JPH0936288A - Manufacture of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability by connecting semiconductor pellet electrodes to the inner leads of a lead frame via a connecting material, improving the radiation properties and improving the surge resistance. SOLUTION: The method for manufacturing a semiconductor device comprises the inner lead forming step of position converting inner leads 4 on a semiconductor pellet electrodes 3 by molding to bent the leads 4, inner lead press bonding step of press bonding to connect the leads 4 to the electrodes 3, and the bump supplying step of supplying a connecting material 7, wherein the electrodes 3 can be connected to the leads 4 via the material 7.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a method for manufacturing a semiconductor device.

[0002]

2. Description of the Related Art A conventional method of joining a semiconductor pellet electrode and an inner lead of a semiconductor device is disclosed in Japanese Patent Application Laid-Open No. 1-184856. This conventional technique is shown in FIG.
(A), (B), (C) and FIGS. 16 (A), (B),
As shown in FIG. 1C, at least one end of each of the first and second leads 22 and 2 made of a conductive elastic material (metal) supported and fixed to the mold package 1 and arranged in parallel.
3 and the inner lead 4 integrated with the lead frame island 6 mounted with the semiconductor pellet 5 provided on the other end of the first lead 22 and the second lead 23 arranged so as to face the lead frame island 6. The semiconductor pellets 5 are included.

The second lead 23 first has a structure shown in FIG.
As shown in (1), the narrow end of the inner lead 4 is bent to form an arm. Next, FIG. 15B and FIG.
As shown in (B), another portion is bent in the second bending step to form the intermediate portion 21. Next, as shown in FIGS. 15C and 16C, the arm is bent slightly downward. In the lead frame state, the first and second leads 2
Reference numerals 2 and 23 are connected by a tie bar (not shown), and the lead frame island 6 and the arm face each other.
The semiconductor device shown in FIG. 15 is obtained by narrowing the semiconductor pellet 5 and mechanically joining the semiconductor pellet 5 by utilizing the spring property of the inner lead 4 and sealing it with a mold.

[0004]

In this conventional method for manufacturing a semiconductor device, the semiconductor pellet is inserted between the lead frame island and the inner lead after the inner lead is bent. Become. Also, in the inner lead bending process, the mechanism of the step of forming a bent inner lead at a predetermined angle becomes complicated, and it is difficult to automate manufacturing equipment. In addition, the bonding between the semiconductor pellet electrode and the inner lead also has significant problems in electrical characteristics and reliability because of mechanical bonding utilizing the spring property of the inner lead.

An object of the present invention is to provide a method of manufacturing a semiconductor device in which the bending of the inner lead is easily automated, the bonding between the semiconductor pellet electrode and the inner lead is strong, and the electrical characteristics and reliability are excellent. It is in.

[0006]

According to the present invention, in a method of manufacturing a semiconductor device, including a step of assembling a semiconductor PET electrode and an inner lead, the step of assembling the inner lead at a right angle at a first bending position. The step of performing the first bending process, and further, at the second bending position parallel to the first bending position, the second bending process is performed at a right angle so that the cross section has a U-shape or a step shape. The method is characterized by including a step of converting the position on the pellet and a step of pressure-bonding the position-converted inner lead and bonding it to the semiconductor pellet electrode via a bonding material.

[0007]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a plan view of a hoop lead frame after molding according to a first embodiment of a method of assembling a semiconductor device of the present invention, and FIG. 2 is an inner lead portion of a first example of the hoop lead frame of FIG. FIG. As shown in FIG. 1, a mold package 1 of a semiconductor device formed on a hoop lead frame 2 according to a first embodiment of a method of assembling a semiconductor device (hereinafter, referred to as an assembling method) of the present invention.
Is an example in which one lead is led out from one end face.

The assembling method of the present invention, as shown in FIG.
This is performed using the hoop lead frame 2 on which the inner lead 4 having the first bending position 11 and the second bending position 14 which are parallel to each other is formed. First, the semiconductor pellet 5 is bonded onto the lead frame island 6. Next, the bonding material 7 is supplied onto the semiconductor pellet electrode 3 by a pump supply function unit (not shown). The bonding material 7 may be supplied on the semiconductor pellet electrode 3 in advance.

FIGS. 3A and 3B are perspective views for explaining a method of bending the inner lead of the hoop lead frame of FIG. 1, and FIGS. 4A to 4D show the bending of FIG. 3A. FIG. 5A to FIG. 5D are side views of the inner lead forming function part shown in the order of steps for explaining the bending method of FIG. FIG. 6 and FIG. 6 are perspective views of the inner lead crimping function part. In the assembling method using the inner lead 4 shown in FIG. 2, first, the first bending process of the inner lead 4 shown in FIG. In the first bending process, after the bonding material 7 is supplied, as shown in FIG. 4A, a first inner lead formed by the rail 9, the first upper bending die 8, and the first lower die 10 is used. The inner lead 4 on which the semiconductor pellet 5 is mounted is placed on the rail 9 of the molding function unit. Next, as shown in FIG. 4B, the first bending upper die 8 is lowered, and the inner lead 4 is sandwiched and fixed by the rail 9. Next, as shown in FIG. 4 (C), the first bending lower mold 10 is raised, and the first bending position 11
At right angles. Finally, the first bending upper die 8 is raised, the first lower bending die 10 is lowered, and each is returned to the original position.

Subsequently, a second bending process of the inner lead 4 shown in FIG. 3B is performed. After the first bending process is performed, as shown in FIG. 5A, a second bending unit including a rail 9, a second upper bending die 12, and a second lower bending die 13.
The first bent inner lead 4 is placed on the rail 9 of the inner lead forming function unit. Next, FIG.
As shown in (B), the second upper mold 12 is lowered, and the inner lead 4 is sandwiched and fixed by the rail 9. Next, FIG.
As shown in (C), the second lower bending mold 13 moves up and is bent at a right angle at the second bending position 14. The position of the bent inner lead 4 is changed on the semiconductor pellet electrode 3. Finally, as shown in FIG. 5 (D), the second upper bending mold 12 is raised, the second lower bending mold 13 is lowered, and each is returned to the original position.

After the second bending process, as shown in FIG. 6, the semiconductor lead electrode 3 and the inner lead 4 are joined via the joining material 7 by crimping with the crimping tool 15 of the inner lead crimping function part. At this time, the hoop lead frame 2 is fed at a pitch, and the supply of the adhesive 7 by the die bonding supply unit, the bending of the inner lead 4 by the inner lead forming function unit, and the press bonding by the inner lead pressing function unit are performed simultaneously. .

FIG. 7 is a perspective view of an inner lead of a second example of the hoop lead frame used in the assembling method of the present invention, and FIG.
Is a perspective view of the inner lead forming function portion of FIG. 7, and FIG.
7A to 7D are side views of the inner lead forming function part shown in the order of steps for explaining the bending method of FIG. 7. As shown in FIG. 7, in the inner lead 4 of the second example, one lead is led out from one end face in the same manner as the hoop lead frame 2 shown in FIG. It has two bending positions 20 parallel to each other.

The assembling method using the second example of the hoop lead frame uses the inner lead 4 having the lateral inner lead 18 shown in FIG. 7, and uses the rail 9, the upper bending die 16 and the lower bending die 16 shown in FIG. Bending is performed in one step by the inner lead forming function section configured by the die 17. First, as shown in FIG.
After bonding, the adhesive 7 is applied on the semiconductor pellet electrode 3.
The inner lead 4 supplied with is placed on the rail 9.

Next, as shown in FIG. 9B, the upper bending die 16 is lowered, and the inner lead 4 is narrowed and fixed to the rail 9. Next, as shown in FIG. 9C, the bending lower mold 1
7 rises and as shown in FIG.
8 are bent at right angles by one forming bending at two bending positions 20. The position of the bent inner lead 4 is changed on the semiconductor pellet 5. Next, the bending upper mold 16 is raised, and the bending lower mold 17 is lowered to return them to their original positions. Finally, as shown in FIG. 6, the semiconductor pellet electrode 3 and the inner lead 4 are joined via the joining material 7 by crimping with the crimping tool 15 of the inner lead crimping function unit.

FIG. 10 is a perspective view of an inner lead of a third example of the hoop lead frame used in the assembling method of the present invention. As shown in FIG. 10, in the inner leads of the third example, the longitudinal inner leads 19 are formed and are parallel to each other within the area.
The book has a bending position. Similar to the inner lead of the second example, this inner lead can be bent in one step.

FIGS. 11A to 11C are side views showing other shapes of the inner lead according to the assembling method of the present invention. As shown in FIGS. 11A to 11C, the shape of the inner lead 4 is different in the position, size, etc. of the lead frame island 6, the inner lead 4 depending on the type of the semiconductor device, and the position conversion is performed accordingly. Since the distance is large and small,
The bending position 20 can be increased or decreased and the shape can be changed as needed to accommodate each type of product.

FIG. 12 is a plan view of a hoop lead frame after mold sealing according to a second embodiment of the assembling method of the present invention, and FIG. 13 is a plan view of an inner lead portion of an example of the hoop lead frame of FIG. is there. As shown in FIG.
The mold package 1 of the semiconductor device formed on the hoop lead frame by the assembling method of the present invention is an example in which two leads are led out from one end surface.

In this assembling method, as shown in FIG. 13, two inner leads 4 having parallel first bending positions 11 and second bending positions 14 are symmetrical with respect to the center line of the REIT frame island 6. This is performed using the hoop lead frame 2 arranged in the above.

FIGS. 14A and 14B are side views of the inner lead forming function shown in the order of steps for explaining the method of bending the inner leads of the hoop lead frame of FIG. In the assembling method using the inner leads 4 shown in FIG. 13, after supplying the bonding material 7 onto the semiconductor pellet electrode 3, first, as shown in FIG. 14A, the two inner leads shown in FIG. The first upper die 8 of the first inner lead forming function part is moved down to be fixed with the inner lead 4 and the rail 9. Next, the first bending mold 10 is raised, and the two inner leads 4 are simultaneously bent at the first bending position 11 at right angles. Next, as shown in FIG. 14B, the second upper bending mold 12 of the second inner lead forming function part descends to fix the inner lead 4 to the rail 9. Next, the second lower mold 13 is raised, and the two inner leads 4 are simultaneously bent at right angles at the second bending position 14 so that the two inner leads 4 are repositioned on the semiconductor pellet electrode 3. Next, the semiconductor pellet electrode 3 and the two inner leads 4 are joined via the joining material 7 by crimping with the crimping tool 15 of the inner lead crimping function unit shown in FIG.

[0021]

As described above, according to the present invention, a plurality of inner lead forming steps for forming and bending the inner lead of the lead frame to change the position of the inner lead on the semiconductor pellet electrode are performed. And a bump supply step of supplying a bonding material, and a mechanism that can bond the semiconductor pellet electrode and the inner lead through the bonding material. Improvement,
The simplification of the respective steps makes it possible to automate the equipment and eliminate the need for a wire bonder, which has the effect of reducing the cost of the manufacturing equipment, the floor, and the manufacturing cost of the semiconductor device.

[Brief description of drawings]

FIG. 1 is a plan view of a hoop lead frame after mold encapsulation according to a first embodiment of a method of assembling a semiconductor device of the present invention.

FIG. 2 is a plan view of an inner lead portion of the first example of the hoop lead frame of FIG. 1;

FIGS. 3A and 3B are perspective views illustrating a method of bending an inner lead of the hoop lead frame of FIG. 1;

4 (A) to 4 (D) are side views of the inner lead forming function part shown in the order of steps for explaining the bending method of FIG. 3 (A).

FIGS. 5A to 5D are side views of the inner lead forming function unit shown in the order of steps for explaining the bending method of FIG. 3B.

FIG. 6 is a perspective view of the inner lead crimping function unit of FIG. 3;

FIG. 7 is a perspective view of an inner lead of a second example of the hoop lead frame used in the assembly method of the present invention.

FIG. 8 is a perspective view of the inner lead forming function unit of FIG. 7;

FIGS. 9A to 9D are side views of the inner lead forming function unit shown in the order of steps for explaining the bending method of FIG. 7;

FIG. 10 is a perspective view of an inner lead of a third example of the hoop lead frame used in the assembling method of the present invention.

11A to 11C are side views showing another shape of the inner lead used in the assembling method of the present invention.

FIG. 12 is a plan view of a hoop lead frame after mold encapsulation according to a second embodiment of the assembling method of the present invention.

FIG. 13 is a plan view of an inner lead portion of an example of the hoop lead frame of FIG.

14A and 14B are side views of the inner lead forming function unit shown in the order of steps for explaining a method of bending the inner lead of the hoop lead frame of FIG. 12;

FIGS. 15A, 15B, and 15C are a front view, a bottom view, and a side view, respectively, of a mold package for explaining a conventional method of bonding a semiconductor pellet electrode and an inner lead.

16A to 16C are plan views showing the method of processing the second lead of FIG. 15 in order of process steps.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mold package 2 Hoop lead frame 3 Semiconductor pellet electrode 4 Inner lead 5 Semiconductor pellet 6 Lead frame island 7 Bonding material 8 First bending die 9 Rail 10 First bending die 11 First bending position 12 Second bending Mold 13 Second lower bending die 14 Second bending position 15 Crimping tool 16 Upper bending die 17 Lower bending die 18 Lateral inner lead 19 Vertical inner lead 20 Bending position 21 Intermediate part 22 First lead 23 First 2 Lead

Claims (4)

[Claims] 1. A method of manufacturing a semiconductor device, comprising: an assembly step of wiring an electrode of a semiconductor pellet placed on an island of a lead frame and an inner lead of the lead frame, wherein the assembling step comprises forming the inner lead Performing a first bending process at a right angle at a first bending position, and further performing a second bending process at a right angle at a second bending position to convert the end portion of the inner lead onto the semiconductor pellet. And a step of crimping and bonding the end portion of the position-converted inner lead to the semiconductor pellet electrode via a bonding material to bond the semiconductor lead electrode. 2. The method of manufacturing a semiconductor device according to claim 1, wherein the first bending position and the second bending position are formed in parallel with each other. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the first bending position and the second bending position are formed so that their cross sections have a U-shape. 4. The method of manufacturing a semiconductor device according to claim 1, wherein the first bending position and the second bending position are formed so that their cross sections are stepwise.