JPH0936292A - Lead bend detector for semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively detect a defective semiconductor element on the way of conveying and to shorten a conveying stopping time due to a lead bend by forming a groove to be filled with the resin molded part of an axial lead type semiconductor element on the surface, and detecting the bend according to whether the molded part penetrates the groove or not. SOLUTION: The resin molded part 1a of a columnar molding 1 having a lead 1b is contained in the groove 4 of a detecting drum 3 and conveyed. In the case of a defective product 2 of a bend lead 2b, a resin molded part 2a does not penetrate the groove 4, but placed on a detecting drum surface to lift the detecting part 6a of a detecting lever 6, thereby moving an arm 6b. Then, a photosensor 8 is operated, and the product 2 is removed from a conveying chain 5. Thus, the defective semiconductor element having a lead bend can be effectively detected on the way of conveying, and the conveying stopping time due to the lead bend can be shortened, thereby enhancing the operating efficiency of a conveying facility.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a detection device for detecting a defective semiconductor element having a lead bend in an axial lead type semiconductor element such as a high voltage diode which is resin-molded.

[0002]

2. Description of the Related Art In a semiconductor element formed by resin molding, such as a high voltage diode, in which each lead portion is carried on a side-by-side carrier chain, there are two to three devices for detecting defective products with bent leads. It uses one photosensor. 2A and 2B are configuration diagrams of a main part of a conventional defective semiconductor element detection device. FIG. 2A is a plan view, FIG. 2B is a side view seen from an arrow A in FIG. 2A, and FIG. FIG. 3C is a side view seen from the arrow B in FIG. Cylinder molded product 1 (semiconductor element)
The lead portion 1b is placed on the carrier chain 5 and the carrier claw 1
The lead portion 1b is sandwiched between the sheets 1 and conveyed. Then, the optical sensors 12a, 12b, 1 which are non-contact sensors aligned in a straight line on the resin molding portion 1a and both lead portions b at three positions.
2c is provided, light is emitted from the sensor, and the reflected light is received by the optical sensors 12a, 12b, 12c, respectively.
It was determined that there was no bend in the lead of the semiconductor element when receiving light from the same location.

[0003]

However, as shown in FIG.
As shown by the dotted line in FIG. 7C, the defective lead-curved product 2 has a shape that can be hung down by the lead portion 2b so that the resin molding portion 2a is the bottom of the swing. In this shape, when viewed from directly above, the lead portion 2b and the resin molding portion 2a are in a straight line, and the light from the optical sensors 12a, 12b, 12c is shown in FIG.
As shown by the dotted line, light is simultaneously applied to three places, and the reflected light is captured by the optical sensors 12a, 12b, and 12c, so that the product is erroneously determined as a non-defective product. Incidentally, the carrying claws attached to the carrying chain 5 are omitted in FIGS.

An object of the present invention is to solve the above problems and to reliably detect a defective semiconductor element having a bent lead.

[0005]

In order to achieve the above object, in an apparatus for detecting a lead bend of an axial lead type semiconductor element in which each lead part is placed on a carrier arranged in parallel and conveyed, The axial lead type semiconductor element has a groove into which the resin molding portion is inserted, the surface is located on the transport path of the transport body and rotates in the same direction as the transport body, and the lead portion on the transport path passes through. Located in the part
It has a detection lever for detecting an axial lead type semiconductor element with a bent lead, and a sensor that works in conjunction with the detection lever. This sensor may be a non-contact sensor that operates by the movement of the detection lever, or a mechanical sensor.

[0006]

[Function] When the resin molding portion enters the groove formed on the rotating body, the detection lever does not move from the normal position, and in the semiconductor element with the bent lead portion, the resin molding portion does not enter the groove portion.
It pushes up the detection part of the detection lever. When the detector is pushed up, the opposite arm of the L-shaped lever moves from its normal position, actuating the sensor and transmitting an electrical signal to the ejector. With this signal, the discharging device is operated, and the defective product is removed from the discharging device.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an embodiment, in which FIG. 1 (a) is a sectional view of essential parts of a detection drum and a detection lever, and FIG. 1 (b) is a top view of the detection drum. In FIG. 1A, the resin molding portion 1a of the cylindrical molded product 1 (good axial lead type semiconductor device) having the lead portion 1b is the transport chain 5 and the detection drum 3
Is conveyed to the groove portion 4 of the detection drum 3 and conveyed. When the lead portion 1a is a straight good product, it is pushed into the groove portion 4 by the detection portion 6a of the detection lever 6, and the dotted line A
Pass in the state of. At this time, the detection lever 6 does not move up and down. In the case of a defective product 2 in which the lead portion 2b is bent, the resin molding portion 2a does not enter the groove portion 4 and is placed on the surface of the detection drum 3 as indicated by the dotted line F, so that when the detection lever 6 is reached, The resin molding portion is as shown by the dotted line C, and the detection portion 6a of the detection lever 6 is pushed up as shown by the dotted line D, and the opposite arm 6b of the L-shaped detection lever 6 is moved as shown by the dotted line E. This is because the L-shaped detection lever 6 is held by the rotating shaft 7. By blocking the light of the optical sensor 8 installed so as to sandwich the arm 6b on the opposite side,
The optical sensor 8 operates. By the operation of the optical sensor 8, an electric signal is transmitted to the discharging device for removing the defective product 2 from the transport chain 5. The transport chain 5 and the detection drum 3 move as shown by the arrows, and when the cylindrical molded product 1 comes to the position of the detection drum 3, the resin molded portion 1 of the cylindrical molded product 1 is inserted into the groove 4.
The speeds of the transport chain 5 and the detection drum 3 and the interval between the groove portions 4 are set so that a is entered. Further, the transfer claw 11 (FIG. 11B) attached to the transfer chain 5 is omitted in FIG. In FIG. 2B, a conveyor chain 5 is provided on both sides of the detection drum 3, and a lead claw 11 attached to the conveyor chain 5 sandwiches the lead portion 1a of the cylindrical molded product 1 so that the cylindrical molded product 1 is transported. It As shown by the dotted line F, in the defective product 2 having a bent lead, the lead portion 2b is carried earlier by the conveying claw 11 and the resin molding portion 2a is left behind and does not enter the groove portion 4 of the detection drum 3. The subsequent state has been described with reference to FIG. Further, instead of the optical sensor 8, a mechanical sensor (switch) other than light, such as a non-contact sensor using ultrasonic waves or a limit switch, is used.
May be used to convey electrical signals.

In this way, a defective semiconductor element having a bent lead portion is reliably detected. The shape of the groove is V
The shape may be a U-shape or a U-shape, but a V-shape is desirable for the smooth transportation of semiconductor elements, and the groove size should be such that when the resin molding part is pushed into the groove part by the detection lever, And the surface of the detection drum may be substantially the same.

[0009]

As described above, according to the present invention, a defective semiconductor element having a bent lead can be reliably detected during transportation, and a detection signal is transmitted to a discharging device for removing the defective semiconductor element.
It is possible to shorten the transportation stop time due to lead bending and improve the operating rate of the transportation equipment.

[Brief description of drawings]

FIG. 1 is an embodiment of the present invention, in which (a) is a sectional view of a main part of a detection drum and a detection lever, and (b) is a top view of the detection drum.

2A and 2B are main-part configuration diagrams of a conventional defective semiconductor element detection device, in which FIG. 2A is a plan view, FIG. 2B is a side view seen from an arrow A in FIG. 2A, and FIG. Side view seen from arrow B

[Explanation of symbols]

 1 Cylindrical molded product (good semiconductor element) 1a Resin molded part 1b Lead part 2 Defective product 2a Resin molded part 2b Lead part 3 Detection drum 4 Groove part 5 Conveyor chain 6 Detecting lever 6a Detecting part 7 Rotating shaft 8 Optical sensor 11 Conveying claw 12a optical sensor 12b optical sensor 12c optical sensor

Claims (2)

[Claims] 1. An apparatus for detecting lead bending of an axial lead type semiconductor element, in which each lead section is placed on a side by side conveyance body and conveyed, and a groove into which a resin molding part of the axial lead type semiconductor element is inserted is provided on a surface. An axial lead-type semiconductor element having a lead bent, the surface of which is located on the transport path of the transport body and which rotates in the same direction as the transport body, and the lead portion on the transport path that passes through. A lead bending detection device for a semiconductor element, comprising: a detection lever for detecting the presence of a sensor; and a sensor interlocking with the detection lever. 2. The lead bending detection device for a semiconductor device according to claim 1, wherein the sensor is a non-contact sensor or a mechanical sensor.