JPH093407A - Lustering agent - Google Patents

Abstract

PURPOSE: To obtain a lustering agent uniformly spreadable on a substrate, easily removable by wiping and effective for applying good luster to the surface of coated or plated metal, plastics, wood, etc. CONSTITUTION: This lustering agent is produced by compounding (A) 100 pts.wt. of a wax and/or a waxy substance with (B) preferably 0.1-100 pts.wt. of cured silicone powder having an average particle diameter of preferably 0.1-200μm (especially 0.5-80μm), preferably exhibiting rubbery nature and containing epoxy group. The epoxy group of the component B is e.g. 4-oxiranylbutyl group, m,8- oxiranyloctyl group, 3-glycidoxypropyl group or 2-(3,4-epoxycyclohexyl)ethyl group. The epoxy equivalent of the compound is especially preferably 500-10,000.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing agent, and more particularly to a polishing agent which can be uniformly spread on a base material, is easy to wipe off, and imparts good gloss to the base material.

[0002]

2. Description of the Related Art A polish containing a wax and / or a wax-like substance containing a cured silicone powder is characterized in that it can be easily wiped off. As such a polishing agent, for example, a polishing agent containing a silicone rubber powder (Japanese Patent Laid-Open No. 2-117979 and Japanese Patent Laid-Open No. 2-179979).
No. 147677), and a polishing agent containing polymethylsilsesquioxane powder (JP-A-55-6297).
No. 8 and Japanese Patent Application Laid-Open No. 61-159474), and a polishing agent containing a silicone rubber powder containing silicone oil (see Japanese Patent Application Laid-Open Nos. 2-150478 and 2-202566). .

However, these polishes have a problem that a uniform polish cannot be prepared due to poor dispersibility of the cured silicone powder in the main component wax and / or wax-like substance. . There is also a problem that such a polish cannot be uniformly spread on the base material, or uneven gloss is generated, so that the base material cannot be provided with good gloss.

[0004]

The present inventors have arrived at the present invention as a result of extensive studies on the above problems. That is, an object of the present invention is to provide a polish which can be uniformly spread on a base material, is easy to wipe off, and gives a good gloss to the base material.

[0005]

The polishing agent of the present invention relates to a polishing agent comprising a wax and / or a wax-like substance, which is characterized by containing a cured silicone powder containing an epoxy group.

The polishing agent of the present invention will be described in detail below. Wax and / or the main component of the polish of the present invention
Examples of the wax-like substance include carnauba wax, montan wax, candelilla wax (candelilla wax), ceresin wax (ozokerite), bees wax, wool wax (lanolin),
Natural or synthetic waxes such as solid paraffin wax, liquid paraffin wax, microcrystalline wax, polyethylene wax, etc., stearic acid, hydrogenated castor oil, fats and oils such as metal soaps, fatty acids, and wax-like substances such as derivatives thereof, wax-like substances Examples thereof include synthetic resins.

A cured silicone powder containing epoxy groups is a characteristic component of the present invention. Examples of this property include gel, rubber, and hard resin, and rubber is particularly preferable. Further, examples of this shape include a spherical shape, a flat shape, and an indefinite shape, and a spherical shape is particularly preferable. The average particle size is preferably 0.1 to 200 μm, and particularly preferably 0.5 to 80 μm. This is because it is very difficult to prepare a cured silicone powder having an average particle size of less than 0.1 μm, and when it exceeds 200 μm, it becomes difficult to prepare a uniform polish. . Examples of the epoxy group contained in the cured silicone powder include a 4-oxiranylbutyl group m, 8-oxiranyloctyl group and 3
-Glycidoxypropyl group and 2- (3,4-epoxycyclohexyl) ethyl group. The content of the epoxy group in the cured silicone powder is, for example, preferably such that the epoxy equivalent is 500 to 100,000 in order to sufficiently exert the effect of the epoxy group, and particularly, the content is 500 to 100. The content is preferably 10,000. Examples of the silicon atom-bonded organic group other than the epoxy group contained in the cured silicone powder include alkyl groups such as methyl group, ethyl group and propyl group; alkenyl groups such as vinyl group, allyl group and butenyl group; phenyl. Group, aryl group such as tolyl group;
Aralkyl groups such as benzyl group and phenethyl group;
A halogenated alkyl group such as 3-trifluoropropyl group;
Examples thereof include organic functional groups such as 3-methacryloxypropyl group, 3-mercaptopropyl group, 3-aminopropyl group, N- (2-aminoethyl) -3-aminopropyl group. Further, in the cured silicone powder, as an optional component, for example, an inorganic filler such as amorphous silica, crystalline silica, titanium oxide or calcium carbonate, or a non-crosslinking silicone oil can be blended.

Examples of the method for preparing the cured silicone powder include organopolysiloxane containing at least two alkenyl groups in one molecule, and organopolysiloxane containing at least two silicon-bonded hydrogen atoms in one molecule. Epoxy compounds containing aliphatic unsaturated bonds such as polysiloxane, allyl glycidyl ether, vinyl cyclohexene monooxide, and glycidyl methacrylate, and an addition reaction curable silicone composition comprising a platinum catalyst, at least 2 in one molecule Organopolysiloxane containing silanol groups, organopolysiloxane containing at least two silicon-bonded hydrogen atoms in one molecule, 4-oxiranylbutyltrimethoxysilane, 4-oxiranylbutyltriethoxysilane,
4-oxiranylbutylmethyldimethoxysilane, 8-
Oxiranyloctyltrimethoxysilane, 8-oxiranyloctyltriethoxysilane, 8-oxiranyloctylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4
-Epoxycyclohexyl) alkoxysilane containing an epoxy group such as ethylmethyldimethoxysilane, or a partial hydrolysis condensate thereof, and a condensation reaction curable silicone composition comprising a condensation reaction catalyst such as an organotin compound, one molecule An organopolysiloxane containing at least two silanol groups therein, an organosilane containing three hydrolyzable groups, or a partial hydrolyzed condensate thereof, an alkoxysilane containing the above epoxy group,
Alternatively, after curing a curable silicone composition such as a condensation reaction curable silicone composition comprising a partial hydrolysis condensate thereof and a condensation reaction catalyst such as an organotin compound or an organic titanium compound, the cured silicone is pulverized. Method, water and an emulsifier are added to the curable silicone composition, and the mixture is emulsified and dispersed by a mixing device such as a micromixer, turbine blade stirrer, homomixer, colloid mill, and homogenizer, and then these curable silicones are used. Examples include methods of curing the composition. In these preparation methods, by adding water and an emulsifier to a curable silicone composition and emulsifying the resulting cured silicone powder, the emulsifier is present on the surface or in the interior, which often gives good results. Examples of the method for removing water from the aqueous dispersion of the cured silicone powder include an air drying method, a method using a well-known heat dryer such as a vacuum dryer, a hot air circulating oven, and a spray dryer.

The polishes of this invention are prepared by uniformly mixing the wax and / or waxy material with a cured silicone powder containing epoxy groups. In the polishing agent of the present invention, the amount of the curable silicone powder blended should be 100 parts by weight of the wax and / or wax-like substance because it is easy to wipe off and gives a good gloss to the substrate. The amount of the wax and / or wax-like substance 100 is preferably 0.1 part by weight or more, and a uniform polish can be easily prepared and can be evenly spread on a substrate. It is preferably 100 parts by weight or less with respect to parts by weight. Further, in the polish of the present invention, as other optional components, for example, dimethyl silicone oil, methylphenyl silicone oil, alkyl-modified silicone oil, epoxy-modified silicone oil, amino-modified silicone oil, fluorinated alkyl-modified silicone oil, etc. Silicone oil; organic resin powder such as fluororesin powder, nylon resin powder, polyester resin powder, acrylic resin powder, epoxy resin powder, phenol resin powder, polyurethane resin powder; calcium carbonate, talc, mica, bentonite, diatomaceous earth, silica, Silicates such as magnesium silicate, inorganic powders such as alumina;
Fragrances, dyes, pigments, leveling agents, ultraviolet absorbers, antistatic agents, and thickeners can be added. As a method for preparing the polish of the present invention, for example, when the wax and / or the wax-like substance is solid at room temperature, the epoxy group-containing cured silicone powder is added to the wax and the wax while heating and melting the substance. The method of blending, after dissolving the wax and / or wax-like substance in an organic solvent,
A method of adding a cured silicone powder containing an epoxy group to this is mentioned. Examples of the apparatus for preparing the polish of the present invention include a Ross mixer, a planetary mixer, a Hobart mixer, a micro mixer, a turbine blade agitator, a homomixer, a colloid mill and a homogenizer.

The properties of the polishing agent of the present invention thus prepared include, for example, semi-solid type, paste type, dispersion type and emulsion type. When the polishing agent of the present invention is used as a dispersion type, it can be blended with an organic solvent such as industrial gasoline, kerosene, ligroin, mineral spirit, normal paraffin solvent, isoparaffin solvent. Also,
The polishing agent of the present invention can be made into an emulsion type by emulsifying a semi-solid type, a paste type, or a dispersion type polishing agent with water and an emulsifier. As this emulsifier,
For example, sorbitan fatty acid ester, glycerin fatty acid ester, decaglycerin fatty acid ester, polyglycerin fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene glycerin fatty acid ester, polyethylene glycol fatty acid ester, polyoxyethylene alkyl ether, alkyl fatty acid triglyceride, poly Nonionic emulsifiers such as oxyalkylene / dimethylpolysiloxane copolymers; anionic emulsifiers such as polyoxyalkyl ether sulfates, alkyl phosphates, polyoxyethylene alkyl ether phosphates; alkyl ammonium salts, alkyl benzyl ammonium salts, etc. Cationic emulsifiers; amphoteric emulsifiers such as betaine acetate, imidazolinium betaine, and lecithin. Further, water and a fatty acid such as oleic acid and stearic acid are added to the polish of the present invention, and this is heated and saponified with an alkaline substance such as triethanolamine, morpholine, caustic soda, and caustic soda to give a gel form. You can also do it.

The polish of the present invention can be evenly spread on a substrate, can be easily wiped off, and can impart good gloss to the substrate even after a weathering test by initial and outdoor exposure. Car body, home appliances, furniture,
Surfaces such as walls and floors, especially painted or plated metal,
It is suitable as a polish for imparting luster and luster to the surface of plastics and wood.

[0012]

EXAMPLES The polishing agent of the present invention will be described in detail with reference to Examples. In the examples, the viscosity is a value measured at 25 ° C. Further, the properties of the cured silicone powder and the polish were measured as follows. [Average particle diameter of cured silicone powder] The average particle diameter was measured by an image processing device connected to an optical microscope. [Epoxy Equivalent of Cured Silicone Powder] After the cured silicone powder was dispersed in an organic solvent, an aqueous hydrochloric acid solution was added and reacted with an epoxy group. Then, the epoxy equivalent was obtained by titrating unreacted hydrochloric acid with sodium hydroxide. [Coating and Spreading Property of Polishing Agent] Uniformity, spreading and spreading when 1 part by weight of the polishing agent was spread on an acrylic resin coating film (20 cm × 20 cm) were evaluated. [Wipeability of Polishing Agent] One part by weight of the polishing agent was evenly spread on an acrylic resin coating film (20 cm × 20 cm), and the wipeability was evaluated. [Initial gloss] The gloss of the acrylic resin coating film immediately after the treatment with the polish was observed. [Dirt Immediately After Weathering Test] Immediately after the acrylic resin coating film treated with the polish was exposed outdoors for one month, the coating film was observed for stains such as scale and dust. [Gloss after weathering test] The acrylic resin coating film treated with a polish was exposed outdoors for one month, and then the coating film was washed with water and the gloss of the coating film was observed.

Reference Example 1 50 parts by weight of dimethylpolysiloxane (vinyl group equivalent = 8000) capped with dimethylvinylsiloxy groups at both ends of the molecular chain and a viscosity of 20 centipoise, formula:

Embedded image A composition obtained by uniformly mixing 11 parts by weight of a dimethylsiloxane / methylhydrogensiloxane copolymer represented by
(I) was prepared. Next, this dimethyl polysiloxane 5
0 parts by weight of chloroplatinic acid in isopropanol (2 parts by weight of platinum metal for this dimethylpolysiloxane)
A composition (II) was prepared by uniformly mixing (0 ppm). 61 parts by weight of this composition (I) and 50 parts of the composition (II)
After uniformly mixing 5 parts by weight of the mixture at 5 ° C., 200 parts by weight of pure water (electrical conductivity = 0.2 μS / cm) at 25 ° C. and polyoxyethylene nonylphenyl ether (HLB = 1)
3.1) 4 parts by weight were quickly mixed, and a homogenizer (300 kgf / cm ² ) was used to prepare a uniform aqueous emulsion of a curable silicone composition. This aqueous emulsion was allowed to stand at 30 ° C. for 6 hours to prepare an aqueous dispersion of silicone rubber powder. This aqueous dispersion was heated at 80 ° C. for 1 hour and then dried with a spray dryer to prepare a silicone rubber powder (A).

[Reference Example 2] 50 parts by weight of dimethylpolysiloxane (vinyl group equivalent = 8000) capped with dimethylvinylsiloxy groups at both ends of the molecular chain and a viscosity of 20 centipoise, formula:

Embedded image A composition obtained by uniformly mixing 11 parts by weight of a dimethylsiloxane / methylhydrogensiloxane copolymer represented by
(I) was prepared. Next, this dimethyl polysiloxane 5
A composition (III) was prepared by uniformly mixing 0 parts by weight, 10 parts by weight of allyl glycidyl ether, and an isopropanol solution of chloroplatinic acid (amount of platinum metal being 20 ppm by weight with respect to this dimethylpolysiloxane). . 5 parts by weight of 61 parts by weight of this composition (I) and 60 parts by weight of composition (III).
After uniformly mixing at 0 ° C, 200 parts by weight of pure water (electrical conductivity = 0.2 μS / cm) at 25 ° C and 4 parts by weight of polyoxyethylene nonylphenyl ether (HLB = 13.1) were rapidly mixed. Then, homogenizer (300kg
f / cm ² ) to prepare a uniform aqueous emulsion of curable silicone composition. Add this water-based emulsion to 3
The mixture was allowed to stand at 0 ° C. for 6 hours to prepare an aqueous dispersion of silicone rubber powder. This aqueous dispersion was heated at 80 ° C. for 1 hour and then dried with a spray dryer to prepare a silicone rubber powder (B).

Reference Example 3 Formula:

Embedded image 100 parts by weight of dimethylpolysiloxane represented by the formula, 10 parts by weight of methylhydrogenpolysiloxane capped with trimethylsiloxy groups at both ends of a molecular chain having a viscosity of 20 centipoise (silicon atom-bonded hydrogen atom equivalent = 67), and 3-glycidoxypropyl Add 6 parts by weight of trimethoxysilane to -5 ° C.
After uniformly mixing with 0.8 parts by weight of tin octylate, a curable silicone composition was prepared. Pure water (electrical conductivity =
0.2 μS / cm) 120 parts by weight and 3 parts by weight of polyoxyethylene nonylphenyl ether (HLB = 13.1) were mixed at about 5 ° C. and then homogenized (300 kgf).
/ Cm ² ) as a uniform aqueous emulsion of a curable silicone composition, and further 240 parts by weight of pure water (electrical conductivity = 0.2 μS / cm) was added thereto. This emulsion was left at room temperature for 1 day to prepare an aqueous dispersion of silicone rubber powder. Water was removed from this aqueous dispersion with a spray dryer to prepare a silicone rubber powder (C).

[0016]

[Table 1]

Example 1 To a planetary mixer were added 10 parts by weight of carnauba wax, 10 parts by weight of ceresin wax (ozokerite), 20 parts by weight of beeswax and 10 parts by weight of microcrystalline wax,
These were heated and mixed at 90 ° C. Next, 25 parts by weight of liquid paraffin, 10 parts by weight of dimethylpolysiloxane capped with trimethylsiloxy groups at both ends of a molecular chain having a viscosity of 350 centipoise, 5 parts by weight of magnesium silicate powder,
10 parts by weight of the silicone rubber powder (B) prepared in Reference Example 2 was added, and these were heated and mixed at 90 ° C. for 30 minutes, and then cooled to room temperature to prepare a semisolid uniform polish.

[Comparative Example 1] Referential Example 2 in Example 1
A semi-solid polish was prepared in the same manner as in Example 1 except that the silicone rubber powder (B) prepared in (3) was not added.

Example 2 20 parts by weight of carnauba wax, 40 parts by weight of kerosene, and 10 parts by weight of dimethylpolysiloxane endblocked by trimethylsiloxy groups at both molecular chain ends having a viscosity of 350 centipoise were added to a planetary mixer and uniformly mixed at room temperature. Mixed. Next, 10 parts by weight of each of the silicone rubber powder (C) prepared in Reference Example 3 was added thereto,
The mixture was mixed at room temperature for 30 minutes to prepare a uniform dispersion type polish.

[Comparative Example 2] Referential Example 3 in Example 2
Example 1 instead of the silicone rubber powder (C) prepared in
A dispersion type polishing agent was prepared in the same manner as in Example 2 except that 10 parts by weight of the silicone rubber powder (A) prepared in (4) was added. This polishing agent had agglomerated particles of silicone rubber powder and was non-uniform.

[0021]

[Table 2]

[0022]

EFFECTS OF THE INVENTION Since the polishing agent of the present invention contains a cured silicone powder containing an epoxy group, it can be evenly spread on a substrate, easy to wipe off, and good for a substrate. It has the feature that it can give a nice luster.

Front Page Continuation (72) Inventor Ken Tanaka 2-2 Chikusaigan, Ichihara, Chiba Toray Dow Corning Silicone Co., Ltd.

Claims (3)

[Claims] 1. A polishing agent comprising a wax and / or a wax-like substance, characterized in that a cured silicone powder containing an epoxy group is blended. 2. The average particle diameter of the cured silicone powder is 0.
The polish according to claim 1, wherein the polish is 1 to 200 µm. 3. The compounding amount of the cured silicone powder is 0.1 to 100 parts by weight based on 100 parts by weight of the wax and / or wax-like substance.
The listed polish.