JPH09312462A - Method of forming electric circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To save time for processing a molten metal by forming an electric circuit using a resin soluble in a solvent to be set and becoming conductive by using light, X-ray, an electron beam individually or together with one another. SOLUTION: Resins to be set by light, X-ray, an electron beam becoming insoluble in a solvent and conductive is used for the formation of an electric circuit. These resins are natural rubber soluble in polybutadiene or polyisoprene or polyisobutylene solvent or copolymer of these monomers or a block copolymer thereof or dual coupling of copolymer with monomer copolymerizable with these elements with iodine added thereto. After the formation of a thin film on a glass sheet by coating the glass sheet with the solution of this resin, this thin film is irradiated with light, X-ray or an electron beam. Through these procedures, the thin film is discolored into dark violet color becoming insoluble in a solvent.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming an electric circuit.

[0002]

2. Description of the Related Art Conventionally, a method for forming an electric circuit is to bond a metal plate on an insulating plate, apply a photosensitive resin on the metal plate, and expose the circuit forming portion to cure the photosensitive resin. After that, a method of forming an electric circuit by dissolving and removing the exposed portion with an acid or the like is well known.

[0003]

In the above-mentioned conventional method, there are problems that more metal is dissolved and removed than the metal used for forming the circuit, and that processing of the dissolved metal is troublesome.

[0004]

Means for Solving the Problems As a result of earnest studies to overcome the above-mentioned drawbacks of the electric circuit forming method according to the conventional method, the present invention can be realized by the following method. (1) An electric circuit is formed by using a resin that is soluble in a solvent and that is cured by light, X-rays, electron beams, or a combination of these and becomes conductive. (2) The electric circuit of (1) above is formed by performing metal plating on a circuit formed of a resin that becomes conductive after curing. (3) The electric circuit of the above (1) or (2) is characterized in that the resin which becomes conductive after curing is an iodinated resin having an aliphatic double bond. (4) The resin having an aliphatic double bond is polybutadiene, polyisobutylene, polyisoprene and a solvent-soluble natural rubber to form the electric circuit of (3). (5) The resin having an aliphatic double bond is a resin obtained by copolymerizing a monomer selected from butadiene, isobutylene and isoprene, or another monomer copolymerizable with these monomers and these monomers. An electric circuit of the above (3) is formed, which is a resin obtained by copolymerizing a monomer selected from a monomer.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, a resin which is soluble in a solvent and which is cured by light, X-rays, electron beams or a combination thereof and becomes conductive is coated on a film or plate-shaped electric insulator. Then, only the circuit formation portion is exposed to light, X-rays, electron beams or a line type in which these are used together to cure the resin, and then the resin applied to the unexposed portion is removed to form an electric circuit. It is possible, and the operation becomes very simple compared with the conventional method.

In addition, when the conductivity of the conductive resin is insufficient, an electric circuit is formed by forming a sufficiently conductive substance on the target circuit having conductivity by using an ordinary plating method or the like. It is possible. In this case, since the amount of metal required is only in the circuit portion, the amount of metal used can be small, and the waste liquid can be treated far less than in the conventional method.

The resin used in the present invention is cured by light, X-rays and electron beams to be insoluble in solvent and conductive. These resins are polybutadiene or polyisoprene or polyisobutylene solvent soluble natural rubber,
Alternatively, iodine is added to a double bond of a copolymer of these monomers, a block copolymer of these monomers, or a copolymer of a monomer copolymerizable therewith. By applying a solution of this resin, forming a thin film on a glass plate by casting, etc., and then irradiating the thin film with light, X-rays, electron beams, etc., the film turns black or black purple,
It becomes insoluble in solvent. Even when the film is immersed in a solvent, the color is not decolorized and the conductivity is hardly changed.

In order to improve the conductivity of the resin used in the present invention, a resin having many double bonds in the resin is preferable. Also,
When adding iodine to the double bond, it is preferable to add a catalyst such as pyridine. For example, it is difficult to add iodine to the double bond of polybutadiene by simply adding iodine to a solution of polybutadiene in chloroform. However, addition of a small amount of pyridine to this makes addition of iodine stoichiometrically at room temperature. proceed.

The solvent used for iodination is not particularly limited as long as it can dissolve the resin and does not react with iodine, but halogenated hydrocarbons such as chloroform, methylene chloride, trichlene, hexane, cyclohexane, benzene, etc. Such hydrocarbons may be mentioned. The resin having a double bond used in the present invention may be any resin having a double bond other than the double bond derived from the benzene ring in the main chain and / or the side chain, such as polybutadiene, polyisoprene, polyisobutylene, natural Examples thereof include rubber or copolymers of butadiene, isoprene, and isobutylene with other monomers. Other copolymerizable monomers are not particularly limited, but as one example, methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate,
Isobutyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, stearyl (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate, glycidyl (meth) acrylate, diethylaminoethyl (meth) acrylate, (meth) acrylamide, (Meth) acrylic acid such as N-methyl (meth) acrylamide, (meth) acrylic acid, allyl (meth) acrylate and derivatives thereof. Styrene, α
-Aromatic hydrocarbon vinyl compounds such as methylstyrene, styrenesulfonic acid, vinyltoluene and the like. Maleic acid,
Unsaturated carboxylic acids such as itaconic acid and fumaric acid, acid anhydrides of unsaturated carboxylic acids such as maleic anhydride, and diesters or half esters of these with linear or branched alcohols having 1 to 20 carbon atoms Esters of unsaturated carboxylic acids. Vinyl esters such as vinyl acetate, vinyl propionate, diallyl phthalate, and allyl compounds. Amino group-containing vinyl compounds such as vinyl pyridine and aminoethyl vinyl ether. Amide group-containing vinyl compounds such as itaconic acid amide, crotonamide, maleic acid diamide, fumaric acid diamide, and N-vinylpyrrolidone. Examples thereof include vinyl compounds such as methyl vinyl ether, cyclohexyl vinyl ether, vinyl chloride, vinylidene chloride, chloroprene and vinyl sulfonic acid.

The temperature for adding iodine is not particularly limited,
From the viewpoint of reducing side reactions, it is preferably performed at 50 ° C. or less. Further, it is preferably performed at 0 ° C. or higher from the viewpoint of the reaction rate of iodine. Further, since the iodinated resin is unstable to heat, the temperature for reaction and storage is 0 to 30.
The degree is more preferable. While many double bonds of the resin are present, the color due to unreacted iodine disappears immediately after their addition, but it takes time until the color disappears as the double bonds decrease. When the coloring is continued for several minutes to several tens of minutes, the addition of iodine is completed and the reaction is completed. The time until the color disappears cannot be generally stated because it depends on the purpose of the resin used and the product to be obtained, but if possible, it is 1
0 minutes to 30 minutes is preferable. When the double bond of the resin can be obtained by calculation or analysis, iodine can be added in an amount corresponding to the amount of the double bond and the reaction can be carried out. When the amount of double bonds is unknown, it is preferable to carry out the reaction by sequentially adding iodine as described above.

After completion of the reaction, a non-solvent such as alcohol is added to the reaction system for precipitation, and the obtained product is recovered. The obtained product is preferably purified by operations such as washing and reprecipitation. It is preferable that the purified product is dried by vacuum drying at a temperature of room temperature or lower and stored in a cool and dark place. Since this product is cured, discolored, and conductive by light, it is preferably shielded from light after the reaction with bromine or iodine.

The present invention will be described below with reference to examples.
It goes without saying that the invention is not limited to these examples.

[0013]

【Example】

Example 1 To a solution of 10 g of polydibutadiene in 100 cc of chloroform was added 3 cc.
Was added to prepare a reaction solution. Iodine was added to the double bond of polybutadiene by adding to the reaction solution a solution prepared by dissolving a chemical equivalent of iodine corresponding to the double bond contained in 10 g of polydibutadiene in 10 cc of chloroform through a dropping funnel. At this time, the system was cooled with water in order to keep the reaction temperature at room temperature.
Addition of iodine took place very quickly and the reaction was complete within 1 hour. After adding methanol to the reaction system and collecting the polymer, the polymer was thoroughly washed with methanol to generate the polymer. It was vacuum dried at room temperature and stored in the dark. Example 2 10 g of a block copolymer of vinylene and styrene was iodinated in the same manner as in Example 1. The iodinated resin was recovered in the same manner as in Example 1, dissolved in chloroform again, and precipitated again 3 times to purify and store the iodinated resin in the same manner as in Example 1. Example 3 A 5% chloroform solution of the iodinated resin obtained in Example 1 was applied on a nylon plate having a thickness of 1 mm to form the polymer thin film. After a pattern was formed on the thin film by light to make the portion conductive, the uncured portion was eluted with chloroform to form an electric circuit on the nylon plate. Example 4 The electric circuit obtained in Example 3 was plated with copper on a portion made conductive by copper sulfate, and an electric circuit using copper was completed.

[0014]

INDUSTRIAL APPLICABILITY According to the present invention, a specific resin having a double bond is added with iodine so that the resin becomes a resin that is discolored, cured, and conductive by X-rays, electron beams, and laser beams. It became possible to form.

Claims (5)

[Claims] 1. A method for forming an electric circuit, which comprises forming an electric circuit using a resin which is soluble in a solvent and which is cured by light, X-rays, electron beams or a combination thereof and becomes conductive. . 2. The method for forming an electric circuit according to claim 1, wherein metal plating is performed on the circuit formed by using a resin that becomes conductive after curing. 3. The method for forming an electric circuit according to claim 1, wherein the resin which becomes conductive after curing is an iodinated resin having an aliphatic double bond. 4. The method for forming an electric circuit according to claim 3, wherein the resin having an aliphatic double bond is polybutadiene, polyisobutylene, polyisoprene and a solvent-soluble natural rubber. 5. A resin in which an aliphatic double bond-containing resin is copolymerized with a monomer selected from butadiene, isobutylene, and isoprene, or another monomer copolymerizable with these monomers is used. A resin obtained by copolymerizing a monomer selected from the above-mentioned monomers.
A method of forming an electric circuit according to the item.