JPH098404A - Semiconductor laser device - Google Patents
Semiconductor laser deviceInfo
- Publication number
- JPH098404A JPH098404A JP14887295A JP14887295A JPH098404A JP H098404 A JPH098404 A JP H098404A JP 14887295 A JP14887295 A JP 14887295A JP 14887295 A JP14887295 A JP 14887295A JP H098404 A JPH098404 A JP H098404A
- Authority
- JP
- Japan
- Prior art keywords
- sealing member
- adapter ring
- chip
- lead frame
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＣＤ（コンパクトディ
スク）プレーヤ等の各種光応用機器に組み込まれてＣＤ
やＣＤ−ＲＯＭなどの光ディスクを読取る半導体レーザ
装置に関し、詳しくは、リードフレームの幅広部上に固
定されたレーザダイオードチップ（以下「ＬＤチップ」
と称す）を樹脂封止してなる樹脂封止型の半導体レーザ
装置の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is incorporated in various optical application devices such as CD (compact disc) players and CDs.
The present invention relates to a semiconductor laser device for reading an optical disk such as a CD-ROM or a CD-ROM, and more specifically, a laser diode chip (hereinafter referred to as “LD chip”) fixed on a wide portion of a lead frame.
(Hereinafter referred to as ") is improved with a resin-sealed semiconductor laser device.
【０００２】[0002]
【従来の技術】各種光応用機器に組み込まれる半導体レ
ーザ装置として、図６に示すキャンタイプのものが従来
から知られている。キャンタイプの半導体レーザ装置10
0 は、円板状のステム101 の上面に不図示の放熱体を突
出状に設けると共に、この放熱体の側面にサブマウント
層を介してＬＤチップを半田付けし、さらにこれら放熱
体，サブマウント層，ＬＤチップを覆うキャップ102 を
ステム101 に溶接した周知の構造のもので、キャップ10
2 の上面にはＬＤチップから発光されるレーザ光を出射
させるためのガラス窓103 が設けられている。そうし
て、例えば図７に示すように、各種光応用機器に内設さ
れた装着孔（ここでは筒状ホルダー200 の段付き装着孔
201 ）にキャップ102 側から挿入され、ステム101 を段
差部で接着又は圧着して固定される。図中210 はステム
101 の下面に両面テープ等の固着手段220 を介して接着
されたプリント基板で、そのランド部には、ステム下面
側に突出するリード端子104 が各々半田付け230 され
る。2. Description of the Related Art A can-type semiconductor laser device shown in FIG. 6 is conventionally known as a semiconductor laser device incorporated in various optical equipments. Can type semiconductor laser device 10
In the case of 0, a radiator (not shown) is provided in a protruding shape on the upper surface of the disc-shaped stem 101, and an LD chip is soldered to the side surface of the radiator via a submount layer. It has a well-known structure in which the cap 102 covering the layers and the LD chip is welded to the stem 101.
A glass window 103 for emitting laser light emitted from the LD chip is provided on the upper surface of 2. Then, as shown in FIG. 7, for example, the mounting holes (here, the stepped mounting holes of the cylindrical holder 200) provided in various optical application devices are provided.
201) is inserted from the cap 102 side, and the stem 101 is fixed by adhering or crimping the stepped portion. In the figure, 210 is the stem
A printed circuit board is adhered to the lower surface of 101 via a fixing means 220 such as a double-sided tape, and lead terminals 104 projecting to the lower surface side of the stem are soldered 230 to the lands of the printed circuit board.
【０００３】尚、半導体レーザ装置はＬＤチップから出
射されるレーザ光の発光点を一定の位置に保つことが重
要であり、そのため上記キャンタイプにおいては、レー
ザ光の発光点がステム101 とガラス窓103 の中心に位置
するようにＬＤチップを固定し、且つ機器内に装着され
た際に前記発光点が基準線202 上に位置するよう、ステ
ム101 の側周面に位置合わせ用溝（図示せず）が形成さ
れている。さらにこの種の半導体レーザ装置は、光応用
機器内に組み込まれる各種部品の共通化を図るべくほぼ
規格統一されており、例えば今日最も量産されている持
ち運びタイプや車搭載用等の小型ＣＤプレーヤに使用す
る低出力用のものでは、ステム101 の外径寸法は５〜６
ｍｍ程度であり、また据置き型ＣＤプレーヤ等の高出力
用のものでは９ｍｍ程度である。In the semiconductor laser device, it is important to keep the light emitting point of the laser light emitted from the LD chip at a fixed position. Therefore, in the above can type, the light emitting point of the laser light is the stem 101 and the glass window. The LD chip is fixed so as to be positioned at the center of 103, and a positioning groove (not shown) is provided on the side peripheral surface of the stem 101 so that the light emitting point is positioned on the reference line 202 when mounted in the device. ) Is formed. Further, this type of semiconductor laser device is almost standardized in order to standardize various parts to be incorporated in an optical application device. For example, it is used in a compact CD player such as a portable type or a car mounted most mass-produced today. For the low power ones used, the outer diameter of the stem 101 is 5-6.
It is about 9 mm, and about 9 mm for high output such as a stationary CD player.
【０００４】[0004]
【発明が解決しようとする課題】一方、近年においては
半導体レーザ装置の低価格化の要望に対応して、上記し
たキャンタイプに比べて製造コストが低い樹脂封止型の
半導体レーザ装置が開発されている。樹脂封止型の半導
体レーザ装置300 の一例を図５を参照して説明すれば、
図中301 はリードフレーム302 の端部幅広部303 上にサ
ブマウント層304 を介して固定されたＬＤチップで、こ
のＬＤチップ301 ，サブマウント層304 を含むリードフ
レーム302 の先端側周囲を透明エポキシ樹脂などの封止
部材305 で封止したものである。封止部材305 は、上記
キャンタイプとの共通化を図るべく、キャンタイプにお
けるステム101 上面にキャップ102 を固定した形状に相
当する段付き円筒形に形成されている。また、この樹脂
封止型のものにおいても、ＬＤチップ301 のレーザ光の
発光点Ｐを一定の位置に保つことが重要であることはい
うまでもなく、前述したキャンタイプと同様に、発光点
Ｐが段付き円筒形の封止部材305 の中心に位置し、且つ
機器内に装着された際に発光点Ｐが基準線202 上に位置
するよう作製されている。On the other hand, in recent years, a resin-sealed semiconductor laser device having a lower manufacturing cost than that of the above-mentioned can type has been developed in response to a demand for lower cost of the semiconductor laser device. ing. An example of the resin-sealed semiconductor laser device 300 will be described with reference to FIG.
In the figure, 301 is an LD chip fixed on the wide end portion 303 of the lead frame 302 via a submount layer 304, and the periphery of the tip side of the lead frame 302 including the LD chip 301 and the submount layer 304 is transparent epoxy. It is sealed with a sealing member 305 such as resin. The sealing member 305 is formed in a stepped cylindrical shape corresponding to a shape in which the cap 102 is fixed to the upper surface of the stem 101 in the can type so as to be shared with the above can type. Also in this resin-sealed type, it is needless to say that it is important to keep the light emitting point P of the laser light of the LD chip 301 at a constant position, and like the can type described above, the light emitting point It is made so that P is located at the center of the stepped cylindrical sealing member 305 and that the light emitting point P is located on the reference line 202 when mounted in the device.
【０００５】このような構造からなる半導体レーザ装置
300 によれば、キャンタイプと同様な取扱いで機器への
装着が可能であり、またリードフレームを用いた樹脂封
止型であるため低コストで提供できるという利点があ
る。ところがこの半導体レーザ装置300 は、ＬＤチップ
301 への通電による温度上昇又は環境温度の変化等によ
りＬＤチップ周辺の樹脂が膨脹し、これに伴い幅広部30
3 が変動して発光点Ｐが移動する虞れがあった。A semiconductor laser device having such a structure
The 300 has an advantage that it can be mounted on a device in the same manner as a can type and can be provided at low cost because it is a resin-sealed type that uses a lead frame. However, this semiconductor laser device 300 has an LD chip
The resin around the LD chip expands due to temperature rise due to energization of 301 or environmental temperature change, etc.
There is a possibility that 3 may fluctuate and the light emitting point P may move.
【０００６】上記問題点を解決する方法として、図２に
示すように、ＬＤチップ３を搭載したリードフレームの
端部幅広部１２ａの両側を透明樹脂の封止部材４から外
部に露出させ、該露出片部１２ｄ，１２ｄに、発光点Ｐ
を中心とする仮想円に内接するアダプタリング５を固定
して半導体レーザ装置を構成し、このアダプタリング５
を機器内の装着孔に固定するようにすることが考えられ
る。この方法によれば、ＬＤチップ３を搭載したリード
フレーム１２の幅広部１２ａがアダプタリング５に固定
されることから、封止部材４の熱膨張に伴う幅広部１２
ａの変動を防止し発光点Ｐを一定の位置に保つことが可
能である。露出片部１２ｄ，１２ｄに対するアダプタリ
ング５の固定には、接着，かしめ等の固着手段の採用が
可能であるが、接着を採用する場合接着剤量の均一化が
困難であることから固定強度や外観寸法の精度にばらつ
きが生じる虞れがある。よってこの点を考慮すれば、ア
ダプタリング５の内周部に一対の取付溝５ａ，５ａを設
け、この取付溝５ａ，５ａに露出片部１２ｄ，１２ｄを
挿入した後、取付溝５ａ，５ａに隣接する部分５ｃ，５
ｃをかしめることが有利である。As a method for solving the above problems, as shown in FIG. 2, both sides of the wide end portion 12a of the lead frame on which the LD chip 3 is mounted are exposed to the outside from the sealing member 4 made of transparent resin. On the exposed pieces 12d and 12d, the light emitting point P
A semiconductor laser device is constructed by fixing an adapter ring 5 inscribed in a virtual circle centered on
It is conceivable to fix the to the mounting hole in the device. According to this method, since the wide portion 12a of the lead frame 12 having the LD chip 3 mounted thereon is fixed to the adapter ring 5, the wide portion 12 associated with the thermal expansion of the sealing member 4 is formed.
It is possible to prevent the variation of a and keep the light emitting point P at a constant position. For fixing the adapter ring 5 to the exposed piece portions 12d, 12d, a fixing means such as adhesion or caulking can be adopted. However, if the adhesion is adopted, it is difficult to make the amount of adhesive uniform, so that the fixing strength or The accuracy of the external dimensions may vary. Therefore, in consideration of this point, a pair of mounting grooves 5a, 5a are provided on the inner peripheral portion of the adapter ring 5, and after the exposed piece portions 12d, 12d are inserted into the mounting grooves 5a, 5a, the mounting grooves 5a, 5a Adjacent parts 5c, 5
It is advantageous to crimp c.
【０００７】しかし乍らこのようなかしめ手段を採用し
た場合、アダプタリング５に対する幅広部１２ａの固定
強度が不足する虞れが有り、封止部材４の熱膨張に伴う
発光点Ｐの移動は防止できるものの、幅広部１２ａのが
たつきにより発光点Ｐが移動してレーザ光の光軸がずれ
る虞れが有り、特に持ち運びタイプや車搭載用等の小型
ＣＤプレーヤのような使用に際して振動を伴う光応用機
器に組み込む場合、さらなる改良が望まれる。かしめ強
度を補充するために接着剤を塗布することも考えられる
が、この場合においても接着剤量の均一化が困難である
ことから、固定強度や外観寸法の精度にばらつきが生じ
る虞れが有る。However, when such caulking means is adopted, there is a risk that the fixing strength of the wide portion 12a with respect to the adapter ring 5 will be insufficient, and movement of the light emitting point P due to thermal expansion of the sealing member 4 is prevented. Although it is possible, the light emission point P may move due to the rattling of the wide portion 12a, and the optical axis of the laser light may be displaced. In particular, vibration occurs when used in a portable CD player, a compact CD player, or the like. Further improvements are desired when incorporated into optical applications. It may be possible to apply an adhesive to supplement the caulking strength, but even in this case, it is difficult to make the amount of adhesive uniform, so there is a possibility that the accuracy of the fixing strength and the external dimensions may vary. .
【０００８】本発明は上記事情に鑑みて成されたもの
で、その目的とするところは、キャンタイプに比べて製
造コストが低く、且つキャンタイプと同様な取扱いで機
器への装着が可能であると共に、ＬＤチップ周囲の樹脂
封止部材の膨脹による発光点の移動、並びに、ＬＤチッ
プを搭載するリードフレーム幅広部のがたつきによるレ
ーザ光の光軸のずれを確実に防止することができる樹脂
封止型の半導体レーザ装置を提供することである。The present invention has been made in view of the above circumstances, and it is an object of the present invention that the manufacturing cost is lower than that of the can type, and that the device can be mounted on a device in the same manner as the can type. At the same time, the resin can surely prevent the movement of the light emitting point due to the expansion of the resin sealing member around the LD chip and the deviation of the optical axis of the laser beam due to the rattling of the wide portion of the lead frame on which the LD chip is mounted. An object is to provide a sealed semiconductor laser device.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本発明の半導体レーザ装置は、リードフレームの幅
広部上に固定されたレーザダイオードチップを透明樹脂
で一次封止すると共に、前記幅広部から両側に延びて前
記一次封止部材より外部へ張り出た一対の露出片部に、
前記レーザダイオードチップの発光点を中心とする仮想
円に内接するアダプタリングをかしめ固定し、さらに前
記一次封止部材及び露出片部を外部封止樹脂で二次封止
してなることを特徴とする。In order to achieve the above object, the semiconductor laser device of the present invention is such that a laser diode chip fixed on a wide portion of a lead frame is primary-sealed with a transparent resin, and the width of the wide portion is increased. To a pair of exposed piece portions that extend from the portion to both sides and project outward from the primary sealing member,
An adapter ring inscribed in a virtual circle centered on the light emitting point of the laser diode chip is caulked and fixed, and the primary sealing member and the exposed piece are secondary sealed with an external sealing resin. To do.
【００１０】[0010]
【作用】以上のように構成した本発明の半導体レーザ装
置によれば、一次封止部材及び露出片部を外部封止樹脂
で二次封止することから、露出片部に対するアダプタリ
ングのかしめ固定部分が二次封止部材で被覆されると共
に、一次封止部材及び露出片部とアダプタリングとの間
に二次封止部材が充填され、この二次封止部材の密着力
により、リードフレーム幅広部がより強固にアダプタリ
ングに固定され、該幅広部のがたつきによるレーザ光の
光軸のずれを確実に防止することができる。また、露出
片部に対するアダプタリングの固定手段にかしめを採用
し、さらに一次封止部材，露出片部の周囲を外部封止樹
脂で二次封止して前記かしめ部分の強度補充を行うよう
にしたので、前記固定手段若しくは強度補充に接着手段
を採用する場合に比べ、対象とする樹脂の密着面積（一
次封止部材に対する二次封止部材の密着面積）が大きい
こと、成形型による成形が可能であるため再現性が高く
外観寸法の精度保持が容易であること等の点から、高品
質の製品を容易に製造することが可能になる。加えて、
一次封止部材の周囲を二次封止部材で封止する二重成形
構造としたことから、半導体レーザ装置全体の耐久性，
耐強度の向上が期待できる。さらに、一次封止部材の外
側に成形する二次封止部材の大きさ，形状等を任意に設
定することで、二次封止部材の背面部（リードフレーム
が突出する側の端部）を、リードフレームに接続するプ
リント基板の接着面として利用することが可能になり、
リードフレームに対するプリント基板の半田付け作業を
容易に行うことができる。According to the semiconductor laser device of the present invention configured as described above, since the primary sealing member and the exposed piece portion are secondarily sealed with the external sealing resin, the adapter ring is caulked and fixed to the exposed piece portion. The portion is covered with the secondary sealing member, the secondary sealing member is filled between the primary sealing member and the exposed piece portion, and the adapter ring, and the adhesion force of the secondary sealing member causes the lead frame. The wide portion is more firmly fixed to the adapter ring, and the deviation of the optical axis of the laser beam due to the rattling of the wide portion can be reliably prevented. Further, caulking is adopted as a means for fixing the adapter ring to the exposed piece, and the primary sealing member and the periphery of the exposed piece are secondarily sealed with an external sealing resin to replenish the strength of the caulked portion. Therefore, compared with the case where the fixing means or the adhesive means is used for supplementing the strength, the contact area of the target resin (the contact area of the secondary sealing member with respect to the primary sealing member) is large, and the molding by the molding die is performed. Since it is possible, it is possible to easily manufacture a high-quality product from the viewpoints of high reproducibility and easy maintenance of accuracy of external dimensions. in addition,
Due to the double-molded structure in which the periphery of the primary sealing member is sealed with the secondary sealing member, the durability of the entire semiconductor laser device,
Improved strength resistance can be expected. Furthermore, by setting the size, shape, etc. of the secondary sealing member to be molded on the outside of the primary sealing member, the back surface portion (the end portion on the side where the lead frame projects) of the secondary sealing member is set. , It can be used as an adhesive surface of a printed circuit board that connects to a lead frame,
The work of soldering the printed circuit board to the lead frame can be easily performed.
【００１１】[0011]
【実施例】以下、本発明に係る半導体レーザ装置の実施
例を図面を参照して説明する。 （第１実施例）図１は本発明の第１実施例に係る半導体
レーザ装置Ａを示し、（ａ）は中央縦断側面図、（ｂ）
は（Ｉ）−（Ｉ）線断面図、（ｃ）は（II）−（II）線
断面図である。本実施例の半導体レーザ装置Ａは、リー
ドフレーム１１，１２，１３と、リードフレーム１２の
端部幅広部１２ａに固定されたＬＤチップ３と、リード
フレーム１１，１２，１３の先端側の周囲を透明樹脂で
フラット型に封止した一次封止部材４と、この一次封止
部材４より外部へ張り出た一対の露出片部１２ｄ，１２
ｄと、この露出片部１２ｄ，１２ｄに固定されるアダプ
タリング５と、前記一次封止部材４及び露出片部１２
ｄ，１２ｄを外部封止樹脂で封止した二次封止部材６と
を備えてなる。Embodiments of the semiconductor laser device according to the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 shows a semiconductor laser device A according to a first embodiment of the present invention.
Is a sectional view taken along line (I)-(I), and (c) is a sectional view taken along line (II)-(II). The semiconductor laser device A of the present embodiment includes the lead frames 11, 12, and 13, the LD chip 3 fixed to the wide end portion 12a of the lead frame 12, and the periphery of the lead frames 11, 12, and 13 on the tip end side. A primary sealing member 4 sealed in a flat type with a transparent resin, and a pair of exposed piece portions 12d, 12 protruding from the primary sealing member 4 to the outside.
d, the adapter ring 5 fixed to the exposed piece portions 12d, 12d, the primary sealing member 4, and the exposed piece portion 12
and a secondary sealing member 6 in which d and 12d are sealed with an external sealing resin.
【００１２】リードフレーム１１，１３の端部１１ａ，
１３ａは図１（ｂ）に示すような鉤形屈曲状に形成し、
これにより、これら端部１１ａ，１３ａとリードフレー
ム１２の端部幅広部１２ａ，中間部１２ｂとの間に透明
樹脂（一次封止部材４）がほぼコ字形に廻り込み、リー
ドフレーム１１，１３に所定の抜き強度が保持される。
リードフレーム１２の端部には幅広部１２ａが形成さ
れ、この幅広部１２ａ上にフォトダイオードからなるサ
ブマウント層２を固着し、さらにこのサブマウント層２
の上面にＬＤチップ３を固着する。The end portions 11a of the lead frames 11 and 13,
13a is formed into a hook-like bent shape as shown in FIG. 1 (b),
As a result, the transparent resin (primary sealing member 4) wraps around between the end portions 11a and 13a and the wide end portions 12a and the intermediate portions 12b of the lead frame 12 in a substantially U-shape, and the lead frames 11 and 13 A predetermined pulling strength is maintained.
A wide portion 12a is formed at an end of the lead frame 12, and a submount layer 2 made of a photodiode is fixed on the wide portion 12a.
The LD chip 3 is fixed to the upper surface of the.
【００１３】サブマウント層２，ＬＤチップ３を含むリ
ードフレーム１２の端部幅広部１２ａ、及びリードフレ
ーム１１，１３の端部１１ａ，１３ａの周囲は、透明エ
ポキシ樹脂などの透明樹脂でフラット型に一次封止され
る。この一次封止部分を一次封止部材４と称する。また
一次封止部材４は前記した通り、リードフレーム１２の
端部幅広部１２ａ，中間部１２ｂと、リードフレーム１
１，１３の端部１１ａ，１３ａとの間に透明樹脂の所定
量がほぼコ字形に廻り込んで、一次封止部材４に対して
各リードフレーム１１，１２，１３が所定の抜き強度を
保持できるよう、アダプタリング５の前側（ＬＤチップ
側）及び後側（リード側）に突出するフラット型に成形
される。The wide end portion 12a of the lead frame 12 including the submount layer 2 and the LD chip 3 and the periphery of the end portions 11a and 13a of the lead frames 11 and 13 are made flat with a transparent resin such as a transparent epoxy resin. Primary sealed. This primary sealing portion is referred to as the primary sealing member 4. As described above, the primary sealing member 4 includes the wide end portion 12a and the intermediate portion 12b of the lead frame 12, and the lead frame 1.
A predetermined amount of transparent resin wraps around the end portions 11a, 13a of the terminals 1, 13 in a substantially U-shape so that the lead frames 11, 12, 13 retain a predetermined pulling strength with respect to the primary sealing member 4. As possible, the adapter ring 5 is molded into a flat mold projecting to the front side (LD chip side) and the rear side (lead side).
【００１４】尚、図示しないが、上記ＬＤチップ３の周
囲は、発光点Ｐから出射されるレーザ光の波長帯におい
て光の吸収係数が低く、且つ耐熱性の高いシリコーン層
が形成され、このシリコーン層を設けることにより、レ
ーザ光の出射により一次封止部材４が光損傷を受けるこ
とが防止される。また、一次封止部材４を前述の如くフ
ラット型に成形することで、ＬＤチップ３及び前記シリ
コーン層の周囲を被覆する透明樹脂（一次封止部材４）
の体積が小さくなり、且つＬＤチップ３の周囲の透明樹
脂の厚みが均等化されるため、透明樹脂の熱変形などに
よる変形量が図５に示す円筒形タイプに比べて緩和さ
れ、透明樹脂とシリコーン層との間に生じる剥離現象を
抑制することができる。Although not shown, a silicone layer having a low light absorption coefficient and a high heat resistance is formed around the LD chip 3 in the wavelength band of the laser light emitted from the light emitting point P. By providing the layer, the primary sealing member 4 is prevented from being damaged by the emission of the laser light. In addition, by molding the primary sealing member 4 into a flat mold as described above, a transparent resin that covers the LD chip 3 and the periphery of the silicone layer (primary sealing member 4)
Since the volume of the transparent resin is reduced and the thickness of the transparent resin around the LD chip 3 is equalized, the amount of deformation due to thermal deformation of the transparent resin is less than that of the cylindrical type shown in FIG. It is possible to suppress the peeling phenomenon that occurs between the silicone layer and the silicone layer.
【００１５】露出片部１２ｄ，１２ｄは、リードフレー
ム１２の端部幅広部１２ａの両脇から左右に張り出した
張出し片部１２ｃ，１２ｃの先端を幅広状に形成したも
ので、前記張出し片部１２ｃ，１２ｃは一次封止部材４
で封止され、露出片部１２ｄ，１２ｄは一次封止部材４
から外部へ露出する。露出片部１２ｄ，１２ｄの先端
は、アダプタリング５の内周に設けた一対の取付溝５
ａ，５ａに挿入してかしめ固定され、これによりアダプ
タリング５が露出片部１２ｄ，１２ｄ、張出し片部１２
ｃ，１２ｃを介して幅広部１２ａに固定される。The exposed strips 12d, 12d are formed by widening the tips of the overhang strips 12c, 12c projecting from the both sides of the wide end 12a of the lead frame 12 to the left and right. , 12c are primary sealing members 4
And the exposed pieces 12d and 12d are sealed with the primary sealing member 4
Exposed to outside. The tips of the exposed pieces 12d and 12d are provided with a pair of mounting grooves 5 provided on the inner circumference of the adapter ring 5.
a, 5a and fixed by caulking, whereby the adapter ring 5 is exposed to the exposed pieces 12d and 12d and the protruding piece 12
It is fixed to the wide portion 12a via c and 12c.
【００１６】取付溝５ａ，５ａは、露出片部１２ｄ，１
２ｄに固定したアダプタリング５がＬＤチップ３の発光
点Ｐを中心とする仮想円に内接するよう設けられ、また
アダプタリング５の外周面には機器内の装着孔に装着す
る際の位置合わせ用溝５ｂが設けられ、これにより、機
器への装着時においてレーザ光の発光点Ｐが所定の位置
に保持されるようになる。尚、アダプタリング５はリー
ドフレーム材と同様な熱膨張係数を有する材質（例えば
Ａｌ等）で形成することが望ましい。またアダプタリン
グ５は、機器内の装着孔の孔径に装着可能な外径寸法、
若しくはキャンタイプのステムの規格に合わせた外径寸
法をもって作製する。The mounting grooves 5a, 5a are provided with exposed piece portions 12d, 1
An adapter ring 5 fixed to 2d is provided so as to be inscribed in a virtual circle centered on the light emitting point P of the LD chip 3, and the outer peripheral surface of the adapter ring 5 is used for positioning when mounting in a mounting hole in the device. The groove 5b is provided so that the emission point P of the laser beam can be held at a predetermined position when it is mounted on the device. The adapter ring 5 is preferably made of a material having a thermal expansion coefficient similar to that of the lead frame material (eg, Al). The adapter ring 5 has an outer diameter dimension that can be attached to the diameter of the mounting hole in the device,
Alternatively, it is manufactured with an outer diameter dimension conforming to the standard of a can type stem.
【００１７】アダプタリング５の取付溝５ａ，５ａと露
出片部１２ｄ，１２ｄの先端との固着は、接着、かしめ
等の方法が採用可能であるが、本発明では固定強度や外
観寸法を所定の精度に保持することを考慮して、上記し
たかしめ手段を採用する。本実施例で採用したかしめ手
段を、図２に示す二次封止前の状態で説明すれば、露出
片部１２ｄ，１２ｄの先端を取付溝５ａ，５ａに挿入し
た後、各々の取付溝５ａの近傍位置５ｃ，５ｃをアダプ
タリング５の前後両面から工具でかしめて、図２（ｂ）
〜（ｄ）に示す如く露出片部１２ｄ，１２ｄの先端を取
付溝５ａ，５ａに対してかしめ固定する。The attachment grooves 5a, 5a of the adapter ring 5 and the tips of the exposed pieces 12d, 12d can be fixed to each other by a method such as adhesion or caulking, but in the present invention, the fixing strength and the external dimension are predetermined. The caulking means described above is adopted in consideration of maintaining accuracy. The caulking means employed in this embodiment will be described in the state before the secondary sealing shown in FIG. 2. After inserting the tips of the exposed pieces 12d, 12d into the mounting grooves 5a, 5a, the respective mounting grooves 5a are inserted. The positions 5c and 5c in the vicinity of are crimped from both front and rear sides of the adapter ring 5 with a tool, and as shown in FIG.
As shown in (d), the tips of the exposed pieces 12d, 12d are caulked and fixed to the mounting grooves 5a, 5a.
【００１８】尚、図２に示す二次封止前の状態において
は、アダプタリング５はかしめ固定部分７，７によって
のみ固定され、よって一次封止部材４，露出片部１２
ｄ，１２ｄとアダプタリング５との間、及び取付溝５
ａ，５ａと露出片部１２ｄ，１２ｄとの間には夫々空隙
Ｃ1 ，Ｃ2 が形成されている。この状態にあっては、幅
広部１２ａに対するアダプタリング５の固定強度が不足
する虞れが有る。本発明の半導体レーザ装置は、一次封
止部材４及び露出片部１２ｄ，１２ｄを外部封止樹脂で
二次封止することで、幅広部１２ａに対するアダプタリ
ング５の固定をより確実にするものである。In the state before the secondary sealing shown in FIG. 2, the adapter ring 5 is fixed only by the caulking fixing portions 7 and 7, so that the primary sealing member 4 and the exposed piece portion 12 are provided.
Between the d and 12d and the adapter ring 5, and the mounting groove 5
Gaps C 1 and C 2 are formed between a and 5a and the exposed piece portions 12d and 12d, respectively. In this state, the fixing strength of the adapter ring 5 with respect to the wide portion 12a may be insufficient. In the semiconductor laser device of the present invention, the primary sealing member 4 and the exposed piece portions 12d, 12d are secondarily sealed with the external sealing resin, so that the adapter ring 5 is more securely fixed to the wide portion 12a. is there.
【００１９】外部封止樹脂は、一次封止部材４を形成す
る透明樹脂のガラス転移温度よりも低いか若しくは前記
ガラス転移温度にごく近い温度で成形可能で、且つ接着
性の高い樹脂材料を用いて、上記一次封止部材４及び露
出片部１２ｄ，１２ｄの周囲を封止するもので、詳しく
は図１に示すように、一次封止部材４の周囲を略円筒形
状に被覆して一次封止部材４とアダプタリング５との間
の空隙Ｃ1 を埋め、且つ露出片部１２ｄ．１２ｄの周囲
を被覆して露出片部１２ｄ．１２ｄとアダプタリング５
との間の空隙Ｃ2 を埋めると共にかしめ固定部分７，７
を被覆する。この二次封止部分を二次封止部材６と称す
る。尚、本実施例においては前述のごとく、一次封止部
材４がアダプタリング５の前側及び後側に突出してお
り、よって二次封止部材６もアダプタリング５の前側
（ＬＤチップ側）及び後側（リード側）に突出するよう
成形される。二次封止部材６の前側（ＬＤチップ側）の
端部にはレーザ光を出射するための開口部６ａが形成さ
れ、また二次封止部材６の後側（リード側）の端部６ｂ
は、図４に示す如くリードフレームに接続するプリント
基板210 の接着面として利用される。The external sealing resin is made of a resin material which can be molded at a temperature lower than the glass transition temperature of the transparent resin forming the primary sealing member 4 or very close to the glass transition temperature and has high adhesiveness. In order to seal the periphery of the primary sealing member 4 and the exposed piece portions 12d, 12d, the primary sealing member 4 is covered in a substantially cylindrical shape as shown in FIG. The gap C 1 between the stopper member 4 and the adapter ring 5 is filled, and the exposed piece 12d. 12d. The periphery of 12d. 12d and adapter ring 5
Caulked portions 7,7 together fill the gap C 2 between the
Is coated. This secondary sealing portion is referred to as the secondary sealing member 6. In this embodiment, as described above, the primary sealing member 4 projects to the front side and the rear side of the adapter ring 5, and therefore the secondary sealing member 6 also faces the front side (LD chip side) and the rear side of the adapter ring 5. It is molded so as to project to the side (lead side). An opening 6a for emitting a laser beam is formed at the front side (LD chip side) end of the secondary sealing member 6, and the rear side (lead side) end 6b of the secondary sealing member 6 is formed.
Is used as an adhesive surface of the printed circuit board 210 connected to the lead frame as shown in FIG.
【００２０】図４は本実施例の半導体レーザ装置Ａを、
光応用機器に内設された装着孔である筒状ホルダー200
の段付き装着孔201 に装着した場合を示す。アダプタリ
ング５は段付き装着孔201 に嵌合しており、また装着孔
201 の内周面に設けた不図示の位置合わせ用凸部に位置
合わせ用溝５ｂが係合して、発光点Ｐが基準線202 上に
位置している。FIG. 4 shows a semiconductor laser device A of this embodiment,
Cylindrical holder 200 that is a mounting hole installed in optical equipment
Shown is the case where it is mounted in the stepped mounting hole 201. The adapter ring 5 is fitted in the stepped mounting hole 201, and
The positioning groove 5b is engaged with a positioning projection (not shown) provided on the inner peripheral surface of 201, and the light emitting point P is located on the reference line 202.
【００２１】而して、以上のように構成した本実施例の
半導体レーザ装置Ａによれば、リードフレームの端部幅
広部１２ａに搭載したＬＤチップ３を樹脂封止した構造
であるため、キャンタイプに比べて低コストで製造で
き、しかもアダプタリング５を機器内の装着孔に嵌合さ
せて固定することからキャンタイプと同様な取扱いで装
着が可能となる。Thus, according to the semiconductor laser device A of the present embodiment configured as described above, since the LD chip 3 mounted on the wide end portion 12a of the lead frame is resin-sealed, It can be manufactured at a lower cost than the type, and since the adapter ring 5 is fitted and fixed in the mounting hole in the device, it can be mounted with the same handling as the can type.
【００２２】また、前記幅広部１２ａの両側に設けた露
出片部１２ｄ，１２ｄにアダプタリング５を固定したこ
とから、リードフレーム幅広部１２ａがアダプタリング
５に固定され、ＬＤチップ３周辺の透明樹脂（一次封止
部材４）の熱膨張に伴う幅広部１２ａの変動を防止して
レーザ光の発光点Ｐを一定位置に保つことが可能にな
る。また、一次封止部材４及び露出片部１２ｄ，１２ｄ
を外部封止樹脂で二次封止することから、露出片部１２
ｄ，１２ｄに対するアダプタリング５のかしめ固定部分
７，７が二次封止部材６で被覆されると共に、一次封止
部材４及び露出片部１２ｄ，１２ｄとアダプタリング５
との間の空隙Ｃ1 ，Ｃ2 に二次封止部材６が充填され、
この二次封止部材６の密着力により、リードフレーム幅
広部１２ａがより強固にアダプタリング５に固定され、
該幅広部１２ａのがたつきによるレーザ光の光軸のずれ
を確実に防止することができる。よって、使用に際して
振動を伴う光応用機器に組み込む場合に特に有用であ
る。Further, since the adapter ring 5 is fixed to the exposed piece portions 12d, 12d provided on both sides of the wide portion 12a, the wide lead frame portion 12a is fixed to the adapter ring 5 and the transparent resin around the LD chip 3 is fixed. It is possible to prevent the wide portion 12a from fluctuating due to the thermal expansion of the (primary sealing member 4) and keep the emission point P of the laser light at a constant position. In addition, the primary sealing member 4 and the exposed pieces 12d, 12d
Since the secondary sealing is performed with the external sealing resin, the exposed piece 12
The caulking fixing portions 7, 7 of the adapter ring 5 with respect to d, 12d are covered with the secondary sealing member 6, and the primary sealing member 4 and the exposed pieces 12d, 12d and the adapter ring 5 are also provided.
The secondary sealing member 6 is filled in the spaces C 1 and C 2 between
Due to the adhesive force of the secondary sealing member 6, the lead frame wide portion 12a is more firmly fixed to the adapter ring 5,
It is possible to reliably prevent the deviation of the optical axis of the laser light due to the rattling of the wide portion 12a. Therefore, it is particularly useful when incorporated into an optical application device that is vibrated during use.
【００２３】また、露出片部１２ｄ，１２ｄに対するア
ダプタリング５の固定手段、若しくは露出片部１２ｄ，
１２ｄに対するアダプタリング５の固定部分の強度補充
手段に接着を採用する場合に比べ、対象とする樹脂の密
着面積（一次封止部材４に対する二次封止部材６の密着
面積）が大きいこと、成形型による成形が可能であるた
め再現性が高く外観寸法の精度保持が容易であること等
の点から、高品質の製品を容易に製造することが可能に
なる。Further, the fixing means of the adapter ring 5 to the exposed piece portions 12d, 12d, or the exposed piece portions 12d, 12d,
Compared with the case where adhesion is adopted as the strength replenishing means of the fixed portion of the adapter ring 5 with respect to 12d, the adhesion area of the target resin (the adhesion area of the secondary sealing member 6 to the primary sealing member 4) is large, and molding Since it can be molded by a mold, it has high reproducibility and it is easy to maintain the accuracy of the external dimensions. Therefore, it becomes possible to easily manufacture high quality products.
【００２４】さらに、一次封止部材４の周囲を二次封止
部材６で封止する二重成形構造としたことから、半導体
レーザ装置Ａ全体の耐久性，耐強度の向上が期待でき
る。また一次封止部材４の外側に成形する二次封止部材
６の大きさ，形状等を任意に設定することで、二次封止
部材６の背面部６ｂを、リードフレームに接続するプリ
ント基板210 の接着面として利用することが可能にな
り、リードフレームに対するプリント基板210 の半田付
け作業を容易に行うことができる。Furthermore, since the periphery of the primary sealing member 4 is sealed with the secondary sealing member 6, the double molding structure is expected to improve the durability and strength of the semiconductor laser device A as a whole. A printed circuit board for connecting the back surface portion 6b of the secondary sealing member 6 to the lead frame by arbitrarily setting the size, shape, etc. of the secondary sealing member 6 formed outside the primary sealing member 4. Since it can be used as an adhesive surface of the printed circuit board 210, the work of soldering the printed circuit board 210 to the lead frame can be easily performed.
【００２５】（第２実施例）次に、図３に示す第２実施
例の半導体レーザ装置Ａ’について説明する。図３
（ａ）は中央縦断側面図、（ｂ）は（IV）−（IV）線断
面図、（ｃ）は（Ｖ）−（Ｖ）線断面図である。この半
導体レーザ装置Ａ’は、リードフレーム８１，８２，８
３と、リードフレーム８２の端部幅広部８２ａにサブマ
ウント層２を介して固定されたＬＤチップ３と、リード
フレーム８１，８２，８３の先端側の周囲を透明樹脂で
フラット型に封止した一次封止部材４’と、この一次封
止部材４’より外部へ張り出た一対の露出片部８２ｄ，
８２ｄと、この露出片部８２ｄ，８２ｄにかしめ固定さ
れるアダプタリング５と、一次封止部材４’及び露出片
部８２ｄ，８２ｄを外部封止樹脂で封止した二次封止部
材６’とを備えてなる基本的構成については第１実施例
と同様であるが、その外観形状，寸法等を図６に示すキ
ャンタイプとほぼ同一とした点が第１実施例と異なって
いる。(Second Embodiment) Next, a semiconductor laser device A'of a second embodiment shown in FIG. 3 will be described. FIG.
(A) is a central longitudinal side view, (b) is a (IV)-(IV) line sectional view, (c) is a (V)-(V) line sectional view. This semiconductor laser device A ′ has lead frames 81, 82, 8
3, the LD chip 3 fixed to the wide end portion 82a of the lead frame 82 via the submount layer 2, and the peripheries of the lead frames 81, 82, 83 on the tip side are flatly sealed with a transparent resin. The primary sealing member 4'and a pair of exposed piece portions 82d protruding outward from the primary sealing member 4 ',
82d, the adapter ring 5 caulked and fixed to the exposed piece portions 82d, 82d, and the secondary sealing member 6'where the primary sealing member 4'and the exposed piece portions 82d, 82d are sealed with an external sealing resin. The basic configuration including the above is the same as that of the first embodiment, but is different from the first embodiment in that the external shape, dimensions and the like are almost the same as those of the can type shown in FIG.
【００２６】以下、前述の説明と重複する部分について
は図中に第１実施例と同一の符号を付して説明を省略
し、この実施例の特徴点のみ述べれば、本例の半導体レ
ーザ装置Ａ’は、その外観形状，寸法等をキャンタイプ
とほぼ同一なものとするために、一次封止部材４’をア
ダプタリング５の前側（ＬＤチップ側）のみに突出する
フラット型に成形すると共に、二次封止部材６’は前記
一次封止部材４’及び露出片部８２ｄ，８２ｄの周囲を
封止し、且つアダプタリング５の前側（ＬＤチップ側）
のみに突出する略円筒型に成形している。さらに本例で
は、前記の如く一次封止部材４’と二次封止部材６’が
アダプタリング５の前側（ＬＤチップ側）のみに突出す
る構成となることから、第１実施例のものに比べて透明
樹脂（一次封止部材４）及び外部封止樹脂（二次封止部
材６）の体積が小さくなっており、これに伴うリードフ
レーム８１，８３の抜き強度の低下を防止するべく、各
リードフレーム８１，８２，８３の形状を図示のような
ものとしている。In the following, the same parts as those in the above description will be designated by the same reference numerals as those in the first embodiment and the description thereof will be omitted. Only the characteristic points of this embodiment will be described. In order to make the external shape, dimensions, etc. of A'substantially the same as the can type, the primary sealing member 4'is formed into a flat type that projects only on the front side (LD chip side) of the adapter ring 5. The secondary sealing member 6 ′ seals the periphery of the primary sealing member 4 ′ and the exposed piece portions 82d, 82d, and the front side of the adapter ring 5 (the LD chip side).
It is molded into a substantially cylindrical shape that only protrudes. Further, in this example, as described above, the primary sealing member 4 ′ and the secondary sealing member 6 ′ are configured to project only on the front side (LD chip side) of the adapter ring 5, so that the first exemplary embodiment is the same as the first exemplary embodiment. Compared with this, the volumes of the transparent resin (primary sealing member 4) and the external sealing resin (secondary sealing member 6) are smaller, and in order to prevent the reduction in the pulling strength of the lead frames 81, 83 due to this, The shape of each lead frame 81, 82, 83 is as illustrated.
【００２７】リードフレーム８１，８３の端部８１ａ，
８３ａは図３（ｂ）に示すような直線形状とすると共
に、リードフレーム８２の端部幅広部８２ａは平面視略
Ｔ字形とし、且つこの幅広部８２ａの両側から後方へ向
けて張り出した張出し片部８２ｃ，８２ｃの先端を幅広
状に形成して露出片部８２ｄ，８２ｄとしている。さら
に、リードフレーム８１，８３の端部８１ａ，８３ａに
連なる部分は図示する如く折曲させ、この折曲部８１
ｂ，８３ｂを外部封止樹脂（二次封止部材６’）で封止
している。これにより、リードフレーム８１，８３の端
部８１ａ，８３ａの廻りに透明樹脂（一次封止部材
４’）がほぼコ字形に廻り込み、且つ前記折曲部分８１
ｂ，８３ｂが外部封止樹脂（二次封止部材６’）で封止
されて、リードフレーム８１，８３に所定の抜き強度が
保持される。The end portions 81a of the lead frames 81 and 83,
83a has a linear shape as shown in FIG. 3 (b), the wide end portion 82a of the lead frame 82 has a substantially T shape in plan view, and the overhanging piece protruding rearward from both sides of the wide portion 82a. The tips of the portions 82c, 82c are formed wide so as to be exposed piece portions 82d, 82d. Further, the portions of the lead frames 81, 83 that are continuous with the end portions 81a, 83a are bent as shown in the drawing, and the bent portions 81
b and 83b are sealed with an external sealing resin (secondary sealing member 6 '). As a result, the transparent resin (primary sealing member 4 ') wraps around the end portions 81a, 83a of the lead frames 81, 83 in a substantially U shape, and the bent portion 81 is formed.
b and 83b are sealed with an external sealing resin (secondary sealing member 6 '), and the lead frames 81 and 83 maintain a predetermined pulling strength.
【００２８】而して本例の半導体レーザ装置Ａ’によれ
ば、第１実施例と同様に、以下のような作用，効果を奏
する。リードフレーム幅広部８２ａに搭載したＬＤチッ
プ３を樹脂封止したためキャンタイプに比べて低コスト
で製造でき、且つアダプタリング５を備えることからキ
ャンタイプと同様な取扱いで機器への装着が可能とな
る。また、露出片部８２ｄ，８２ｄにアダプタリング５
を固定したことから、ＬＤチップ３周辺の透明樹脂（一
次封止部材４’）の熱膨張に伴う幅広部８２ａの変動を
防止して、レーザ光の発光点Ｐを一定位置に保つことが
可能になる。しかも露出片部８２ｄ，８２ｄに対するア
ダプタリング５のかしめ固定部分７，７が二次封止部材
６’で被覆されると共に、一次封止部材４’及び露出片
部８２ｄ，８２ｄとアダプタリング５との間の空隙
Ｃ1 ，Ｃ2 に二次封止部材６’が充填されるので、幅広
部８２ａがより強固にアダプタリング５に固定され、該
幅広部８２ａのがたつきによるレーザ光の光軸のずれを
確実に防止することができる。よって、持ち運びタイプ
や車搭載用等の小型ＣＤプレーヤ等に組み込む場合に特
に有用である。Thus, according to the semiconductor laser device A'of the present example, the following actions and effects are obtained as in the first embodiment. Since the LD chip 3 mounted on the wide lead frame portion 82a is resin-sealed, the LD chip 3 can be manufactured at a lower cost than the can type, and since the adapter ring 5 is provided, it can be mounted on a device with the same handling as the can type. . Further, the adapter ring 5 is attached to the exposed pieces 82d and 82d.
Since the fixed portion is fixed, it is possible to prevent the wide portion 82a from changing due to the thermal expansion of the transparent resin (primary sealing member 4 ') around the LD chip 3 and keep the emission point P of the laser light at a fixed position. become. Moreover, the caulking fixing portions 7, 7 of the adapter ring 5 to the exposed piece portions 82d, 82d are covered with the secondary sealing member 6 ', and the primary sealing member 4'and the exposed piece portions 82d, 82d and the adapter ring 5 are formed. Since the secondary sealing member 6 ′ is filled in the gaps C 1 and C 2 between them, the wide portion 82a is more firmly fixed to the adapter ring 5, and the light of the laser light due to the rattling of the wide portion 82a. It is possible to reliably prevent the axis from shifting. Therefore, it is particularly useful when incorporated in a portable CD player, a compact CD player mounted in a vehicle, or the like.
【００２９】また、アダプタリング５の固定手段、若し
くはアダプタリング５の固定部分の強度補充手段に接着
を採用する場合に比べ、対象とする樹脂の密着面積（一
次封止部材４’に対する二次封止部材６’の密着面積）
が大きいこと、成形型による成形が可能であるため再現
性が高く外観寸法の精度保持が容易であること等の点か
ら、高品質の製品を容易に製造することが可能になる。
さらに、一次封止部材４’の周囲を二次封止部材６’で
封止する二重成形構造としたことから、半導体レーザ装
置Ａ’全体の耐久性，耐強度の向上が期待できる。ま
た、二次封止部材６’の背面部６ｂを、リードフレーム
に接続するプリント基板の接着面として利用することが
可能になり、リードフレームに対するプリント基板の半
田付け作業を容易に行うことができる。Further, as compared with the case where adhesion is adopted for the fixing means of the adapter ring 5 or the strength supplementing means of the fixed portion of the adapter ring 5, the adhesion area of the target resin (secondary sealing to the primary sealing member 4 ' (Adhesion area of stop member 6 ')
It is possible to easily manufacture a high quality product from the standpoints of large size, high reproducibility since molding by a molding die is possible, and easy maintenance of accuracy of external dimensions.
Further, since the periphery of the primary sealing member 4'is sealed with the secondary sealing member 6 ', the double molding structure is provided, so that the durability and strength of the entire semiconductor laser device A'can be expected to be improved. Further, the back surface portion 6b of the secondary sealing member 6'can be used as an adhesive surface of the printed board to be connected to the lead frame, and the work of soldering the printed board to the lead frame can be easily performed. .
【００３０】さらに本例の半導体レーザ装置Ａ’によれ
ば、一次封止部材４’及び二次封止部材６’をアダプタ
リング５の前側（ＬＤチップ側）のみに突出させてキャ
ンタイプとほぼ同一の外観形状，寸法に形成したことか
ら、キャンタイプとの互換性に優れ、より多くの光応用
機器への対応が可能となり、用途の拡大が期待できる
等、多くの効果を有する。Further, according to the semiconductor laser device A'of this embodiment, the primary sealing member 4'and the secondary sealing member 6'are made to protrude only on the front side (LD chip side) of the adapter ring 5 and are almost of the can type. Since they are formed in the same external shape and size, they have excellent compatibility with the can type, can be applied to more optical application devices, and can be expected to expand their applications.
【００３１】次に、本発明実施品、図２に示すアダプタ
リングをかしめ固定したのみの比較品、及び、図５に示
す従来の樹脂封止型（従来品）とを用いて行った評価試
験について説明する。本発明実施品は、第１実施例に係
る非キャンタイプと、第２実施例に係るキャンタイプと
の双方を用意した。またそれら両実施例においては、透
明樹脂（一次封止部材）、外部封止樹脂（二次封止部
材）として下記表１に示す樹脂を用いた。すなわち、透
明樹脂としてガラス転移点温度が１２０℃程度のものを
用いた場合は外部封止樹脂としてガラス転移点温度が１
５５℃程度のものを用い、また透明樹脂としてガラス転
移点温度が１６０℃程度のものを用いた場合は外部封止
樹脂としてガラス転移点温度が１７５℃程度のものを用
いた。Next, an evaluation test was carried out using the product of the present invention, the comparative product shown in FIG. 2 in which the adapter ring is only caulked and fixed, and the conventional resin-sealed mold (conventional product) shown in FIG. Will be described. As the product of the present invention, both the non-can type according to the first embodiment and the can type according to the second embodiment were prepared. In both of these examples, the resins shown in Table 1 below were used as the transparent resin (primary sealing member) and the external sealing resin (secondary sealing member). That is, when a transparent resin having a glass transition temperature of about 120 ° C. is used, the external sealing resin has a glass transition temperature of 1 ° C.
When the transparent resin having a glass transition temperature of about 160 ° C. was used, the external sealing resin having a glass transition temperature of about 175 ° C. was used.
【００３２】[0032]
【表１】 [Table 1]
【００３３】このような本発明実施品、比較品、従来品
の全てについて、室温下及び高温高湿条件下におけるレ
ーザ光の光軸の位置を測定し、その移動量を確認した。
結果を表２乃至表５に示す。表２乃至表５中に太線で示
す枠は、レーザ光の光軸の移動量の許容範囲を表す。ま
た本発明実施品、比較品について、アダプタリングに任
意の方向から加圧してその抜き強度を測定した。結果を
表６に示す。The position of the optical axis of the laser beam was measured under the conditions of room temperature and high temperature and high humidity for all the products of the present invention, the comparative products, and the conventional products, and the amount of movement thereof was confirmed.
The results are shown in Tables 2 to 5. The frames indicated by thick lines in Tables 2 to 5 represent the allowable range of the movement amount of the optical axis of the laser light. Further, with respect to the product of the present invention and the comparative product, the pulling strength was measured by pressing the adapter ring from any direction. Table 6 shows the results.
【００３４】[0034]
【表２】 [Table 2]
【００３５】[0035]
【表３】 [Table 3]
【００３６】[0036]
【表４】 [Table 4]
【００３７】[0037]
【表５】 [Table 5]
【００３８】[0038]
【表６】 [Table 6]
【００３９】以上の測定結果から、図５に示す従来の樹
脂封止型は、レーザ光の光軸の移動量が極めて大きく、
許容範囲外であることが分かる（表２）。一方、図２に
示すアダプタリングをかしめ固定したのみの比較品は、
レーザ光の光軸の移動量が許容範囲内にあり、従来の樹
脂封止型に比べれば改善され、使用に供し得ることが分
かる（表３）。これに対し、本発明実施品ではレーザ光
の光軸の移動量がさらに小さく、使用に際して振動を伴
う光応用機器に組み込むタイプとして極めて有用である
ことが確認できた（表４，表５）。From the above measurement results, the conventional resin-sealed type shown in FIG. 5 has an extremely large amount of movement of the optical axis of the laser beam,
It can be seen that it is outside the allowable range (Table 2). On the other hand, the comparative product shown in FIG.
It can be seen that the amount of movement of the optical axis of the laser beam is within the allowable range, which is improved compared to the conventional resin-sealed type and can be used (Table 3). On the other hand, in the product of the present invention, the amount of movement of the optical axis of the laser beam was smaller, and it was confirmed that the product was extremely useful as a type incorporated into an optical application device that is vibrated during use (Tables 4 and 5).
【００４０】また表６の測定結果から、上記比較品はア
ダプタリングの抜き強度が３．０ｋｇ程度であるのに対
し、本発明実施品のキャンタイプのもので２０ｋｇ以
上、非キャンタイプのものでは３０ｋｇ以上であり、比
較品に対して７〜１０倍程度の強度が得られることが分
かり、アダプタリングをかしめ固定したのみの場合に比
べ、リードフレーム幅広部に対するアダプタリングの固
定をより確実なものとし得ることが確認できた。From the measurement results in Table 6, the comparative product has a pulling strength of the adapter ring of about 3.0 kg, whereas the can type of the product of the present invention has a breaking strength of 20 kg or more and the non-can type. It is more than 30 kg, and it is found that the strength is about 7 to 10 times that of the comparative product, and more secure fixing of the adapter ring to the wide lead frame part compared to the case where the adapter ring is only caulked and fixed. I was able to confirm that
【００４１】[0041]
【発明の効果】以上説明したように本発明の半導体レー
ザ装置は、リードフレーム幅広部上に固定されたＬＤチ
ップを透明樹脂で一次封止すると共に、前記幅広部から
両側に延びて一次封止部材より外部へ張り出た一対の露
出片部に、ＬＤチップの発光点を中心とする仮想円に内
接するアダプタリングをかしめ固定し、さらに一次封止
部材及び露出片部を外部封止樹脂で二次封止してなる新
規な構成としたので、以下に記載される効果を奏する。As described above, in the semiconductor laser device of the present invention, the LD chip fixed on the wide portion of the lead frame is primary-sealed with the transparent resin, and the LD chip is extended to both sides from the wide portion and is primary-sealed. An adapter ring inscribed in a virtual circle centered on the light emitting point of the LD chip is caulked and fixed to the pair of exposed pieces that extend outward from the member, and the primary sealing member and the exposed piece are sealed with an external sealing resin. Since it has a new configuration of secondary sealing, it has the following effects.
【００４２】１．リードフレームを用いた樹脂封止型で
あるためキャンタイプに比べて低コストで製造でき、し
かもアダプタリングを機器内の装着孔に嵌合させて固定
することからキャンタイプと同様な取扱いで装着が可能
となる。1. Since it is a resin-sealed type that uses a lead frame, it can be manufactured at a lower cost than the can type, and since the adapter ring is fitted and fixed in the mounting hole in the device, it can be mounted in the same way as the can type. It will be possible.
【００４３】２．リードフレーム幅広部の両側に設けた
露出片部にアダプタリングを固定してレーザ光の発光点
位置を一定に保つと共に、一次封止部材及び露出片部を
外部封止樹脂で二次封止してリードフレーム幅広部のが
たつきによるレーザ光の光軸のずれを確実に防止するこ
とができ、特に持ち運びタイプや車搭載用等の小型ＣＤ
プレーヤのような使用に際して振動を伴う光応用機器に
組み込む場合に有用である。2. The adapter ring is fixed to the exposed pieces provided on both sides of the wide lead frame to keep the emission point position of the laser light constant, and the primary sealing member and the exposed piece are secondarily sealed with external sealing resin. It is possible to reliably prevent the deviation of the optical axis of the laser beam due to rattling of the lead frame wide part, and especially a compact CD for carrying type or for mounting on a car.
This is useful when incorporated into an optical application device that is subject to vibration during use such as a player.
【００４４】３．アダプタリングをかしめ固定すると共
に該かしめ部分を二次封止部材で強度補充するので、ア
ダプタリングの固定若しくはその強度補充に接着手段を
採用する場合に比べ、対象とする樹脂の密着面積（一次
封止部材に対する二次封止部材の密着面積）が大きいこ
と、成形型による成形が可能であるため再現性が高く外
観寸法の精度保持が容易であること等の点から、高品質
の製品を容易に製造することが可能になる。3. Since the adapter ring is caulked and fixed and the caulked portion is supplemented with strength by the secondary sealing member, compared to the case where an adhesive means is used for fixing the adapter ring or supplementing the strength, the adhesion area of the target resin (primary sealing A high quality product is easy because of the large contact area of the secondary sealing member to the stopper member, the high reproducibility because it can be molded by the mold, and the accuracy of the external dimensions can be easily maintained. Can be manufactured.
【００４５】４．一次封止部材の周囲を二次封止部材で
封止する二重成形構造としたことから、半導体レーザ装
置全体の耐久性，耐強度の向上が期待できる。4. Since the periphery of the primary sealing member is sealed with the secondary sealing member to have a double-molded structure, improvement in durability and strength of the entire semiconductor laser device can be expected.
【００４６】５．一次封止部材の外側に成形する二次封
止部材の大きさ，形状等を任意に設定することで、二次
封止部材の背面部（リードフレームが突出する側の端
部）を、リードフレームに接続するプリント基板の接着
面として利用することが可能になり、リードフレームに
対するプリント基板の半田付け作業を容易に行うことが
できる。5. By setting the size, shape, etc. of the secondary sealing member to be molded on the outside of the primary sealing member, the back surface portion (end portion on the side where the lead frame projects) of the secondary sealing member is It can be used as an adhesive surface of the printed board to be connected to the frame, and the work of soldering the printed board to the lead frame can be easily performed.
【００４７】６．一次封止部材及び二次封止部材をアダ
プタリングの前側（ＬＤチップ側）のみに突出させてキ
ャンタイプとほぼ同一の外観形状，寸法に形成すれば、
キャンタイプとの互換性に優れ、より多くの光応用機器
への対応が可能となり、用途の拡大が期待できる。6 If the primary sealing member and the secondary sealing member are made to project only on the front side (LD chip side) of the adapter ring and have the same external shape and dimensions as the can type,
It has excellent compatibility with the can type and can support more optical application devices, and it can be expected to expand the applications.
【図１】本発明に係る半導体レーザ装置の第１実施例を
示し、（ａ）は中央縦断側面図、（ｂ）は（ａ）の
（Ｉ）−（Ｉ）線に沿う断面図、（ｃ）は（ａ）の（I
I）−（II）線に沿う断面図である。FIG. 1 shows a first embodiment of a semiconductor laser device according to the present invention, where (a) is a central longitudinal side view, (b) is a sectional view taken along line (I)-(I) of (a), c) is (I) of (a)
It is sectional drawing which follows the I)-(II) line.
【図２】図１に示す半導体レーザ装置の二次封止前の状
態を示し、（ａ）は横断平面図、（ｂ）は（ａ）の(II
I) − (III)線に沿う断面図、（ｃ）は背面図、（ｄ）
は背面側から見た斜視図である。2 shows a state before secondary sealing of the semiconductor laser device shown in FIG. 1, (a) is a cross-sectional plan view, (b) is (II) of (a).
(I)-(III) sectional view, (c) is a rear view, (d)
FIG. 4 is a perspective view seen from the back side.
【図３】本発明に係る半導体レーザ装置の第２実施例を
示し、（ａ）は中央縦断側面図、（ｂ）は（ａ）の(IV)
−(IV)線に沿う断面図、（ｃ）は（ａ）の（Ｖ）−
（Ｖ）線に沿う断面図である。FIG. 3 shows a second embodiment of the semiconductor laser device according to the present invention, (a) is a central longitudinal side view, (b) is (IV) of (a).
-A sectional view taken along the line (IV), (c) is (V) of (a)-
It is sectional drawing which follows the (V) line.
【図４】図１に示す半導体レーザ装置の機器内部への装
着状態を示す縦断面図である。FIG. 4 is a vertical cross-sectional view showing a mounting state of the semiconductor laser device shown in FIG. 1 inside a device.
【図５】従来の樹脂封止型の半導体レーザ装置を示す斜
視図である。FIG. 5 is a perspective view showing a conventional resin-sealed semiconductor laser device.
【図６】キャンタイプの半導体レーザ装置を示す斜視図
である。FIG. 6 is a perspective view showing a can type semiconductor laser device.
【図７】キャンタイプの半導体レーザ装置の機器内部へ
の装着状態を示す縦断面図である。FIG. 7 is a vertical cross-sectional view showing a mounted state of a can type semiconductor laser device inside a device.
【符号の説明】 １１，１２，１３、８１，８２，８３：リードフレーム １２ａ，８２ａ：リードフレームの端部幅広部 ２：サブマウント層 ３：ＬＤチップ ４，４’：一次封止部材 ５：アダプターリング ６，６’：二次封止部材 ７：かしめ固定部分[Description of Reference Signs] 11, 12, 13, 81, 82, 83: Lead Frame 12a, 82a: Wide End of Lead Frame 2: Submount Layer 3: LD Chip 4, 4 ': Primary Sealing Member 5: Adapter ring 6, 6 ': Secondary sealing member 7: Caulking fixed part
Claims (1)
レーザダイオードチップを透明樹脂で一次封止すると共
に、前記幅広部から両側に延びて前記一次封止部材より
外部へ張り出た一対の露出片部に、前記レーザダイオー
ドチップの発光点を中心とする仮想円に内接するアダプ
タリングをかしめ固定し、さらに前記一次封止部材及び
露出片部を外部封止樹脂で二次封止してなることを特徴
とする半導体レーザ装置。1. A laser diode chip fixed on a wide portion of a lead frame is primary-sealed with a transparent resin, and a pair of exposures extending from the wide portion to both sides and projecting outward from the primary sealing member. An adapter ring inscribed in a virtual circle centered on the light emitting point of the laser diode chip is caulked and fixed to one part, and the primary sealing member and the exposed piece part are secondarily sealed with an external sealing resin. A semiconductor laser device characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14887295A JPH098404A (en) | 1995-06-15 | 1995-06-15 | Semiconductor laser device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14887295A JPH098404A (en) | 1995-06-15 | 1995-06-15 | Semiconductor laser device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH098404A true JPH098404A (en) | 1997-01-10 |
Family
ID=15462615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14887295A Pending JPH098404A (en) | 1995-06-15 | 1995-06-15 | Semiconductor laser device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH098404A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7567599B2 (en) | 2005-01-03 | 2009-07-28 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same |
-
1995
- 1995-06-15 JP JP14887295A patent/JPH098404A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7567599B2 (en) | 2005-01-03 | 2009-07-28 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor laser diode device with thermal conductive encapsulating resin and method for manufacturing the same |
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