JPH0963660A - Terminal crimping structure in extra fine conductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To crimp an extra fine conductor to a crimp terminal directly, by prescribing the crimp terminal and the crimping part of the extra fine conductor smaller than the size of an applicable conductor of the crimp terminal, to be formed into a cross section shape coincident to the extra fine conductor. SOLUTION: The ratio of the cross section area of the crimping part to, the conductor cross section area, of a crimp terminal 11 and the crimping part 19 of an extra fine conductor 18 smaller than the size of an applicable conductor of the crimp terminal 11 (the conductor compression ratio) is set 70% or more, so as to make in the cross section form coincident to the extra fine conductor 18. Consequently, a terminal crimping structure in an extra fine conductor 18 in which the extra fine conductor 18 can be crimped directly to the crimp terminal 11 through no other part can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal crimping structure for an ultrafine conductor. More specifically, it relates to a terminal crimping structure for crimping a crimp terminal with an ultrafine conductor that is thinner than the applicable conductor size. Hereinafter, the "extra-fine conductor" will be described with reference to the inner conductor in the thin coaxial wire. However, it can also be applied to other ultrafine conductors.

[0002]

2. Description of the Related Art FIG. 8 shows a conventional example in which a crimp terminal is crimped to a conductor thinner than the applicable conductor conductor size of the crimp terminal. This is a so-called additional wire crimping method in which additional wires of the same size are added to meet the applicable conductor size in total, and these ultrafine conductors and additional wires are crimped together.

9 to 12 show an injection molded substrate (MID; Molded Interconnecting Deposition) previously proposed by the present applicant.
FIG. 9 shows a series of assembling methods, FIG. 10 shows an injection-molded substrate 2, FIG. 11 shows a holder 3 for bearing, and FIG. Shows the relay connection state of the crimp terminal 5 for housing housing and the internal conductor 8a in the micro coaxial wire 8. (See Japanese Patent Laid-Open No. 6-208877.) In this method, the crimp terminal 5 inserted into the slot 1a of the housing 1 is crimped to the lead conductor 5a having a conductor size applicable to the terminal, and the conductor 5a is attached. It is extended on the housing 1 and inserted into the through hole 2b of the injection molded substrate 2,
In the through hole 2b, a soldering process 6 is performed so as to extend over the land 2c specific to the through hole 2b, and the end of the internal conductor 8a in the micro coaxial wire 8 is soldered 10 in the land 2c. In the figure, 2a is an insulative substrate body, 3a is an insulative substrate, 3b is a notch for passing a conductor, 4 is a crimping terminal for grounding, 4a is a conductor for its lead, 7 is a spacer, and 9 is a spacer. Is a conductive tape for collective grounding.

[0004]

According to the former of the above-mentioned conventional wire crimping methods, since several crimp terminals are crimped by crimping so as to match the applicable conductor size of the crimp terminal, workability is improved. It was very bad and the cost of crimping was high.

According to the different-size conductor replacement connection method, the terminal crimping work is performed by separately using the lead conductor having the applicable conductor size of the crimp terminal, and the injection-molded board (MID) for relay connection processing is used. As the lead conductor and the ultrafine conductor are soldered, the number of steps increases, which increases the work cost, and the material cost increases because of the injection-molded substrate, which also increases the cost. Was there.

Therefore, the problem to be solved by the present invention is to provide a terminal in an ultrafine conductor which can directly crimp an extrafine conductor having a size not applicable to the crimping terminal to the crimping terminal without interposing another member, and can ensure quality. It is to provide a crimping structure.

[0007]

[Means for Solving the Problems] According to the means provided by the present invention, firstly, a crimp portion of a crimp terminal and an ultrafine conductor thinner than an applicable conductor size of the crimp terminal is provided with a cross-sectional shape conforming to the ultrafine conductor. Thus, the terminal crimping structure in the ultrafine conductor is formed by setting the ratio of the cross-sectional area of the crimping portion to the conductor cross-sectional area (conductor compression ratio).

In the above means, the ratio of the cross-sectional area of the crimp portion to the conductor cross-sectional area may be 70% or more.
Further, the conductor compression ratio may be 30%.

As a second means, the crimping portion of the crimping terminal and the extra fine conductor smaller than the applicable conductor size of this crimping terminal is formed in a shape different from the original crimping shape of the crimping terminal.
The crimp portion having this irregular shape has a cross-sectional shape within the outer frame size of the crimp terminal's original post-crimp shape.

In the above-mentioned second means, it is preferable that the tensile strength of the crimped portion having an irregular shape is set to the breaking strength of the conductor × 0.8 or more.

[0011]

DETAILED DESCRIPTION OF THE INVENTION In the following description, "AWG"
Is American Wire Gauge, and also "S
“Q” is called “scare” or “scare millimeter” and is a substitute for square millimeter.

FIG. 1 shows a comparative example to the embodiment described later, which is a crimp terminal for a 32 to 36 AWG conductor manufactured by Hirose Electric Co., Ltd., and a conductor 12 made of 36 AWG (7 / 0.05) tin-plated annealed copper wire. The pressure-bonding part 13 of FIG. FIG. 2 shows a 36 AWG having the conductor of FIG. 1 as an inner conductor.
A (0.013 SQ) coaxial line is shown. In addition, 14 is an insulator (Teflon; trade name), 15 is an outer conductor (tin-plated annealed copper wire), and 16 is a jacket (6F).

This comparative example shows a so-called normal crimping sectional structure in which a conductor 12 having an applicable conductor size is crimped to a crimp terminal 11. Crimping part 13 in this example
The cross sectional area of the conductor is 0.0116SQ, which is compressed by 11%.

In each of the drawings, dimensions are given for easy understanding of the thickness. Rectangular frame 1 shown in FIG.
7 is the outer frame size of the crimp section (0.84 mm x 0.4 mm)
The cross-sectional shape of the crimping portion is determined so that the crimping portion 13 is accommodated within this outer frame dimension. This is because the crimp terminal 11 including the crimp portion 13 can be inserted into the slot of the connector housing (see 1 in FIG. 9) and the fixation after the insertion is improved.

FIG. 3 shows an embodiment of the present invention, in which a crimp terminal for a 32-36 AWG conductor manufactured by Hirose Electric Co., Ltd. similar to the above is used, and 40 AWG (7/7) which is thinner than the applicable conductor size of the crimp terminal. 0.032) The case where the conductor 18 made of silver-plated annealed copper wire is crimped is shown, and 19 is the crimped portion. In FIG. 4, the conductor 18 of FIG. 3 is used as the inner conductor.
The 0AWG (0.0056SQ) coaxial line is shown.
20 is an insulator (foamed PE), 21 is a reinforcing layer (PE tape), 22 is an outer conductor (tin-plated hard copper wire), and 23 is a jacket (polyester tape).

The crimping portion 19 of this embodiment is for inserting the connector housing, and is set within the outer frame dimension 17 of the normal crimping so that the crimping cross-sectional shape is different from that of the ordinary crimping. That is, as apparent from the overlap comparison diagram with the conductor crimping portion 13 having the applicable conductor size in FIG. 5, the crimping portion 19 having the irregular cross-sectional shape apparently has the area portions 24, 24 (0) indicated by half black. .024SQ), but the area part 24,2
A part of 4 is a part 25 (0.01
69SQ) and the remaining area (0.0071
By moving SQ) to the conductor crimping portion, the cross-sectional area ratio in the crimping portion 19 becomes 70% or more (the conductor compression ratio is 30% or less). Incidentally, the cross-sectional area of the conductor crimping portion is 0.0045SQ, which means that the cross-sectional area of the 40AWG conductor (0.0056SQ) is compressed by 20%.

Table 1 shows 36 AWG, 38 AWG, 40 A
It shows the tensile strength / compression bonding cross-section comparison data of each conductor of WG, 42 AWG, and 46 AWG.

[0018]

[Table 1]

From Table 1, the following can be verified. That is, the standard value (breaking strength of the conductor x 0.8% or more) of the crimping portion tensile strength is satisfied by the normal crimping shape 36 AWG, the modified cross-section crimping shape 38 AWG, 40 AWG, 42 AWG of the present invention. is there. However, the 46 AWG did not show a satisfactory value of 0.42 N with respect to the standard value of 0.627 N. The reason for this is that the compression ratio of each conductor size shown in FIG.
Various types of compression blades were examined for what is generally said to have a compression ratio of 30% or less, but 46 AWG had to compress by 46% in order to obtain the highest tensile strength. However, if the compression rate exceeds 30%, the conductor will be damaged during pressure bonding and the strength will be weakened. In other words, the compression ratio must not exceed 30%, and it is necessary to form a crimped shape that maximizes the tensile strength of the crimped portion.

Regarding the 46 AWG, various shapes were examined, but they could not be realized. As a result of this examination, it was concluded that the deformed cross-section crimped shape structure of the present invention can be applied up to 42 AWG, which is 28% of the limit.

When the conductor crimping portion of the crimp terminal is covered with an appropriate amount by solder plating or the like to reduce the cross-sectional area of the crimp portion and a conductor thinner than the applicable conductor size is crimped, a compression ratio of 30 is obtained.
It can be set to be less than or equal to%.

[0022]

According to the present invention as described above, an extra fine conductor having a size of the outer conductor to which the crimp terminal is not applied can be directly crimped to the crimp terminal without interposing another member, and quality can be secured. The purpose of providing the terminal crimping structure can be achieved, and the effect of cost reduction is large because other members and extra work steps are unnecessary.

[Brief description of drawings]

FIG. 1 is a cross-sectional explanatory view showing a crimping state of a crimping terminal to an ultrafine conductor as a comparative example with respect to an example of the present invention.

FIG. 2 is an explanatory cross-sectional view of the coaxial wire used in FIG.

FIG. 3 is a cross-sectional explanatory view showing a crimping state of a crimping terminal to an ultrafine conductor having a conductor size different from that of FIG. 1 according to an embodiment of the present invention.

4 is a cross-sectional explanatory view of the coaxial wire used in FIG.

5 is an explanatory view showing a situation in which the crimping structure of FIG. 1 and the crimping structure of FIG. 3 are overlapped and compared with each other.

FIG. 6 is a graph showing tensile strength ratios of terminal crimping portions for conductors of various sizes.

FIG. 7 is a graph showing compression cross-section ratios for conductors of various sizes.

FIG. 8 is an explanatory diagram showing a crimping procedure of a crimping terminal to an ultrafine conductor as a conventional example.

FIG. 9 is a conventional example using an injection-molded substrate, in which (a) is an explanatory view of a step of housing a terminal having a ground wire lead wire in a housing, and (b) is an internal conductor lead wire. Explanatory drawing of the housing process of the terminal which has,
(C) is an explanatory view of the process of assembling the injection-molded substrate, and (D)
Is an explanatory diagram of a soldering process for the lead wire, (e) is an explanatory diagram of a holder assembling process and a micro coaxial wire insertion / shielding process, and (f) is an explanatory diagram of a completed soldering state of the internal conductor.

10 is a perspective view showing a conventional injection-molded substrate in FIG.

11 is a perspective view showing a conventional holder in FIG. 7. FIG.

12 is an explanatory view of a main part showing a soldering state of an internal conductor of a conventional example in FIG.

[Explanation of symbols]

 11 Crimping Terminal (for 32 to 36 AWG Conductor) 12 Conductor (36 AWG) 13 Crimping Part (Normal Crimping Cross Section) 18 Conductor (40 AWG) 19 Crimping Part (Atypical Cross Section)

Front page continued (72) Inventor Hiroshi Komuro 5-1-1 Hidaka-cho, Hitachi City, Ibaraki Hitachi Cable Company, Ltd. Hidaka Factory (72) Inventor Masato Watanabe 5-1-1 Hidaka-cho, Hitachi City, Ibaraki Prefecture No. 1 Inside the Power Systems Laboratory, Hitachi Cable, Ltd. (72) Inventor Katsuo Endo, 880, Sunazawa, Hitachi, Ibaraki Prefecture Hitachi Cable Assembly Co., Ltd. (72) Inventor, Akihiko Tayama, 880, Sunazawa, Hitachi, Ibaraki Hitachi Cable Assembly Co., Ltd.

Claims (5)

[Claims] 1. A ratio of the cross-sectional area of the crimping portion to the conductor cross-sectional area (conductor) so that the crimping portion of the crimping terminal and an ultrafine conductor thinner than the applicable conductor size of the crimping terminal has a cross-sectional shape that matches the ultrafine conductor. Terminal crimping structure for ultra-fine conductors, which is set by setting the compression ratio. 2. A terminal crimping structure for an ultrafine conductor, wherein the ratio of the sectional area of the crimping portion to the conductor sectional area is 70% or more. 3. A terminal crimping structure for an ultrafine conductor, wherein the conductor compression ratio is 30%. 4. A crimping portion of a crimping terminal and an ultrafine conductor thinner than the applicable conductor size of this crimping terminal is formed in a shape different from the original crimping shape of the crimping terminal. A terminal crimping structure for an ultra-fine conductor that has a cross-sectional shape within the outer frame dimensions of the terminal's original shape after crimping. 5. A terminal crimping structure for an ultra-fine conductor, wherein the tensile strength of the above-mentioned irregularly shaped crimping portion is set to the breaking strength of the conductor × 0.8 or more.