JPH0964256A - Manufacture of electronic device, and its adhesive member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the manufacture of a heat radiating member annexation type of electronic device in which electronic components and a heat radiating member can be bonded and fixed simply without needing much time and labor for bonding processing, and is excellent in all of adhesive properties such as heat conductivity or heat radiation property, heat resistance, preservation property, and others. SOLUTION: An electronic component 1 and a heat radiating member 3 are bonded and fixed through an adhesive member 2 which has heat-resistant pressure-sensitive adhesive layers 21 and 23 having such preservation performance that it withstands the load of 500g for 30 minutes or more in atmosphere at 80 deg.C per 2.0cm<2> in adhesion area without falling on one side or both sides of a heat conductive base material 22 or the heat radiating member 3. Hereby, the generated heat can be transmitted efficiently to the heat radiating member through the adhesive member without the adhesion property dropping by the heat generation by the electronic component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic device equipped with a heat dissipation member, which is excellent in maintaining adhesive strength and heat dissipation.

[0002]

BACKGROUND ART In electronic components such as hybrid packages, multi-chip modules, and sealed integrated circuits made of plastic or metal, the heat generation amount increases with the high integration of IC circuits, etc. Since there is a risk of causing functional failures, measures have been taken to prevent functional failures by attaching heat dissipation members such as heat sinks to electronic components.

Conventionally, as a method of manufacturing an electronic device in which the electronic component and the heat dissipation member are bonded to each other, the electronic component is bonded to the electronic component with an adhesive composed of a mixed composition of aluminum powder or the like, a polymerizable acrylic acid ester monomer and an initiator. A method of bonding a heat dissipation member has been known (US Pat. No. 4,772,960).
issue).

However, after applying the adhesive to one or both of the electronic component and the heat radiating member, it is necessary to use a primer or cure the oxygen by blocking oxygen, and the adhesive treatment requires many hours and a lot of labor. In addition, there is a problem in that the manufacturing efficiency of the electronic device is poor, because it is necessary to temporarily fix the adherend until it is cured.

[0005]

DISCLOSURE OF THE INVENTION The inventors of the present invention have considered that the adhesive treatment using a heat conductive filler such as the above-mentioned metal powder requires a lot of time and a lot of labor for the adhesive treatment. The pressure-sensitive adhesive layer was tried. However, although the pressure-sensitive adhesive layer can simplify the adhesive treatment, it is difficult to balance the thermal conductivity or heat dissipation by the thermally conductive filler and the adhesive property by the adhesive component, especially the heat resistance, and a satisfactory electronic device can be obtained. Was found to be difficult to form. Considering the further increase in heat generation due to higher integration of IC circuits, etc. and the vertically long use of personal computers equipped with electronic parts, etc., it has excellent thermal conductivity or heat dissipation, and also has adhesive properties, especially heat resistance. It is required that they have excellent properties and retention performance and that they are balanced in a high performance state.

Therefore, according to the present invention, the electronic component and the heat radiating member can be easily adhesively fixed to each other without requiring a lot of labor and a lot of labor for the adhesive treatment, and the thermal conductivity or the heat radiating property and the heat resistance and the holding property of the adhesive property can be improved. An object of the present invention is to obtain a method of manufacturing an electronic device equipped with a heat dissipation member, which is excellent in both cases.

[0007]

According to the present invention, a heat-resistant pressure-sensitive adhesive layer having a holding ability to withstand a load load of 500 g in an atmosphere of 80 ° C. per unit area of 2.0 cm ² without dropping for 30 minutes or more is used. The present invention provides a method for manufacturing an electronic device, characterized in that an electronic component and a heat radiating member are bonded and fixed via an adhesive member provided on one surface or both surfaces of a conductive base material or a heat radiating member.

[0008]

With the above structure, the electronic component and the heat radiating member can be easily adhesively fixed through the pressure-sensitive adhesive layer without requiring a lot of labor and a lot of labor for the adhesive treatment, and the adhesive characteristic is generated by the heat generated by the electronic component. An electronic device with a heat-dissipating member that exhibits excellent adhesive properties such as heat resistance and holding performance without deteriorating, and efficiently transfers generated heat to the heat-dissipating member through the adhesive member and has excellent heat conductivity or heat dissipation. Can be obtained.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The manufacturing method according to the present invention has a bonding area of 2.
Adhesion with a heat-resistant pressure-sensitive adhesive layer having a holding property that can withstand a load of 500 g per 0 cm ² under a load of 500 g for 30 minutes or more in an atmosphere of 80 ° C. on one side or both sides of a heat conductive base material or heat dissipation member. An electronic device is obtained by adhesively fixing an electronic component and a heat dissipation member via a member.

Therefore, in the present invention, the adhesion area is 2.0 cm ^2.
Per load of 500g in an atmosphere of 80 ℃
An electronic component and a heat dissipation member are adhesively fixed to each other via an adhesive member having a heat-resistant pressure-sensitive adhesive layer having a holding performance that can withstand not falling for more than a minute. Examples thereof are shown in FIGS. 1 and 2. Reference numeral 1 is an electronic component, 2 is an adhesive member, and 3 is a heat dissipation member.

The adhesive member used in the present invention comprises the pressure-sensitive adhesive layers 21 and 23 as shown in FIG.
2 on both sides, or as shown in FIG. 2, the pressure sensitive adhesive layer 24 can be formed on one side of the heat dissipation member 3.

Examples of the heat conductive base material include metals (including alloys), particularly metals having excellent thermal conductivity such as aluminum and copper, stainless steel and beryllium copper, and excellent thermal conductivity such as heat conductive silicone rubber. A sheet-like material made of a polymer or the like is used. Further, a film made of a heat resistant polymer can be preferably used. In the case of a heat conductive substrate made of a heat resistant polymer, an adhesive member having unexpectedly excellent heat conductivity in addition to its original good heat resistance can be obtained. The reason why such good thermal conductivity is exhibited is unknown, but its thermal conductivity is comparable to the case of using a metal with good thermal conductivity.

Examples of the heat resistant polymer include polyimide, polyethylene terephthalate, polyethylene naphthalate, polytetrafluoroethylene, polyether ether ketone, polyether sulfone, polymethylpentene, polyetherimide, polysulfone, polyphenylene sulfide, polyamide imide. , Polyester imide, aromatic polyamide and the like.

The thickness of the heat conductive substrate can be appropriately determined, but is generally 10 to 125 μm. The thickness of the heat conductive substrate is preferably 25 to 100 μm from the viewpoint of heat resistance and heat conductivity in the state where the pressure sensitive adhesive layers are provided on both surfaces.

The pressure-sensitive adhesive layer has an adhesive area of 2.0 cm ^2.
Per load of 500g in an atmosphere of 80 ℃
A heat-resistant material having a holding performance that can withstand not falling for more than a minute is used. The pressure-sensitive adhesive layer can be formed by using an appropriate pressure-sensitive adhesive such as silicone-based, acrylic-based or rubber-based adhesive. From the viewpoint of heat resistance, a silicone-based or acrylic pressure-sensitive adhesive can be preferably used.

The thickness of the pressure-sensitive adhesive layer can be appropriately determined, but is generally 10 to 200 μm. The thickness of the pressure-sensitive adhesive layer is preferably 30 to 130 μm from the viewpoint of adhesive properties such as holding performance and thermal conductivity. When an acrylic pressure-sensitive adhesive layer having a thickness of 60 μm or more is used, a bulk polymer or a polymer obtained by irradiation with ultraviolet rays is preferable in terms of adhesive properties such as holding performance and thermal conductivity.

The adhesive member can be formed, for example, by coating a pressure-sensitive adhesive on a heat conductive substrate and subjecting the pressure-sensitive adhesive to a cross-linking treatment by heating, or by heating the pressure-sensitive adhesive layer formed on the separator. It can be carried out by a method similar to the method for forming an adhesive tape such as a method of transferring onto a conductive substrate.

As shown in FIG. 1, the adhesive member 2 in which pressure sensitive adhesive layers 21 and 23 are provided on both surfaces of the heat conductive base material 22 has the electronic component 1 and the heat radiating member 3 via the pressure sensitive adhesive layers on the front and back sides thereof. It is used to form an electronic device by a method of adhesively fixing. There is no particular limitation on the electronic component or heat dissipation member to be bonded and fixed via the adhesive member.

Incidentally, examples of electronic components to be bonded and fixed include IC chips, hybrid packages, multi-chip modules, and sealed integrated circuits made of plastic or metal. INDUSTRIAL APPLICABILITY The present invention can be advantageously applied to the adhesive fixing of electronic components having a large heat generation amount such as those in which IC circuits are highly integrated.

On the other hand, as the other heat radiation member to be bonded and fixed, for example, a heat sink made of a plate or sheet made of a metal, which is exemplified as the material for forming the heat conductive base material, or another heat radiator. can give. The thickness of the heat sink consisting of a plate or sheet is 10 μm to 10 mm,
In particular, it is generally 50 μm to 5 mm, particularly 100 μm to 3 mm, but not limited to this. Further, the radiator may be an appropriate structure such as a form having cooling fins.

As illustrated in FIG. 2, the adhesive member 2 used in the present invention is dropped onto the heat dissipation member 3 with a load of 500 g for 30 minutes or more in an atmosphere of 80 ° C. per 2.0 cm ^{2 of} the adhesive area. Alternatively, the heat-resistant pressure-sensitive adhesive layer 24 having a holding ability to withstand the heat may be provided. In this case, the heat dissipation member 3 forming the adhesive member and the electronic component 1 are bonded via the pressure-sensitive adhesive layer 24. Therefore, as the heat dissipation member, a heat sink made of a plate or sheet is preferably used.

[0022]

【Example】

Example 1 60 parts of isononyl acrylate (parts by weight, the same applies hereinafter), 28 parts of butyl acrylate, 12 parts of acrylic acid, and 2,
A premix consisting of 0.1 part of 2'-dimethoxy-2-phenylacetophenone (photopolymerization initiator) was exposed to ultraviolet rays in a nitrogen atmosphere to partially polymerize, and the viscosity was about 45.
A coating processable syrup of 00 centipoise was prepared, and 100 parts of the syrup was added to tetrabismethylene-
3- (3'-5'-di-t-butyl-4'-hydroxyphenyl) propionate methane (radical chain inhibitor) 4
Part and 0.2 parts of trimethylolpropane triacrylate (cross-linking agent) are added and coated on a polyester film surface-treated with a release agent, and high pressure mercury with a light intensity of 5 mW / cm ² in a nitrogen gas atmosphere. 90 at the lamp
After photopolymerization treatment by irradiating with 0 mj / cm ² ultraviolet rays, it is dried in a hot air circulation dryer at 130 ° C for 5 minutes to a thickness of 50μ.
An m pressure-sensitive adhesive layer was formed and transferred to both sides of an aluminum foil having a thickness of 30 μm to obtain an adhesive member (total thickness 130 μm.
m).

Example 2 Example 1 except that an aluminum foil having a thickness of 15 μm was used.
An adhesive member was obtained according to the above (total thickness: 115 μm).

Example 3 An adhesive member was obtained in the same manner as in Example 1 except that the pressure-sensitive adhesive layer had a thickness of 125 μm (total thickness 280 μm).

Example 4 An adhesive member was obtained in the same manner as in Example 1 except that a polyimide film having a thickness of 25 μm was used instead of the aluminum foil (total thickness 125 μm).

Example 5 90 parts of 2-ethylhexyl acrylate and 10 parts of acrylic acid
Parts in 210 parts of ethyl acetate in the presence of 0.4 parts of 2,2'-azobisisobutyronitrile and under nitrogen substitution.
The solution is polymerized while stirring at 0 to 80 ° C, and the viscosity is about 1
A pressure-sensitive adhesive solution having 20 poise, a polymerization rate of 99.2% by weight and a solid content of 31.4% by weight was prepared, and 3 parts of a polyfunctional isocyanate cross-linking agent was added to 100 parts of the solution to prepare a release agent. Coated on a polyester film surface-treated with, dried in a hot air dryer at 40 ° C for 5 minutes, and then 1
A pressure-sensitive adhesive layer having a thickness of 30 μm was formed by drying at 30 ° C. for 5 minutes, and the pressure-sensitive adhesive layer was transferred onto both sides of an aluminum foil having a thickness of 30 μm to obtain an adhesive member (total thickness 90 μm).

Comparative Example 1 An adhesive member was obtained in the same manner as in Example 1 except that the base material made of aluminum foil was not used (total thickness 100 μm).

Comparative Example 2 An adhesive member was obtained in the same manner as in Example 3 except that the substrate made of aluminum foil was not used (total thickness 250 μm).

Comparative Example 3 A premix consisting of 100 parts of isooctyl acrylate and 0.1 part of 2,2'-dimethoxy-2-phenylacetophenone was exposed to ultraviolet rays in a nitrogen atmosphere to be partially polymerized to obtain a viscosity of A coating processable syrup of about 3000 centipoise was prepared, and 45 parts of the syrup contained 5 parts of acrylic acid, 50 parts of aluminum oxide powder and tripropylene glycol diacrylate (cross-linking agent).
1 part and 0.05 parts of 2,2′-dimethoxy-2-phenylacetophenone were added and coated on a polyester film surface-treated with a release agent, and the light intensity was 5 mW / cm ² under a nitrogen gas atmosphere. 90 with a high-pressure mercury lamp
After photopolymerization by irradiating with 0 mj / cm ² ultraviolet rays, it is dried in a hot air circulation dryer at 130 ° C. for 5 minutes to a thickness of 250.
A μm pressure-sensitive adhesive layer (adhesive member) was formed (total thickness 250
μm).

Evaluation test Retention performance The adhesive members obtained in the examples and comparative examples were prepared to have a length of 125 mm and a width of 25.
mm × 0.4 mm thick aluminum plate with a length of 20 mm × 10 mm (width) bonded to one end in the length direction, left in an atmosphere of 80 ° C. for 30 minutes, and then loaded with a load of 500 g at 80 ° C. Then I investigated the time until it fell.

Thermal conductivity: Dimension of 20 mm × on a heat block set at 200 ° C.
A 20 mm adhesive member was placed, and a copper block (20 mm × 20 mm × thickness 10 mm) having a thermocouple on it was superposed on the adhesive member, and the time required for the copper block to reach 150 ° C. was examined.

The above results are shown in Tables 1 and 2.

[Table 1]

[0033]

[Table 2]

From Table 1 and Table 2, according to the present invention, the electronic component and the discharge member can be simply adhered and fixed via the adhesive member,
Excellent adhesiveness such as heat resistance and holding performance without deterioration of adhesiveness due to heat generated by electronic parts, and moreover, the generated heat is efficiently transmitted to the heat dissipation member through the adhesive member, resulting in excellent thermal conductivity or heat dissipation. It can be seen that an electronic device equipped with a heat dissipation member can be obtained.

[Brief description of drawings]

FIG. 1 is a sectional view of an embodiment.

FIG. 2 is a sectional view of another embodiment.

[Explanation of symbols]

1: Electronic component 2: Adhesive member 3: Heat dissipation member (heat sink) 21, 23, 24: Pressure-sensitive adhesive layer 22: Thermally conductive base material

Claims (4)

[Claims] 1. A pressure-sensitive adhesive layer is provided on both sides of a heat-conductive substrate, and the pressure-sensitive adhesive layer has a pressure-sensitive adhesive layer of 80 cm ² per 2.0 cm ² .
An electronic device in which an electronic component and a heat dissipation member are adhesively fixed through an adhesive member that is a heat-resistant adhesive having a holding performance that can withstand a load of 500 g in a ℃ atmosphere for 30 minutes or more without falling. Manufacturing method. 2. The method for manufacturing an electronic device according to claim 1, wherein the heat conductive base material is a heat resistant film. 3. The heat-dissipating member is provided with a heat-resistant pressure-sensitive adhesive layer having a holding performance capable of withstanding a load load of 500 g in an atmosphere of 80 ° C. per a bonding area of 2.0 cm ² without dropping for 30 minutes or more. A method of manufacturing an electronic device, wherein an electronic component is adhesively fixed via the pressure-sensitive adhesive layer of the adhesive member. 4. A pressure-sensitive adhesive layer for adhering and fixing an electronic component and a heat-dissipating member is provided on one or both sides of a heat conductive base material or a heat-dissipating member, and the pressure-sensitive adhesive layer has an adhesive area of 2.0 cm ^2. Therefore, the adhesive member is characterized by being a heat-resistant adhesive having a holding ability to withstand a load of 500 g in an atmosphere of 80 ° C. without dropping for 30 minutes or more.