JPH09326225A - Thermo-relay - Google Patents

Thermo-relay

Info

Publication number
JPH09326225A
JPH09326225A JP16383396A JP16383396A JPH09326225A JP H09326225 A JPH09326225 A JP H09326225A JP 16383396 A JP16383396 A JP 16383396A JP 16383396 A JP16383396 A JP 16383396A JP H09326225 A JPH09326225 A JP H09326225A
Authority
JP
Japan
Prior art keywords
contact
relay
bimetal
heating element
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16383396A
Other languages
Japanese (ja)
Inventor
Tsuyoshi Nozoki
堅 除
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Tanshi Kogyo Kk
Original Assignee
Fuji Tanshi Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Tanshi Kogyo Kk filed Critical Fuji Tanshi Kogyo Kk
Priority to JP16383396A priority Critical patent/JPH09326225A/en
Publication of JPH09326225A publication Critical patent/JPH09326225A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a low cost delay thermo-relay. SOLUTION: Contacts 5 are adapted to stand face to face opposite to each other on a surface of an insulation board 6 and a bimetallic strip 2 is placed over between these contacts 5. ON-type relay wherein a free end of the bimetallic strip 2 extending from one contact 5 normally keeps contact with the other contact 5 or OFF-type one wherein the free end keeps apart are sellected. A heat emitting body 3 such as a resistor or a PTC heating body is formed on a back side surface of this insulation board 6 and two lead wires 7 extending therefrom are connected to a voltage limiting side via a limit switch. The dimetallic strip 2 is blipped by turning on the limit switch. A low cost delay relay used as a delay switch and the like is thereby made possible.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明はバイメタルのオン・
オフによって直接負荷を遅延制御するサーモリレーに関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a thermorelay that directly delays and controls a load by turning off.

【0002】[0002]

【従来の技術】従来のリレーは磁性体やマグネットコイ
ルそしてバネ等で構成され,コイル通電によって瞬時に
負荷を制御する。
2. Description of the Related Art A conventional relay is composed of a magnetic material, a magnet coil, a spring, etc., and instantaneously controls the load by energizing the coil.

【0003】[0003]

【発明が解決しようとする課題】従来方式リレーは部品
点数が多くコスト高である。セラミック基板の利便さと
バイメタルの遅延性を利用した低コストのリレーを提供
するのが本発明であり,以下図面に基づいて詳しく説明
する。
The conventional type relay has a large number of parts and is costly. The present invention provides a low-cost relay that utilizes the convenience of a ceramic substrate and the delay property of a bimetal, and will be described in detail below with reference to the drawings.

【0004】[0004]

【課題を解決するための手段】薄いセラミック基板の上
側面に接点を対峙形成し,両接点間にバイメタルを掛け
渡し,セラミック基板の裏面にPTC発熱体を形成す
る。バイメタルは常時オンあるいはオフに設定され,加
熱により反転する。キューリ温度に達するまでの遅延時
間は,小型化によっ著しく短縮される。
Means for Solving the Problems A contact is formed on the upper side surface of a thin ceramic substrate, a bimetal is laid between both contacts, and a PTC heating element is formed on the back surface of the ceramic substrate. The bimetal is always set to on or off, and it is inverted by heating. The delay time to reach the Curie temperature is significantly shortened by miniaturization.

【0005】[0005]

【発明の実施の形態】セラミック等からなる絶縁基板6
の上側面に接点5,5を対峙形成し,この接点間にバイ
メタル2を掛け渡す。一方の接点5から伸びるバイメタ
ル2の自由端は他の接点5に常時当接あるいは離れてい
るようにセッテイグされている。常時当接のバイメタル
は所定温度に達して始めてこの接点5から離れる。絶縁
基板6の裏側面に発熱体3を形成し,リード線7,7を
これから伸ばす。この発熱体3は,抵抗やPTC材料で
形成される。PTC発熱体の場合にはキューリ温度以下
でバイメタル2が作動するように設定される。このよう
に構成されるサーモリレー本体1の利用例を第1,3図
に示す。
BEST MODE FOR CARRYING OUT THE INVENTION Insulating substrate 6 made of ceramic or the like
Contact points 5 and 5 are formed to face each other on the upper side surface, and a bimetal 2 is laid between these contact points. The free end of the bimetal 2 extending from one contact 5 is set so as to be always in contact with or away from the other contact 5. The bimetal, which is always in contact, leaves the contact 5 only after reaching a predetermined temperature. The heating element 3 is formed on the back side of the insulating substrate 6, and the lead wires 7, 7 are extended from this. The heating element 3 is made of a resistance or PTC material. In the case of a PTC heating element, the bimetal 2 is set to operate below the Curie temperature. An example of the use of the thermo-relay main body 1 thus configured is shown in FIGS.

【0006】第1図は常時オンのバイメタル2を負荷回
路に配置してある。制御スイッチ4をオンにすると,制
御電圧が発熱体3に加えられ昇温する。サーモリレー本
体1の熱容量に応じて昇温速度は異なる。熱容量を今日
の集積化技術を利用して極めて小さく採れば,昇温速度
は著しく大きくなり,速動応動型となる。所定温度に達
するとバイメタル2の自由端は第2図のように接点5か
ら離れる。PTC発熱体の場合にはキューリ温度以下で
バイメタル2は離れる。PTC発熱体はキューリ温度に
達すると急峻な抵抗値を呈し余分な発熱は抑制される。
制御スイッチ4を開くと発熱体3は降温してバイメタル
2はオン状態に戻る。
In FIG. 1, an always-on bimetal 2 is arranged in a load circuit. When the control switch 4 is turned on, a control voltage is applied to the heating element 3 to raise the temperature. The temperature rising rate differs depending on the heat capacity of the thermo-relay body 1. If the heat capacity is made extremely small by using today's integrated technology, the rate of temperature rise will be remarkably high, and it will be a fast response type. When the predetermined temperature is reached, the free end of the bimetal 2 separates from the contact 5 as shown in FIG. In the case of a PTC heating element, the bimetal 2 separates below the Curie temperature. When the PTC heating element reaches the Curie temperature, it exhibits a steep resistance value, and excessive heat generation is suppressed.
When the control switch 4 is opened, the temperature of the heating element 3 drops and the bimetal 2 returns to the on state.

【0007】第3図はシャント制御方式(延引スイッ
チ)の実施例であり,負荷に対して並列に制御スイッチ
と発熱体3の直列回路が配置されている。負荷側回路に
挿入されたバイメタル2は常時オフの状態である。制御
スイッチ4がオンになると,発熱体3は昇温しバイメタ
ル2はオン状態に変化する。遅延リレーとして作動す
る。過渡応答性はサーモリレー本体1の熱容量と周囲の
熱環境に左右される。第2図の実施例は一枚のセラミッ
ク基板6に一個のバイメタル2を配置したが,複数のバ
イメタル2を配置して多数の負荷を制御することもでき
る。また,PTC発熱体3との対を複数配置して個別に
負荷を制御することもできる。
FIG. 3 shows an embodiment of the shunt control system (extension switch), in which a series circuit of the control switch and the heating element 3 is arranged in parallel with the load. The bimetal 2 inserted in the load side circuit is always off. When the control switch 4 is turned on, the heating element 3 is heated and the bimetal 2 is turned on. Acts as a delay relay. The transient response depends on the heat capacity of the thermorelay body 1 and the surrounding thermal environment. In the embodiment of FIG. 2, one bimetal 2 is arranged on one ceramic substrate 6, but a plurality of bimetals 2 may be arranged to control a large number of loads. Further, a plurality of pairs with the PTC heating element 3 can be arranged to individually control the load.

【0008】[0008]

【発明の効果】要するに,本発明は薄いセラミック基板
の上側面に接点5,5を対峙形成し,両接点間にバイメ
タル2を掛け渡し,セラミック基板の裏面に抵抗等の発
熱体3を取り付け,この発熱体3を制御スイッチ4を経
て制御電圧に接続するため,低コストの遅延リレーを提
供できる。
In summary, according to the present invention, the contacts 5 and 5 are formed facing each other on the upper surface of the thin ceramic substrate, the bimetal 2 is laid between both contacts, and the heating element 3 such as a resistor is attached to the back surface of the ceramic substrate. Since this heating element 3 is connected to the control voltage via the control switch 4, a low-cost delay relay can be provided.

【図面の簡単な説明】[Brief description of drawings]

【第1図】常時オンのバイメタルよりなるサーモリレー
本体を負荷回路に配置した時の回路図である。
FIG. 1 is a circuit diagram when a thermo-relay body made of bimetal which is always on is arranged in a load circuit.

【第2図】サーモリレー本体の正面図である。FIG. 2 is a front view of the thermorelay body.

【第3図】常時オフのバイメタルよりなるサーモリレー
本体を負荷回路に配置した時の回路図である。
FIG. 3 is a circuit diagram when a thermo-relay body made of bimetal which is always off is arranged in a load circuit.

【符号の説明】[Explanation of symbols]

1 サーモリレー本体 2 バイメタル 3 発熱体 4 制御スイッチ 5 接点 6 絶縁基板 7 リード線 1 Thermo-relay body 2 Bimetal 3 Heating element 4 Control switch 5 Contact point 6 Insulation board 7 Lead wire

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 絶縁基板6の表面にバイメタル2とこれ
への作動熱を供給する発熱体3を配置してなる,サーモ
リレー。
1. A thermorelay in which a bimetal 2 and a heating element 3 for supplying operating heat thereto are arranged on the surface of an insulating substrate 6.
【請求項2】 薄いセラミック基板の上側面に接点5,
5を対峙形成し,両接点間にバイメタル2を掛け渡し,
セラミック基板の裏面にPTC発熱体3を形成してな
る,サーモリレー。
2. A contact 5, on the upper surface of the thin ceramic substrate.
5 is formed facing each other, and the bimetal 2 is laid between both contacts,
A thermorelay in which a PTC heating element 3 is formed on the back surface of a ceramic substrate.
【請求項3】 薄いセラミック基板の上側面に接点5,
5を対峙形成し,両接点間にバイメタル2を掛け渡し,
セラミック基板の裏面に抵抗等の発熱体3を取り付け,
この発熱体3を制御スイッチ4を経て制御電圧に接続す
る,サーモリレー。
3. A contact 5, on the upper surface of the thin ceramic substrate.
5 is formed facing each other, and the bimetal 2 is laid between both contacts,
Attach a heating element 3 such as a resistor to the back surface of the ceramic substrate,
A thermorelay that connects this heating element 3 to a control voltage via a control switch 4.
JP16383396A 1996-06-04 1996-06-04 Thermo-relay Pending JPH09326225A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16383396A JPH09326225A (en) 1996-06-04 1996-06-04 Thermo-relay

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16383396A JPH09326225A (en) 1996-06-04 1996-06-04 Thermo-relay

Publications (1)

Publication Number Publication Date
JPH09326225A true JPH09326225A (en) 1997-12-16

Family

ID=15781619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16383396A Pending JPH09326225A (en) 1996-06-04 1996-06-04 Thermo-relay

Country Status (1)

Country Link
JP (1) JPH09326225A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005076301A1 (en) * 2004-02-06 2005-08-18 Tyco Electronics Raychem K.K. Switch and device using the switch
KR100654013B1 (en) * 2005-02-21 2006-12-05 엘에스전선 주식회사 Breaker of Providing Successive Trip Mechanism Based on Positive Temperature Coefficient Current-Limiting Device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005076301A1 (en) * 2004-02-06 2005-08-18 Tyco Electronics Raychem K.K. Switch and device using the switch
US8395062B2 (en) 2004-02-06 2013-03-12 Tyco Electronics Raychem Kk Switch and device using the switch
KR100654013B1 (en) * 2005-02-21 2006-12-05 엘에스전선 주식회사 Breaker of Providing Successive Trip Mechanism Based on Positive Temperature Coefficient Current-Limiting Device

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