming a predetermined plating pattern, and a cutting step of cutting and removing plating on a raised portion compared to a portion. 16. The method for manufacturing a built-in antenna structure according to claim 15, wherein the molded product is a dielectric contained in an antenna element, and a masking step of masking an inner surface of the molded product before a plating process. A method for manufacturing a built-in antenna structure for a mobile phone, comprising: 17. A molding step of molding a plating-compatible member into a desired shape, a resist coating step of coating a plating resistant resist on a non-plating treated portion, and a plating treatment step of plating a molded product coated with the resist. And a removing step of removing the resist, wherein a predetermined plating pattern is formed, and a method of manufacturing a built-in antenna structure of a mobile phone.