JPH097667A - Anisotropic conductive film - Google Patents
Anisotropic conductive filmInfo
- Publication number
- JPH097667A JPH097667A JP15729595A JP15729595A JPH097667A JP H097667 A JPH097667 A JP H097667A JP 15729595 A JP15729595 A JP 15729595A JP 15729595 A JP15729595 A JP 15729595A JP H097667 A JPH097667 A JP H097667A
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- anisotropic conductive
- contact
- film
- bumps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は２つのユニット間の電気
的接続を行う異方導電フィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive film for electrically connecting two units.
【０００２】[0002]
【従来技術】２つのユニットの間、例えば、半導体ウエ
ハと、試験機能を有する媒体（例えばＭＣＭ基板、検査
用ウエハ）との間を電気的に接続するためのコンタクト
フィルムとして異方導電フィルムが使用されている。2. Description of the Related Art An anisotropic conductive film is used as a contact film for electrically connecting between two units, for example, a semiconductor wafer and a medium having a test function (for example, MCM substrate, inspection wafer). Has been done.
【０００３】従来の異方導電フィルムとして、例えば、
日東技報（Ｖｏｌ．３０，Ｎｏ．１，Ｍａｙ．１９９
２）に報告されている日東電工製の超高密度異方導電フ
ィルムがある。As a conventional anisotropic conductive film, for example,
Nitto Giho (Vol. 30, No. 1, May. 199)
There is an ultra-high density anisotropic conductive film manufactured by Nitto Denko reported in 2).
【０００４】図４は従来の異方導電フィルムの概略構成
を示す断面図である。FIG. 4 is a sectional view showing a schematic structure of a conventional anisotropic conductive film.
【０００５】従来の異方導電フィルムは、電気絶縁性を
有するポリイミドフィルム５０内にその厚さ方向に格子
状配置の貫通孔を有し、この貫通孔の中に半田やニッケ
ル等の金属を充填して金属柱状部５１を形成し、この金
属柱状部５１はポリイミドフィルム５０の表裏面でバン
プ５２となっている。The conventional anisotropic conductive film has through holes arranged in a lattice pattern in the thickness direction of a polyimide film 50 having an electric insulation property, and the through holes are filled with a metal such as solder or nickel. Thus, the metal columnar portion 51 is formed, and the metal columnar portion 51 becomes the bump 52 on the front and back surfaces of the polyimide film 50.
【０００６】この異方導電フィルムはポリイミドフィル
ムと金属のみで構成されているため、高い信頼性と寸法
の安定性を持ち、例えば、直径２５μｍ、ピッチ４５μ
ｍ程度の微細なバンプを数μｍの位置精度で形成でき
る。Since this anisotropic conductive film is composed only of a polyimide film and a metal, it has high reliability and dimensional stability. For example, the diameter is 25 μm and the pitch is 45 μm.
Fine bumps of about m can be formed with a positional accuracy of several μm.
【０００７】[0007]
【発明が解決しようとする課題】上述した従来の異方導
電フィルムは、ポリイミドフィルム５０の貫通孔５２の
中に金属を充填した構造であるためコンタクト方向、す
なわち、フィルム５０の厚さ方向に弾力性がなく、広い
面積で微細ピッチの一括コンタクトを行う場合には、２
つの接続ユニットおよび異方導電フィルムに高精度の高
さ寸法精度が要求され、実用上使用できる面積および貫
通孔５２の配列ピッチが制限されるという問題点があっ
た。Since the above-mentioned conventional anisotropic conductive film has a structure in which the through hole 52 of the polyimide film 50 is filled with metal, it is elastic in the contact direction, that is, the thickness direction of the film 50. In case of non-reliability and making a batch contact with a fine pitch in a large area, 2
There is a problem that one connection unit and the anisotropic conductive film are required to have high precision in height dimension accuracy, and the practically usable area and the arrangement pitch of the through holes 52 are limited.
【０００８】本発明は上述の点にかんがみてなされたも
ので、コンタクト方向に弾性機能を有し、広い面積での
微細ピッチの一括コンタクトを行うことができる異方導
電フィルムを提供することを目的とする。The present invention has been made in view of the above points, and an object thereof is to provide an anisotropic conductive film having an elastic function in the contact direction and capable of performing collective contact with a fine pitch in a wide area. And
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本発明は電気絶縁性を有するフィルムに微細な貫通
孔を形成し、該貫通孔の中に金属を充填して柱状部とな
し、該柱状部に接続して該柱状部の両端で前記フィルム
の表裏面にバンプを形成し、該フィルムの厚さ方向にの
み電気導通を有する異方導電フィルムにおいて、前記柱
状部および前記バンプの一部または全部が形状記憶合金
で作られていることを特徴とする。In order to achieve the above object, the present invention forms fine through holes in an electrically insulating film and fills the through holes with metal to form columnar parts. In the anisotropic conductive film having bumps formed on the front and back surfaces of the film at both ends of the columnar portion connected to the columnar portion and having electrical conduction only in the thickness direction of the film, A part or all is made of a shape memory alloy.
【００１０】また、本発明は前記柱状部および前記バン
プの表面に金属メッキが施されていることを特徴とす
る。Further, the present invention is characterized in that the surfaces of the columnar portion and the bump are plated with metal.
【００１１】[0011]
【作用】柱状部およびバンプの一部または全部に形状記
憶合金を用いてその形状復元力によりコンタクト方向の
弾性機能を持たせたので、２つのユニット間のコンタク
トギャップのばらつきを吸収し、広い接触面積で微細ピ
ッチの一括コンタクトに対しても、安定したコンタクト
を得ることができる。The shape memory alloy is used for a part or all of the columnar portion and the bump to give the elastic function in the contact direction by the shape restoring force, so that the variation of the contact gap between the two units is absorbed and a wide contact is achieved. A stable contact can be obtained even for a collective contact with an area having a fine pitch.
【００１２】[0012]
【実施例】以下に本発明を図面に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.
【００１３】図１は本発明の異方導電フィルムの概略構
成を示す断面図である。FIG. 1 is a sectional view showing a schematic structure of the anisotropic conductive film of the present invention.
【００１４】本発明の異方導電フィルム１は、電気絶縁
性を有するポリイミドフィルム２にその厚さ方向に例え
ば格子状に配列された複数個の微細な貫通孔８を形成
し、その貫通孔８の中にニッケル金属を充填して柱状部
３を形成し、該柱状部３に接続して該柱状部３の両端で
ポリイミドフィルム２の表裏面にＴｉ−Ｎｉ合金等の形
状記憶合金でバンプ４が形成されている。このバンプ４
は電気抵抗値を小さくするため金メッキ５を施し、圧着
等により柱状部３に接続されている。金メッキ以外に抵
抗値を小さくするその他の金属をバンプ４にメッキする
こともできる。In the anisotropic conductive film 1 of the present invention, a plurality of fine through holes 8 arranged in, for example, a lattice shape in the thickness direction of the polyimide film 2 having an electric insulating property are formed, and the through holes 8 are formed. A columnar portion 3 is formed by filling the inside of the columnar portion 3 with each other, and the columnar portion 3 is connected to both ends of the columnar portion 3 and bumps 4 are formed on the front and back surfaces of the polyimide film 2 with a shape memory alloy such as a Ti—Ni alloy. Are formed. This bump 4
Is plated with gold 5 to reduce the electric resistance value, and is connected to the columnar portion 3 by pressure bonding or the like. Other than gold plating, the bump 4 can be plated with other metal that reduces the resistance value.
【００１５】図２は使用中の本発明の異方導電フィルム
の概略構成を示す断面図であり、（ａ）は非導通状態を
示し、（ｂ）は導通状態を示す図である。FIG. 2 is a cross-sectional view showing a schematic structure of the anisotropic conductive film of the present invention in use, (a) showing a non-conducting state and (b) showing a conducting state.
【００１６】パッド７をそれぞれ形成した２つの基板６
の間に異方導電フィルム１を挿入し、両基板６を電気的
に接続しようとするものである。Two substrates 6 each having a pad 7 formed thereon
The anisotropic conductive film 1 is inserted between the two to electrically connect the two substrates 6.
【００１７】図２（ａ）は両基板をコンタクトさせる初
期の状態を示したもので、異方導電フィルム１の形状記
憶合金で形成されたバンプ４は、その先端部が予めつぶ
された形状をしている。この初期の状態においては、基
板６のパッド７は図に示すように高さにばらつきがある
ため、一部のパッド７は異方導電フィルム１のバンプ４
と接触せず、パッド７とバンプ４の間に間隙１０が存在
し、非導通状態となっている。FIG. 2 (a) shows an initial state in which both substrates are brought into contact with each other. The bump 4 formed of the shape memory alloy of the anisotropic conductive film 1 has a shape in which the tip portion is crushed in advance. are doing. In this initial state, since the pads 7 of the substrate 6 have different heights as shown in the figure, some of the pads 7 are bumps 4 of the anisotropic conductive film 1.
There is a gap 10 between the pad 7 and the bump 4 without being in contact with, and it is in a non-conductive state.
【００１８】図２（ｂ）は図２（ａ）の状態から、異方
導電フィルム１に熱を与え、相変態温度に達した形状記
憶合金製バンプ４が、マルテンサイト相からオーステナ
イト相へ相変態した状態を示している。この時バンプ４
は図２（ａ）のつぶれた状態から元の半球形状に復元し
ようとするため、バンプ４の変形量の範囲にある間隙１
０は埋められ、基板６のパッド７と異方導電フィルム１
のバンプ４が接触し、両基板６同志の電気的接続をおこ
なって導通状態にする。FIG. 2B shows that from the state of FIG. 2A, the shape memory alloy bumps 4 which have reached the phase transformation temperature by applying heat to the anisotropic conductive film 1 are transformed from the martensite phase to the austenite phase. It shows a transformed state. Bump 4 at this time
2 tries to restore the original hemispherical shape from the collapsed state of FIG.
0 is filled with the pad 7 of the substrate 6 and the anisotropic conductive film 1
Bumps 4 come into contact with each other to electrically connect both substrates 6 and bring them into a conductive state.
【００１９】なお、バンプ４の形状記憶合金材料として
二方向性の形状記憶合金を用いると、バンプ４の形状が
半球状の場合と先端がつぶれた状態とを温度で選択で
き、コンタクトの制御が可能となる。If a bidirectional shape memory alloy is used as the shape memory alloy material for the bumps 4, it is possible to select whether the shape of the bumps 4 is hemispherical or the state in which the tips are crushed by the temperature, and the contact can be controlled. It will be possible.
【００２０】図３は本発明による異方導電フィルムの別
の実施例の概略構成を示す断面図である。FIG. 3 is a sectional view showing a schematic structure of another embodiment of the anisotropic conductive film according to the present invention.
【００２１】図３の実施例において、ポリイミドフィル
ム２の貫通孔８の内部にある柱状部３とそれに接続する
バンプ４の全部が形状記憶合金により作られている。こ
の場合も図１の実施例と同様に、バンプ４の先端をつぶ
した状態から元の半球状に相変態により復元させること
により両基板６を電気的に接続させることができる。In the embodiment of FIG. 3, the columnar portion 3 inside the through hole 8 of the polyimide film 2 and the bumps 4 connected thereto are all made of a shape memory alloy. Also in this case, as in the embodiment of FIG. 1, both substrates 6 can be electrically connected by restoring the original state of the bump 4 to the original hemispherical shape by phase transformation.
【００２２】[0022]
【発明の効果】本発明の異方導電フィルムは、電気絶縁
性を有するフィルムに微細な貫通孔を形成し、該貫通孔
の中に金属を充填して柱状部となし、該柱状部に接続し
て該柱状部の両端で前記フィルムの表裏面にバンプを形
成し、該フィルムの厚さ方向にのみ電気導通を有する異
方導電フィルムにおいて、前記柱状部および前記バンプ
の一部または全部が形状記憶合金で作られているので、
形状記憶合金の形状変化によりコンタクト方向に弾性機
能をもたせることができ、広い接触面積での微細ピッチ
の一括コンタクトに対しても、接続パッド間の高さばら
つきを吸収することができるという優れた効果が得られ
る。EFFECT OF THE INVENTION The anisotropic conductive film of the present invention has fine through holes formed in an electrically insulating film, and metal is filled into the through holes to form columnar parts, which are connected to the columnar parts. Then, bumps are formed on the front and back surfaces of the film at both ends of the columnar part, and in the anisotropic conductive film having electrical conduction only in the thickness direction of the film, part or all of the columnar part and the bump are shaped. Made of memory alloy,
An excellent effect that it is possible to have an elastic function in the contact direction by changing the shape of the shape memory alloy, and it is possible to absorb height variations between connection pads even for batch contacts with a fine pitch in a wide contact area. Is obtained.
【図１】本発明の異方導電フィルムの概略構成を示す断
面図である。FIG. 1 is a cross-sectional view showing a schematic configuration of an anisotropic conductive film of the present invention.
【図２】使用中の本発明の異方導電フィルムの概略構成
を示す断面図であり、（ａ）は非導通状態を示し、
（ｂ）は導通状態を示す図である。FIG. 2 is a cross-sectional view showing a schematic configuration of the anisotropic conductive film of the present invention in use, (a) showing a non-conductive state,
(B) is a figure which shows a conduction state.
【図３】本発明による異方導電フィルムの別の実施例の
概略構成を示す断面図である。FIG. 3 is a cross-sectional view showing a schematic configuration of another embodiment of the anisotropic conductive film according to the present invention.
【図４】従来の異方導電フィルムの概略構成を示す断面
図である。FIG. 4 is a cross-sectional view showing a schematic configuration of a conventional anisotropic conductive film.
１ 異方導電フィルム ２ ポリイミドフィルム ３ 柱状部 ４ バンプ ５ 金メッキ ６ 基板 ７ パッド ８ 貫通孔 １０ 間隙 ５０ ポリイミドフィルム ５１ 柱状部 ５２ バンプ 1 Anisotropic Conductive Film 2 Polyimide Film 3 Columnar Part 4 Bump 5 Gold Plating 6 Substrate 7 Pad 8 Through Hole 10 Gap 50 Polyimide Film 51 Columnar Part 52 Bump
Claims (2)
通孔を形成し、該貫通孔の中に金属を充填して柱状部と
なし、該柱状部に接続して該柱状部の両端で前記フィル
ムの表裏面にバンプを形成し、該フィルムの厚さ方向に
のみ電気導通を有する異方導電フィルムにおいて、前記
柱状部および前記バンプの一部または全部が形状記憶合
金で作られていることを特徴とする異方導電フィルム。1. A fine through hole is formed in an electrically insulating film, a metal is filled into the through hole to form a columnar portion, and the columnar portion is connected to both ends of the columnar portion. In an anisotropic conductive film having bumps formed on the front and back surfaces of the film and having electrical continuity only in the thickness direction of the film, part or all of the columnar portion and the bumps are made of a shape memory alloy. Characteristic anisotropic conductive film.
属メッキが施されていることを特徴とする請求項１に記
載の異方導電フィルム。2. The anisotropic conductive film according to claim 1, wherein surfaces of the columnar portions and the bumps are plated with metal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15729595A JPH097667A (en) | 1995-06-23 | 1995-06-23 | Anisotropic conductive film |
| US08/637,603 US6133744A (en) | 1995-04-28 | 1996-04-25 | Apparatus for testing semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15729595A JPH097667A (en) | 1995-06-23 | 1995-06-23 | Anisotropic conductive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH097667A true JPH097667A (en) | 1997-01-10 |
Family
ID=15646547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15729595A Pending JPH097667A (en) | 1995-04-28 | 1995-06-23 | Anisotropic conductive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH097667A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011204622A (en) * | 2010-03-26 | 2011-10-13 | Fujitsu Ltd | Connector, electronic device, and method for manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6293870A (en) * | 1985-10-18 | 1987-04-30 | セイコーエプソン株式会社 | Conducting film composed of fine shape-memory metal wire |
| JPH06231818A (en) * | 1993-02-01 | 1994-08-19 | Nitto Denko Corp | Anisotropic conductive connector with elasticity |
-
1995
- 1995-06-23 JP JP15729595A patent/JPH097667A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6293870A (en) * | 1985-10-18 | 1987-04-30 | セイコーエプソン株式会社 | Conducting film composed of fine shape-memory metal wire |
| JPH06231818A (en) * | 1993-02-01 | 1994-08-19 | Nitto Denko Corp | Anisotropic conductive connector with elasticity |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011204622A (en) * | 2010-03-26 | 2011-10-13 | Fujitsu Ltd | Connector, electronic device, and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19970728 |