JPH0959334A - Thermosetting resin, its cured product and production of the same thermosetting resin - Google Patents
Thermosetting resin, its cured product and production of the same thermosetting resinInfo
- Publication number
- JPH0959334A JPH0959334A JP7211858A JP21185895A JPH0959334A JP H0959334 A JPH0959334 A JP H0959334A JP 7211858 A JP7211858 A JP 7211858A JP 21185895 A JP21185895 A JP 21185895A JP H0959334 A JPH0959334 A JP H0959334A
- Authority
- JP
- Japan
- Prior art keywords
- primary amine
- thermosetting resin
- amine compound
- compound
- divalent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 38
- 239000011347 resin Substances 0.000 title claims abstract description 38
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- -1 polyphenol compound Chemical class 0.000 claims abstract description 60
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 125000003277 amino group Chemical group 0.000 claims abstract description 17
- 235000013824 polyphenols Nutrition 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 150000002989 phenols Chemical class 0.000 claims abstract description 4
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims abstract description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 229920003986 novolac Polymers 0.000 claims description 2
- 239000008098 formaldehyde solution Substances 0.000 claims 1
- 238000004132 cross linking Methods 0.000 abstract description 8
- 150000001875 compounds Chemical class 0.000 abstract description 6
- 238000006116 polymerization reaction Methods 0.000 abstract description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 26
- BGDOLELXXPTPFX-UHFFFAOYSA-N 3,4-dihydro-2h-1,2-benzoxazine Chemical group C1=CC=C2ONCCC2=C1 BGDOLELXXPTPFX-UHFFFAOYSA-N 0.000 description 22
- 239000000047 product Substances 0.000 description 20
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 10
- 238000001723 curing Methods 0.000 description 7
- 238000001879 gelation Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 3
- 238000002329 infrared spectrum Methods 0.000 description 3
- 239000011268 mixed slurry Substances 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 150000001448 anilines Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical group C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 1
- BCHZICNRHXRCHY-UHFFFAOYSA-N 2h-oxazine Chemical compound N1OC=CC=C1 BCHZICNRHXRCHY-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は高密度の架橋構造に
改良された新規な熱硬化性樹脂に関するものであり、熱
硬化性樹脂の中で特に高い信頼性の求められる電子部
品、自動車部品、情報通信機器、構造部材において好適
に用いられる熱硬化性樹脂に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel thermosetting resin improved to have a high-density crosslinked structure. Among thermosetting resins, electronic parts, automobile parts, which require particularly high reliability, The present invention relates to a thermosetting resin that is preferably used in information communication devices and structural members.
【0002】本発明はまた、この熱硬化性樹脂の好適な
製造法及びこの熱硬化性樹脂を硬化して得られる硬化物
に関する。The present invention also relates to a suitable method for producing the thermosetting resin and a cured product obtained by curing the thermosetting resin.
【0003】[0003]
【従来の技術】熱硬化性樹脂は耐熱性、寸法安定性等の
優れた特性により熱可塑性樹脂と比べ高い信頼性を有し
産業上の様々な分野で広く用いられているが、これは熱
硬化性樹脂に特有の架橋構造によるところが大きく、特
に高い耐熱性を示すフェノール樹脂やメラミン樹脂等は
非常に高密度の架橋構造を有している。しかしこのよう
な高密度の架橋構造は樹脂硬化物に脆く靭性に乏しいと
いう欠点をも与える。2. Description of the Related Art Thermosetting resins have higher reliability than thermoplastic resins due to their excellent properties such as heat resistance and dimensional stability, and are widely used in various industrial fields. This is largely due to the cross-linking structure peculiar to the curable resin, and particularly phenol resin, melamine resin and the like which have high heat resistance have a very high density cross-linking structure. However, such a high-density cross-linked structure also gives the cured resin a disadvantage of being brittle and poor in toughness.
【0004】一方これらの汎用熱硬化性樹脂に対して、
樹脂の単位構造そのものの剛直性によって、架橋密度が
大きくなくても高い耐熱性を示す樹脂が存在する。例え
ば近年特開昭49−47378号公報において加熱によ
り重合しうるジヒドロベンゾオキサジン環を有する化合
物(以下、ジヒドロベンゾオキサジン化合物と称するこ
とがある。)が示されており、これらは上述の汎用熱硬
化性樹脂と比べ重合点の存在割合、すなわち硬化物にお
ける架橋密度が小さいにもかかわらず上述の汎用熱硬化
性樹脂に匹敵する高い耐熱性や機械強度を有している。On the other hand, for these general-purpose thermosetting resins,
Due to the rigidity of the resin unit structure itself, there are resins that exhibit high heat resistance even if the crosslink density is not large. For example, in recent years, JP-A-49-47378 discloses a compound having a dihydrobenzoxazine ring which can be polymerized by heating (hereinafter sometimes referred to as a dihydrobenzoxazine compound), and these are general-purpose thermosetting compounds described above. It has high heat resistance and mechanical strength comparable to the above-mentioned general-purpose thermosetting resins, even though the ratio of polymerization points is smaller than that of the thermosetting resin, that is, the crosslink density in the cured product is small.
【0005】この低架橋密度ながら優れた特性を有する
ジヒドロベンゾオキサジン化合物を更に高架橋密度化で
きれば、より高い耐熱性や機械強度が期待でき、その産
業上の利用範囲を更に拡げることが可能となる。しかし
ながらジヒドロベンゾオキサジン化合物の高架橋密度化
には非常に困難が伴う。というのはジヒドロベンゾオキ
サジン環は加熱により容易に重合しうるという有用な性
質の代償として、合成時においても部分的に重合反応が
伴うという欠点をも有しており、ジヒドロベンゾオキサ
ジン環を高密度に形成しようとすると、この副反応によ
ってゲル化が起こり安定な熱硬化性樹脂とはなり得な
い。このために、例えば米国特許第4501864号明
細書には、ポリアミンを用いることを特徴とするジヒド
ロエンゾオキサジン化合物の硬化法が示されているが、
直接ポリアミンのアミノ基をジヒドロベンゾオキサジン
化することなく、ジヒドロベンゾオキサジン環を低密度
に含有する化合物とポリアミンを組成物として調製し重
合時に反応させるという手法を用いている。当然、この
手法では硬化反応以前は組成物中の各成分を互いに反応
させず、かつ均一に混合した状態に保つ必要があるが、
組成物調製時に用いる混練法、充填材、第3成分、溶剤
等によっては成分間の反応や相分離が起こってしまい、
反応の制御と相分離の防止との両立が極めて困難であ
る。[0005] If the dihydrobenzoxazine compound having excellent properties in spite of the low cross-linking density can be made to have a higher cross-linking density, higher heat resistance and mechanical strength can be expected, and the industrial application range thereof can be further expanded. However, it is very difficult to increase the crosslink density of the dihydrobenzoxazine compound. This is because the dihydrobenzoxazine ring has the disadvantage of being partially polymerized during synthesis, at the cost of its useful property that it can be easily polymerized by heating. If it is attempted to form, the side reaction causes gelation and cannot be a stable thermosetting resin. For this reason, for example, US Pat. No. 4,501,864 discloses a method for curing a dihydroenzoxazine compound, which is characterized by using a polyamine.
A method in which a compound containing a dihydrobenzoxazine ring at a low density and a polyamine are prepared as a composition and reacted at the time of polymerization without directly converting the amino group of the polyamine to dihydrobenzoxazine is used. Naturally, in this method, it is necessary to prevent the components in the composition from reacting with each other before the curing reaction and to keep them in a uniformly mixed state.
Depending on the kneading method used for preparing the composition, the filler, the third component, the solvent, etc., reaction between the components or phase separation may occur,
It is extremely difficult to achieve both control of reaction and prevention of phase separation.
【0006】[0006]
【発明が解決しようとする課題】本発明は、安定な均一
組成でかつ重合後は従来のジヒドロベンゾオキサジン化
合物を凌駕する高い架橋密度を形成する新規なジヒドロ
ベンゾオキサジン環を有する熱硬化性樹脂、その硬化物
及びこの熱硬化性樹脂の製造法を提供することを目的と
する。DISCLOSURE OF THE INVENTION The present invention provides a thermosetting resin having a novel dihydrobenzoxazine ring, which has a stable and uniform composition and, after polymerization, forms a high crosslink density superior to that of conventional dihydrobenzoxazine compounds. It is intended to provide a cured product thereof and a method for producing the thermosetting resin.
【0007】[0007]
【課題を解決するための手段】上記課題を解決するため
に本発明者らは鋭意検討の結果、下記に示すとおり2価
アミン化合物の構造を分子内に導入することにより、ゲ
ル化を起こすことなく高密度のベンゾオキサジン環を有
する熱硬化性樹脂を製造できることを見出し、こに知見
に基づいて本発明を完成するに至った。Means for Solving the Problems In order to solve the above problems, the inventors of the present invention have conducted extensive studies and as a result, introduced a structure of a divalent amine compound into the molecule to cause gelation as shown below. It has been found that a thermosetting resin having a high-density benzoxazine ring can be produced without the need, and the present invention has been completed based on this finding.
【0008】すなわち本発明は、ポリフェノール化合
物、ホルムアルデヒド、少なくとも1種類の2価1級ア
ミン化合物及び少なくとも1種類の1価1級アミン化合
物の4成分を、ポリフェノール化合物のフェノール核の
モル数:ホルムアルデヒドのモル数:2価1級アミン化
合物のアミノ基と1価1級アミン化合物のアミノ基の合
計のモル数が1〜3:2〜2.2:1のモル比で、2価
1級アミン化合物のアミノ基のモル数:1価1級アミン
化合物のアミノ基のモル数が1:9〜5:5のモル比で
反応させることを特徴とする熱硬化性樹脂の製造法を提
供するものである。That is, in the present invention, four components of a polyphenol compound, formaldehyde, at least one kind of divalent primary amine compound and at least one kind of monovalent primary amine compound are added to the polyphenol compound in the number of moles of phenol nucleus: formaldehyde. Molar number: The divalent primary amine compound has a molar ratio of 1 to 3: 2 to 2.2: 1 in terms of the total mole number of the amino group of the divalent primary amine compound and the amino group of the monovalent primary amine compound. The number of moles of amino groups of 1): a method for producing a thermosetting resin, characterized in that the number of moles of amino groups of a monovalent primary amine compound is reacted in a molar ratio of 1: 9 to 5: 5. is there.
【0009】ジヒドロベンゾオキサジン環を有する化合
物の重合反応は、ジヒドロベンゾオキサジン環1個につ
き下記式(1)の如く進行する。The polymerization reaction of the compound having a dihydrobenzoxazine ring proceeds as shown in the following formula (1) for each dihydrobenzoxazine ring.
【0010】[0010]
【化1】 (式中、nはジヒドロベンゾオキサジン環の数を表
す。) 従って、ポリフェノール化合物からジヒドロベンゾオキ
サジン化合物を合成した場合、アミン化合物が全て1価
であってもその硬化物は架橋構造を有する。従ってポリ
フェノール化合物からジヒドロベンゾオキサジン化合物
の合成時に前述の副反応が生じると、硬化前の段階にお
いても僅かながら架橋構造が生じるが、これだけでは樹
脂全体をゲル化させるには至らない。しかしアミン化合
物として2価のものを用いると、ポリフェノール化合物
によって生じる架橋構造とアミン化合物の多官能化によ
る架橋が相乗効果として現れ、温和な条件下で合成を行
っても合成中に急速にゲル化が起き、多官能化されたジ
ヒドロベンゾオキサジン化合物は製造できない。そこ
で、ポリフェノール化合物/1価アミンシステム中へゲ
ル化を起こさぬ範囲で如何に多くの2価アミン化合物を
導入できるかが本発明における重要な要素となる。Embedded image (In the formula, n represents the number of dihydrobenzoxazine rings.) Therefore, when a dihydrobenzoxazine compound is synthesized from a polyphenol compound, the cured product has a crosslinked structure even if all the amine compounds are monovalent. Therefore, when the above-mentioned side reaction occurs during the synthesis of the dihydrobenzoxazine compound from the polyphenol compound, a slight cross-linked structure is generated even before the curing, but this alone does not lead to gelation of the entire resin. However, if a divalent amine compound is used, the cross-linking structure generated by the polyphenol compound and the cross-linking due to the polyfunctionalization of the amine compound appear as a synergistic effect, and even if the synthesis is performed under mild conditions, gelation occurs rapidly during the synthesis. Occurs, and a polyfunctionalized dihydrobenzoxazine compound cannot be produced. Therefore, an important factor in the present invention is how many divalent amine compounds can be introduced into the polyphenol compound / monovalent amine system within a range that does not cause gelation.
【0011】[0011]
【発明の実施の形態】具体的には、2価1級アミン化合
物のアミノ基のモル数と1価1級アミン化合物のアミノ
基のモル数の比が、2価1級アミン化合物のアミノ基:
1価1級アミン化合物のアミノ基=1:9〜5:5のモ
ル比であることが必要であり、特に2:8〜4:6であ
ることが望ましい。Specifically, the ratio of the number of moles of amino groups of a divalent primary amine compound to the number of moles of amino groups of a monovalent primary amine compound is such that the amino group of a divalent primary amine compound is :
The amino group of the monovalent primary amine compound needs to have a molar ratio of 1: 9 to 5: 5, and particularly preferably 2: 8 to 4: 6.
【0012】また、架橋度がアミン化合物の多官能度と
ポリフェノール化合物のフェノール核の多官能度の相乗
効果による以上、ポリフェノール化合物の構造にも適正
な範囲が存在する。すなわち、ポリフェノール化合物と
しては、ビスフェノールあるいはホルムアルデヒドとフ
ェノールとをホルムアルデヒド:フェノール=4〜7:
10のモル比で反応させて得られたフェノールノボラッ
ク樹脂を用いることが好ましい。Further, since the degree of cross-linking is due to the synergistic effect of the polyfunctionality of the amine compound and the polyfunctionality of the phenol nucleus of the polyphenol compound, there is an appropriate range in the structure of the polyphenol compound. That is, as the polyphenol compound, bisphenol or formaldehyde and phenol are formaldehyde: phenol = 4 to 7:
It is preferable to use a phenol novolac resin obtained by reacting at a molar ratio of 10.
【0013】ビスフェノールとしては具体的には、Specific examples of bisphenol include:
【0014】[0014]
【化2】 等が用いられる。中でも、特にビスフェノールAが好ま
しい。Embedded image Etc. are used. Among them, bisphenol A is particularly preferable.
【0015】一方、1価1級アミン化合物としては、例
えば、メチルアミン、シクロヘキシルアミン、アニリ
ン、炭素数1〜12のアルキル基又はアリール基で置換
された置換アニリン等の置換アニリンなどが用いられる
が、ジヒドロベンゾオキサジン環の安定性及び硬化物の
耐熱性の観点から特にアニリンが好ましい。On the other hand, as the monovalent primary amine compound, for example, methylamine, cyclohexylamine, aniline, substituted aniline such as substituted aniline substituted with an alkyl group having 1 to 12 carbon atoms or an aryl group, and the like are used. From the viewpoint of the stability of the dihydrobenzoxazine ring and the heat resistance of the cured product, aniline is particularly preferable.
【0016】また、2価1級アミン化合物としては、Further, as the divalent primary amine compound,
【0017】[0017]
【化3】 等が用いられる。特に1価1級アミン化合物の場合と同
様芳香族ジアミンが望ましく、中でもp−フェニレンジ
アミン及び2,2−ビス[4−(4−アミノフェノキ
シ)フェニル]プロパンが好ましい。Embedded image Etc. are used. Aromatic diamines are particularly preferable as in the case of monovalent primary amine compounds, and among them, p-phenylenediamine and 2,2-bis [4- (4-aminophenoxy) phenyl] propane are preferable.
【0018】本発明の熱硬化性樹脂の製造法は上述の通
り製造過程におけるゲル化の抑制に特に配慮した原料構
成となっており、これらの原料を反応させて目的とする
熱硬化性樹脂を製造する。反応方法としては、具体的に
は、ホルムアルデヒドの水溶液中にポリフェノール化合
物、2価1級アミン化合物、1価1級アミン化合物の混
合物をそのままであるいは溶剤に溶解して添加し、70
〜140℃の温度で20分〜8時間反応させることが好
ましい。この範囲外で反応を行ったり、あるいは原材料
の添加順序を変えると製造中にゲル化が起きたりあるい
は未反応物が多量に残留することがある。As described above, the method for producing a thermosetting resin of the present invention has a raw material composition in which the suppression of gelation in the production process is particularly taken into consideration. By reacting these raw materials, the desired thermosetting resin is obtained. To manufacture. As a reaction method, specifically, a mixture of a polyphenol compound, a divalent primary amine compound and a monovalent primary amine compound is added to an aqueous solution of formaldehyde as it is or after it is dissolved in a solvent and added.
It is preferable to react at a temperature of 140 ° C for 20 minutes to 8 hours. If the reaction is carried out outside this range, or if the order of addition of the raw materials is changed, gelation may occur during production or a large amount of unreacted substances may remain.
【0019】本発明の熱硬化性樹脂は、従来より知られ
ているジヒドロベンゾオキサジン化合物と同様に加熱の
みにより揮発性副生物を放出することなく硬化する。た
だし、硬化前の段階において部分的な架橋構造が形成さ
れているため硬化時の流動性には若干劣ることから、高
温で加圧成形する硬化法が適している。具体的には、1
50〜220℃で20分〜2時間加熱することにより所
望の硬化物が生成する。Like the conventionally known dihydrobenzoxazine compound, the thermosetting resin of the present invention is cured only by heating without releasing volatile by-products. However, since a partially crosslinked structure is formed in the stage before curing, the fluidity at the time of curing is slightly inferior, and therefore, a curing method of press molding at high temperature is suitable. Specifically, 1
A desired cured product is produced by heating at 50 to 220 ° C. for 20 minutes to 2 hours.
【0020】硬化物は2価1級アミン化合物の作用によ
り高耐熱、高強度、高弾性、低寸法変化の優れた特性を
有するが、これは2価1級アミン化合物により硬化物の
アミノメチレン鎖が部分的に固定されることによる。The cured product has excellent properties such as high heat resistance, high strength, high elasticity and low dimensional change due to the action of the divalent primary amine compound. Is partly fixed.
【0021】[0021]
【実施例】以下、具体例を挙げて本発明を具体的に説明
するが、本発明はこれらに限定されるものではない。EXAMPLES The present invention will be specifically described below with reference to specific examples, but the present invention is not limited thereto.
【0022】実施例1 アニリン745g(8モル相当)、p−フェニレンジア
ミン108g(1モル相当)を80℃で混合して均一溶
液とし、次いでビスフェノールA1141g(5モル相
当)を加え更に混合し、スラリーを得た。別途3リット
ルフラスコ中にホルマリン(37%水溶液)1623g
(20モル相当)を秤量し90℃に加熱し、撹拌しつつ
上記スラリーを20分間かけて少しづつ加えた。添加
後、発熱に注意しながらフラスコ内を90〜100℃に
保ち、30分後冷却、固化させ生成物をバット上に取り
出した。これを粗粉砕し100℃で4時間減圧乾燥して
多官能ジヒドロベンゾオキサジン1を得た。この多官能
ジヒドロベンゾオキサジン1をソックスレー抽出器を用
いてメチルエチルケトンにより抽出し、残渣を乾燥・秤
量してその抽出前の重量に対する割合をゲル分率として
求めた。表1にゲル分率を示すが、多官能ジヒドロベン
ゾオキサジン1の場合は0.02%以下であった。Example 1 745 g of aniline (corresponding to 8 mol) and 108 g of p-phenylenediamine (corresponding to 1 mol) were mixed at 80 ° C. to form a uniform solution, and 1141 g of bisphenol A (corresponding to 5 mol) was added and further mixed to form a slurry. Got Separately 1623 g of formalin (37% aqueous solution) in a 3 liter flask
(Corresponding to 20 mol) was weighed and heated to 90 ° C., and the above slurry was added little by little over 20 minutes while stirring. After the addition, paying attention to heat generation, the inside of the flask was kept at 90 to 100 ° C., and after 30 minutes, the product was cooled and solidified, and the product was taken out on a vat. This was roughly crushed and dried under reduced pressure at 100 ° C. for 4 hours to obtain polyfunctional dihydrobenzoxazine 1. This polyfunctional dihydrobenzoxazine 1 was extracted with methyl ethyl ketone using a Soxhlet extractor, the residue was dried and weighed, and the ratio to the weight before extraction was determined as a gel fraction. The gel fraction is shown in Table 1. In the case of polyfunctional dihydrobenzoxazine 1, it was 0.02% or less.
【0023】この多官能ジヒドロベンゾオキサジン1を
粉砕し100×100×4mmの金型内に充填し、油圧
プレス装置で200℃・30分・30kgf/cm2の
条件で加熱加圧し、板状の成形品を得た。これを適宜切
断し、特性試験に供した。表1に硬化物特性を示す。ま
た、図1にこの多官能ジヒドロベンゾオキサジン1硬化
物のIRスペクトルを示す。This polyfunctional dihydrobenzoxazine 1 was crushed and filled in a mold of 100 × 100 × 4 mm, and heated and pressed under the conditions of 200 ° C., 30 minutes and 30 kgf / cm 2 by a hydraulic press machine to obtain a plate-like shape. A molded product was obtained. This was appropriately cut and subjected to a characteristic test. Table 1 shows the characteristics of the cured product. Further, FIG. 1 shows an IR spectrum of this cured polyfunctional dihydrobenzoxazine 1.
【0024】実施例2 実施例1におけるアニリン及びp−フェニレンジアミン
の配合量をアニリン559g(6モル相当)、p−フェ
ニレンジアミン216g(2モル相当)に替えて、同様
に多官能ジヒドロベンゾオキサジン2を合成した。ただ
しアニリン・p−フェニレンジアミン・ビスフェノール
A混合スラリーの粘度を低減するため、エタノール50
0gを添加した。この多官能ジヒドロベンゾオキサジン
2のゲル分率を表1に示す。また、実施例1と同様に多
官能ジヒドロベンゾオキサジン2を硬化させた。硬化物
特性を表1に、硬化物のIRスペクトルを図2に示す。Example 2 In the same manner as in Example 1, except that the amounts of aniline and p-phenylenediamine compounded were 559 g (corresponding to 6 mol) of aniline and 216 g (corresponding to 2 mol) of p-phenylenediamine, polyfunctional dihydrobenzoxazine 2 was similarly added. Was synthesized. However, in order to reduce the viscosity of the aniline / p-phenylenediamine / bisphenol A mixed slurry, ethanol 50
0 g was added. The gel fraction of this polyfunctional dihydrobenzoxazine 2 is shown in Table 1. Further, the polyfunctional dihydrobenzoxazine 2 was cured in the same manner as in Example 1. The characteristics of the cured product are shown in Table 1, and the IR spectrum of the cured product is shown in FIG.
【0025】実施例3 実施例2のp−フェニレンジアミンに替えて2,2−ビ
ス[4−(4−アミノフェノキシ)フェニル]プロパン
821g(2モル相当)を用い、同様に多官能ジヒドロ
ベンゾオキサジン3を合成した。ただし、アニリン・
2,2−ビス[4−(4−アミノフェノキシ)フェニ
ル]プロパン・ビスフェノールA混合スラリーの粘度の
低減のためにメチルセロソルブ1000gを添加した。
ゲル分率を表1に示す。また、実施例1と同様に多官能
ジヒドロベンゾオキサジン3を硬化させた。硬化物特性
を表1に、硬化物のIRスペクトルを図3に示す。Example 3 In place of the p-phenylenediamine of Example 2, 821 g (corresponding to 2 mol) of 2,2-bis [4- (4-aminophenoxy) phenyl] propane was used, and a polyfunctional dihydrobenzoxazine was similarly prepared. 3 was synthesized. However, aniline
In order to reduce the viscosity of the 2,2-bis [4- (4-aminophenoxy) phenyl] propane / bisphenol A mixed slurry, 1000 g of methyl cellosolve was added.
The gel fraction is shown in Table 1. Further, the polyfunctional dihydrobenzoxazine 3 was cured in the same manner as in Example 1. The properties of the cured product are shown in Table 1, and the IR spectrum of the cured product is shown in FIG.
【0026】比較例1 実施例1においてアニリン・p−フェニレンジアミン混
合物をアニリンのみ931g(10モル相当)に替えて
同様に多官能ジヒドロベンゾオキサジン4を合成した。
また、同様に硬化物を作製した。ゲル分率及び硬化物特
性を表1に示す。Comparative Example 1 Polyfunctional dihydrobenzoxazine 4 was synthesized in the same manner as in Example 1, except that the aniline / p-phenylenediamine mixture was replaced by 931 g (corresponding to 10 mol) of aniline.
A cured product was prepared in the same manner. The gel fraction and cured product properties are shown in Table 1.
【0027】比較例2 実施例1においてアニリン・p−フェニレンジアミンの
配合量をアニリン279g(3モル相当)、p−フェニ
レンジアミン378g(3.5モル相当)に替えて、同
様に多官能ジヒドロベンゾオキサジン5及びその硬化物
を得た。ただし、アニリン・p−フェニレンジアミン混
合スラリーの粘度を低減するためメチルセロソルブ10
00gを添加した。ゲル分率及び硬化物特性を表1に示
す。Comparative Example 2 In the same manner as in Example 1, except that the compounding amount of aniline / p-phenylenediamine was changed to 279 g of aniline (corresponding to 3 mol) and 378 g of p-phenylenediamine (corresponding to 3.5 mol), polyfunctional dihydrobenzo was similarly used. Oxazine 5 and its cured product were obtained. However, in order to reduce the viscosity of the aniline / p-phenylenediamine mixed slurry, methyl cellosolve 10
00 g was added. The gel fraction and cured product properties are shown in Table 1.
【0028】[0028]
【表1】 [Table 1]
【0029】[0029]
【発明の効果】本発明の多官能ジヒドロベンゾオキサジ
ンから成る熱硬化性樹脂は、低架橋密度ながら比較的高
い特性を有するジヒドロベンゾオキサジン化合物を、製
造上の問題点をクリアしつつ高架橋密度化したものであ
り、実用に供され得る熱硬化性樹脂としてトップクラス
の耐熱性、機械特性を実現したものである。そのため熱
硬化性樹脂の中でも特に信頼性の求められる電子部品、
自動車部品、情報通信機器、構造部材等に好適である。The thermosetting resin comprising the polyfunctional dihydrobenzoxazine of the present invention is a dihydrobenzoxazine compound having a relatively high property while having a low crosslink density, and has a high crosslink density while clearing the problems in production. It is a thermosetting resin that can be put to practical use and has achieved top class heat resistance and mechanical properties. Therefore, among thermosetting resins, electronic components that require particularly reliability,
It is suitable for automobile parts, information and communication equipment, structural members, etc.
【図1】実施例1で得られた熱硬化性樹脂硬化物のIR
スペクトル。FIG. 1 is the IR of a thermosetting resin cured product obtained in Example 1.
Spectrum.
【図2】実施例2で得られた熱硬化性樹脂硬化物のIR
スペクトル。FIG. 2 IR of cured thermosetting resin obtained in Example 2
Spectrum.
【図3】実施例3で得られた熱硬化性樹脂硬化物のIR
スペクトル。FIG. 3 IR of cured thermosetting resin obtained in Example 3
Spectrum.
Claims (5)
ド、少なくとも1種類の2価1級アミン化合物及び少な
くとも1種類の1価1級アミン化合物の4成分を、ポリ
フェノール化合物のフェノール核のモル数:ホルムアル
デヒドのモル数:2価1級アミン化合物のアミノ基と1
価1級アミン化合物のアミノ基の合計のモル数が1〜
3:2〜2.2:1のモル比で、2価1級アミン化合物
のアミノ基のモル数:1価1級アミン化合物のアミノ基
のモル数が1:9〜5:5のモル比で反応させることを
特徴とする熱硬化性樹脂の製造法。1. A polyphenol compound, a formaldehyde, at least one divalent primary amine compound, and at least one monovalent primary amine compound are added to four components, the number of moles of the phenol nucleus of the polyphenol compound: the number of moles of formaldehyde: Amino group of divalent primary amine compound and 1
The total number of moles of amino groups of the valent primary amine compound is 1 to
In the molar ratio of 3: 2 to 2.2: 1, the number of moles of the amino group of the divalent primary amine compound: the molar ratio of the number of moles of the amino group of the monovalent primary amine compound is 1: 9 to 5: 5. A method for producing a thermosetting resin, which comprises reacting with.
あるいはホルムアルデヒドとフェノールとをホルムアル
デヒド:フェノール=4〜7:10のモル比で反応させ
て得られたフェノールノボラック樹脂である請求項1記
載の熱硬化性樹脂の製造法。2. The production of a thermosetting resin according to claim 1, wherein the polyphenol compound is a phenol novolac resin obtained by reacting bisphenol or formaldehyde with phenol at a molar ratio of formaldehyde: phenol = 4 to 7:10. Law.
ノール化合物、2価1級アミン化合物及び1価1級アミ
ン化合物の混合物をそのままあるいは溶剤に溶解して添
加し、70〜140℃の温度で20分〜8時間反応させ
る請求項1又は2記載の熱硬化性樹脂の製造法。3. A mixture of a polyphenol compound, a divalent primary amine compound and a monovalent primary amine compound is added to an aqueous formaldehyde solution as it is or after being dissolved in a solvent, and the mixture is added at a temperature of 70 to 140 ° C. for 20 minutes to 8 minutes. The method for producing a thermosetting resin according to claim 1, wherein the thermosetting resin is reacted for a time.
得られた熱硬化性樹脂。4. A thermosetting resin obtained by the manufacturing method according to claim 1.
〜220℃で20分〜2時間加熱することにより得られ
る硬化物。5. The thermosetting resin according to claim 4,
A cured product obtained by heating at 220 ° C for 20 minutes to 2 hours.
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Cited By (10)
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JPH11106465A (en) * | 1997-09-30 | 1999-04-20 | Hitachi Chem Co Ltd | Production of phenolic resin-based self hardening resin |
WO2007097305A1 (en) * | 2006-02-20 | 2007-08-30 | Sekisui Chemical Co., Ltd. | Method for producing thermosetting resin, thermosetting resin, thermosetting composition containing same, molded body, cured body, and electronic device containing those |
WO2007129640A1 (en) * | 2006-05-01 | 2007-11-15 | Sekisui Chemical Co., Ltd. | Sintered resin product and electronic device comprising the same |
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