JPH0969973A - Position adjusting method for solid-state image pickup element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To position the solid-state image pickup element in an image pickup optical system quickly with high precision. SOLUTION: A resolution chart 10 in solid structure having a longitudinally stripped adjustment pattern is imaged on the solid-state image pickup element 4, its image is picked up, and the video signal is outputted to a television monitor 6 through a video signal processing circuit 5. Further, a digital converter circuit 9c performs digital conversion and stores video data in a frame memory in an image processing board 9b. An arithmetic circuit 9a calculates a contrast integrated value from the video data of the adjustment pattern to detect which position on the resolution chart 10 in solid structure the focus of a master lens 2 is at, and the specific position of the solid-state image pickup element 4 is calculated. A correction drive circuit 8 drives a position adjusting mechanism 11 to adjust the back focus, and swing and tilt of the solid-state image pickup element 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adjusting the back focus and the amount of tilt of a solid-state image sensor, and more particularly to a method for adjusting the position of a solid-state image sensor by arranging the solid-state image sensor at a predetermined position of an image pickup optical system at high speed. is there.

[0002]

2. Description of the Related Art A conventional method for arranging a solid-state image pickup device at a predetermined position of an image pickup optical system will be described with reference to FIGS.

FIG. 29 is a block diagram of an apparatus for arranging a solid-state image pickup element at a predetermined position of an image pickup optical system.

In FIG. 29, reference numeral 1 is a plane resolution chart for detecting the focal position of the master lens 2, and this resolution chart has focal points of the master lens 2 at its four corners as shown in FIG. The adjustment pattern 1a, which is a black-and-white alternating pattern used when detecting the, is drawn. As shown in FIG. 31, this resolution chart 1 is illuminated from the front by a light source 15, and the reflected light image of the resolution chart 1 by the light emitted from this light source 15 reaches the master lens 2.

Returning to FIG. 29, reference numeral 3 denotes an RGB color separation prism arranged in the latter stage of the master lens 2. Three RGB solid-state image pickup elements 4 are arranged to face each other on the color separation prism 3. Each solid-state image sensor 4 is connected to a television monitor 6 via a video signal processing circuit 5.

Reference numeral 7 is a positioning mechanism for moving each solid-state image pickup device 4 to the focal position of the master lens 2, and 8 is a correction driving circuit for controlling each positioning mechanism 7. This correction driving circuit 8
Is connected to an arithmetic circuit 9a that constitutes the VME system 9. The VME system 9 is composed of an arithmetic circuit 9a for calculating a contrast integrated value, an image processing board 9b having a frame memory, and a digital conversion circuit 9c for converting a video signal from the video signal processing circuit 5 into a digital signal.

Next, the operation of the above conventional example will be described. In FIG. 29, the resolution chart 1 is imaged on the solid-state image sensor 4 by the master lens 2. Solid-state imaging device 4
The video signal of the resolution chart 1 converted into an electric signal by the is output to the television monitor 6 via the video signal processing circuit 5 and is converted into a digital signal by the digital conversion circuit 9c in the VME system 9 to generate an image. It is stored in the frame memory in the processing board 9b. The contrast integrated value is calculated by the arithmetic circuit 9a in the VME system 9 from the alternating pattern of the resolution chart which is the video data stored in the frame memory.

This integrated value of contrast is a value obtained by adding the differences in the brightness of the adjacent pixels in the video output to the television monitor 6, and a large value means that the resolution of the output image is high. This means that the focus of the master lens 2 is located on the solid-state imaging device 4, and the solid-state imaging device 4 is located at a predetermined position of the imaging optical system.

Next, the solid state image pickup device 4 is moved by the positioning mechanism 7.
Is slightly moved with respect to the optical axis direction Z, and after the movement is stopped, the above-described series of operations is repeated to calculate the contrast integrated value after the movement of the solid-state imaging device 4.

The characteristic shown in FIG. 32 is obtained by slightly moving the solid-state image pickup device 4 in the optical axis direction Z and repeating a series of operations for fetching a video signal by the VME system 9 and calculating a contrast integrated value each time. be able to.

FIG. 32 shows the relationship between the position of the solid-state image pickup device 4 with respect to the optical axis direction Z and the contrast integrated value. In FIG. 32, the position of the solid-state imaging device 4 having the highest contrast integrated value in the optical axis direction Z is set as the focus position of the master lens 2, and the positioning mechanism 7 causes the solid-state imaging device 4 to focus on the master lens 2. Move to position.

In this way, the back focus of the solid-state image pickup device 4 can be adjusted and placed at a predetermined position in the image pickup optical system.

Next, the operation of the conventional example for adjusting the amount of tilt of the solid-state image pickup device with respect to the image pickup optical system will be described.

After the video signal of the resolution chart 1 is converted into a digital signal by the digital conversion circuit 9c and loaded into the frame memory in the image processing board 9b in the VME system 9, the four corners of the resolution chart 1 shown in FIG. The contrast integrated value at each of the four corners of the adjustment pattern 1a is calculated by the arithmetic circuit 9a in the VME system 9.

By outputting this calculated value to the correction drive circuit 8 and operating the positioning mechanism 7, the solid-state image pickup device 4
Is slightly moved in the horizontal direction X and the vertical direction Y with respect to the optical axis direction Z. Each time, the integrated value of contrast of the adjustment patterns 1a at the four corners of the resolution chart 1 is calculated by the series of operations described above. The amount of tilt where the contrast integrated values of the adjustment patterns 1a at the four corners of the resolution chart 1 match is detected by the series of operations described above, and the solid-state image sensor 4 is adjusted to this amount of tilt.

In this way, the amount of tilt of the solid-state image pickup device 4 can be adjusted and placed at a predetermined position in the image pickup optical system.

As described above, in the apparatus in which the conventional solid-state image pickup device is arranged at a predetermined position of the image pickup optical system, the solid-state image pickup device is moved back and forth in the optical axis direction to detect the focal position of the master lens. The back focus of the solid-state image sensor can be adjusted, and the tilt of the solid-state image sensor is adjusted so that the integrated values of the contrasts at the four corners of the resolution chart output to the TV monitor match. The inclination of can be corrected.

[0018]

However, in the apparatus in which the above-mentioned conventional solid-state image pickup device is arranged at a predetermined position of the image pickup optical system, the resolution chart output from the solid-state image pickup device in order to detect the focus position of the master lens. It is necessary to detect the maximum value of the integrated value of contrast of the image, and in order to detect the maximum value of the integrated value of contrast, the solid-state imaging device is moved back and forth in the optical axis direction, and the integrated value of the contrast is calculated each time. Since it is necessary to determine the maximum value by comparison, there is a problem that the focus position of the master lens cannot be detected at high speed.

Further, in order to adjust the tilt of the solid-state image pickup device in the image pickup optical system, the inclination of the solid-state image pickup device is detected so that the contrast integrated values at the four corners of the resolution chart output to the television monitor match. Since it is necessary to shake the image pickup device in the horizontal direction and the vertical direction, there is a problem that the tilt of the solid-state image pickup device cannot be adjusted at high speed.

Further, there is a problem in that it is not possible to obtain information as to which position the solid-state image sensor is located at a predetermined position, that is, with respect to the focal position of the master lens, at a certain point during the adjustment.

Further, there is a problem that the focus position of the master lens cannot be accurately detected visually only with the monitor screen of the captured image of the adjustment pattern of the resolution chart obtained from the solid-state image sensor.

Further, in the image pickup optical system, the further the light ray incident on the lens is from the optical axis, the more the light ray is not imaged at the position calculated by the optical axis formula of the lens, and FIG.
As shown in Fig. 6, distortion aberration in which the shape of the image does not completely match the shape of the object occurs, so if the adjustment patterns are arranged at the four corners of the resolution chart, the distortion of the master lens will affect the focus of the master lens. There is a problem that the position detection accuracy is reduced.

Further, a difference in image forming magnification occurs due to a difference in distance between each slope element of the three-dimensional block of the resolution chart from the master lens. Therefore, due to the difference in image forming magnification,
There is a problem that the detection accuracy of the focus position of the master lens is reduced.

Further, a light source is arranged obliquely in front of the image pickup surface of the resolution chart, and a reflected light image of the light emitted from the light source in the resolution chart is formed on the solid-state image pickup element through the master lens, which is close to the light source of the resolution chart. Since the illuminance of the portion is higher than that of the distant portion, the illuminance unevenness occurs on the resolution chart due to the difference in distance between the light source and the resolution chart. The contrast integrated value calculated to detect the focus position of the master lens is a value obtained by adding the differences in the brightness of the adjacent pixels of the image captured by the solid-state image sensor captured in the frame memory. Due to the unevenness, there is a problem that the maximum value is taken at a position closer to the light source than the actual focus position of the master lens, and the detection accuracy of the focus position of the master lens is deteriorated.

There is also a problem that the size of the resolution chart becomes large because of the three-dimensional structure.

Further, in order to detect the positional deviation of the solid-state image pickup device in the α, β, Z (tilt and back focus) directions, in the conventional plane structure resolution chart, the focus position of the master lens is detected. It is necessary to detect the maximum position of the integrated value of contrast of the image of the resolution chart output by the solid-state image sensor.To detect the maximum position of the integrated value of contrast, move the solid-state image sensor back and forth in the optical axis direction. Each time, it is necessary to calculate the contrast integrated value and determine the maximum value. After the solid-state image pickup device is fixed, the solid-state image pickup device cannot be moved back and forth in the optical axis direction, so that there is a problem in that it is not possible to detect the positional deviation of the solid-state image pickup device in the α, β, and Z directions. It was

The present invention solves such a conventional problem, and provides an excellent solid-state image pickup device capable of easily arranging the solid-state image pickup device at a predetermined position of the image pickup optical system in a narrow area at high speed with high accuracy. It is an object to provide a position adjusting method.

Further, it is possible to obtain position information for the focus position of the master lens of the solid-state image pickup device at the time of adjustment,
It is an object of the present invention to provide a position adjusting method for a solid-state image sensor, which can detect the focal position of a master lens with high accuracy visually.

[0029]

In order to achieve the above object, the present invention is a method of positioning a solid-state image sensor based on image data of a resolution chart of the solid-state image sensor, which is used for adjustment with density. The resolution chart having a three-dimensional structure part in which a pattern is drawn on its slope is formed on the solid-state image sensor by a master lens, and a contrast integrated value is calculated from a captured image of the adjustment pattern by the solid-state image sensor to calculate the maximum value. The position is obtained as the focus position of the master lens, a predetermined position of the image pickup optical system in which the solid-state image pickup device is to be arranged is calculated from this focus position, and the solid-state image pickup device is moved by the position adjustment mechanism based on the calculation result. The method is characterized by positioning at a predetermined position of the system.

Further, according to the present invention, a resolution chart having a plurality of three-dimensional structure parts in which an adjustment pattern having a density is drawn on its slope is formed on the solid-state image pickup device by a master lens, and each adjustment by the solid-state image pickup device is performed. The contrast integration value is calculated from the captured image of the working pattern, and its maximum position is obtained as the focus position of the master lens, and the amount of tilt of the solid-state image sensor in the imaging optical system is calculated from the three-dimensional positional relationship of the plurality of focus positions. It is a method characterized by calculating and adjusting the amount of tilt of the solid-state imaging device based on the calculation result.

Therefore, according to the present invention, the resolution chart is imaged by the solid-state image sensor through the master lens,
The integrated value of contrast should be calculated from the captured image of the adjustment pattern drawn on the slope of the three-dimensional structure of the resolution chart, and the maximum position should be detected as the focus position of the master lens, and the solid-state image sensor should be placed from this focus position. By calculating the predetermined position of the image pickup optical system and the amount of tilt of the solid-state image sensor, and adjusting the back focus and amount of tilt of the solid-state image sensor by the position adjustment mechanism, the solid-state image sensor can be quickly moved to the optimum position of the image pickup optical system. Can be positioned.

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of the present invention will be described in detail below with reference to FIGS.

FIG. 1 is a schematic block diagram of an apparatus for arranging a solid-state image pickup device to which a first embodiment of the present invention is applied at a predetermined position of an image pickup optical system, and is the same as FIG. 29 showing a conventional example. Are denoted by the same reference numerals, the description of the configuration will be omitted, and portions different from FIG. 29 will be mainly described.

In FIG. 1, a point different from the conventional one is a resolution chart 10 for detecting the focus position of the master lens 2.
It is in the place where the three-dimensional structure. That is, the adjustment patterns A to D arranged at the four corners of the resolution chart 10 are as shown in FIG.
As shown in FIG. 3, each of the three-dimensional blocks 10a has slanted surfaces that incline toward each other. On each slanted surface of each three-dimensional block 10a, a large number of vertical stripes extending along the slanted surface are drawn at predetermined intervals in the direction orthogonal to the slanted surface direction. As a result, an adjustment pattern composed of a black and white alternating pattern is formed.

The characteristic part of this embodiment is the position adjusting mechanism 11 for moving each solid-state image pickup device 4 to the focal position of the master lens 2. As shown in FIG. 1, each position adjusting mechanism 11 has six axial directions, namely, a horizontal direction X, a vertical direction Y, a rotation direction θ with respect to the optical axis, an optical axis direction Z, a horizontal tilt α, and a vertical direction. It is configured to move variably in each direction of tilt β. Then, the focus position correction data of the master lens 2 calculated by the VME system 9 based on the image pickup signal is supplied to each position adjusting mechanism 11 via the correction drive circuit 8.

Next, the operation of this embodiment configured as described above will be described. In FIG. 1, the light passing through the master lens 2 is converted into R, G, and
The light is split into the three colors of B, and the respective lights are converted into electric signals by the respective solid-state image pickup devices 4. The resolution chart 10 having a three-dimensional structure is imaged on the solid-state image sensor 4 by the master lens 2. The video signal converted into an electric signal by each solid-state imaging device 4 outputs the stereoscopic structure resolution chart 10 to the television monitor 6 via the video signal processing circuit 5, and at the same time, the digital conversion circuit 9c in the VME system 9 outputs a digital signal. And is once written in the frame memory in the image processing board 9b. Then, the VME system 9, the correction drive circuit 8, and the position adjusting mechanism 11 correct the registration deviation generated between the images formed on the plurality of solid-state image pickup devices 4.

Next, the operation of correcting the above registration deviation will be described. First, the case of adjusting the back focus of the solid-state image sensor will be described with reference to FIGS. FIG. 4 shows the image data including the adjustment pattern shown in FIG. 3, which is taken in on the frame memory in the image processing board 9b in the VME system.
The direction is the scanning direction on the television monitor 6. In the image data taken in the frame memory, designated areas are provided as shown in FIG. 4, and the integrated value of contrast in each designated area is obtained. Since the pixel lines of the odd fields and the pixel lines of the even fields are alternately captured in each row of the frame memory, the image data for two rows is set as one designated area.

The integrated value F of contrast is displayed on the television monitor 6.
It is a value obtained by adding up the differences in the brightness of the adjacent pixels in the image output to, and the integrated value of contrast in the designated area on the j-th row is expressed by (Equation 1).

[0039]

[Equation 1]

The high contrast integrated value means that
This means that the brightness difference between white and black is high, and the image is output clearly. That is, it means that the focus of the master lens 2 is aligned with the surface of the solid-state image sensor.

In each designated area in the frame memory in FIG. 4, the integrated value of contrast is obtained, and the area with the highest integrated value of contrast is detected.

The resolution chart of the three-dimensional structure shown in FIG. 3 and the drawing of the image data taken into the frame memory shown in FIG. 4 are made to correspond to each other, and which area of the three-dimensional structure resolution chart 10 has the highest contrast integrated value is derived. . In the slope portion of the three-dimensional structure chart 10, the area at the focus position of the master lens 2 having the highest contrast integrated value is detected, and the height h of this area from the reference surface is obtained. The relationship between the integrated value of contrast of each designated area and the height h from the reference surface is as shown in FIG. 5, assuming that the area of the jth row takes the maximum value of the integrated value of contrast.

In each of the R, G and B solid state image pickup devices 4,
By performing the above process and controlling each position adjusting mechanism 11 by the correction drive circuit 7, the light of each solid-state image sensor 4 is adjusted so as to compensate the height h of the area serving as the focus position of the master lens 2 with respect to the reference surface. Adjust the axial direction Z.

Next, the case of adjusting the tilt amount of the solid-state image pickup device will be described. After the video signal from the solid-state image pickup device 4 is converted into a digital signal and taken into the frame memory of the image processing board 9b in the VME system 9, the four corners are adjusted from the adjustment patterns 10a at the four corners of the three-dimensional structure resolution chart 10 shown in FIG. The maximum area of each contrast integrated value is calculated. Then, the focus positions of the master lens 2 at the four corners of the three-dimensional structure resolution chart 10 are obtained. Next, in the slope portions at the four corners of the three-dimensional structure resolution chart 10, the master lens 2 having the highest contrast integrated value
The height h from the reference plane of the area that becomes the focal point position of is determined.

Here, if the horizontal tilt α and the vertical tilt β are not tilted with respect to the optical axis, the maximum area of the contrast integrated value at each of the four corners and the height h from the reference surface are the same. If the horizontal tilt α and the vertical tilt β are inclined with respect to the optical axis, the maximum area of the contrast integrated value at each of the four corners and the height h from the reference surface are different. FIG. 6 shows the relationship.

The position where the integrated value of the contrast has the maximum value is detected in the three-dimensional structure resolution chart 10 having a depth, and the three-dimensional positional relationship of the focus of the master lens 2 at the four corners of the three-dimensional structure resolution chart 10 is derived to obtain the imaging optics. The amount of tilt of the solid-state image sensor 4 in the system can be calculated. The tilt of the solid-state image sensor 4 with respect to the optical axis is adjusted by correcting the horizontal tilt α and the vertical tilt β via the correction driving circuit 7 based on the correction data.

As described above, according to the first embodiment,
An image of the resolution chart 10 having a three-dimensional structure is captured by the solid-state image sensor 4 via the master lens 2, and the resolution chart 10
The contrast integrated value is calculated from the picked-up image of the adjustment pattern drawn on the slope of the three-dimensional block, and the maximum position thereof is set as the focus position of the master lens 2, whereby the solid-state image pickup device 4 is moved forward and backward with respect to the optical axis direction. Without moving
The focus positions of the master lens 2 are detected, and the focus positions of the master lens 2 at the four corners of the resolution chart 10 are detected from the captured images of the adjustment patterns drawn on the slopes of the three-dimensional blocks at the four corners of the resolution chart 10. By calculating the amount of tilt of the solid-state image sensor 4 from the three-dimensional positional relationship of the focus positions and adjusting the back focus and the amount of tilt of the solid-state image sensor 4 by the position adjusting mechanism 11, the solid-state image sensor 4 can be imaged at high speed. Can be positioned at the optimum position.

In the first embodiment, the three-dimensional structure resolution chart 10 is a triangular three-dimensional block.
The three-dimensional structure resolution chart 10 may have a depth.

Next, a second embodiment of the present invention will be described with reference to FIGS.
3 will be described. Will be described.

The second embodiment is a solid-state image pickup position adjusting method for adjusting the position of the solid-state image pickup with high accuracy by using the adjustment pattern in which the distortion aberration of the master lens is corrected in advance.

FIG. 7 is a structural diagram of a resolution chart of a three-dimensional structure in the second embodiment. In FIG.
Are three-dimensional blocks which are arranged at the four corners of the resolution chart 24 and have an inward inclination with respect to each other.
2 on the slope of the
2 is formed with a black-and-white alternating pattern 23 in which a large number of black and white alternating patterns are drawn at predetermined intervals in a direction orthogonal to the slope direction.

An optical system for forming an image of the three-dimensional structure resolution chart on the solid-state image sensor by the master lens when adjusting the amount of tilt of the solid-state image sensor will be described with reference to FIG.

In FIG. 8, the inclination θ of the oblique line 22 drawn on the inclined surface of the three-dimensional block 21 provided on the resolution chart 24 shown in FIG. 7 is the principal ray 25 and the oblique line 2 shown in FIG.
When the angle formed with 2 is φ, the lateral width of the resolution chart 24 for imaging is X, the lateral width of the solid-state image sensor 25 is x, and the distance between the resolution chart 24 and the solid-state image sensor 25 is Z, the following equation is obtained.

Tan θ = tan φ = (X−x) / (2Z) (2) By tilting the black-and-white alternating pattern on the adjustment pattern by the angle θ calculated from the equation (2), the video signal processing circuit is The image of the adjustment pattern of the resolution chart output to the television monitor via the television monitor is displayed from the black and white alternating pattern of vertical stripes distorted with respect to the television monitor image shown in FIG. It becomes a black and white alternating pattern of vertical stripes that extend straight to the case, and the distortion of the black and white alternating pattern due to the distortion aberration of the master lens can be removed.

Next, adjustment of the amount of tilt of the solid-state image pickup device based on the three-dimensional structure resolution chart shown in FIG. 7 will be described.

FIG. 11 is a block diagram of an apparatus for arranging the solid-state image pickup device in a predetermined position of the image pickup optical system according to the second embodiment of the present invention. The same parts as those in FIG. 1 are designated by the same reference numerals and the description of the structure is omitted.

In FIG. 11, the resolution chart 24 shown in FIG. 7 is imaged on the solid-state image sensor 4 via the master lens 2. The video signal converted into an electric signal by the solid-state image sensor 4 is passed through a video signal processing circuit 5 to a television monitor 6
Is input to the VME system, converted into a digital signal by the digital conversion circuit 9c in the VME system, and once written in the frame memory in the image processing board 9b.

The image of the adjustment pattern of the resolution chart 24 displayed on the television monitor 6 is a black-and-white alternating pattern of vertical stripes extending straight vertically to the picture size of the television monitor 6 as shown in FIG.

Therefore, in the frame memory in the image processing board 9b, a black-and-white alternating pattern which is perpendicular to the X axis of the frame memory is written as shown in FIG. If the distortion chart of the master lens 2 is not corrected without using the resolution chart 24, a distorted black-and-white alternating pattern as shown in FIG. 13 is written.

Then, the calculation circuit 9a calculates the integrated value of contrast by adding the differences in the brightness of the pixels adjacent in the X direction by using the image data of the adjustment pattern in the frame memory as shown in FIG. A plurality of focus positions of the master lens 2 are obtained from the contrast distributions of the adjustment patterns at the four corners on 24, and the tilt amount of the solid-state image sensor 4 in the image pickup optical system is calculated from the three-dimensional positional relationship of the plurality of obtained focus points. Based on this calculation result, the position adjustment mechanism 11 adjusts the amount of tilt of the solid-state image sensor 4.

Needless to say, the back focus of the solid-state image pickup device 4 can be adjusted in the same manner as in the first embodiment also in the second embodiment.

As described above, according to the second embodiment,
Adjustment pattern 2 in which the distortion of the master lens 2 is corrected
3 is used to calculate the integrated value of contrast to calculate the focus position of the master lens 2 and the amount of tilt of the solid-state image sensor 4, and the position adjusting mechanism 11 calculates the back focus of the solid-state image sensor 4 and By adjusting the amount of tilt, the solid-state image sensor 4 can be positioned at the optimum position of the imaging optical system at high speed and with high accuracy.

Next, a third embodiment of the present invention will be described with reference to the drawings. In the third embodiment, the position adjustment of the solid-state imaging is performed with high accuracy by using the adjustment pattern in which the difference in the imaging magnification due to the distance difference from the master lens of each slope element of the three-dimensional block of the resolution chart is previously corrected. This is a position adjustment method for solid-state imaging.

FIG. 14 is a structural diagram of a three-dimensional block provided on the resolution chart used in the third embodiment of the present invention, and is an explanatory diagram of a method for correcting the difference in image forming magnification.

In FIG. 14, 31 is a resolution chart used in the third embodiment, 32 is a three-dimensional block provided on the resolution chart 31, 33 is a diagram of the three-dimensional block 32 seen from the oblique direction, and 34. Is a solid block 32
Is a bottom view, and 35 is a side view of the cubic block 32.

Reference numeral 36 is an adjustment pattern drawn on the slope of the three-dimensional block 32 in which the difference in image forming magnification is corrected in advance.

Reference numeral 37 is image data of the adjustment pattern 31 which is picked up by the solid-state image pickup device and taken into the frame memory.

The slope area 39 and the slope area 40 of the three-dimensional block 32 have different heights from the reference surface 38 of the resolution chart 31. Therefore, when the resolution chart 31 is imaged by the optical system as shown in FIG. 8, since the distance between the slope area 39 and the master lens and the distance between the slope area 40 and the master lens are different, the slope area 39 in the solid-state imaging device is different. And the imaging magnification of the slope area 40 are different.

Since the adjustment pattern 36 corrects such a difference in imaging magnification in advance, the width of the black-and-white alternating stripe is changed according to the height from the reference surface 38, that is, the distance from the master lens. An image obtained by picking up the adjustment pattern 36 by the solid-state image pickup device has an even pitch like the image data 37.
A contrast integrated value is calculated from the image data 37 having the uniform pitch.

As described above, according to the third embodiment,
The position adjustment mechanism calculates the focus position of the master lens and the amount of tilt of the solid-state image sensor by calculating the integrated value of contrast using the resolution chart 31 of the three-dimensional structure having the adjustment pattern 36 in which the difference in the imaging magnification is corrected in advance. By adjusting the back focus and tilt of the solid-state image sensor, the solid-state image sensor can be positioned at an optimum position of the image pickup optical system at high speed and with high accuracy.

Next, a fourth embodiment of the present invention will be described in detail with reference to the drawings. The fourth embodiment uses a resolution chart having a structure in which light incident from the back surface is transmitted, and by irradiating illumination light from the back surface of the resolution chart,
It is a position adjustment method for solid-state imaging that removes uneven illuminance and adjusts the position of solid-state imaging with high accuracy.

FIG. 15 is an explanatory diagram showing a resolution chart illumination method according to the fourth embodiment of the present invention.

In FIG. 15, reference numeral 51 indicates the focus position of the master lens 2 in FIG. 2, FIG. 7, or FIG.
Is a resolution chart as shown in FIG. 4 and has a structure in which light emitted from the illumination light source 52 arranged on the back surface is transmitted. The transmitted light image of the resolution chart 51 is formed on the solid-state image sensor 4 via the master lens 2 and the color separation prism 3.

Reference numeral 53 is a three-dimensional block provided on the resolution chart 51, and reference numeral 54 is an adjustment pattern drawn on the slope of the three-dimensional block 53.

Next, the operation of the fourth embodiment will be described with reference to FIG. Since the illuminating light source 52 is arranged on the back surface of the resolution chart 51, the entire back surface of the resolution chart 51 can be illuminated with a uniform illuminance. Since the resolution chart 51 has a structure of transmitting light, the transmitted light image of the resolution chart 51 by this uniform illumination light is imaged on the solid-state image sensor 4 via the master lens 2 and the color separation prism 3.

Therefore, when the transmitted light image of the resolution chart 51 is picked up by the solid-state image pickup device 4, an image of the adjustment pattern 54 free from the influence of illuminance unevenness can be obtained. The focus position of the master lens is calculated with high accuracy by calculating the contrast integrated value from this image and detecting at which position on the resolution chart 51 of the three-dimensional structure with depth the maximum value of the contrast integrated value is detected. A predetermined position of the image pickup optical system in which the solid-state image pickup device 4 is to be arranged is calculated from the calculated focal position, and the position adjustment mechanism positions the solid-state image pickup device 4 at the predetermined position of the image pickup optical system based on the calculation result.

As described above, according to the fourth embodiment, the illumination light source 52 is arranged on the back surface of the resolution chart 51 having a three-dimensional structure that transmits the light incident from the back surface, and the entire back surface of the resolution chart 51 is made uneven. With a uniform illuminance, the transmitted light image of the resolution chart 51 by this uniform illumination light is imaged by the solid-state imaging device 4, and the integrated value of contrast is calculated to calculate the focus position of the master lens 2 and the solid-state imaging device 4. By calculating the amount of tilt and adjusting the back focus and amount of tilt of the solid-state image sensor 4 by the position adjusting mechanism, the solid-state image sensor 4 can be positioned at the optimum position of the imaging optical system at high speed and with high accuracy.

Next, a fifth embodiment of the present invention will be described in detail with reference to the drawings. FIG. 16 is an explanatory diagram showing the configuration of the image pickup optical system according to the fifth embodiment of the present invention.

In FIG. 16, reference numeral 61 is a resolution chart of a structure in which the resolution chart as shown in FIG. 15 is miniaturized and incident light from the back surface is transmitted, and 62 is a master lens.
Reference numeral 63 is an illuminating light source that illuminates the resolution chart 61 from the back side.

As described above, according to the fifth embodiment,
By incorporating a small resolution chart 61 having a three-dimensional structure that transmits incident light from the back surface into the master lens 62,
In a narrow area, the solid-state image sensor can be positioned at the optimum position of the image pickup optical system.

Next, a sixth embodiment of the present invention will be described with reference to the drawings. FIG. 17 is a configuration diagram of an apparatus for arranging the solid-state image sensor according to the sixth embodiment of the present invention at a predetermined position of the image pickup optical system. The same parts as those in FIG. 1 are designated by the same reference numerals and the description of the structure is omitted.

In FIG. 17, reference numeral 71 is a resolution chart having a three-dimensional structure, and as shown in FIG. 18, contrast integration by a reference plane 72 on which a circular center of gravity calculation pattern 74 is drawn and a black-and-white alternating stripe extending in the slope direction. A solid block 73 in which a value calculation pattern 75 is drawn on its slope
Composed of

Next, the operation of the sixth embodiment configured as described above will be described. In FIG. 17, the light image of the resolution chart 71 enters the color separation prism 3 through the master lens 2, is separated into three primary colors of red, green, and blue, and is formed on the element surface of each solid-state image sensor 4. , Converted to electrical signals.

The video signal converted into an electric signal by each solid-state image pickup device 4 is converted into a digital signal through the video signal circuit 5 and the digital conversion circuit 9c and written in the frame memory in the image processing board 9b.

Then, based on the image data picked up by each solid-state image pickup device 4, the correction drive circuit 8 and the position adjusting mechanism 11 correct the deviation of the solid-state image pickup device from the predetermined position of the image pickup optical system.

Next, the position correction operation will be described.
FIG. 19 shows the image data of the resolution chart 71 loaded in the frame memory of the image processing board 9b, 81 is the image of the gravity center calculation pattern 74, and 82 is the three-dimensional block 7.
The image of the contrast integrated value calculation pattern 75 drawn on the slope 3 is shown.

First, in the image data of the contrast integrated value pattern 75 on the frame memory, a designated area 83 is provided, the contrast integrated value is obtained for each line in the designated area 83, and the line where the contrast integrated value is maximum is obtained. Ask for. Next, in the image data of the center-of-gravity calculation pattern 74 on the frame memory, its Y-direction center-of-gravity position is obtained.

When the solid-state image pickup device 4 is at a predetermined position in the image pickup optical system, that is, when the focus position of the master lens 2 is on the reference plane 72, a line where the contrast integrated value in the designated area 83 has the maximum value, The Y-direction centroid positions of the images of the centroid calculation pattern 74 are equal. Further, when the solid-state image sensor 4 is closer to the color separation prism 3 from a predetermined position in the image pickup optical system, the line j having the maximum contrast integrated value in the designated area 83 and the image of the gravity center calculation pattern 74 are displayed. The relationship between the Y-direction center of gravity positions p is as shown in FIG.

The above-described processing is performed in each of the R, G, and B solid-state image pickup devices 4 so that the maximum position of the integrated value of contrast for each solid-state image pickup device 4 and the position of the center of gravity of the center-of-gravity calculation pattern 74 in the Y direction become equal. By controlling each position adjusting mechanism 11 by the correction driving circuit 7,
Is arranged at a predetermined position of the image pickup optical system to be arranged.

As described above, according to the sixth embodiment,
The solid-state imaging device 4 captures an image of the resolution chart 71 having a solid block in which the contrast integrated value calculation pattern 75 is drawn on the reference plane and the slope in which the center of gravity calculation pattern 74 is drawn, and this image is displayed on the monitor 6.
The maximum position of the integrated value of contrast is calculated from the image of the pattern 75 for calculating integrated value of contrast, the Y-direction center of gravity position of the image of the pattern 74 of calculating center of gravity is calculated, and the maximum position of the integrated value of contrast and the position of center of gravity in the Y direction are calculated. By comparing the relationships, the focus position of the master lens 2 and the solid-state image sensor 4
The amount of tilt is calculated, and the back focus and the amount of tilt of the solid-state image sensor 4 are adjusted by the position adjusting mechanism 11 without moving the solid-state image sensor 4 back and forth in the optical axis direction. The positional relationship between the focus position of the master lens 2 and the focus position of the master lens 2 can be visually recognized, and the solid-state imaging device 4 can be positioned at an optimum position of the imaging optical system easily at high speed.

In the resolution chart of the sixth embodiment described above, a triangular solid block in which a pattern for calculating the contrast integrated value of a black-and-white alternating stripe is drawn on the slope, and the pattern for calculating the center of gravity of the reference plane is circular. ,
The three-dimensional block may have a depth, and the contrast integrated value calculation pattern of the three-dimensional block may be one that allows comparison of contrast integrated values. In addition, the gravity center calculation pattern of the reference plane may be any as long as the gravity center position in the Y direction can be measured.

Next, a seventh embodiment of the present invention will be described with reference to the drawings. The seventh embodiment is a solid-state image pickup position adjustment method for easily adjusting the solid-state image pickup position by visualizing the focus position of the master lens.

FIG. 21 is an explanatory diagram of a method for visualizing the focal position of the master lens in the seventh embodiment of the present invention.

In FIG. 21, reference numeral 91 is an image of the adjustment pattern drawn on the slope of the three-dimensional block of the resolution chart, which is picked up by the solid-state image pickup device and captured in the frame memory, and the image 92 of this adjustment pattern is displayed on the monitor. This is the screen.

Reference numeral 93 designates a designated area as shown in FIG. 4, calculates the X-direction contrast integrated value in each designated area, and contrast integrated value characteristics created on the overplane from each calculated contrast integrated value. It is the screen which displayed the image 94 of the figure on the monitor.

Reference numeral 95 is a focus position recognition image 96 in which the image 92 of the adjustment pattern and the image 94 of the contrast integrated value characteristic diagram written on the overplane are superimposed and shown.
It is a monitor display screen of.

Next, the operation of the seventh embodiment will be described. The adjustment pattern of the resolution chart is imaged by the solid-state imaging device, the image is taken into the frame memory, the contrast integrated value is calculated from the image 92 of this adjustment pattern, and the calculated contrast integrated value is displayed on the overplane. An image 94 of the integrated contrast value characteristic diagram is created, and a focus position recognition image 96 in which the image 92 of the adjustment pattern and the image 94 of the integrated contrast value characteristic diagram are superimposed is displayed on the monitor, and the focus position recognition image 96 is displayed. Based on this, the focus position of the master lens and the amount of tilt of the solid-state image sensor are calculated, and the back focus and amount of tilt of the solid-state image sensor are adjusted by the position adjusting mechanism without moving the solid-state image sensor back and forth in the optical axis direction.

As described above, according to the seventh embodiment,
A resolution chart of a three-dimensional structure having an adjustment pattern is imaged by a solid-state image sensor to calculate a contrast integrated value, an image 94 of a contrast integrated value characteristic diagram is created on the overplane from the contrast integrated value, and the adjustment pattern of the adjustment pattern is created. A focus position recognition image 96 obtained by superimposing the image 92 and the image 94 of the contrast integrated value characteristic diagram is displayed on the monitor, and based on the focus position recognition image 96, the solid-state image sensor is adjusted by the position adjusting mechanism to optimize the imaging optical system. By positioning at the position, the focus position of the master lens can be visually recognized, and the solid-state image sensor can be positioned at an optimum position of the image pickup optical system easily at high speed.

Next, an eighth embodiment of the present invention will be described in detail with reference to the drawings. FIG. 22 shows the configuration of the eighth embodiment of the present invention.

In FIG. 22, reference numeral 11 denotes a tilt coarse adjustment three-dimensional block used to roughly adjust the tilt of the solid-state image pickup device for the image pickup optical system to which the method of the present invention is applied.
Compensate for different measurement ranges when measuring the focus position of the master lens.

The operation of the above embodiment will be described.
When adjusting the tilt of the solid-state image sensor in the imaging optical system, it is necessary to adjust the tilt of the solid-state image sensor so that the pixel surface of the solid-state image sensor is parallel to the reference plane of the resolution chart. When the resolution chart is imaged on the solid-state image sensor through the master lens, if the pixel plane of the solid-state image sensor and the reference plane of the resolution chart are parallel, the master lens is focused over the entire reference plane of the resolution chart.
However, when the pixel surface of the solid-state image sensor is not parallel to the reference plane of the resolution chart and is open, the master lens is focused on a portion other than the reference plane in the image pickup optical system.

By making the resolution chart a three-dimensional structure, a focus out of the reference plane of the resolution chart is detected,
The amount of tilt of the solid-state imaging device is calculated from the detected positional relationship of the focal points of the master lens. However, when the amount of tilt of the solid-state image sensor increases, the focus of the master lens deviates greatly from the reference plane, and it cannot be detected on the three-dimensional blocks arranged at the four corners of the resolution chart. When adjusting the position of the solid-state image sensor, if the amount of tilt of the solid-state image sensor is large, the three-dimensional positional relationship between a plurality of focal points cannot be calculated, and the amount of tilt of the solid-state image sensor in the imaging optical system cannot be calculated. There was a problem that could not be calculated. In order to solve the above-mentioned problem, a tilt coarse adjustment solid block having the shape shown in FIG. 2 for supplementing different measurement ranges when measuring the focus position of the master lens is provided on the resolution chart.

When the solid-state image pickup device has a large amount of α-axis tilt and the master lens is out of focus on the α-axis adjusting solid block 12 shown in FIG. 22, the focus position of the master lens appears on the focal plane 31 shown in FIG. . When the master lens is focused near the center of the focus position measurement area 21 shown in FIG. 23, as shown in FIG.
Although the focus position of the master lens deviates from above 3, even if the amount of α-axis tilt is large, the α-axis tilt coarse adjustment in which a step is provided in parallel to the inwardly inclined slope that is the focus position measurement area 21 shown in FIG. The focus position of the master lens can be detected in the use area 22. As shown in FIG. 25, 2 detected on the three-dimensional block 41 for tilt coarse adjustment
In two blocks with a step from the one focus,
The α-axis tilt amount of the solid-state image sensor is adjusted so that the two focal positions have the same height on the optical axis.

Therefore, the distance from the focus of the master lens to the reference plane near the center of the focus position measurement area 34 shown in FIG. 24 and the focus of the master lens detected on the α-axis coarse adjustment area 35 to the reference plane. And the pixel plane of the solid-state image sensor and the reference plane of the resolution chart are parallel to each other. However, in comparison with the method for adjusting the tilt of the solid-state image pickup device according to claim 2, wherein the α-axis tilt amount is calculated using the focus position measurement area of the tilt-adjustment coarse-adjustment solid block 11 and the α-axis adjustment solid block 12 shown in FIG. , The tilt adjustment accuracy drops. Therefore, three-dimensional block 1 for tilt coarse adjustment
After the coarse adjustment of the α-axis tilt amount of the solid-state image sensor according to 1, the focus of the master lens can be detected on the α-axis adjusting solid block 12 on the solid structure chart shown in FIG. By adjusting the tilt of the solid-state image sensor from 2, it is possible to adjust the α-axis tilt of the solid-state image sensor in a wide range without lowering the accuracy.

The β-axis tilt adjustment is similar to the α-axis tilt adjustment, and the β-axis tilt amount of the solid-state image pickup device is large,
When the master lens is out of focus on the β-axis adjusting solid block 13 shown in FIG. 22, the focus position of the master lens appears on the focal plane 51 shown in FIG. When the master lens is focused near the center of the focus position measurement area 21 shown in FIG. 23, the focus position of the master lens deviates from the β-axis adjusting solid block 53 as shown in FIG. Even if it is large, it is possible to detect the focus position of the master lens in the β-axis tilt amount measurement area 23, which is provided at a position where the inclined surface which is the focus position measurement area 21 having an inward inclination is translated from the center of the resolution chart. I can. As shown in FIG. 27, the β-axis tilt amount of the solid-state image sensor is adjusted so that the positions of the two focal points detected on the tilt coarse adjustment three-dimensional block 61 are aligned with the Y axis of the frame memory in the image processing apparatus. By doing so, the distance from the focus of the master lens to the reference plane aligned near the center of the focus position measurement area 54 shown in FIG. 26, and the distance from the focus of the master lens detected on the β-axis coarse adjustment area to the reference plane The distances become equal, and the pixel surface of the solid-state image sensor and the reference surface of the resolution chart are parallel.

However, the tilt amount of the solid-state image pickup device according to claim 2 is calculated by using the focus position measurement area of the tilt coarse adjustment solid block 11 and the β axis adjustment solid block 13 shown in FIG. The tilt adjustment accuracy is lower than that of the adjustment method. Therefore, after the rough adjustment of the β-axis tilt of the solid-state imaging device by the tilt coarse adjustment three-dimensional block, FIG.
Solid block 1 for β-axis adjustment on the solid structure chart shown in
Since the focus of the master lens can be detected on the third lens unit, the tilt adjustment of the solid-state image sensor according to claim 2 can be performed to adjust the β-axis tilt of the solid-state image sensor in a wide range without lowering the accuracy. You can

As described above, according to the above-described embodiment, when positioning the solid-state image pickup device based on the image pickup signal of the resolution chart of the solid-state image pickup device, the amount of tilt of the solid-state image pickup device is large and the solid-state image pickup device has a three-dimensional structure resolution chart. Even when the focus of the master lens cannot be detected on the three-dimensional blocks arranged at the four corners and the amount of tilt of the solid-state image sensor cannot be calculated, the focus position of the master lens is measured. By providing a tilting coarse adjustment three-dimensional block having the shape shown in FIG. 23 that compensates for different measurement ranges on the resolution chart, the focus of a plurality of master lenses can be detected on the tilting coarse adjustment three-dimensional block. . Therefore, the amount of tilt of the solid-state image pickup device in the image pickup optical system can be calculated over a wide range, and rough adjustment can be performed. After the coarse adjustment, since the tilt of the solid-state image sensor is adjusted based on the method of adjusting the tilt of the solid-state image sensor in the image pickup optical system according to claim 2, the tilt of the solid-state image sensor in the image pickup optical system is adjusted. It has an effect that adjustment can be performed in a wide range without lowering accuracy.

Next, FIG. 28 shows a ninth embodiment of the present invention.
It will be described in detail based on. FIG. 28 is a resolution chart featuring a three-dimensional structure used to detect the tilt and back focus position shift of the solid-state imaging device in the imaging optical system after the completion of the sticking reaction of the three-plate CCD block. Reference numeral 11 is a three-dimensional block arranged at the four corners of the resolution chart, which is used to calculate the amount of tilt of the solid-state image pickup device in the image pickup optical system. The focus amount of the solid-state imaging device is calculated by detecting the focal points of the plurality of master lenses on the four three-dimensional blocks and determining the three-dimensional positional relationship of the plurality of focal points. The three-dimensional position of the focus of the master lens can be obtained from the coordinates of the focus position in the X and Y directions and the height from the reference plane 12 of the stereo chart from the image data obtained from the solid-state image sensor.

The operation of the above embodiment will be described.
After adjusting the solid-state imaging device to a predetermined position of the imaging optical system based on the imaging signal of the resolution chart by the solid-state imaging device,
The solid-state image pickup device is fixed to the optical block (prism) through the wedge block by the UV adhesive. After the fixing work, until the fixing reaction is completed, thermal expansion or contraction stress causes a positional deviation of the solid-state image pickup element in the image pickup optical system once adjusted. Regarding the positional deviation in the X, Y, and θ directions of the solid-state image sensor after the sticking reaction, the displacement amount of the solid-state image sensor by using the image signal of the resolution chart by the solid-state image sensor according to the conventional planar structure resolution chart ( It is possible to obtain the position deviation).

However, in order to detect the positional deviation in the α, β, Z (tilt and back focus) directions of the solid-state image pickup device, in the conventional planar structure resolution chart, in order to detect the focus position of the master lens, It is necessary to detect the maximum position of the integrated value of contrast of the image of the resolution chart output by the solid-state image sensor.To detect the maximum position of the integrated value of contrast, move the solid-state image sensor back and forth in the optical axis direction. Each time, it is necessary to calculate the contrast integrated value and determine the maximum value.

After the fixation reaction of the solid-state image sensor is completed, the solid-state image sensor cannot be moved back and forth in the optical axis direction, so that the positional deviation of the solid-state image sensor in the α, β, and Z directions cannot be detected. . In order to solve the above problem, a resolution chart featuring a three-dimensional structure shown in FIG. 28 is used. After the completion of the fixation reaction of the solid-state image sensor, the resolution chart having a three-dimensional structure portion in which an adjustment pattern having a density is drawn on the slope is formed on the solid-state image sensor by a master lens, and the adjustment chart is adjusted by the solid-state image sensor. The contrast integrated value is calculated from the imaged image of the pattern, the maximum position is obtained as the focus position of the master lens, and α, β, Z of the solid-state image pickup device in the image pickup optical system are calculated from this focus position.
Calculate the predetermined position in the direction and detect the position deviation after completion of the sticking reaction

After the fixation reaction is completed, when the solid-state image pickup device moves up against a predetermined position of the image pickup optical system, in the three-dimensional block 11 arranged at the four corners of the resolution chart featuring the three-dimensional structure shown in FIG. And the plurality of focal points are the reference plane 12
Focus on different heights from. The back focus position shift of the solid-state image sensor can also be estimated by detecting the focus of the master lens on the three-dimensional structure blocks 11 arranged at the four corners of the resolution chart.

As described above, according to the above-described embodiment, the resolution chart featuring the three-dimensional structure is imaged by the solid-state image sensor through the master lens, and the solid-state image sensor of the solid-state image sensor is captured based on the image signal of the resolution chart. Since the amount of tilt and the back focus position are calculated, it is not necessary to move the solid-state image sensor back and forth in the optical axis direction, and α and β of the solid-state image sensor in the image pickup optical system after the fixation of the solid-state image sensor are completed. , And the effect of being able to detect the positional deviation in the Z direction.

[0114]

As is apparent from the first embodiment, according to the present invention, the resolution chart of the three-dimensional structure is imaged by the solid-state image sensor through the master lens and drawn on the slope of the three-dimensional block of the resolution chart. By calculating the contrast integration value from the captured image of the adjustment pattern and setting the maximum position as the focus position of the master lens, without moving the solid-state image sensor back and forth with respect to the optical axis direction,
The focus position of the master lens is detected, and the focus position of the master lens at the four corners of the resolution chart is detected from the captured image of the adjustment pattern drawn on the slopes of the three-dimensional blocks at the four corners of the resolution chart. By calculating the amount of tilt of the solid-state image sensor from the original positional relationship and adjusting the back focus and tilt of the solid-state image sensor by the position adjustment mechanism, the solid-state image sensor can be positioned at the optimum position of the imaging optical system at high speed. Has the effect.

Further, as is apparent from the second embodiment, according to the present invention, the contrast integrated value is calculated using the resolution chart of the three-dimensional structure having the adjustment pattern in which the distortion of the master lens is corrected in advance. By
By calculating the focus position of the master lens and the amount of tilt of the solid-state image sensor, and adjusting the back focus and tilt of the solid-state image sensor by the position adjustment mechanism, the solid-state image sensor can be positioned at the optimum position of the imaging optical system with high speed and high accuracy. It has the effect that it can be positioned.

Further, as apparent from the third embodiment, according to the present invention, the contrast integrated value is calculated using the resolution chart of the three-dimensional structure having the adjustment pattern in which the difference in the imaging magnification is corrected in advance. By calculating the focus position of the master lens and the amount of tilt of the solid-state image sensor, and adjusting the back focus and tilt of the solid-state image sensor by the position adjustment mechanism, the solid-state image sensor can be optimized at high speed and high accuracy. It has the effect that it can be positioned in position.

Further, according to the present invention, as is apparent from the above-mentioned fourth embodiment, the illumination light source is arranged on the back side of the resolution chart of the three-dimensional structure which transmits the light incident from the back side, and the entire back side of the resolution chart is covered. Illuminate with a uniform illuminance without unevenness, take a transmitted light image of the resolution chart with this uniform illumination light with the solid-state image sensor, calculate the contrast integrated value, and calculate the focus position of the master lens and the amount of tilt of the solid-state image sensor. By calculating and adjusting the back focus and the amount of tilt of the solid-state image sensor by the position adjusting mechanism, there is an effect that the solid-state image sensor can be positioned at the optimum position of the image pickup optical system with high speed and high accuracy.

As is clear from the fifth embodiment, according to the present invention, a solid-state image sensor can be provided in a narrow area by incorporating a small resolution chart having a three-dimensional structure that transmits incident light from the back surface into a master lens. This has the effect that the imaging optical system can be positioned at the optimum position.

As is apparent from the sixth embodiment, according to the present invention, a resolution chart having a solid block having a reference plane on which a gravity center calculation pattern is drawn and a three-dimensional block on which a contrast integrated value calculation pattern is drawn on a slope is solid. The image is picked up by the image pickup device, this image is displayed on the monitor, the maximum position of the contrast integrated value is calculated from the image of the pattern for calculating the contrast integrated value, and the Y-direction center of gravity position of the image of the center of gravity calculating pattern is calculated. By comparing the relationship between the maximum position of this integrated value of contrast and the position of the center of gravity in the Y direction, the focus position of the master lens and the amount of tilt of the solid-state image sensor are calculated, and the position is calculated without moving the solid-state image sensor back and forth in the optical axis direction. By adjusting the back focus and the amount of tilt of the solid-state image sensor with the adjustment mechanism, Positional relationship between the focal position of Sutarenzu not recognize visually, and has the effect that the solid-state imaging device can be positioned in the optimum position of the imaging optical system at a high speed.

Further, as is apparent from the seventh embodiment, according to the present invention, the resolution chart of the three-dimensional structure having the adjustment pattern is imaged by the solid-state image sensor to calculate the contrast integrated value, and the contrast integrated value is calculated. Image 9 of the characteristic diagram of integrated value of contrast on overplane
4 is created, a focus position recognition image 96 in which the image 92 of the adjustment pattern and the image 94 of the contrast integrated value characteristic diagram are superimposed is displayed on the monitor, and the solid-state image sensor is displayed based on the focus position recognition image 96. By locating the focus position of the master lens with the position adjusting mechanism at the optimum position of the image pickup optical system, it is possible to visually recognize the focus position of the master lens and to position the solid-state image sensor at the optimum position of the image pickup optical system easily at high speed. Have.

Further, as is apparent from the eighth embodiment, according to the present invention, when performing positioning of the solid-state image sensor based on the image signal of the resolution chart of the solid-state image sensor, the amount of tilt of the solid-state image sensor is increased. Is large, the focus of the master lens cannot be detected on the three-dimensional blocks arranged at the four corners of the three-dimensional structure resolution chart, and the amount of tilt of the solid-state imaging device cannot be calculated. By providing a three-dimensional block in the resolution chart to compensate for different measurement ranges when measuring the focus position of the lens, the focus of a plurality of master lenses is detected on the three-dimensional block, and the tilt of the solid-state image sensor in the imaging optical system is detected. The amount can be calculated. Since the focus of the master lens is detected in a wide range, it is not necessary to enlarge the shape of the three-dimensional block arranged at the four corners of the three-dimensional structure resolution chart, and the plurality of focus of the master lens is detected on the three-dimensional block. Thus, the amount of tilt of the solid-state image pickup device in the image pickup optical system can be calculated from the three-dimensional positional relationship.

As is apparent from the ninth embodiment, the present invention is characterized by a three-dimensional structure in adjusting the position of the solid-state image pickup device based on the image pickup signal of the resolution chart of the solid-state image pickup device. The resolution chart is imaged by a solid-state image sensor through the master lens, the integrated value of contrast is calculated from the captured image of the adjustment pattern drawn on the slope of the three-dimensional block of the resolution chart, and the maximum position is set to the focus position of the master lens. By
Since the tilt and back focus position of the solid-state imaging device in the imaging optical system can be calculated without moving the solid-state imaging device back and forth in the optical axis direction, the position adjustment of the solid-state imaging device in the imaging optical system is possible. After that, there is an effect that it is possible to detect the tilt of the solid-state image pickup element and the deviation of the back focus position which occur during the completion of the adhesion reaction of the adhesive.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an apparatus for arranging a solid-state image sensor at a predetermined position of an image pickup optical system according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a three-dimensional structure resolution chart according to the first embodiment of the present invention.

FIG. 3 is an enlarged perspective view of a three-dimensional structure resolution chart according to the first embodiment of the present invention.

FIG. 4 is a configuration diagram of a frame memory in the image processing board according to the first embodiment of the present invention.

FIG. 5 is a characteristic diagram of a contrast integrated value in a designated area of the frame memory according to the first embodiment of the present invention.

FIG. 6 is a perspective view of a three-dimensional structure resolution chart showing the amount of tilt of the solid-state imaging device according to the first embodiment of the present invention.

FIG. 7 is a structural diagram of a three-dimensional structure resolution chart according to the second embodiment of the present invention.

FIG. 8 is a configuration diagram of an optical system for forming an image of a three-dimensional structure resolution chart on a solid-state image sensor by a master lens in a second embodiment of the present invention.

FIG. 9 is a display diagram showing a television monitor display screen of a three-dimensional structure resolution chart affected by lens distortion.

FIG. 10 is a display diagram showing a television monitor display screen of a three-dimensional structure resolution chart according to a second embodiment of the present invention.

FIG. 11 is a configuration diagram of an apparatus for arranging a solid-state image sensor at a predetermined position of an image pickup optical system according to a second embodiment of the present invention.

FIG. 12 is a display diagram showing image data of a three-dimensional structure resolution chart written in a frame memory in the second embodiment of the invention.

FIG. 13 is a display diagram showing image data of a three-dimensional structure resolution chart affected by the distortion aberration of the lens written in the frame memory.

FIG. 14 is a schematic diagram showing a method of correcting a difference in imaging magnification using a three-dimensional block provided on a resolution chart used in the third embodiment of the invention.

FIG. 15 is a perspective view showing a resolution chart illumination method according to a fourth embodiment of the present invention.

FIG. 16 is a perspective view showing a configuration of an image pickup optical system according to a fifth embodiment of the present invention.

FIG. 17 is a configuration diagram of an apparatus for arranging a solid-state image sensor in a predetermined position of an image pickup optical system according to a sixth embodiment of the present invention.

FIG. 18 is a configuration diagram of a three-dimensional structure resolution chart according to the sixth embodiment of the present invention.

FIG. 19 is a display diagram showing image data of a three-dimensional structure resolution chart written in a frame memory in the sixth embodiment of the invention.

FIG. 20 is a characteristic diagram of a contrast integrated value when the solid-state imaging device is closer to the color separation prism from a predetermined position in the imaging optical system in the sixth embodiment of the invention.

FIG. 21 is a display diagram of a television monitor showing a method for visualizing the focus position of the master lens in the seventh embodiment of the invention.

FIG. 22 is a structural diagram of a three-dimensional structure resolution chart in the eighth embodiment of the invention.

FIG. 23 is an enlarged perspective view of a three-dimensional structure resolution chart in the eighth embodiment of the invention.

FIG. 24 is a schematic diagram showing α-axis adjustment in the eighth embodiment of the invention.

FIG. 25 is a schematic diagram showing α-axis adjustment in the eighth embodiment of the invention.

FIG. 26 is a schematic view showing β-axis adjustment in the eighth embodiment of the invention.

FIG. 27 is a schematic diagram showing β-axis adjustment in the eighth embodiment of the invention.

FIG. 28 is a structural diagram of a three-dimensional structure resolution chart in the ninth embodiment of the present invention.

FIG. 29 is a block diagram of an apparatus for arranging a conventional solid-state image sensor at a predetermined position of an image pickup optical system.

FIG. 30 is a perspective view of a resolution chart used in an apparatus for arranging a conventional solid-state image sensor at a predetermined position of an image pickup optical system.

FIG. 31 is a schematic diagram showing a conventional resolution chart illumination method.

FIG. 32 is a characteristic diagram of a contrast integrated value according to the position of a conventional solid-state image sensor.

FIG. 33 is a display diagram showing the shape of an object and the shape of an image due to lens distortion.

[Explanation of symbols]

 2, 62 master lens 3 color separation prism 4 solid-state image sensor 6 TV monitor 8 correction drive circuit 9 VME system 9a arithmetic circuit 9b image processing board 9c digital conversion circuit 10, 24, 31, 51, 61, 71 resolution chart 10a, 21 , 32, 53, 73 Solid block A to D, 23, 36, 54 Adjustment pattern 11 Position adjustment mechanism 22 Oblique line 25 Main ray 38, 72 Reference plane 52, 63 Illumination light source 74 Center of gravity calculation pattern 75 Contrast integrated value calculation Pattern for

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Hiromon Toba 4-3 Tsunashima East, Kohoku Ward, Yokohama City, Kanagawa Prefecture Matsushita Communication Industry Co., Ltd. (72) Inventor Kazuyuki Kobayashi Tsunashima, Kohoku Ward, Yokohama City, Kanagawa Prefecture Matsushita Communication Industrial Co., Ltd., East 3-chome 3-72 (72) Inventor Toshiro Obi 4-3-1 Tsunashima East, 3-4 Tsunashima, Yokohama City, Kanagawa Prefecture Matsushita Communication Industrial Co., Ltd.

Claims (12)

[Claims] 1. A method for positioning a solid-state image sensor based on image-captured data of a resolution chart of the solid-state image sensor, the resolution chart having a three-dimensional structure portion in which an adjustment pattern having a density is drawn on a slope thereof. Is imaged on the solid-state image sensor by the master lens, the integrated value of contrast is calculated from the captured image of the adjustment pattern by the solid-state image sensor, and its maximum position is determined as the focus position of the master lens. A solid-state image sensor, which calculates a predetermined position of the image-pickup optical system in which the solid-state image sensor is to be arranged, and positions the solid-state image sensor at a predetermined position of the image-pickup optical system by a position adjusting mechanism based on the calculation result. Position adjustment method. 2. A method for positioning a solid-state image sensor based on image data of a resolution chart obtained by the solid-state image sensor, the resolution having a plurality of three-dimensional structure parts in which an adjustment pattern having a density is drawn on its slope. An image of the chart is formed on the solid-state image sensor by the master lens, a contrast integrated value is calculated from the imaged image of each adjustment pattern by the solid-state image sensor, and the maximum position thereof is obtained as the focus position of the master lens. A solid-state image pickup device characterized by calculating a tilt amount of the solid-state image pickup device in an image pickup optical system from a three-dimensional positional relationship of a plurality of focal positions and adjusting the tilt amount of the solid-state image pickup device based on the calculation result. Position adjustment method. 3. A method for performing positioning of a solid-state image sensor based on a captured image of a resolution chart of the solid-state image sensor, comprising: a three-dimensional structure portion having a first adjustment pattern with density drawn on its slope. , A reference surface on which a second adjustment pattern is drawn, the resolution chart is imaged on the solid-state image sensor by a master lens, and a captured image of the resolution chart by the solid-state image sensor is displayed on a monitor. The integrated position of the second adjustment pattern is calculated from the image captured by the solid-state image sensor while calculating the integrated value of the contrast from the captured image of the first adjustment pattern according to Then, the predetermined position of the image pickup optical system in which the solid-state image pickup element is to be arranged is calculated from the positional relationship between the focus position and the center of gravity position. Position adjustment method of a solid-state imaging device characterized by positioning in a predetermined position of the imaging optical system by the position adjusting mechanism of the solid-state imaging device based on the calculation result. 4. A method for positioning a solid-state image sensor based on a captured image of a resolution chart of the solid-state image sensor, comprising a plurality of three-dimensional structures in which a first adjustment pattern with density is drawn on its slope. And a reference surface on which a plurality of second adjustment patterns respectively corresponding to the first adjustment pattern are drawn, and the resolution chart is imaged on the solid-state image sensor by a master lens. The captured image of the resolution chart is displayed on the monitor, the integrated value of contrast is calculated from the captured image of each of the first adjustment patterns by the solid-state image sensor, and the maximum position thereof is obtained as the focus position of the master lens. The barycentric position of each of the second adjustment patterns is obtained from the image picked up by the image pickup device, and the focus position and the corresponding position are obtained. Position adjustment of the solid-state image sensor characterized in that the amount of tilt of the solid-state image sensor in the imaging optical system is calculated from each positional relationship with the position of the center of gravity, and the amount of tilt of the solid-state image sensor is adjusted based on the calculation result. Method. 5. A method for positioning a solid-state image sensor based on a captured image of the resolution chart by the solid-state image sensor, comprising a resolution chart having a three-dimensional structure part in which an adjustment pattern having a density is drawn on its slope. An image is formed on the solid-state image sensor by the master lens, a contrast integrated value is calculated from a captured image of the adjustment pattern by the solid-state image sensor, and its maximum position is obtained as the focus position of the master lens. A position adjusting method for a solid-state image sensor, comprising: displaying a captured image in an overlapping manner on a display screen; and positioning the solid-state image sensor at a predetermined position of an image pickup optical system by a position adjusting mechanism based on the display result. 6. A method for positioning a solid-state image sensor based on a captured image of a resolution chart by the solid-state image sensor, the resolution having a plurality of three-dimensional structure parts in which an adjustment pattern having a density is drawn on a slope thereof. An image of the chart is formed on the solid-state image sensor by the master lens, a contrast integrated value is calculated from the imaged image of each adjustment pattern by the solid-state image sensor, and the maximum position thereof is obtained as the focus position of the master lens. A method for adjusting the position of a solid-state image sensor, comprising: displaying a plurality of focus positions in an overlapping manner on a display screen of the captured image, and adjusting the amount of tilt of the solid-state image sensor based on the display result. 7. The resolution chart has the three-dimensional structure portion in which the adjustment pattern in which the distortion aberration of the master lens is corrected in advance or the first adjustment pattern is drawn on the slope thereof. Claim 1
7. The position adjusting method for a solid-state image pickup device according to claim 6. 8. The resolution chart includes the adjustment pattern or the first adjustment pattern in which the difference in imaging magnification due to the difference in distance between each slope element of the three-dimensional block from the master lens is corrected in advance. 7. The position adjusting method for a solid-state image pickup device according to claim 1, further comprising the three-dimensional structure portion depicted in FIG. 9. The resolution chart is for transmitting light incident from the back surface, a light source is arranged on the back surface of the resolution chart, and a transmitted light image of the resolution chart is transferred to the solid-state imaging device by the master lens. 9. The position adjusting method for a solid-state image pickup device according to claim 1, wherein an image is formed. 10. The position adjusting method for a solid-state image sensor according to claim 9, wherein the resolution chart is incorporated in the master lens. 11. A method for positioning the solid-state imaging device based on an imaging signal of the resolution chart by the solid-state imaging device, wherein the resolution chart has a three-dimensional structure with density. In the method for adjusting the position of the solid-state imaging device, one of three-dimensional blocks having inwardly inclined slopes arranged at the four corners of the resolution chart is used to supplement a different measurement range when measuring the focus position of the master lens. A method for adjusting the position of a solid-state image pickup device, characterized in that the amount of tilt of the solid-state image pickup device is calculated in a wide range without deteriorating the measurement accuracy by using blocks. 12. In the step of adjusting the position of the solid-state image pickup device by the position adjusting means based on the image pickup signal of the resolution chart of the solid-state image pickup device to perform the fixing work, the fixing reaction occurs after the fixing work until the fixing reaction is completed. The displacement of the solid-state imaging device in the imaging optical system and the positional shift of the back focus are made into a three-dimensional structure in the resolution chart, so that the displacement of the solid-state imaging device is recognized as the displacement of the imaging signal, and imaging after the fixation reaction is completed. A method for adjusting the position of a solid-state image sensor, comprising detecting the tilt and back focus position shift of the solid-state image sensor in an optical system without moving the solid-state image sensor, a resolution chart, or a master lens.