JPH0957770A - Die structure - Google Patents
Die structureInfo
- Publication number
- JPH0957770A JPH0957770A JP7216023A JP21602395A JPH0957770A JP H0957770 A JPH0957770 A JP H0957770A JP 7216023 A JP7216023 A JP 7216023A JP 21602395 A JP21602395 A JP 21602395A JP H0957770 A JPH0957770 A JP H0957770A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- mold surface
- vacuum
- heater
- surface member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011148 porous material Substances 0.000 claims abstract description 13
- 239000002923 metal particle Substances 0.000 claims abstract description 11
- 239000011230 binding agent Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 13
- 238000010097 foam moulding Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 239000011347 resin Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 16
- 239000002245 particle Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000005187 foaming Methods 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 230000035699 permeability Effects 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 239000006260 foam Substances 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Instrument Panels (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Molding Of Porous Articles (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、自動車のインスト
ルメントパネルなど、表皮（フィルムを含む）をもつ発
泡成形品を製造する場合に利用される金型の構造に関
し、詳しくは表皮を真空引きなどで型面に沿わせて発泡
成形するための金型構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a mold used for producing a foam-molded article having a skin (including a film) such as an instrument panel of an automobile, and more specifically, vacuuming the skin. The present invention relates to a mold structure for foam molding along the mold surface.
【０００２】[0002]
【従来の技術】自動車のインストルメントパネルなどを
製造するには、ＰＶＣなどの軟質樹脂を用いて、先ず真
空成形あるいはパウダースラッシュ成形などにより所定
形状の表皮を形成する。次に発泡成形型内にその表皮を
配置し、真空引きにより表皮を型面に吸着させる。そし
て形状保持の為の樹脂製インサートを型内に配置し、イ
ンサートと表皮の間にウレタンなどの発泡樹脂を注入し
て発泡させることで、表皮及びインサートと一体的に接
合された発泡成形品が得られる。2. Description of the Related Art To manufacture an automobile instrument panel or the like, a soft resin such as PVC is first used to form a skin having a predetermined shape by vacuum forming or powder slush forming. Next, the skin is placed in the foaming mold, and the skin is attracted to the mold surface by vacuuming. Then, by placing a resin insert for shape retention in the mold and injecting a foaming resin such as urethane between the insert and the skin to cause foaming, a foam molded product integrally joined with the skin and the insert is obtained. can get.
【０００３】またウレタンの発泡成形の際に型面にフィ
ルムを吸着させ、発泡成形品表面にフィルム層を形成す
ることで表面品質を向上させることも行われている。こ
のとき型面にシボ模様などを形成しておき、真空引きに
よりフィルムを型面に吸着することで型面のシボ模様な
どをフィルムに転写させて意匠性を一層高めることも行
われている。It has also been attempted to improve the surface quality by adsorbing a film on the mold surface during foam molding of urethane and forming a film layer on the surface of the foam molded article. At this time, a texture pattern or the like is formed on the mold surface, and the film is attracted to the mold surface by vacuuming to transfer the texture pattern or the like on the mold surface to the film to further enhance the design.
【０００４】そして上記の発泡成形に用いられる金型で
は、型面に開口する複数の真空孔が設けられ、真空引き
による表皮の型面への吸着を可能としている。In the mold used for the foam molding described above, a plurality of vacuum holes are formed in the mold surface so that the skin can be attracted to the mold surface by vacuuming.
【０００５】[0005]
【発明が解決しようとする課題】ところで発泡成形の場
合には金型を所定温度に制御して発泡反応を促進させる
ために、金型内にはヒーターが埋設されている。したが
って、このヒーターが埋設された位置に貫通する真空孔
を形成することは困難であり、そのため従来の金型構造
においては真空孔の位置に制約が生じていた。In the case of foam molding, a heater is embedded in the mold in order to control the mold at a predetermined temperature to promote the foaming reaction. Therefore, it is difficult to form a vacuum hole penetrating the position where the heater is embedded, and thus the position of the vacuum hole is restricted in the conventional mold structure.
【０００６】例えば、表皮の意匠部分は特に型面に沿う
正確な形状とする必要があるが、その位置に対応する位
置にヒーターが存在すると真空孔を設けることができな
い。一方、ヒーターをその位置を避けて配置すれば、真
空孔は所望の位置とすることができるもののその位置に
おける温度制御が不十分となってしまう。また位置ずれ
などにより発泡樹脂が表皮と型面の間に進入する場合も
あるが、この場合には真空孔内に発泡樹脂が進入して真
空孔が閉塞されるという不具合が発生する。したがって
次の成形までに真空孔内の樹脂を除去することが行われ
ているが、金型は重く、また真空孔の長さが長い場合が
多く、メンテナンスの工数が多大であるとともに成形の
サイクルタイムの増大の原因となっている。For example, the design portion of the skin needs to have an accurate shape especially along the mold surface, but if a heater exists at a position corresponding to that position, the vacuum hole cannot be provided. On the other hand, if the heater is arranged avoiding that position, the vacuum hole can be located at a desired position, but the temperature control at that position becomes insufficient. In addition, there is a case where the foamed resin enters between the skin and the mold surface due to misalignment or the like, but in this case, the foamed resin enters the vacuum hole to close the vacuum hole. Therefore, the resin in the vacuum hole is removed before the next molding, but the mold is heavy and the length of the vacuum hole is often long, which requires a lot of maintenance work and a molding cycle. This is the cause of the increase in time.
【０００７】本発明はこのような事情に鑑みてなされた
ものであり、真空孔及びヒーターの配設位置の自由度を
高めるとともに、真空孔内の樹脂を容易に除去できる金
型構造とすることを目的とする。The present invention has been made in view of the above circumstances, and provides a mold structure capable of increasing the degree of freedom in the arrangement positions of the vacuum hole and the heater and easily removing the resin in the vacuum hole. With the goal.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決する本発
明の金型構造の特徴は、キャビティ側をキャビティ外部
より高圧とすることで表皮を型面に沿わせた状態で発泡
成形を行う金型構造であって、金属粒とバインダとから
なり所定形状に形成された通気性の基体と、基体表面に
保持され表裏を貫通する細孔をもつ型面部材と、からな
ることにある。MEANS FOR SOLVING THE PROBLEMS The features of the mold structure of the present invention for solving the above-mentioned problems are that a mold for foaming is formed in a state where the skin is along the mold surface by making the pressure on the cavity side higher than that outside the cavity. The mold structure comprises a breathable substrate formed of metal particles and a binder in a predetermined shape, and a mold surface member having pores that are held on the surface of the substrate and penetrate through the front and back.
【０００９】[0009]
【発明の実施の形態】基体は金属粒とバインダとから形
成されて通気性を有している。つまり金属粒どうしの間
の隙間が連通する部分が多く、その隙間が通気通路とな
っている。一方、型面部材は基体表面に保持されて表裏
を貫通する細孔を有している。したがって細孔と基体の
通気通路とが連通するため、型面部材表面に表皮を配置
して基体側から真空吸引することで、型面への表皮の吸
着が可能となる。また表皮側から圧空を供給すれば、表
皮と型面部材との間の空気は細孔及び通気通路を介して
排除できるので、表皮は確実に型面に沿うように押圧さ
れる。BEST MODE FOR CARRYING OUT THE INVENTION The substrate is formed of metal particles and a binder and has air permeability. That is, there are many portions where the gaps between the metal particles communicate with each other, and the gaps serve as ventilation passages. On the other hand, the mold surface member has pores which are held on the surface of the substrate and penetrate the front and back. Therefore, since the pores communicate with the ventilation passages of the base, the skin can be adsorbed on the mold surface by disposing the skin on the surface of the mold surface member and vacuum suction from the base side. Further, if the compressed air is supplied from the skin side, the air between the skin and the mold surface member can be eliminated through the pores and the ventilation passages, so that the skin is surely pressed along the mold surface.
【００１０】このように金属粒とバインダとで通気性を
もつ基体とするには、金属粒の粒径はできるだけ均一と
することが望ましい。粒径の分布が広くなると、大きな
金属粒どうしの隙間に小さな金属粒が充填されることに
なり、十分な通気性が得られない場合がある。またバイ
ンダの量が多い場合にも隙間が充填されてしまうので、
金属粒とバインダとの比率は体積比で７：３〜９：１程
度とするのが望ましい。バインダの量がこの範囲より少
ないと基体の強度が不足し、多いと通気性が不足するよ
うになる。In order to form a gas-permeable substrate with the metal particles and the binder, it is desirable that the particle diameter of the metal particles be as uniform as possible. If the distribution of the particle size becomes wide, the small metal particles are filled in the gaps between the large metal particles, and sufficient air permeability may not be obtained. Also, when the amount of binder is large, the gap will be filled, so
The volume ratio of the metal particles to the binder is preferably about 7: 3 to 9: 1. If the amount of the binder is less than this range, the strength of the substrate will be insufficient, and if the amount is too large, the air permeability will be insufficient.
【００１１】金属粒の材質は特に制限されないが、ヒー
ターで温度を制御する場合には熱伝導率の高い金属を用
いることが望ましい。また重量は軽い方が望ましいの
で、アルミニウム又はアルミニウム合金を用いるのが特
に望ましい。またバインダの材質も特に制限されない
が、ヒーターを用いる場合にはエポキシ樹脂やフェノー
ル樹脂などの耐熱性に優れた樹脂が望ましい。The material of the metal particles is not particularly limited, but it is desirable to use a metal having a high thermal conductivity when controlling the temperature with a heater. Since it is desirable that the weight is light, it is particularly desirable to use aluminum or an aluminum alloy. The material of the binder is also not particularly limited, but when a heater is used, a resin having excellent heat resistance such as epoxy resin or phenol resin is desirable.
【００１２】型面部材としては、精密な型面をもつ必要
があることから、従来の金型と同様の金属から形成する
ことが望ましい。例えばニッケル合金などから電鋳加工
により形成することができる。この型面部材は、基体に
着脱自在に保持された状態とするのが望ましい。これに
より細孔に樹脂が進入した場合のメンテナンスが容易と
なる。また型面部材は板状の肉厚の薄い形状とすること
ができるので、細孔の長さが短く、この点からも細孔内
の樹脂の除去が容易である。Since it is necessary for the mold surface member to have a precise mold surface, it is desirable to form the mold surface member from the same metal as that of the conventional mold. For example, it can be formed by electroforming from a nickel alloy or the like. It is desirable that the mold surface member be detachably held by the base body. This facilitates maintenance when the resin enters the pores. Further, since the mold surface member can be formed in a thin plate shape, the length of the pores is short, and from this point also, the resin in the pores can be easily removed.
【００１３】[0013]
【実施例】以下、実施例により本発明をさらに具体的に
説明する。図１に本実施例の金型構造を示す。この金型
構造は、枠体１０と底板１１とからなる箱部材１と、底
板１１と間隔を隔てて設けられ箱部材１を区画するサン
ドバック２と、サンドバック２表面に形成された基体３
と、基体３表面に保持された型面部材４とから構成され
ている。EXAMPLES The present invention will be described in more detail below with reference to examples. FIG. 1 shows the mold structure of this embodiment. This mold structure has a box member 1 including a frame 10 and a bottom plate 11, a sand bag 2 that is provided at a distance from the bottom plate 11 to partition the box member 1, and a base body 3 formed on the surface of the sand bag 2.
And the mold surface member 4 held on the surface of the base body 3.
【００１４】箱部材１の底板１１には真空通路１２が形
成され、真空通路１２は切り換えバルブ１３を介して図
示しない真空装置に連結されている。また枠体１０の一
部にはリード線取り出し口１４が設けられている。サン
ドバック２は基体３の放熱を防止する断熱材として機能
するとともに基体３を保持するものであり、砂にエポキ
シ樹脂が含浸固化して形成されている。このサンドバッ
ク２と底板１１の間には空間部２０が形成されている。
またサンドバック２には、複数の真空流通パイプ２１が
サンドバック２を貫通して埋設され、真空流通パイプ２
１は空間部２０と連通している。つまり空間部２０は真
空通路１２及び真空流通パイプ２１とのみ連通してい
る。A vacuum passage 12 is formed in the bottom plate 11 of the box member 1, and the vacuum passage 12 is connected to a vacuum device (not shown) via a switching valve 13. A lead wire outlet 14 is provided in a part of the frame body 10. The sandbag 2 functions as a heat insulating material for preventing heat dissipation of the base body 3 and holds the base body 3, and is formed by impregnating and solidifying epoxy resin in sand. A space 20 is formed between the sandbag 2 and the bottom plate 11.
A plurality of vacuum circulation pipes 21 are embedded in the sandbag 2 so as to penetrate through the sandbag 2,
1 communicates with the space portion 20. That is, the space 20 communicates only with the vacuum passage 12 and the vacuum circulation pipe 21.
【００１５】基体３は、アルミニウム粒子とエポキシ樹
脂から形成されている。アルミニウム粒子は篩いにより
１〜２ｍｍの大きさに分級されたものが用いられ、アル
ミニウム粒子６．５重量部に対してエポキシ樹脂及び硬
化剤が１重量部となるように混合され、エポキシ樹脂が
固化することで形状及び強度が与えられている。またこ
のときアルミニウム粒子の体積に対する硬化したエポキ
シ樹脂の体積比は７：１であり、アルミニウム粒子どう
しの間には空隙が存在しているために、基体３は十分な
通気性を有している。そして基体３のサンドバック２に
接する側には、真空流通パイプ２１の一端部が埋設され
ている。The substrate 3 is made of aluminum particles and epoxy resin. The aluminum particles used are those classified by a sieve into a size of 1 to 2 mm, and the epoxy resin and the curing agent are mixed so as to be 1 part by weight with respect to 6.5 parts by weight of the aluminum particles, and the epoxy resin is solidified. By doing so, the shape and strength are given. At this time, the volume ratio of the cured epoxy resin to the volume of the aluminum particles is 7: 1, and since there are voids between the aluminum particles, the substrate 3 has sufficient air permeability. . One end of the vacuum circulation pipe 21 is embedded on the side of the base body 3 that contacts the sandbag 2.
【００１６】また基体３の型面部材４から約１０ｍｍ離
れた位置には、シリコーンゴムで被覆されたヒーター３
０が配置され、ヒーター３０のリード線３１及び型面部
材４に接して配置された図示しない温度センサーからの
リード線がリード線取り出し口１４から箱部材１の外部
に延びている。リード線取り出し口にはシール材１５が
充填され、箱部材１の気密性が維持されている。Further, a heater 3 covered with silicone rubber is provided at a position about 10 mm away from the mold surface member 4 of the substrate 3.
A lead wire from a temperature sensor (not shown) arranged in contact with the lead wire 31 of the heater 30 and the mold surface member 4 extends from the lead wire outlet 14 to the outside of the box member 1. The lead wire take-out port is filled with the sealing material 15, so that the airtightness of the box member 1 is maintained.
【００１７】型面部材４はニッケル合金から約３ｍｍ厚
さの所定形状に形成され、型面には電鋳加工により形成
されたシボ面４０が形成されている。また型面部材４に
は、表裏面を貫通する細孔としての直径１ｍｍの真空孔
４１が複数個形成されている。この型面部材４は、ボル
ト４２により基体３に着脱自在に保持されている。上記
のように構成された本実施例の金型では、真空通路１２
からの吸引力は空間部２０、真空流通パイプ２１、基体
３内部及び真空孔４１に伝わり、型面部材４のシボ面４
０側の空気が吸引される。また基体３はアルミニウム粒
子どうしの間隙により通気性を有しているので、基体３
内の空気流路は網の目のように存在する。したがってヒ
ーター３０の位置に関わらず安定して吸引することがで
きる。逆に、ヒーター３０は真空孔４１の位置に関わら
ずどこに設けてもよく、それによって吸引が妨げられる
ような不具合はない。The mold surface member 4 is formed of a nickel alloy into a predetermined shape having a thickness of about 3 mm, and the surface of the mold has an embossed surface 40 formed by electroforming. Further, the mold surface member 4 is formed with a plurality of vacuum holes 41 having a diameter of 1 mm as pores penetrating the front and back surfaces. The mold surface member 4 is detachably held by the base body 3 by a bolt 42. In the mold of this embodiment configured as described above, the vacuum passage 12
Is transmitted to the space 20, the vacuum flow pipe 21, the inside of the base body 3 and the vacuum hole 41, and the suction surface 4 of the mold surface member 4
The air on the 0 side is sucked. Further, since the base 3 has air permeability due to the gap between the aluminum particles, the base 3
The internal air flow path exists like a mesh. Therefore, stable suction can be performed regardless of the position of the heater 30. On the contrary, the heater 30 may be provided anywhere regardless of the position of the vacuum hole 41, and there is no inconvenience that the suction is hindered thereby.
【００１８】つまり型面部材４の真空孔４１の位置及び
ヒーター３０の位置は、互いに無関係に自由に設定する
ことができるので、型面形状に合わせた最適な位置に設
定することができる。またヒーター３０からの熱は、基
体３内で互いに接触しているアルミニウム粒子どうしを
伝って型面部材４に速やかに伝達されるため、型面部材
４の温度制御をより安定して行うことができる。That is, the positions of the vacuum holes 41 of the mold surface member 4 and the position of the heater 30 can be freely set independently of each other, so that they can be set at optimum positions according to the shape of the mold surface. Further, the heat from the heater 30 is quickly transferred to the mold surface member 4 through the aluminum particles that are in contact with each other in the base body 3, so that the temperature of the mold surface member 4 can be controlled more stably. it can.
【００１９】さらに型面部材４は基体３から着脱可能で
あるので、メンテナンスが容易であり、真空孔４１に発
泡樹脂が進入したとしても容易に除去することができ
る。以下、上記金型を用いて実際に発泡成形品を形成す
る方法を説明して、この金型の作用を一層具体的に説明
する。先ずウレタン製フィルム５が型面部材４表面に配
置され、図示しない真空装置により箱部材１の真空通路
１２から空気が吸引される。すると空間部２０、真空流
通パイプ２１、基体３内部及び真空孔４１の空気が吸引
され、フィルム５は図２に示すように型面部材４のシボ
面４０に吸着される。これによりフィルム５にはシボ面
４０の形状が転写され、シボ面４０の形状に賦形され
る。Further, since the mold surface member 4 is detachable from the base body 3, maintenance is easy and even if the foamed resin enters the vacuum hole 41, it can be easily removed. Hereinafter, a method of actually forming a foam-molded article using the above-mentioned mold will be described, and the action of this mold will be described more specifically. First, the urethane film 5 is arranged on the surface of the mold surface member 4, and air is sucked from the vacuum passage 12 of the box member 1 by a vacuum device (not shown). Then, the air in the space 20, the vacuum circulation pipe 21, the inside of the base 3 and the vacuum hole 41 is sucked, and the film 5 is adsorbed to the textured surface 40 of the mold surface member 4 as shown in FIG. As a result, the shape of the embossed surface 40 is transferred to the film 5 and shaped into the shape of the embossed surface 40.
【００２０】その状態で、型面に樹脂製インサート６０
が配置された他方の型部材６が箱部材１と型締めされ、
インサート６０とフィルム５との間に所定量のウレタン
発泡樹脂が注入される。型面部材４は熱伝導性に優れた
基体３により伝導されたヒーター３０からの熱により約
３５℃に温調されているため、発泡樹脂は均一に発泡し
てインサート６０とフィルム５との間を充填し、かつ発
泡成形体はインサート６０及びフィルム５と一体的に接
合される。In that state, a resin insert 60 is formed on the mold surface.
The other mold member 6 in which is arranged is clamped to the box member 1,
A predetermined amount of urethane foam resin is injected between the insert 60 and the film 5. Since the mold surface member 4 is temperature-controlled to about 35 ° C. by the heat from the heater 30 conducted by the base body 3 having excellent thermal conductivity, the foamed resin is uniformly foamed so that the gap between the insert 60 and the film 5 is increased. And the foamed molding is integrally bonded to the insert 60 and the film 5.
【００２１】なお、発泡成形時に発泡樹脂がフィルム５
と型面部材３の間に進入し、真空孔４１内にまで進入す
る場合が考えられる。この場合には、型面部材４を基体
３から分離する。これにより型面部材４のみとなるため
軽量となり、取扱いが容易となる。また真空孔４１の長
さは約３ｍｍと短いので、内部に詰まった発泡樹脂を容
易に除去できる。The foamed resin is used as the film 5 during foam molding.
It is conceivable that it may enter between the mold surface member 3 and the mold surface member 3 and even into the vacuum hole 41. In this case, the mold surface member 4 is separated from the base body 3. As a result, since only the mold surface member 4 is used, the weight is reduced and the handling becomes easy. Further, since the length of the vacuum hole 41 is as short as about 3 mm, the foamed resin clogged inside can be easily removed.
【００２２】[0022]
【発明の効果】すなわち本発明の金型構造によれば、型
面部材の細孔の位置と基体中のヒーターの位置は互いに
無関係に設定できるため、型面の形状に応じた最適位置
に細孔とヒーターを設けることができる。またメンテナ
ンスの際には、型面部材を基体と分離することで工数を
小さくすることができ、成形のサイクルタイムの短縮化
を図ることができる。According to the mold structure of the present invention, the positions of the pores of the mold surface member and the position of the heater in the substrate can be set independently of each other, so that the optimum position can be set according to the shape of the mold surface. Holes and heaters can be provided. Further, at the time of maintenance, the man-hours can be reduced by separating the mold surface member from the base body, and the molding cycle time can be shortened.
【図１】本発明の一実施例の金型構造の断面図である。FIG. 1 is a cross-sectional view of a mold structure according to an embodiment of the present invention.
【図２】本発明の一実施例の金型構造を用いた成形途中
の状態の断面図である。FIG. 2 is a cross-sectional view showing a state in the middle of molding using the mold structure according to the embodiment of the present invention.
１：箱部材 ２：サンドバック
３：基体 ４：型面部材 １２：真空通路 ２
０：空間部 ３０：ヒーター ４１：真空孔（細孔） ４
２：ボルト1: Box member 2: Sandbag
3: Substrate 4: Mold surface member 12: Vacuum passage 2
0: Space part 30: Heater 41: Vacuum hole (pore) 4
2: Bolt
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｌ 31:58 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location B29L 31:58
Claims (1)
圧とすることで表皮を型面に沿わせた状態で発泡成形を
行う金型構造であって、 金属粒とバインダとからなり所定形状に形成された通気
性の基体と、該基体表面に保持され表裏を貫通する細孔
をもつ型面部材と、からなることを特徴とする金型構
造。1. A mold structure for performing foam molding in a state in which a skin is placed along a mold surface by applying a higher pressure to the cavity side than the outside of the cavity, the mold structure being formed of metal particles and a binder into a predetermined shape. A mold structure comprising a breathable substrate and a mold surface member that is held on the substrate surface and has pores penetrating the front and back.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7216023A JPH0957770A (en) | 1995-08-24 | 1995-08-24 | Die structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7216023A JPH0957770A (en) | 1995-08-24 | 1995-08-24 | Die structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0957770A true JPH0957770A (en) | 1997-03-04 |
Family
ID=16682093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7216023A Pending JPH0957770A (en) | 1995-08-24 | 1995-08-24 | Die structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0957770A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003033243A1 (en) * | 2001-10-18 | 2003-04-24 | Sakaeriken Kogyo Co., Ltd. | Mold set |
| KR100391463B1 (en) * | 2001-04-25 | 2003-07-12 | 현대자동차주식회사 | Using the fiber reinforced plastic of vacuum forming progress |
| JP2006326904A (en) * | 2005-05-24 | 2006-12-07 | Toyota Boshoku Corp | Mold for skin material and its manufacturing method |
| JP2007112038A (en) * | 2005-10-21 | 2007-05-10 | Toyota Motor Corp | Mold for molding and its manufacturing method |
| JP2007216638A (en) * | 2006-02-20 | 2007-08-30 | Toyota Boshoku Corp | Skin material forming mold and its manufacturing method |
| WO2008065946A1 (en) * | 2006-12-01 | 2008-06-05 | Tanazawa Hakkosha Co., Ltd. | Mold for resin molding, method for manufacturing mold for resin molding, and resin molded product |
| JP2010030159A (en) * | 2008-07-29 | 2010-02-12 | Toyota Boshoku Corp | Mold for injection molding |
| JP4909271B2 (en) * | 2005-08-04 | 2012-04-04 | 株式会社棚澤八光社 | Resin mold |
-
1995
- 1995-08-24 JP JP7216023A patent/JPH0957770A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100391463B1 (en) * | 2001-04-25 | 2003-07-12 | 현대자동차주식회사 | Using the fiber reinforced plastic of vacuum forming progress |
| WO2003033243A1 (en) * | 2001-10-18 | 2003-04-24 | Sakaeriken Kogyo Co., Ltd. | Mold set |
| JP2006326904A (en) * | 2005-05-24 | 2006-12-07 | Toyota Boshoku Corp | Mold for skin material and its manufacturing method |
| JP4909271B2 (en) * | 2005-08-04 | 2012-04-04 | 株式会社棚澤八光社 | Resin mold |
| JP2007112038A (en) * | 2005-10-21 | 2007-05-10 | Toyota Motor Corp | Mold for molding and its manufacturing method |
| JP4661517B2 (en) * | 2005-10-21 | 2011-03-30 | トヨタ自動車株式会社 | Mold and its manufacturing method |
| JP2007216638A (en) * | 2006-02-20 | 2007-08-30 | Toyota Boshoku Corp | Skin material forming mold and its manufacturing method |
| JP4619301B2 (en) * | 2006-02-20 | 2011-01-26 | トヨタ紡織株式会社 | Skin material mold and manufacturing method thereof |
| WO2008065946A1 (en) * | 2006-12-01 | 2008-06-05 | Tanazawa Hakkosha Co., Ltd. | Mold for resin molding, method for manufacturing mold for resin molding, and resin molded product |
| JPWO2008065946A1 (en) * | 2006-12-01 | 2010-03-04 | 株式会社棚澤八光社 | Resin-molding mold, resin-molding mold manufacturing method and resin-molded article |
| US8794951B2 (en) | 2006-12-01 | 2014-08-05 | Tanazawa Hallosha Co., Ltd. | Mold for resin molding, method for manufacturing mold for resin molding, and resin molded product |
| JP2010030159A (en) * | 2008-07-29 | 2010-02-12 | Toyota Boshoku Corp | Mold for injection molding |
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