JPH09327750A - Cutting device of resin film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily cut a peripheral part of a resin film sucked to a pattern plate. SOLUTION: A cutting device of a resin film is provided with a Nichrome wire 6 which is arranged above a pattern plate 15 vertically movably, and connected to a power source to cut a peripheral part of a resin film F, and a sucking member 9 which is arranged above the pattern plate 15 in an elevating/lowering manner, located outside the Nichrome wire 6, extended therealong, and capable of sucking the resin film F, and the peripheral part of the resin film F is lifted by the sucking member 9, and brought into contact with the Nichrome wire 6 so as to be cut.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an apparatus suitable for cutting a resin film adsorbed on the surface of a model board.

[0002]

2. Description of the Related Art In a so-called vacuum mold making method in which silica sand is surrounded by a frame and a resin film, and the enclosed interior is suction-decompressed to cure the silica sand, a so-called vacuum mold making method is required. The resin film cut into pieces is heated in a state of being held at the peripheral portion to impart ductility, and then adsorbed on the model plate. And especially when there is a large model part on the side of the model plate,
In order to give the resin film a large degree of extensibility, and to be able to sufficiently heat the part corresponding to the large model part on its side,
The resin film used was larger than the model board.
However, when a mold is molded using such a large resin film, when the frame or the like that adsorbs the resin film is inverted or moved, the peripheral edge of the resin film peels off from the frame due to its own weight. Therefore, it is necessary to make the resin film as small as possible after being adsorbed on the model board. By the way, conventionally, there is no cutting device capable of easily cutting the peripheral portion of the resin film adsorbed on the model plate into a desired size, and there is a large model portion on the side portion of the model plate described above. In this case, after cutting the resin film to a required small size, the worker manually heats the part that needs the extensibility by flame etc. The environment was getting worse. The present invention has been made in view of the above circumstances,
It is an object of the present invention to provide an apparatus capable of easily cutting the peripheral edge portion of a resin film adsorbed on a model plate.

[0003]

In order to achieve the above object, a resin film cutting apparatus of the present invention is an apparatus for cutting a resin film adsorbed on the surface of a model plate, which is above the model plate. A nichrome wire which is arranged so as to be capable of moving up and down relatively to this and which is connected to a power source and melts and cuts the peripheral portion of the resin film; and a nichrome wire which is arranged above the model plate so as to be liftable and located outside the nichrome wire. And a suction member capable of adsorbing the resin film while extending substantially along the same, and the peripheral portion of the resin resin film adsorbed on the model plate is lifted by the suction member and brought into contact with the nichrome wire. To melt down.

[0004]

1 to 3 show an embodiment of the present invention.
This will be described in detail based on FIG. As shown in FIG. 2, which is a front view, a rail 2 extending in the left-right direction is provided on the upper surface of the ceiling portion of the gate frame 1 that is long in the left-right direction.
A traveling carriage 3 is mounted on the top so that the traveling carriage 3 can travel. A gate-shaped lifting frame 4 is mounted below the traveling carriage 3 so as to be lifted and lowered via a downwardly directed first cylinder 5, and nichrome wires 6 extending in the left-right direction are provided on both front and rear sides of a lower portion of the lifting frame 4. The two nichrome wires 6 are stretched via a mounting member 7 so that the resin film F adsorbed on the model plate 15 described later can be melt-cut to a required width.

Two downwardly facing second cylinders 8 are pivotally mounted on the front and rear outer surfaces of the ceiling portion of the elevating frame 4, and the lower ends of the piston rods 8a of the respective second cylinders 8 are supported. Is located outside the nichrome wire 6 and extends in the left-right direction along the nichrome wire 6.
Is installed at the center. Further, as shown in FIG. 1 which is a cross-sectional view taken along the line AA of FIG. 2 (a state in which the elevating frame 4 and the like are lowered), each suction member 9 is pivotally attached to the elevating frame 4 via the bracket 10 and the support pin 11. It is also fixed to the tip end of the supported link 12, and is vertically moved around the support pin 11 as a fulcrum by the expansion and contraction operation of the second cylinder 8 so as to move up and down. The inside of the hollow portion of each suction member 9 communicates with a vacuum pump (not shown) via a rubber hose 13, and a large number of suction holes 14 are formed on the lower surface of each suction member 9. In the figure, 15
Is a model plate, and 16 is a recovery hopper.

Next, using the apparatus thus constructed,
An operation of fusing and removing both front and rear portions of the resin film F adsorbed on the surface of the model plate 15 will be described. At the position just above the model plate 15 which has adsorbed the resin film F on its surface,
The elevating frame 4, the suction member 9 and the like are moved by the traveling carriage 3, and then the first cylinder 5 is extended to lower the elevating frame 4, the suction member 9 and the like so that the suction member 9 contacts the resin film F. Contact. Next, the nichrome wire 6 is energized to heat the nichrome wire 6, and the inside of the suction member 9 is communicated with a vacuum pump to suck the resin film F onto the lower surface of the suction member 9, and subsequently contract the second cylinder 8. When activated, the adsorbing member 9 is raised to raise the side portions of the resin film F and to bring them into contact with the heated nichrome wire 6 to fuse the side portions of the resin film F. After fusing the resin film F,
The first cylinder 5 is contracted to raise the elevating frame 4, the melted resin film F, etc., and then the traveling carriage 3
The elevating frame 4, the melted resin film F and the like are moved to a position directly above the recovery hopper 16. Then, the reduced pressure in the adsorption member 9 is released and the resin film F melted and cut.
Are dropped into the collection hopper 16.

In the above embodiment, the suction member 9 is raised and lowered by rotating through the link 12, but the same effect can be obtained by directly raising and lowering it without passing through the link 12. The effect is obtained.

[0008]

As is apparent from the above description, according to the present invention, there is provided a nichrome wire which is arranged above the model plate so as to be able to move up and down relatively thereto and which is connected to a power source and melts and cuts the peripheral portion of the resin film. A suction member which is arranged above the model plate so as to be able to move up and down, extends outside the nichrome wire and extends substantially along the nichrome wire, and which is capable of sucking the resin film. It also has an excellent effect that the peripheral edge of the resin film can be easily and surely cut.

[Brief description of drawings]

1 is a partial cross-sectional side view showing a main part of an embodiment of the present invention (A- in a state in which a suction member is lowered in FIG. 2;
(A sectional view).

FIG. 2 is a partial cross-sectional schematic front view of a vacuum mold making equipment to which the present invention is applied.

FIG. 3 is a plan view of FIG. 2;

[Explanation of symbols]

 6 Nichrome wire 9 Adsorption member 15 Model board F Resin film

Claims (1)

[Claims] 1. An apparatus for cutting a resin film adsorbed on the surface of a model board, which is arranged above the model board 15 so as to be able to move up and down relatively thereto and connected to a power source. Nichrome wire 6 for fusing the periphery of
And a suction member 9 which is disposed above the model plate 15 so as to be able to move up and down, is located outside the nichrome wire 6 and extends substantially along the nichrome wire 6, and is capable of sucking the resin film F.
An apparatus for cutting a resin film, comprising: