JPH0969685A - Removing tool for surface mount component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tool capable of easily removing a surface mount component soldered to a board without applying a stress to the component or the mounted board in the case of removing the component soldered to the board. SOLUTION: The removing tool for a surface mount component comprises an interchangeable structure for batch heating to melt the entire solder of a surface mount component 1 or a chip 3 structure integral with a heater 2, heating means for heating the chip 3, a suction pad 4 for sucking the component 1 on the upper surface, and a vacuum source for supplying vacuum pressure to the pad 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tool for removing a surface mount component soldered to a board.

[0002]

2. Description of the Related Art Most of surface mount components have a large number of terminals on the side faces of the components and they are mounted on a board by soldering at high density.

FIG. 2 shows an example of a conventional technique. Conventionally, the following method has been used to remove these surface mount components 1 from the substrate 8. The soldering iron 9 is applied to the soldering portion on one side of the surface mount component 1 to melt the solder. After confirming that the solder has melted, one side of the surface mount component 1 is mechanically separated from the substrate using tweezers or the like. Next, the soldered portion on the opposite side is melted in the same manner to separate the surface mount component 1 from the substrate 8.

[0004]

When the surface mount component 1 is detached from the substrate 8 by the above conventional method, the following problems occur. As shown in FIG. 3, bending stress is applied to the non-melting terminal portion of the surface mount component 1 to be removed, and the terminal is easily broken such as broken. The above stress also applies stress to the substrate 8 and leads to peeling of lands on the substrate surface and destruction of the substrate 8 as shown in FIG. It takes great care and man-hours.

[0005]

In order to solve the above-mentioned problems, in the structure of the present invention, a chip 3 having a replaceable structure or a heater 2 and an integrated structure in which all the solder parts of the surface mount component 1 are collectively melted by heating. A structure is provided, heating means (heater 2 and temperature controller 5) for heating the chip 3 is provided, a suction pad 4 for sucking the chip is provided on the upper surface of the surface mount component 1, and a vacuum for supplying a vacuum pressure to the suction pad 4 is provided. There is a constituent means for providing a source (a vacuum pump, a solenoid valve and a switch for opening and closing the same). As a result, when the surface mount component 1 is removed, the solder can be collectively melted by the chip 3, and the surface mount component can be lifted up from the substrate surface by the suction pad 4 without any mechanical stress. It is possible to realize a tool for removing surface mount components that is easy and safe to remove.

There is also a structure means of a tool for removing surface-mounted components, which constitutes a vacuum source to which a vacuum regulator 6 for adjusting the vacuum pressure is added.

There is also a construction means of a tool for removing surface-mounted components in which a suction pad 4 having conductivity is used, and a ground wiring for grounding the suction pad 4 is provided to add a structure for preventing static electricity.

[0008]

FIG. 1 shows an embodiment according to the present invention. The surface mounting component removal tool has the following configuration. The main body of this removal tool has a grip 19 formed in a shape that is easy to grasp and operate with one hand and fits in the palm, together with a hand switch, chip 3, heater 2, heat insulating portion 16, suction pad 4, vacuum pipe piping. 12 and support column 1 which is a support structure
8, a solenoid valve 13 connected thereto, a vacuum regulator 6, a vacuum pump 15, and a temperature controller 5.

The solder parts 11 on both sides of the surface mount component 1 are
A concave chip 3 that does not melt on each side but melts at the same time and a heater 2 that heats it are provided, and a contact surface other than the surface where the heater 2 and the chip 3 contact each other provides heat insulation for blocking heat from the heater 2. The part 16 is provided. The heat insulating portion 16 is fixed to a pillar 18 which is a structure. The chip 3 can be easily replaced with any one suitable for the shape and size of the surface mount component 1 by screwing or the like.
That is, a shape that is compatible with the melting pitch of the solder portion 11 and a shape that is compatible with the height of the surface mount component 1 to be removed is used. The heater 2 is the solder part 1 of the terminal of the surface mount component 1 to be removed.
The temperature controller 5 has a heat source sufficient for melting 1 and can be controlled according to the heat capacity of the solder portion 11.
With. The temperature controller 5 is provided with a temperature sensor 17 arranged in the immediate vicinity of the heater 2, and receives the signal to control the temperature of the heater section. In order to remove the surface-mounted component 1 in the state of the molten solder portion, the suction pad 4 and the vacuum pump 15 are provided. The suction pad 4 has conductivity and is connected to the ground terminal 7 in order to prevent electrostatic breakdown. Further, this is made of a material having elasticity so that it can be easily attracted to the surface mount component 1. In addition, it has elasticity that fits better to the surface-mounted component 1 and adsorbs it, and is formed, for example, of conductive rubber in a bellows shape. A vacuum regulator 6 is provided so that the suction force can be arbitrarily controlled by the weight of the surface mount component 1. The solenoid valve is operated by a hand switch or a foot switch (foot switch) provided on the grip of the main body to open and close the valve of the three-way solenoid valve. When ON, vacuum pressure is supplied to the suction pad to suck the surface mount component 1, and when OFF, atmospheric pressure from the leak hole is supplied to the suction pad to release the suction of the surface mount component 1.

Next, an example of an actual work procedure will be described. First, the chip 3 suitable for the surface mount component 1 to be removed is mounted and fixed to the heater 2. Set the temperature controller 5 and vacuum system to appropriate values. Contact the chip 3 with the soldering part, and
Is set so as to be in close contact with the surface of the surface mount component 1, and the solder is melted. The hand switch is turned on, the vacuum system is activated, the surface mounting component 1 is sucked by the suction action of the suction pad 4, and the tool body is lifted and removed. Then, the hand switch is turned off to remove the surface mount component 1 from the suction pad 4.

In the above description of the embodiment, the case of the replaceable chip 3 structure has been described. However, if it is only necessary to deal with a single surface mount component 1, the heater 2 and the chip 3 can be used. 3 and 3 may be integrated.

[0012]

Since the present invention is configured as described above, it has the following effects. By replacing and mounting the chip 3 corresponding to each surface mount component 1, it is possible to easily remove the soldered surface mount component 1 and the substrate 8 without damaging them. By sucking the surface mounting component 1 by the suction pad 4, it becomes possible to stably remove the leads of the surface mounting component 1 without deforming the leads. With these, in a relatively short time,
It is possible to easily and safely realize a tool for removing the surface-mounted component that can remove the surface-mounted component 1.

[Brief description of drawings]

FIG. 1 is a tool for removing soldered surface mount components from a board according to the present invention.

FIG. 2 is a conventional method for removing a soldered surface mount component from a substrate.

FIG. 3 shows how to apply mechanical stress by a conventional method for removing a soldered surface mount component from a substrate.

[Explanation of symbols]

 1 Surface Mount Component 2 Heater 3 Chip 4 Adsorption Pad 5 Temperature Controller 6 Vacuum Regulator 7 Earth Terminal 8 Board 9 Soldering Iron 11 Solder Part 12 Vacuum Pipe Piping 13 Solenoid Valve 15 Vacuum Pump 16 Thermal Insulation Part 17 Temperature Sensor 18 Strut 19 Grip

Claims (4)

[Claims] 1. A tool for removing a surface mount component (1) soldered to a substrate (8), wherein a chip (3) structure for collectively heating and melting all solder parts of the surface mount component (1) is provided, A heating means for heating the chip (3) is provided, an adsorption pad (4) for adsorbing the chip on the surface mounting component (1) is provided, and a vacuum source for supplying a vacuum pressure to the adsorption pad (4) is provided. A tool for removing surface-mounted components, characterized by comprising the above. 2. A chip (3) having a replaceable structure for collectively heating and melting all solder parts of a surface mount component (1) in a tool for removing a surface mount component (1) soldered to a substrate (8). ) Structure is provided, a heating means for heating the chip (3) is provided, an adsorption pad (4) for adsorbing the chip on the upper surface of the surface mount component (1) is provided, and a vacuum pressure is supplied to the adsorption pad (4). A tool for removing surface-mounted components, which is provided with a vacuum source and is equipped with the above. 3. The tool for removing surface-mounted components according to claim 1, wherein the vacuum source has a vacuum regulator (6) for adjusting vacuum pressure. 4. The surface mounting component removal tool according to claim 1, wherein the suction pad (4) having conductivity is used, and a ground wiring for grounding the pad is provided to prevent static electricity.