JPH0961460A - Contact probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the cost, to improve the productivity and to enable coping with a narrowing of a pitch by providing a body having predetermined number of through holes and plungers to be inserted to be holes. SOLUTION: Predetermined number of through holes 140 are provided in the body of the contact probe, plungers 200 having conductivity are inserted into the holes 140, and its contacts 210 protrude. A spring 300 is elastically urged to the side that the plungers 200 are protruded by the contacts 210. A closing member 400 is mounted at a body 100 to block the hole 140. A conductive layer in contact with the plunger 200 is connected to a lead 150 having conductivity. Since the probe does not need a high-cost barrel with deteriorated productivity, its cost can be reduced. Since the distance between the holes can be reduced as compared with that using the barrel, it can deal with the present LSI chip having enhanced density and reduced size.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a contact probe.

[0002]

2. Description of the Related Art As shown in FIG. 4, a contact probe used for measuring various electrical characteristics of an object to be measured, such as an LSI chip formed on a wafer, has a cylindrical barrel 510 having conductivity. A spring 520 inserted into the barrel 510, a plunger 530 elastically urged by the spring 520, and the barrel 5
Lead portion 5 electrically connected to one side of 10
40 and 40.

Such a contact probe has a barrel 51.
By inserting the spring 520 and the plunger 530 from the opening side of 0, that is, the side where the lead portion 540 is not provided, and caulking the opening side of the barrel 510 with the contact portion 531 of the plunger 530 protruding from the barrel 510. Composed.

This contact probe is arranged on the substrate on which a predetermined pattern wiring is formed, corresponding to the arrangement position of the electrode pad of the LSI chip.

[0005]

However, the above-mentioned conventional contact probe has the following problems. That is, since the barrel is usually ground, it has the drawback of being expensive and having poor productivity. Further, since the barrel is always required, the dimension between the contact probes adjacent to each other cannot be reduced to a predetermined value or less when the contact probes are arranged on the substrate. For this reason, it is difficult for the conventional contact probe to reduce the pitch, and it may not be possible to cope with the current high-density and miniaturized LSI chip.

The present invention was devised in view of the above circumstances, and it is possible to reduce the cost as a contact probe and improve the productivity.
Moreover, it is an object of the present invention to provide a contact probe that can cope with a narrow pitch.

[0007]

A contact probe according to a first aspect of the present invention comprises a body provided with a predetermined number of through holes,
A conductive plunger that is inserted into the through hole and has a contact portion protruding from the through hole, and a side that is inserted into the through hole from a side opposite to the side from which the contact portion protrudes and that has the contact portion protruding from the plunger. A spring for elastically urging the through hole, a closing member attached to the body for closing the through hole from the side opposite to the side where the contact portion of the plunger projects, and the through hole formed on the inner surface of the through hole. And a conductive layer in contact with the plunger inserted in the body, the conductive layer being connected to a conductive lead portion formed on the outer surface of the body.

A contact probe according to a second aspect of the present invention includes a body having a predetermined number of through holes, a conductive plunger inserted into the through holes and having a contact portion protruding from the through holes, and the contact points. A spring that is inserted into the through hole from the side opposite to the side from which the part protrudes and elastically biases the plunger toward the side where the contact part protrudes; and a spring formed on the inner surface of the through hole and inserted into the through hole. And a conductive layer with which the plunger contacts, the conductive layer is connected to a conductive lead portion formed on the outer surface of the body, and the inserted spring is inserted into the through hole. A locking claw that locks with is provided.

Further, the body of the contact probe according to claim 3 is an injection molded circuit component.

[0010]

1 is a schematic exploded perspective view of a contact probe according to a first embodiment of the present invention, and FIG. 2 is a body constituting the contact probe according to the first embodiment of the present invention. FIG. 2A is a schematic front view, FIG. 2B is a schematic bottom view, FIG. 2C is a schematic front vertical sectional view, and FIG. 3D is a schematic side view. Longitudinal section, Figure 3
6A and 6B are drawings of a body constituting a contact probe according to a second embodiment of the present invention, in which FIG. 7A is a schematic front vertical cross-sectional view and FIG. 7B is A in FIG. It is a schematic enlarged view of a part.

The contact probe according to the first embodiment has a body 100 provided with a predetermined number (10 in the drawing) of through holes 140, and is inserted into the through holes 140.
Plunger 20 having conductivity with which the contact portion 210 projects
0, and a spring 300 that is inserted into the through hole 140 from the side opposite to the side where the contact portion 210 projects to elastically urge the plunger 200 toward the side where the contact portion 210 projects.
And is attached to the body 100 and has a through hole 140.
A closing member 400 for closing the plug 200 from the side opposite to the side where the contact point 210 of the plunger 200 projects;
A conductive layer 150 formed on the inner surface of the body 100 and contacting the plunger 200 inserted into the through hole 140. The conductive layer 150 is formed on the outer surface of the body 100 and has a conductive lead portion 160. Connected with.

The body 100 is formed of an insulating synthetic resin into a substantially rectangular parallelepiped shape. Such body 1
00 has an upper surface 110 formed with a groove portion 111 in the left-right direction, and a plurality of protrusions (in the drawing, 1
The (zero) protrusions 112 are formed. The protrusion 1
12 is flush with the upper surface 110 of the body 100.

Further, on the right and left side surfaces of the body 100, locking claws 1 for locking a closing member 400 described later are provided.
30 is formed to project.

Further, the body 100 has an upper surface 11
A plurality of penetrating from 0 to the lower surface 120 (10 in the drawing)
Through holes 140 are opened. This through hole 140
Are provided facing the groove portion 111 on the upper surface 110.

The through hole 140 has a small-diameter portion 141 formed on the lower surface 120 side of the body 100, and the small-diameter portion 141.
The large-diameter portion 142 having a larger diameter is integrally connected.

Large diameter portion 142 and small diameter portion 1 of through hole 140
A conductive layer 150 is formed on the inner surface of 41. The conductive layer 150 is a connection layer 1 which is a thin film layer having conductivity.
Lead portion 1 formed on the protruding portion 112 by 70
It is electrically connected to 60.

The lead portion 160 includes the protruding portion 112.
Is a thin film layer having conductivity formed on the upper surface and the side surface of, and is a portion connected to a wiring pattern previously formed on a substrate (not shown) to which the contact probe is attached.

On the other hand, the connection layer 170 is formed from the side surface of the groove portion 111 to the conductive layer 150 formed on the inner surface of the through hole 140, and the conductive layer 150 and the lead portion 16 are formed.
0 is electrically connected.

Such a body 100 is manufactured as an injection molded circuit component. The injection-molded circuit component is a component in which a part of the molded product is resin-plated and the resin-plated part is used as a circuit.
ed Interconnection Device
Also called e).

Specifically, the body 100 is manufactured as follows. First, the outer shape of the body 100 is formed by injection molding using ABS resin or the like mixed with a catalyst. Conductive layer 1
A portion corresponding to the inner surface of the through hole 140 in which the 50 is formed, a portion corresponding to the protruding portion 112 in which the lead portion 160 is formed, and a connection for electrically connecting the conductive layer 150 to the lead portion 160. Parts other than the three parts where the layer 170 is to be formed are covered with ABS resin or the like in which the catalyst is not mixed.

That is, the conductive layer 150 and the lead portion 160
Only the portion where the connection layer 170 is formed is exposed from the ABS resin or the like in which the catalyst is not mixed. A conductive plating layer of copper or the like is formed on a portion exposed from the ABS resin or the like in which the catalyst is not mixed. This plated layer becomes the conductive layer 150, the lead portion 160, and the connection layer 170.

The plunger 200 is made of a conductive metal and has a substantially cylindrical contact portion 220 having an outer diameter substantially equal to the inner diameter of the large diameter portion 142 of the through hole 140, and the center of the bottom surface of the contact portion 220. Contact part 21 projected from
0 and 0 are integrally formed. The contact part 210
Is smaller than the inner diameter of the small diameter portion 141 of the through hole 140 and is taller than the depth dimension of the small diameter portion 141.

The spring 300 is a so-called coil spring, and is set to be longer than the depth dimension of the through hole 140 in order to elastically bias the plunger 200 in the direction in which the contact portion 210 projects.

The closing member 400 is attached to the upper surface 110 of the body 100 to close the through hole 140, and is provided with a lid portion 410 that fits in the groove portion 111 and right and left sides of the lid portion 410. And a locking portion 420. The closing member 400 is made of an insulating synthetic resin or the like.

The lid 410 is the upper surface 1 of the body 100.
It corresponds to the shape of the groove portion 111 formed in the groove 10, and the lid portion 410 is fitted in the groove portion 111 to close the through hole 140.

The locking portion 420 is formed in a substantially concave shape and hangs from the left and right sides of the lid portion 410 in a direction orthogonal to each other. The locking portion 420 is formed on the body 10
The blocking member 400 is attached to the body 100 by being engaged with the locking claws 130 that are formed to project on the side surface of 0.

When the closing member 400 is attached to the body 100, the lid 410 is attached to the upper surface 11 of the body 100.
It is designed to be flush with 0.

Even if the through hole 140 in which the plunger 200 and the spring 300 are inserted is closed by the closing member 140 attached to the body 100, the lead portion 160 is connected to the conductive layer 150 of the through hole 140 via the connection layer 170. Since they are connected, the contact probe can be attached to the substrate to ensure electrical connection with the wiring pattern of the substrate and the conductive layer 150, and further with the plunger 200.

In the contact probe thus constructed, the closing member 400 is brought into close contact with the substrate, and the lead portion 160 is connected to the wiring pattern formed on the substrate by soldering or the like.

In the contact probe attached to the substrate, the contact portion 210 of the plunger 200 has the through hole 1
It projects from the small diameter portion 141 of 40. In this state, the contact portion 21 is attached to the electrode pad such as the LSI chip which is the measurement object
Contact 0. Then, in the LSI chip and the like, the conductive layer 150 in contact with the plunger 200 and the conductive layer 1
It is connected to a tester (not shown) via a connection layer 170 to which 50 is connected and a lead portion 160 connected to this connection layer 170.

When the contact point 210 of the plunger 200 is brought into contact with the electrode pad, the plunger 200 pushes up the spring 300 against the elastic force of the spring 300. Therefore, a predetermined distance is provided between the contact point 210 of the plunger 200 and the electrode pad. The contact pressure can be secured.

In the contact probe according to the above-described embodiment, the through hole 140 is closed by using the closing member 400 in which the lid portion 410 and the locking portion 420 are integrally formed, but the present invention is not limited to this. Not just the body 1
Any device that can be attached to No. 00 to close the through hole 140 can be used. For example, the through hole 140 may be closed with an adhesive tape having an insulating property.

Next, the contact probe according to the second embodiment will be described with reference to FIG. This second
The contact probe according to the embodiment of the present invention is greatly different from the contact probe according to the first embodiment,
The presence or absence of the closing member 400. That is, the contact probe according to the second embodiment does not have an independent member corresponding to the closing member 400.

Closing member 400 in the first embodiment
The purpose is to prevent the spring 300 inserted into the through hole 140 from coming out of the through hole 140 in order to elastically urge the plunger 200. Here, in order for the spring 300 inserted into the through hole 140 to elastically urge the plunger 200, the spring 30
It suffices that 0 does not come out of the through hole 140. Therefore, as shown in FIG.
Locking claw 180 for locking the spring 200 on the inner surface of 42
May be formed.

The locking claw 180 is formed on one opening side of the through hole 140, that is, on the upper surface 110 side of the body 100, and the spring 20 inserted into the through hole 140.
It is formed inward so that 0 does not come out. The locking claw 180 also has a conductive layer 150 formed by plating.

[0036]

The contact probe according to the present invention includes a body having a predetermined number of through holes, a conductive plunger inserted into the through holes and having a contact portion protruding from the through hole, and the contact portion. The spring is inserted into the through hole from the side opposite to the side where the spring protrudes and elastically biases the plunger toward the side where the contact portion protrudes; and the spring attached to the body so that the contact portion of the plunger protrudes through the through hole. It has a closing member that closes from the side opposite to the side, and a conductive layer formed on the inner surface of the through hole and in contact with the plunger inserted into the through hole, the conductive layer being on the outer surface of the body. It is connected to the formed conductive lead portion.

According to such a contact probe, unlike the conventional contact probe, an expensive and less productive barrel is unnecessary, so that the cost can be reduced. Further, since the distance between the through holes can be set smaller than that of the conventional one using the barrel, the contact probe can be applied to the current high density and miniaturized LSI chip.

Further, since the body is an injection molded circuit component, it can be mass-produced from the barrel used in the conventional contact probe, and a plunger and a spring are inserted into the through hole of the body to penetrate the body with a closing member. Since it is only necessary to close the holes, the productivity of the contact probe as a whole can be greatly improved.

Further, the body provided with a predetermined number of through holes, the conductive plunger inserted into the through holes and having the contact portion protruding from the through hole, and the side from which the contact portion protrudes are opposite to each other. A spring that is inserted into the through hole from the side and elastically biases the plunger toward the side where the contact portion projects.
A conductive layer formed on the inner surface of the through hole and in contact with a plunger inserted into the through hole, the conductive layer being connected to a conductive lead portion formed on the outer surface of the body. In the contact probe in which the through hole is provided with the locking claw for locking the inserted spring in the inserted state, the closing member is not required, so that the number of parts can be further reduced. This makes it possible to reduce the number of manufacturing steps and costs.

Even in the contact probe which does not use the closing member, since the body is an injection molded circuit component, the productivity of the contact probe as a whole can be remarkably improved.

[Brief description of drawings]

FIG. 1 is a schematic exploded perspective view of a contact probe according to a first embodiment of the present invention.

2A and 2B are drawings of a body constituting the contact probe according to the first embodiment of the present invention, in which FIG. 2A is a schematic front view, FIG. 2B is a schematic bottom view, and FIG. Figure (C)
Is a schematic front vertical cross-sectional view, and FIG. 6D is a schematic side vertical cross-sectional view.

3A and 3B are drawings of a body constituting a contact probe according to a second embodiment of the present invention, in which FIG. 3A is a schematic front vertical cross-sectional view and FIG. It is a schematic enlarged view of the A section of FIG.

FIG. 4 is a schematic exploded perspective view of a conventional contact probe.

[Explanation of symbols]

 100 Body 140 Through Hole 150 Conductive Layer 160 Lead Part 200 Plunger 210 Contact Part 300 Spring 400 Closing Member

Claims (3)

[Claims] 1. A body provided with a predetermined number of through holes,
A conductive plunger that is inserted into the through hole and has a contact portion protruding from the through hole, and a side that is inserted into the through hole from a side opposite to the side from which the contact portion protrudes and that has the contact portion protruding from the plunger. A spring for elastically urging, a closing member attached to the body for closing the through hole from the side opposite to the side where the contact portion of the plunger projects, and the through hole formed on the inner surface of the through hole. And a conductive layer in contact with the plunger inserted in the contact probe, the conductive layer being connected to a conductive lead portion formed on the outer surface of the body. 2. A body provided with a predetermined number of through holes,
A conductive plunger that is inserted into the through hole and has a contact portion protruding from the through hole, and a side that is inserted into the through hole from a side opposite to the side from which the contact portion protrudes and that has the contact portion protruding from the plunger. And a conductive layer formed on the inner surface of the through hole and in contact with a plunger inserted into the through hole, the conductive layer being formed on the outer surface of the body. A contact probe, which is connected to a flexible lead portion, and has a locking claw for locking the inserted spring in the inserted state in the through hole. 3. The contact probe according to claim 1, wherein the body is an injection molded circuit component.