JPH0941190A - Plating method and device for producing screen cylinder for rotary screen and screen cylinder for rotary screen - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a screen cylinder for a rotary screen capable of reproducing designs having a stereoscopic feel and a plating method and device for producing this product. SOLUTION: A metallic meshed substrate 7 of a cylindrical shape acting as cathode is arranged in a plating cell 1 in which a plating liquid is stored. A first anode 3 is arranged on the inner side of this meshed substrate 7 and a second anode 4 on the outer side. Electroplating is executed by passing current between either or both of the first anode 3 and the second anode 4 and the meshes substrate 7. This device has a holding member 2 capable of mounting and holding the meshed substrate. The meshed substrate 7 and the cathode of a power source are electrically connected via the holding member 2 and the meshed substrate 7 is made rotatable around its central axis. At this time, second anodes 4a, b are disposed in the positions facing each other across the meshed substrate 7. A plating liquid ejection pipe 5 is preferably disposed diagonally below the meshed substrate 7. This screen cylinder has a sectional shape at which highly viscous glue is liable to flow out to the outer peripheral surface side of the cylinder.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating method and a plating apparatus for producing a screen cylinder for a rotary screen composed of a cylindrical body of reticulated metal, and a screen cylinder for a rotary screen produced by using the plating apparatus. It is about.

[0002]

2. Description of the Related Art Heretofore, as a plating apparatus used for electroplating the peripheral surface of a screen cylinder for a rotary screen made of a mesh-like metal cylinder, a mesh is provided inside a plating tank in which a plating solution is stored. A substrate is arranged, an anode is provided outside the mesh substrate, and a current is passed between the anode and the mesh substrate (cathode) while the mesh substrate is immersed in a plating solution and rotated to perform electroplating. Things are common. However, when electroplating is performed using such a conventionally known plating apparatus, a plating layer hardly precipitates on the inner peripheral surface side of the mesh substrate,
Since the plating layer is preferentially deposited on the outer peripheral surface side of the mesh substrate, as shown in FIG. 8, in the enlarged sectional shape of the obtained cylinder, the inner peripheral surface 8a of the mesh substrate 7 obtained in the first plating step is formed. The thickness of the second plating layer on the'side is smaller than the thickness on the outer peripheral surface 8b 'side of the mesh substrate 7,
The second plating layer 8 is formed such that the inner surface side is almost flat and the outer surface side is bulged spherically, and the aperture ratio decreases with the deposition of the plating layer on the outer peripheral surface. By the way, in a screen cylinder for a rotary screen, it is desired that the screen cylinder has a good shape, and that the contours and fine lines of the pattern can be printed clearly, and in order to obtain such a print, the printing paste inside the screen is directed outward. It is necessary to have a screen cylinder which is easy to come out, has a high mesh ratio, a good aperture ratio, and has a necessary rigidity and a minimum thickness. Despite the above demands, in the case of a screen cylinder for a rotary screen manufactured using a conventional plating apparatus, when printing on a cloth substrate, it is particularly required for synthetic fabrics. Since the relatively high-viscosity printing paste hardly migrates to the outside of the cylinder, the hue becomes thin, the printing paste is poorly formed, and it is difficult to obtain a product having a three-dimensional design. Further, there is also a problem that the fine line portion of the design cannot be printed sharply, and it is difficult to reproduce a fine design.

[0003]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems in the conventional plating method and apparatus, and provides a method for depositing a plating layer on the inner peripheral surface side of a mesh substrate made of a mesh-like metal cylinder and forming the outer periphery. It is an object of the present invention to provide a plating method and a plating apparatus capable of arbitrarily adjusting plating layer deposition on a surface side. Further, in the present invention, compared with the conventional rotary screen screen cylinder, a thicker plating layer is deposited not only on the outer peripheral surface side but also on the inner peripheral surface side of the cylinder, and a corner portion on the inner surface side in the cylinder cross section is large. By providing a round shape, even a relatively high-viscosity printing paste can easily flow to the outer peripheral surface of the cylinder and provide a screen cylinder that can reproduce a three-dimensional pattern sharply. It is also what to say.

In order to increase the aperture ratio of the screen cylinder, the present inventors provided anodes at the inner and outer positions of the mesh substrate to be electroplated while rotating, and provided the anode on the inner peripheral surface side of the mesh substrate. Electroplating by depositing a large number of plating layers, appropriately selecting an anode positioned inside and outside the mesh substrate, or simultaneously selecting two anodes and appropriately selecting a current density. As a result, it has been found that a screen cylinder for a rotary screen having a desired thickness and a sectional shape and a large aperture ratio can be obtained, and the present invention has been completed.

[0005]

According to the present invention, there is provided a plating method comprising:
This is for manufacturing a screen cylinder for a rotary screen consisting of a mesh body of a mesh metal, and a metal mesh substrate of a cylinder body acting as a cathode is disposed inside a plating tank in which a plating solution is stored. A first anode is arranged inside the mesh substrate, a second anode is arranged outside the mesh substrate, and the mesh substrate is arranged on one or both of the first anode and the second anode. And a peripheral surface of the mesh substrate is electroplated by passing an electric current between them. According to this method, by passing a current between the mesh substrate and the first anode inside the mesh substrate, it is possible to increase the plating layer deposition on the inner peripheral surface side of the mesh substrate. By passing a current between the metal substrate and the second anode on the outside thereof, it is possible to increase the deposition of the plating layer on the outer peripheral surface side of the mesh substrate, and also to apply a current between the network substrate and the two anodes simultaneously. , The inner and outer peripheral surfaces of the mesh substrate can be electroplated simultaneously. At this time, the current between the first anode and the mesh substrate (current density) and the current between the second anode and the mesh substrate (current density) may be changed.

FIGS. 1A and 1B are schematic views showing a plating method according to the present invention. In this method, a cylindrical body acting as a cathode is provided inside a plating tank 1 in which a plating solution L is stored. The metal mesh substrate 7 is arranged in a state of being immersed in the plating solution L, the first anode 3 is arranged inside the mesh substrate 7, the second anode 4 is arranged outside the mesh substrate 7, An electric current is applied between one or both of the one anode 3 and the second anode 4 or between the anode and the mesh substrate 7 to perform electroplating while rotating the mesh substrate 7. In FIG. 1, the connection state with the power supply is omitted, but the mesh substrate 7 is connected to the cathode of the power supply, and the first anode 3 and the second anode 4 are connected to the anode of the power supply.
The method of mounting is not particularly limited. In the present invention,
The first anode 3 is preferably arranged on the central axis of the mesh substrate 7 so that the inner peripheral surface of the mesh substrate 7 can be uniformly plated. However, since the mesh substrate 7 rotates around the central axis, However, the first anode 3 does not necessarily have to be on the central axis of the mesh substrate 7 and may be arranged in parallel with the generatrix of the mesh substrate 7. On the other hand, the second anode 4 may be disposed outside the outer peripheral surface of the mesh substrate 7 and parallel to the generatrix of the mesh substrate 7. In the present invention, the mesh substrate 7 may be arranged so that its central axis is parallel to the liquid surface of the plating solution L, or may be arranged so as to be suspended vertically as shown in FIG. In the former case, a part of the mesh substrate 7 may be exposed from the level of the plating solution L along the generating line (FIG. 1).
(See (a) and (b)).

A plating apparatus according to the present invention is a plating apparatus for manufacturing a screen cylinder for a rotary screen comprising a mesh of metal mesh, wherein the plating apparatus is capable of storing a plating solution therein. A tank, a holding member having a structure capable of attaching and holding a cylindrical metal mesh substrate, and a first anode disposed inside the mesh substrate when the mesh substrate is attached to the holding member. A second anode disposed outside the outer peripheral surface of the mesh substrate, wherein the holding member has a structure in which the mesh substrate and a cathode of a power supply are electrically connected via the holding member. And a structure in which the mesh substrate rotates around a central axis of the mesh substrate.

FIGS. 2A and 2B show the internal structure of a preferred example of the plating apparatus of the present invention. As shown in FIG.
A plating tank 1, a holding member 2, a first anode 3 and a second anode 4 are provided. A plating solution used for electroplating is stored inside the plating tank 1 in the plating apparatus of the present invention.
The material is generally made of synthetic resin.

Further, the apparatus of the present invention is provided with a holding member 2 having a structure capable of attaching and holding a cylindrical metal mesh substrate 7, and when electroplating is performed,
The mesh substrate 7 is attached to the holding member 2, and the mesh substrate 7 is immersed in the plating solution. At this time, when the mesh substrate 7 is immersed and held in parallel with the level of the plating solution, FIG.
As shown in (a), the holding member 2 is provided with a fitting holding portion 10 having a shape that can be fitted into the left and right ends of the mesh substrate 7 so that the entire mesh substrate 7 can be stably fixed. It is preferable to provide a taper so that the mesh substrate 7 can be easily attached and detached. In the apparatus of the present invention, the mesh substrate 7 is connected to the cathode of the power supply via the holding member 2, and the holding member 2 is generally made of a conductive material. However, a structure in which the holding member 2 and the mesh substrate 7 are partially electrically connected may be used.

In the plating apparatus of the present invention,
At a position inside the mesh substrate 7 when the mesh substrate 7 is attached to the holding member 2, the first anode 3 is arranged parallel to the central axis of the mesh substrate 7, that is, parallel to the generatrix of the mesh substrate 7. A first anode 3 connected to the anode of the power supply;
When a current is passed between the mesh substrate 7 connected to the cathode of the power supply via the first electrode 3 and the plating solution existing between the first anode 3 and the mesh substrate 7, the inner peripheral surface of the mesh substrate 7 is The deposition amount of the plating layer becomes larger than the deposition amount of the outer peripheral surface. The first anode 3 in the present invention may be rod-shaped or tubular, and the structure thereof is not particularly limited. Are preferably the same. Further, it is preferable that the first anode 3 and the mesh substrate 7 are arranged concentrically, that is, the first anode 3 is arranged on the center axis of the mesh substrate 7 (see FIG. 2B). At this time, an anode diaphragm 16 may be provided on the outer peripheral surface of the first anode 3 as shown in FIG. In addition, as shown in FIG. 3, the first anode 3 in the present invention is a round rod-shaped nickel first anode 3 ′ on a circumference centered on a pipe shaft 9 located at the rotation center of the mesh substrate 7. Are arranged at equal angular intervals,
Each anode 3'may have a structure in which it is electrically connected (shown by a solid line in the drawing).

Further, the holding member 2 in the apparatus of the present invention comprises:
The electroplating on the peripheral surface of the mesh substrate 7 by the plating apparatus according to the present invention is performed while rotating the mesh substrate 7 in a plating solution. In the device illustrated in FIG. 2, the holding member 2 and the first anode 3 are integrated with each other in a state where they are electrically insulated via the electric insulating member 11, and the holding member 2 and the first anode 3 are combined with the pipe shaft 9 that is rotated by the driving device 12. Although one anode 3 and the mesh substrate 7 rotate at a constant speed, the apparatus of the present invention may have a structure in which the first anode 3 does not rotate, and the first anode 3 and the mesh substrate 7 may rotate. 2 is not limited to the example shown in FIG.

Further, in the plating apparatus of the present invention, a second anode 4 connected to an anode of a power supply is provided at a position outside the outer peripheral surface of the mesh substrate when the mesh substrate is attached to the holding member 2. When a current flows between the second anode 4 and the holding member 2, a current flows between the second anode 4 and the mesh substrate 7, and the outer circumferential surface of the mesh substrate 7 is smaller than the inner circumferential surface. More (thick) plating layer is deposited. Although the structure of the second anode 4 in the present invention is not particularly limited, a material in which nickel chips (small pieces) are put in a bag woven from polypropylene fibers is particularly suitable. The second anode 4 is immersed in a plating solution while being electrically insulated from the plating tank 1 so that the plating tank 1
And suspended from above.

In the apparatus of the present invention, as shown in FIGS. 2A and 2B, in order to deposit a uniform plating layer on the peripheral surface of the mesh substrate 7, As the anode 4, a pair of second anodes 4a, 4b are preferably arranged at positions facing each other across the mesh substrate 7 attached to the holding member 2 and in parallel with the generatrix of the mesh substrate 7. It is preferable that the distance between the second anode and the mesh substrate 7 is the same. Further, in the present invention, as shown in FIG. 4 (a), particularly, the distance between the outer peripheral surface of the mesh substrate 7 and the inner surfaces of the second anodes 4a and 4b is constant. It is particularly preferable that the second anodes 4a and 4b to be formed have a concentric cross-sectional shape corresponding to the diameter of the mesh substrate 7, and these are respectively arranged concentrically with the mesh substrate 7, and the concentric cross-sectional shapes shown in FIG. May be arranged concentrically with the mesh substrate 7. Further, in the plating apparatus of the present invention, when the mesh substrate 7 is attached to the holding member 2, the mesh substrate 7 is obliquely below the mesh substrate 7 so as to be parallel to the generatrix of the mesh substrate 7. Plating solution to mesh substrate 7
It is preferable to provide a plating solution jetting tube 5 for supplying the solution toward the substrate. The plating solution jetting tube 5 is provided with a plurality of plating solution jetting holes 6 in a straight line along the longitudinal direction of the tube. Is supplied. However, the direction in which the plating solution is ejected from the plating solution ejection tube 5 is not limited to the direction shown in FIG. In the present invention, as shown in FIG. 2A, the plating solution flows along the mesh substrate 7 from the center of the cylinder and flows parallel to the axial direction of the cylinder, and overflows from the bearing grooves at both ends of the plating tank 1. It is preferable to adopt a structure that circulates through the receiving tank 17.

FIGS. 2 (a) and 2 (b) show, as a plating apparatus of the present invention, a horizontal type apparatus which performs plating by laying a mesh substrate in a direction parallel to the level of a plating solution. However, the plating apparatus of the present invention is a vertical type (see FIG. 10) apparatus in which a mesh substrate is suspended in a vertical direction, immersed in a plating solution, and electrolytic plating is performed while rotating the mesh substrate. In the case of the vertical type apparatus, there is an advantage that the impurities of nickel oxide generated on the anode side as the electroplating proceeds can be settled and removed, and the adhesion to the cylinder can be prevented.

As a plating solution used for depositing a plating layer on a roll using the plating apparatus of the present invention, various compositions having a composition conventionally known as a nickel plating solution can be used. As a nickel plating bath particularly suitable in terms of increasing the small porosity, a sulfamic acid bath containing nickel sulfamate, nickel bromide and boric acid may be mentioned, and a general additive may be blended.
The pH value of the sulfamic acid bath was 3.5 to 3.5.
4.5 is common.

Next, a screen cylinder for a rotary screen of the present invention manufactured by using the above plating apparatus will be described. The screen cylinder for a rotary screen according to the present invention is obtained by applying a second plating layer 8 formed by electroplating to the surface of a first plating mesh substrate 7 having a cylindrical shape formed by electroplating. As can be understood from the enlarged cross-sectional views shown in (a) to (d), the maximum growth thickness of the second plating layer 8 on the inner peripheral surface side perpendicular to the peripheral surface of the first plating mesh substrate 7. d
_1, the maximum growth thickness d ₂ of the outer peripheral surface side, and the growth thickness d ₃ in the horizontal direction to the peripheral surface, wherein d ₁ / d ₂ = 0.75 to
It is characterized by satisfying 1.25 and d ₃ / d ₂ = 0.35 to 0.45. Further, the present invention provides a screen cylinder for a rotary screen having the above characteristics,
The formula d ₁ / d ₂ > 1, that is, the first plated mesh substrate 7
The inner peripheral surface side is plated thicker than the outer peripheral surface side.

FIGS. 7A to 7D show specific examples of enlarged cross-sectional shapes of the screen cylinder for a rotary screen of the present invention. FIG. 9 shows a particularly preferred screen cylinder as an example. 8, the first plating mesh substrate 7 having the same cross-sectional shape as the second plating layer 8
However, the inner peripheral surface side is thicker than the outer peripheral surface side (1 <d ₁ / d
₂ ≤ 1.25) Plated structure is shown. Here, comparing the enlarged sectional shape of the screen cylinder for a rotary screen of the present invention (FIG. 9) with the enlarged sectional shape of the conventional one (FIG. 8), the sectional shape of the conventional product is such that the inner surface side is flat. On the other hand, the R of the inner corner is small, and the outer R of the side in contact with the printing base material is spherical, whereas the R of the inner corner is large in the product of the present invention. Since the shape is such that the resistance when extruded in the outward direction is small, the relatively high-viscosity printing paste can easily flow out, and is suitable for clearly reproducing a three-dimensional pattern. In particular, highly viscous glue is convenient for printing on synthetic fiber cloth such as hydrophobic tetron. However, the enlarged sectional shapes of the rotary screen screen cylinder of the present invention are shown in FIGS.
However, the present invention is not limited to the examples described above, and an optimum cross-sectional shape is appropriately selected in accordance with various printing conditions.

The procedure for manufacturing the screen cylinder for a rotary screen of the present invention will be described below.
First, as shown in FIG. 5A, a net-shaped conductive portion 13 is formed on the outer peripheral surface of the cylindrical body.
A mother roll 15 having a non-conductive portion 14 formed in a portion surrounded by is prepared, and electroplating is performed on the surface of the mother roll 15 to selectively deposit a plating layer on the conductive portion 13, thereby forming a cylindrical body. -Shaped first plating mesh substrate 7
Is formed, and the cylindrical body is extracted from the mother roll 15. The enlarged cross-sectional shape of the first plated mesh substrate 7 thus obtained is a semicircular shape with the inner peripheral surface side flat and the outer peripheral surface side curved (see FIG. 5B).

Then, as shown in FIG. 6, the first plating mesh substrate 7 was attached to and held by the holding member 2 in the above-described plating apparatus of the present invention, and this was stored in the plating tank. While being immersed and rotated in the plating solution, the first plating mesh substrate 7 is connected to a power source such that the first anode disposed inside the first plating mesh substrate 7 serves as an anode and the first plating mesh substrate 7 serves as a cathode. Perform electroplating. In this case, the plating layer is deposited on the entire peripheral surface of the first plating mesh substrate 7, that is, on the inner peripheral surface side and the outer peripheral surface side. The inner peripheral surface side of the plated mesh substrate 7 is larger than the outer peripheral surface side.
At this time, if necessary, an electric current is passed between the first plating mesh substrate 7 and the second anode located outside the plating mesh substrate 7 to deposit a plating layer from the outer peripheral surface side of the first plating mesh substrate 7. ,
A screen cylinder for a rotary screen having a desired cross-sectional shape is obtained.

The screen cylinder for a rotary screen of the present invention thus produced has a plating layer which is preferentially grown in the direction perpendicular to the screen cylinder surface, has a high porosity, and has a printing paste. When printing is performed on a cloth base material using this cylinder, a product having a three-dimensional and voluminous design can be manufactured because the printing paste is easily applied and the printing paste is well-poured. Further, the screen cylinder of the present invention is suitable for producing a product having a clear pattern because the printing paste has a good cut and the shape is good so that a fine line can be reproduced.

[0021]

EXAMPLE A copper plating layer was formed on the outer peripheral surface of a metal cylindrical substrate, and a large number of concave portions were formed in a mesh shape by embossing the copper plating layer. Then, a chrome plating layer was further formed on the copper plating layer. After forming a non-conductive portion by filling an insulating resin in a concave portion formed on the chromium plating layer, the outer peripheral surface is polished, and a mother roll having a configuration shown in FIG. Was prepared. The line width of the conductive portion of the mother roll thus manufactured is 15 to 20 μm. And as a nickel plating bath, nickel sulfamate 200 ~
A general sulfamic acid bath (pH value: about 4.0) containing 400 g / l, nickel bromide 5 to 15 g / l, and boric acid 20 to 30 g / l was prepared, and this nickel sulfamate plating bath was used. Bath temperature 50 ° C, current density 1-4
Under an operating condition of A / dm ² and an energizing time of 60 minutes, nickel plating was applied to the outer peripheral surface of the mother roll, and a first plating layer was selectively formed on a conductive portion of the mother roll. The obtained first plating layer was removed from the mother roll to obtain a tubular first plating mesh substrate made of nickel metal in a net shape. The thickness of the first plating mesh substrate is 35 to 50 μm.
It is.

Then, the first plated mesh substrate is
The plating apparatus of the present invention having the structure shown in (a) and (b) is attached and held, and in a nickel sulfamate plating bath similar to the above, the bath temperature is 50 ° C. and the current density is 1 to 5 A. / Dm ² , and the amount of mesh substrate is 0.5 to
A screen cylinder for a rotary screen of the present invention (average thickness 100 μm, d ₁₎ was applied with nickel plating using two anodes while rotating at a speed of 5 revolutions / minute.
/ D ₂ = 0.75, d ₃ / d ₂ = 0.40).

[0023]

According to the plating method of the present invention, the amount of plating layer deposited on the inner peripheral surface and the amount of plated layer deposited on the outer peripheral surface of the mesh substrate are adjusted by appropriately selecting the anode through which current flows. In particular, by using a first anode to deposit a large number of plating layers on the inner peripheral surface side of the mesh substrate, it is possible to prevent a decrease in the aperture ratio of the screen cylinder. It is suitable for manufacturing. Further, the plating apparatus of the present invention has a structure in which the first anode located on the inside of the mesh substrate and the second anode located on the outside can be appropriately selected and used. A plating layer having a constant thickness can be formed in a relatively short time. In the case of electroplating using this apparatus, the inner and outer peripheral surfaces of the mesh substrate can be alternately plated, and as a result, the desired thickness and cross section can be obtained. A plated product on which a plated layer having a shape is formed can be obtained. Furthermore,
The screen cylinder for a rotary screen of the present invention obtained by using such a plating apparatus has a good aperture ratio, a good printing paste, and is suitable for producing a product having a three-dimensional design. In addition, the printing paste is easily cut and is suitable for producing a product with a clear pattern.

[Brief description of drawings]

1 (a) and 1 (b) are schematic diagrams of an apparatus used for a plating method of the present invention, (a) is a front view of the apparatus, and (b) is a side view of the apparatus. It is.

FIGS. 2A and 2B are views showing an internal structure of a preferred example of the plating apparatus of the present invention, and FIG.
FIG. 3B is a diagram when the device is viewed from above, and FIG. 4B is a diagram when the device is viewed from the side.

FIG. 3 is a diagram showing a positional relationship between a first anode in which a plurality of first anodes 3 ′ are arranged at equal angular intervals and a mesh substrate 7;

FIGS. 4A and 4B show the first anode 3 and the mesh substrate 7;
FIG. 4 is a diagram showing a preferred positional relationship between the second anodes 4a, 4b and 4.

FIG. 5 (a) is a diagram showing a state in which electroplating is performed on the surface of a mother roll 15, a plating layer is deposited on a conductive portion 13, and a cylindrical first plating mesh substrate 7 is formed.
(B) is a diagram when the mesh substrate 7 is extracted from the mother roll 15.

FIG. 6 is a view showing a state where the first plating mesh substrate 7 is attached to and held by the holding member 2;

FIGS. 7A to 7D are enlarged views showing a cross-sectional shape of a screen cylinder for a rotary screen of the present invention.

FIG. 8 is an enlarged view showing a cross-sectional shape of a conventional screen cylinder for a rotary screen.

FIG. 9 is an enlarged view showing a cross-sectional shape of a particularly preferred example of the screen cylinder for a rotary screen of the present invention.

FIG. 10 is a schematic view of a plating apparatus of the present invention of a type in which the mesh substrate 7 is arranged vertically.

[Explanation of symbols]

 1 plating tank 2 holding member 3 first anode 4, 4a, 4b second anode 5 plating solution jetting pipe 6 plating solution jetting hole 7 mesh substrate (first plating mesh substrate) 8 second plating layer 9 pipe shaft 10 fitting holder 11 Electrical Insulation Member 12 Drive Device 13 Conductive Part 14 Non-Conductive Part 15 Mother Roll 16 Anode Separator 17 Overflow Tank

Claims (5)

[Claims] 1. A plating method for producing a screen cylinder for a rotary screen comprising a mesh of metal mesh, comprising: a plating tank 1 in which a plating solution L is stored.
Inside, a cylindrical metal mesh substrate 7 acting as a cathode is arranged, the first anode 3 is arranged inside the mesh substrate 7, and the second anode 4 is arranged outside the mesh substrate 7. And
A rotary screen characterized in that a current is passed between the first anode 3 and the second anode 4 or both anodes and the mesh substrate 7 so as to electroplate the peripheral surface of the mesh substrate 7. Method for manufacturing screen cylinders. 2. A plating apparatus for producing a screen cylinder for a rotary screen comprising a mesh body of a mesh metal, said plating apparatus comprising: a plating tank 1 capable of storing a plating solution therein; A holding member 2 having a structure capable of attaching and holding a metal mesh substrate 7 of
When the mesh substrate 7 is attached to the holding member 2, a first anode 3 disposed inside the mesh substrate 7 and a second anode 4 arranged outside the outer peripheral surface of the mesh substrate 7. Wherein the holding member 2 has a structure in which the mesh substrate 7 and a cathode of a power supply are electrically connected via the holding member 2, and the mesh substrate 7 is connected to the mesh substrate 7. A plating apparatus for manufacturing a screen cylinder for a rotary screen, wherein the plating apparatus rotates about a central axis of the screen. 3. The holding member 2 as the second anode 4.
At a position facing each other across the mesh substrate 7 attached to the
Second anodes 4a, 4b parallel to the generatrix of the mesh substrate 7
Is provided, and the first anode 3 is connected to the mesh substrate 7.
When the mesh substrate 7 is attached to the holding member 2, the plating solution is disposed obliquely below the mesh substrate 7 and parallel to the generatrix of the mesh substrate 7. An ejection pipe 5 is provided, and the plating solution ejection pipe 5 is provided.
Has a plurality of plating solution ejection holes 6, and a mesh substrate 7 attached to the holding member 2 from the plating solution ejection holes 6.
The plating apparatus according to claim 2, wherein the plating solution is supplied toward the plating apparatus. 4. A screen cylinder for a rotary screen formed by electroplating, wherein said cylinder has a cylindrical first plating mesh substrate 7 and a second plating mesh substrate 7 provided on a surface of said first plating mesh substrate 7. The second plating layer 8 has a maximum growth thickness d ₁ on the inner peripheral surface side and a maximum growth thickness on the outer peripheral surface side in a direction perpendicular to the peripheral surface of the first plating mesh substrate 7. d ₂ and the growth thickness d _{3 in the} horizontal direction with respect to the peripheral surface are represented by the formula d ₁ / d ₂ =
0.75-1.25 and d ₃ / d ₂ = 0.35~0.4
5. A screen cylinder for a rotary screen, which satisfies 5. 5. The growth thickness of the second plating layer 8 is given by the following formula:
₁ / d _{2> 1} rotary screen for screen cylinder according to claim 4, wherein a satisfying.