JPH0966590A - Sheet for ic card - Google Patents
Sheet for ic cardInfo
- Publication number
- JPH0966590A JPH0966590A JP7224313A JP22431395A JPH0966590A JP H0966590 A JPH0966590 A JP H0966590A JP 7224313 A JP7224313 A JP 7224313A JP 22431395 A JP22431395 A JP 22431395A JP H0966590 A JPH0966590 A JP H0966590A
- Authority
- JP
- Japan
- Prior art keywords
- card
- sheet
- polyethylene terephthalate
- resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229920005989 resin Polymers 0.000 claims abstract description 35
- 239000011347 resin Substances 0.000 claims abstract description 35
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 20
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 19
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 19
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 239000012463 white pigment Substances 0.000 claims abstract description 6
- 230000003746 surface roughness Effects 0.000 claims abstract description 5
- 229920001634 Copolyester Polymers 0.000 claims description 12
- 239000011342 resin composition Substances 0.000 claims 1
- 229920001225 polyester resin Polymers 0.000 abstract description 6
- 239000004645 polyester resin Substances 0.000 abstract description 6
- 238000004049 embossing Methods 0.000 abstract description 2
- 229920001577 copolymer Polymers 0.000 abstract 2
- 230000004927 fusion Effects 0.000 description 13
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 7
- 238000005452 bending Methods 0.000 description 7
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 7
- 238000007639 printing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229920006038 crystalline resin Polymers 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- FUGNKDHFOHVBFD-UHFFFAOYSA-L S(=O)(=O)([O-])[O-].[Ca+2].[O-2].[Ti+4] Chemical compound S(=O)(=O)([O-])[O-].[Ca+2].[O-2].[Ti+4] FUGNKDHFOHVBFD-UHFFFAOYSA-L 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- PBSCQLAMFAVHIW-UHFFFAOYSA-L barium(2+) oxygen(2-) titanium(4+) sulfate Chemical compound [O-2].[Ti+4].[Ba+2].[O-]S([O-])(=O)=O PBSCQLAMFAVHIW-UHFFFAOYSA-L 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Credit Cards Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】内部にＩＣチップ等を搭載し
たモジュールを装着したＩＣカードに用いられるＩＣカ
ード用シートに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card sheet used for an IC card having a module having an IC chip or the like mounted therein.
【０００２】[0002]
【従来の技術】近年、ＩＣカードは従来の磁気ストライ
プカードに比べ、その記憶量が大きいことから各種分野
での使用が増えている。一般的にＩＣカードの材料は、
コアシートと称せられる白色に着色された中心層とコア
シートの表層に積層され、カード裏表面に一対として被
覆される透明なオーバーシートから構成される。コアシ
ートは一層もしくは二層であってオーバーシートに接す
る面にオフセット印刷、シルクスクリーン印刷、グラビ
ア印刷等の印刷を施されているのが一般的であり、コア
シート及びオーバーシートの積層面の接着は熱融着を介
してのドライラミネート、もしくは熱融着接着剤を用い
てのプレス接着も見受けられる。ＩＣカード用シートに
要求される性能としては、印刷インキ接着性・インキ着
肉仕上がり性・印刷機械適性等の印刷に関する性能、剛
性、衝撃強度・引張り強度・伸び・屈曲性等の機械強
度、耐熱性・熱融着性等の熱的性能、厚み精度・カット
寸法精度・平滑性等の寸法精度、打刻性等をあげること
ができる。2. Description of the Related Art In recent years, IC cards have been used more and more in various fields because they have a larger storage capacity than conventional magnetic stripe cards. Generally, the material of IC card is
It is composed of a white-colored central layer called a core sheet and a transparent oversheet which is laminated on the surface layer of the core sheet and which covers the back surface of the card as a pair. The core sheet is a single layer or two layers, and the surface in contact with the oversheet is generally printed by offset printing, silk screen printing, gravure printing, etc., and the adhesion of the laminated surface of the core sheet and the oversheet Can also be found in dry lamination through heat fusion or press bonding using a heat fusion adhesive. Performances required for IC card sheets include printing performance such as printing ink adhesion, ink inking finish, printing machine suitability, mechanical strength such as rigidity, impact strength, tensile strength, elongation, flexibility, and heat resistance. The thermal performance such as heat resistance and heat sealing property, the thickness accuracy, the cut dimension accuracy, the dimensional accuracy such as the smoothness, and the stampability can be improved.
【０００３】この様なＩＣカードは必然的に上衣やズボ
ンのポケットで所持されるため、所持される部分によっ
てはカードに曲げ変形が加わることは十分に考えられ
る。図１はＩＣカードの表側を凸に、図２はＩＣカード
の裏側を凸にそれぞれ曲げた場合のＩＣカード断面を示
す。１は内部にＩＣチップを搭載したモジュール、２は
オーバーシート、３はコアシートである。これらのＩＣ
カード用シートは一般に塩化ビニルシートが用いられる
が、その理由は、汎用樹脂であり、製造コストが低いこ
ともさることながら、着色の容易さ、印刷加工性のよ
さ、熱融着性のよさ、エンボス加工性のよさ、さらに曲
げ加工性、打刻性のよさ等が他の樹脂と比較して良好も
しくはバランスがとれていることがその最大の理由であ
る。しかし、ＩＣカードの所持方法によってはカードが
曲がり、図１、図２に示すようにこの様なモジュールを
埋め込んだ構造では、ＩＣカード用シートとモジュール
との接着されている角部４にてクラックが発生しやすい
欠点がある。Since such an IC card is inevitably carried by a jacket or pants pocket, it is quite possible that the card is bent and deformed depending on the carrying part. FIG. 1 shows a cross section of an IC card when the front side of the IC card is bent to be convex and FIG. Reference numeral 1 is a module in which an IC chip is mounted inside, 2 is an oversheet, and 3 is a core sheet. These IC
Vinyl chloride sheet is generally used as the card sheet, because the reason is that it is a general-purpose resin, and the production cost is low, and the coloring is easy, the printability is good, and the heat-sealing property is good. The main reason for this is that good embossability, bending workability, engravability, etc. are better or more balanced than other resins. However, depending on how the IC card is held, the card bends, and in the structure in which such a module is embedded as shown in FIGS. 1 and 2, cracks occur at the corners 4 where the IC card sheet and the module are bonded. There is a drawback that is likely to occur.
【０００４】[0004]
【発明が解決しようとする課題】カードを曲げてもＩＣ
カード用シートとモジュールとの接着されている角部に
クラックが発生することのないＩＣカード用シートを提
供する。Even if the card is bent, the IC
(EN) Provided is an IC card sheet in which no crack is generated at the corner where the card sheet and the module are bonded.
【０００５】[0005]
【課題を解決するための手段】ポリエチレンテレフタレ
ート樹脂製のＩＣカード用コアシート及びオーバーシー
トであって、該ポリエチレンテレフタレート樹脂が該ポ
リエチレンテレフタレート樹脂のエチレングリコール成
分の１０〜７０％をシクロヘキサンジメタノールに置換
してなる共重合ポリエステル樹脂組成物からなり、かつ
シートの少なくとも片面に表面粗さＲａが０．５〜１５
μｍのエンボス加工を施していることを特徴とするＩＣ
カード用シートであって、さらには、該共重合ポリエス
テル樹脂１００重量部に対し白色顔料を１〜１５部添加
した組成物からなることを特徴とするＩＣカード用シー
トである。A core sheet and an oversheet for an IC card made of polyethylene terephthalate resin, wherein the polyethylene terephthalate resin replaces 10 to 70% of the ethylene glycol component of the polyethylene terephthalate resin with cyclohexanedimethanol. And a surface roughness Ra of 0.5 to 15 on at least one side of the sheet.
IC characterized by embossing of μm
A card sheet, which further comprises a composition in which 1 to 15 parts by weight of a white pigment is added to 100 parts by weight of the copolyester resin, is an IC card sheet.
【０００６】図１はＩＣカードを表側に凸に曲げた場合
のＩＣカード断面を示すが、曲げ変形時の圧縮最大応力
は、ＩＣカード用オーバーシート２と内部にＩＣチップ
を搭載したモジュール１との接着されている角部４で生
じる。また図２はＩＣカードを裏側に凸に曲げた場合の
ＩＣカード断面を示すが、曲げ変形時の引張最大応力
は、前記と同様にＩＣカード用オーバーシート２と内部
にＩＣチップを搭載したモジュール１との接着されてい
る角部４で生じる。すなわち、図１、図２に示すように
曲げ変形時のＩＣカードはモジュール１の裏面側に位置
するＩＣカード用オーバーシート２に最大応力の発生す
ることがわかる。FIG. 1 shows a cross section of an IC card when the IC card is convexly bent to the front side. The maximum compressive stress at the time of bending deformation is the IC card oversheet 2 and the module 1 having an IC chip mounted inside. Occurs at the corners 4 which are bonded together. FIG. 2 shows a cross section of the IC card when the IC card is convexly bent to the back side. The maximum tensile stress at the time of bending deformation is the same as that described above with the IC card oversheet 2 and the module in which the IC chip is mounted inside. It occurs at the corner 4 which is bonded to 1. That is, as shown in FIGS. 1 and 2, it can be seen that the IC card during bending deformation has a maximum stress generated in the IC card oversheet 2 located on the back surface side of the module 1.
【０００７】本発明の共重合ポリエステル樹脂は、ポリ
エチレンテレフタレート樹脂においてエチレングリコー
ル成分の１０〜７０％をシクロヘキサンジメタノールに
置換してなるものを使用するが、エチレングリコール成
分の置換量が１０％未満では、接着あるいは融着して用
いる場合、接着剤の選択が難しくあるいは熱融着性が劣
り、融着後のシートの弾性率が低下する。これはポリエ
チレンテレフタレート樹脂は結晶性樹脂であるため融着
後の冷却時にシートの再結晶化が進むことにより熱融着
性がなくなり、シートの弾性が低下するためである。ま
た逆に、エチレングリコール成分の置換量が７０％を超
えると共重合ポリエステル樹脂の弾性率が下がり、接着
あるいは圧着して用いる場合接着剤の選択が難しくある
いは熱融着性に劣る。これは共重合ポリエステル樹脂の
置換量が多くなると、再結晶化が速く進み、熱融着性が
なくなり、シートの弾性が低下するためである。すなわ
ち、エチレングリコール成分の１０〜７０％のみをシク
ロヘキサンジメタノールに置換することにより、共重合
ポリエステル樹脂は非結晶性の樹脂となり、熱融着性能
をもち、シートの弾性の低下がなくなる。したがって、
エチレングリコール成分のシクロヘキサンジメタノール
への置換量は１０〜７０％がよく、好ましくは２０〜３
５％である。As the copolyester resin of the present invention, a polyethylene terephthalate resin in which 10 to 70% of the ethylene glycol component is replaced with cyclohexanedimethanol is used, but when the substitution amount of the ethylene glycol component is less than 10%. In the case of using by adhesion or fusion, the selection of an adhesive is difficult or the heat fusion property is poor, and the elastic modulus of the sheet after fusion is lowered. This is because, since the polyethylene terephthalate resin is a crystalline resin, the re-crystallization of the sheet progresses during cooling after fusion and the heat fusion property disappears, and the elasticity of the sheet decreases. On the contrary, when the substitution amount of the ethylene glycol component exceeds 70%, the elastic modulus of the copolyester resin is lowered, and it is difficult to select an adhesive or the heat fusion property is poor when the adhesive or pressure-bonding is used. This is because when the replacement amount of the copolyester resin is increased, recrystallization is accelerated, the heat fusion property is lost, and the elasticity of the sheet is reduced. That is, by substituting 10 to 70% of the ethylene glycol component with cyclohexanedimethanol, the copolyester resin becomes a non-crystalline resin, has heat fusion performance, and does not deteriorate the elasticity of the sheet. Therefore,
The replacement amount of the ethylene glycol component with cyclohexanedimethanol is preferably 10 to 70%, and more preferably 20 to 3%.
5%.
【０００８】この共重合樹脂をシート状に加工するには
カレンダリング法、押し出し法、プレス法などがある
が、ここでは特に限定するものではない。この共重合樹
脂にはブロッキング防止剤を添加することができる。ブ
ロッキング防止剤には、タルク系、炭酸カルシウム系等
の一般的な物が使われる。本発明のコアーシートには白
色顔料として酸化チタン、酸化亜鉛、酸化チタン−硫酸
バリウム、酸化チタン−硫酸カルシウム、酸化チタン−
珪酸マグネシウムのいずれかを添加できる。白色顔料は
共重合ポリエステル樹脂１００重量部に対して１〜１５
重量部添加するのが好ましい。白色顔料の含有率が１重
量部未満になるとカードとしての白色度が不足し不適当
であり、白色顔料の含有率が１５重量部を越えると、シ
ート加工の生産性が低下し、熱融着性が得にくく不適当
である。共重合樹脂をシート状に加工するときに、両面
または片面に表面粗さＲａが０．５〜１５μｍのエンボ
ス処理を施すが、エンボス処理が施されていない場合、
シートにブロッキングが起こりカード製作時に支障をき
たす。また表面粗さＲａが１５μｍを超えると印刷イン
キ接着性・インキ着肉仕上がり性・印刷機械適性等の印
刷に関する適性が低下しカード製作時に支障をきたす。A calendering method, an extrusion method, a pressing method and the like can be used to process the copolymer resin into a sheet, but the method is not particularly limited here. An antiblocking agent can be added to this copolymer resin. As the anti-blocking agent, general substances such as talc type and calcium carbonate type are used. In the core sheet of the present invention, white pigments such as titanium oxide, zinc oxide, titanium oxide-barium sulfate, titanium oxide-calcium sulfate, titanium oxide-
Either magnesium silicate can be added. The white pigment is 1 to 15 with respect to 100 parts by weight of the copolyester resin.
It is preferable to add parts by weight. When the content of the white pigment is less than 1 part by weight, the whiteness as a card is insufficient and unsuitable, and when the content of the white pigment exceeds 15 parts by weight, the productivity of sheet processing is lowered, and heat fusion is not performed. It is not suitable because it is difficult to obtain When the copolymer resin is processed into a sheet shape, both surfaces or one surface is embossed with a surface roughness Ra of 0.5 to 15 μm, but when not embossed,
Blocking occurs on the seat, which interferes with card production. If the surface roughness Ra exceeds 15 μm, the printability such as the adhesion of the printing ink, the finish of the ink inking, the suitability for the printing machine, etc. is deteriorated, which causes an obstacle during the production of the card.
【０００９】[0009]
《実施例１》ポリエチレンテレフタレート樹脂のエチレ
ングリコール成分の３０％をシクロヘキサンジメタノー
ルに置換した共重合ポリエステル樹脂をカレンダーによ
りシート状に圧延製膜し厚さ０．１ｍｍのオーバーシー
トを得た。次いで前述の共重合ポリエステル樹脂１００
重量部に酸化チタンを２．３重量部加え、その配合組成
をカレンダーによりシート状に圧延製膜し厚さ０．７ｍ
ｍのコアシートを得た。得られたコアシートとオーバー
レイを融着しＩＣカード用シートを得た。本発明で得ら
れたＩＣカード用シートを使ったＩＣカードを図１、図
２に示すようにそれぞれ曲げ変形を与えたが、オーバー
シートと内部にＩＣチップを搭載したモジュールとの接
着されている角部にクラックは認められず、ＩＣモジュ
ールの破損も認められなかった。また得られたカード用
シートはインキ歪み性、インキ変色性、インキ密着度等
の印刷機械特性は問題がなかった。ＩＣカードのＩＳＯ
規格による試験においても、ＩＣカード用オーバーシー
トの引張強さはＩＳＯ規格の４７．１Ｎ／ｍｍ2以上の
値を満足するとともに、力学的耐久性として規定されて
いる、長辺方向たわみ２０ｍｍを３０回／分×１０００
回、短辺方向たわみ１０ｍｍを３０回／分×１０００回
及びねじれ３０回／分×１０００回のいずれの試験にお
いても、ＩＣカード用シートのクラック及びＩＣモジュ
ールの破損も認められなかった。Example 1 A copolymerized polyester resin obtained by substituting 30% of the ethylene glycol component of polyethylene terephthalate resin with cyclohexanedimethanol was rolled into a sheet by a calendar to obtain an oversheet having a thickness of 0.1 mm. Next, the above-mentioned copolyester resin 100
2.3 parts by weight of titanium oxide is added to parts by weight, and the composition is rolled into a sheet by a calendar to form a film having a thickness of 0.7 m.
m core sheet was obtained. The obtained core sheet and the overlay were fused to obtain an IC card sheet. An IC card using the IC card sheet obtained in the present invention was bent and deformed as shown in FIGS. 1 and 2, and the oversheet and the module having an IC chip inside are bonded together. No cracks were found in the corners and no damage to the IC module was found. The obtained card sheet had no problems with printing mechanical properties such as ink distortion, ink discoloration, and ink adhesion. ISO of IC card
Even in the test according to the standard, the tensile strength of the IC card oversheet satisfies the ISO standard of 47.1 N / mm 2 or more, and the long side deflection of 20 mm, which is specified as the mechanical durability, is 30 mm. Times / min x 1000
In the tests of 30 times / minute × 1000 times and 30 times / minute × 1000 times of twisting, the bending of the IC card sheet and the damage of the IC module were not recognized.
【００１０】《比較例１》ポリエチレンテレフタレート
樹脂においてエチレングリコール成分の２％をシクロヘ
キサンジメタノールに置換した共重合ポリエステル樹脂
をカレンダーによりシート状に圧延製膜し厚さ０．１ｍ
ｍのオーバーシートを得た。次いでポリエチレンテレフ
タレート樹脂のエチレングリコール成分の３０％をシク
ロヘキサンジメタノールに置換した共重合ポリエステル
樹脂１００重量部に酸化チタンを２．３重量部加え、そ
の配合組成をカレンダーによりシート状に圧延製膜し厚
さ０．７ｍｍのコアシートを得た。得られたオーバーシ
ートはコアシートに熱融着が不可能であった。 《比較例２》ポリエチレンテレフタレート樹脂のエチレ
ングリコール成分の３０％をシクロヘキサンジメタノー
ルに置換した共重合ポリエステル樹脂をカレンダーによ
りシート状に圧延製膜し厚さ０．１ｍｍのオーバーシー
トを得た。次いで前述の共重合ポリエステル樹脂１００
重量部に酸化チタンを２０重量部加え、その配合組成を
カレンダーによりシート状に圧延製膜し厚さ０．７ｍｍ
のコアシートを得た。得られたコアシートではオーバー
シートに熱融着が不可能であった。 《比較例３》ポリエチレンテレフタレート樹脂のエチレ
ングリコール成分の３０％をシクロヘキサンジメタノー
ルに置換した共重合ポリエステル樹脂をカレンダーによ
りシート状に圧延製膜し厚さ０．１ｍｍのオーバーシー
トを得た。次いで前述の共重合ポリエステル樹脂１００
重量部に酸化チタンを０．５重量部加え、その配合組成
をカレンダーによりシート状に圧延製膜し厚さ０．７ｍ
ｍのコアシートを得た。得られたＩＣカード用シート
は、融着時に加えられた熱により融着後のシートの変色
が大きかった。 《比較例４》ポリエチレンテレフタレート樹脂のエチレ
ングリコール成分の３０％をシクロヘキサンジメタノー
ルに置換した共重合ポリエステル樹脂をカレンダーによ
りシート状に圧延製膜し厚さ０．１ｍｍのオーバーシー
トを得た。次いでポリエチレンテレフタレート樹脂にお
いてエチレングリコール成分の９０％をシクロヘキサン
ジメタノールに置換した共重合ポリエステル樹脂１００
重量部に酸化チタンを２．３重量部加え、その配合組成
をカレンダーによりシート状に圧延製膜し厚さ０．７ｍ
ｍのコアシートを得た。得られたコアシートではオーバ
ーシートに熱融着が不可能であった。Comparative Example 1 A polyethylene terephthalate resin in which 2% of the ethylene glycol component was replaced by cyclohexanedimethanol was rolled into a sheet by a calender to form a film having a thickness of 0.1 m.
m oversheet was obtained. Next, 2.3 parts by weight of titanium oxide was added to 100 parts by weight of the copolyester resin in which 30% of the ethylene glycol component of the polyethylene terephthalate resin was replaced with cyclohexanedimethanol, and the composition was rolled into a sheet by a calender to form a film. A 0.7 mm thick core sheet was obtained. The obtained oversheet could not be heat fused to the core sheet. Comparative Example 2 A copolymerized polyester resin obtained by substituting 30% of the ethylene glycol component of polyethylene terephthalate resin with cyclohexanedimethanol was rolled into a sheet by a calendar to obtain an oversheet having a thickness of 0.1 mm. Next, the above-mentioned copolyester resin 100
20 parts by weight of titanium oxide was added to parts by weight, and the composition was rolled into a sheet by a calender to form a film with a thickness of 0.7 mm.
Core sheet was obtained. The obtained core sheet could not be heat fused to the oversheet. Comparative Example 3 A copolymerized polyester resin obtained by substituting 30% of the ethylene glycol component of a polyethylene terephthalate resin with cyclohexanedimethanol was rolled into a sheet with a calendar to obtain an oversheet having a thickness of 0.1 mm. Next, the above-mentioned copolyester resin 100
0.5 parts by weight of titanium oxide was added to parts by weight, and the composition was rolled into a sheet by a calendar to form a film with a thickness of 0.7 m.
m core sheet was obtained. The obtained IC card sheet had a large discoloration of the sheet after fusion due to the heat applied during fusion. Comparative Example 4 A copolymerized polyester resin obtained by substituting 30% of the ethylene glycol component of polyethylene terephthalate resin with cyclohexanedimethanol was rolled into a sheet by a calendar to obtain an oversheet having a thickness of 0.1 mm. Next, in the polyethylene terephthalate resin, 90% of the ethylene glycol component was replaced with cyclohexanedimethanol
2.3 parts by weight of titanium oxide is added to parts by weight, and the composition is rolled into a sheet by a calendar to form a film having a thickness of 0.7 m.
m core sheet was obtained. The obtained core sheet could not be heat fused to the oversheet.
【００１１】《比較例５》ポリ塩化ビニル樹脂１００重
量部に次ぎに示す各種添加剤を加え、その配合組成をカ
レンダーによりシート状に圧延製膜し厚さ０．１ｍｍの
オーバーシートを得た。さらに同じ配合組成１００重量
部に対し酸化チタンを２．３重量部加え、その配合組成
をカレンダーによりシート状に圧延製膜し厚さ０．７ｍ
ｍのコアシートを得た。 ポリ塩化ビニル樹脂 １００ 重量部 オクチル錫メルカプト系安定剤 ３．０ 重量部 脂肪酸系滑剤 ０．５ 重量部 ＭＢＳ樹脂 １０ 重量部 このオーバーシート及びコアシートを使ったＩＣカード
を図１、図２に示すようにそれぞれ曲げ変形を与えた場
合、ＩＣモジュールの破損は認められなかったが、ＩＣ
カード用オーバーシートと内部にＩＣチップを搭載した
モジュールとの接着されている角部にクラックが認めれ
た。ＩＣカードのＩＳＯ規格による試験においても、Ｉ
Ｃカード用オーバーシートの引張強さはＩＳＯ規格の４
７．１Ｎ／ｍｍ2以上の値を満足するが、力学的耐久試
験では短辺方向たわみ１０ｍｍを３０回／分×１０００
回において、ＩＣカード用オーバーシートと内部にＩＣ
チップを搭載したモジュールとの接着されている角部に
クラックが認められた。Comparative Example 5 Various additives shown below were added to 100 parts by weight of polyvinyl chloride resin, and the blended composition was rolled into a sheet by a calender to obtain an oversheet having a thickness of 0.1 mm. Further, 2.3 parts by weight of titanium oxide was added to 100 parts by weight of the same composition, and the composition was rolled into a sheet by a calender to form a film having a thickness of 0.7 m.
m core sheet was obtained. Polyvinyl chloride resin 100 parts by weight Octyl tin mercapto-based stabilizer 3.0 parts by weight Fatty acid-based lubricant 0.5 parts by weight MBS resin 10 parts by weight IC cards using this over-seat and core sheet are shown in FIGS. 1 and 2. When bending deformation was applied to each, the IC module was not damaged.
Cracks were observed at the corners where the card oversheet and the module having the IC chip mounted inside were bonded. Even in the test based on the ISO standard of the IC card, I
Tensile strength of C card oversheet is ISO standard 4
A value of 7.1 N / mm 2 or more is satisfied, but in the mechanical endurance test, deflection in the short side direction of 10 mm is 30 times / min × 1000.
At the time of the IC, oversheet for IC card and IC inside
Cracks were observed at the corners where the chip-mounted module was bonded.
【００１２】[0012]
【発明の効果】ＩＣカードの繰り返し曲げに対して、Ｉ
Ｃカードのモジュールとオーバーシートとの接着部の角
部周辺にクラックが発生しないＩＣカード用シートを提
供することができる。EFFECTS OF THE INVENTION With respect to repeated bending of an IC card, I
It is possible to provide an IC card sheet in which cracks do not occur around the corners of the bonding portion between the C card module and the oversheet.
【図１】従来のＩＣカードを示すもので、ＩＣカードを
表側に凸に曲げた場合の断面を示す。FIG. 1 shows a conventional IC card, showing a cross section when the IC card is bent in a convex shape to the front side.
【図２】従来のＩＣカードを示すもので、ＩＣカードを
裏側に凸に曲げた場合の断面を示す。FIG. 2 shows a conventional IC card, showing a cross section when the IC card is convexly bent to the back side.
１ モジュール ２ オーバーシート ３ カバーシート ４ 角部 1 module 2 over sheet 3 cover sheet 4 corner
Claims (2)
Ｃカード用コアシート及びオーバーシートであって、該
ポリエチレンテレフタレート樹脂が該ポリエチレンテレ
フタレート樹脂のエチレングリコール成分の１０〜７０
％をシクロヘキサンジメタノールに置換してなる共重合
ポリエステル樹脂組成物からなり、かつシートの少なく
とも片面に表面粗さＲａが０．５〜１５μｍのエンボス
加工を施していることを特徴とするＩＣカード用シー
ト。1. I made of polyethylene terephthalate resin
A core sheet for C cards and an oversheet, wherein the polyethylene terephthalate resin is 10 to 70 of an ethylene glycol component of the polyethylene terephthalate resin.
% Of the copolyester resin composition in which cyclohexanedimethanol is replaced, and at least one side of the sheet is embossed with a surface roughness Ra of 0.5 to 15 μm. Sheet.
レングリコール成分の１０〜７０％をシクロヘキサンジ
メタノールに置換してなる共重合ポリエステル樹脂１０
０重量部に対し、白色顔料を１〜１５部添加した組成物
からなることを特徴とする請求項１記載のＩＣカード用
シート。2. A copolyester resin 10 obtained by substituting 10 to 70% of the ethylene glycol component of a polyethylene terephthalate resin with cyclohexanedimethanol.
The IC card sheet according to claim 1, wherein the IC card sheet comprises a composition in which 1 to 15 parts by weight of a white pigment is added to 0 part by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7224313A JPH0966590A (en) | 1995-08-31 | 1995-08-31 | Sheet for ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7224313A JPH0966590A (en) | 1995-08-31 | 1995-08-31 | Sheet for ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0966590A true JPH0966590A (en) | 1997-03-11 |
Family
ID=16811803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7224313A Pending JPH0966590A (en) | 1995-08-31 | 1995-08-31 | Sheet for ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0966590A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999009102A1 (en) * | 1997-08-19 | 1999-02-25 | Mitsubishi Plastics Inc. | Resin composition for cards, and sheets and cards |
| JPH11189708A (en) * | 1997-12-26 | 1999-07-13 | Tsutsunaka Plast Ind Co Ltd | Resin composition for card |
| EP0947543A3 (en) * | 1998-03-30 | 2000-09-20 | Sumitomo Bakelite Company Limited | Sheet made of polyester resin composition |
| US6551699B1 (en) | 1998-03-17 | 2003-04-22 | Eastman Chemical Company | Polyester resin compositions for calendering |
| KR20040024696A (en) * | 2002-09-16 | 2004-03-22 | 위영환 | Method for forming the RF antenna in PET sheet, Method for producing the Smart Card using the PET sheet and Smart card using of the Method |
| US6846440B2 (en) | 1998-03-17 | 2005-01-25 | Eastman Chemical Company | Polyester resin compositions for calendering |
| KR100537121B1 (en) * | 2003-01-23 | 2005-12-16 | 주식회사 제이디씨텍 | Inlay Layer Being Used Material of PET and Combi-Type Intergrated Circuit Card Inserted said Inlay Layer |
| US7235623B2 (en) | 2003-11-26 | 2007-06-26 | Eastman Chemical Company | Polyester compositions for calendering |
-
1995
- 1995-08-31 JP JP7224313A patent/JPH0966590A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999009102A1 (en) * | 1997-08-19 | 1999-02-25 | Mitsubishi Plastics Inc. | Resin composition for cards, and sheets and cards |
| JPH11189708A (en) * | 1997-12-26 | 1999-07-13 | Tsutsunaka Plast Ind Co Ltd | Resin composition for card |
| US6551699B1 (en) | 1998-03-17 | 2003-04-22 | Eastman Chemical Company | Polyester resin compositions for calendering |
| US6846440B2 (en) | 1998-03-17 | 2005-01-25 | Eastman Chemical Company | Polyester resin compositions for calendering |
| US7279123B2 (en) | 1998-03-17 | 2007-10-09 | Eastman Chemical Company | Polyester resin compositions for calendering |
| US7438841B2 (en) | 1998-03-17 | 2008-10-21 | Eastman Chemical Company | Polyester resin compositions for calendering |
| EP0947543A3 (en) * | 1998-03-30 | 2000-09-20 | Sumitomo Bakelite Company Limited | Sheet made of polyester resin composition |
| KR20040024696A (en) * | 2002-09-16 | 2004-03-22 | 위영환 | Method for forming the RF antenna in PET sheet, Method for producing the Smart Card using the PET sheet and Smart card using of the Method |
| KR100537121B1 (en) * | 2003-01-23 | 2005-12-16 | 주식회사 제이디씨텍 | Inlay Layer Being Used Material of PET and Combi-Type Intergrated Circuit Card Inserted said Inlay Layer |
| US7235623B2 (en) | 2003-11-26 | 2007-06-26 | Eastman Chemical Company | Polyester compositions for calendering |
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