JPH09304474A - Semiconductor element-measuring apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To shorten the measurement index time by supplying a semiconductor element with the use of a measuring arm that can vacuum chuck any of an SOP(small outline package) type and a QFP(quad flat package) type semiconductor elements, and setting a measuring part at a position 90 deg. rotated in the vertical direction. SOLUTION: A storing part unit can store any of an SOP type and a QFP type elements. A measuring part unit consists of a measuring part, a supplying part and a transferring part. When a semiconductor element 3 not yet measured is sent out from a feed position of a horizontal movement mechanism to a measurement position 15, a rotary measuring arm 19 rotates and moves to above the element 3 at a position 15 and a front block 20 of the arm 19 vacuum chucks the element 3. When the element 3 is away from a first stage 16, the arm 19 rotates 90 deg. in a vertical direction and transfers the element 3 chucked by the block 20 to a measuring device 14. The element 3 is moved from the block 20 to a measuring socket 21, where the element 3 is measured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device measuring apparatus used when conducting an electrical characteristic test of a semiconductor device.

[0002]

2. Description of the Related Art The outer shape of a semiconductor element is typically SO
P (small outline package) type and QFP (quad flat pac)
kage) type, and in the semiconductor element measuring apparatus, the method of supplying the semiconductor element to be measured to the measuring apparatus was different due to the difference in shape.

That is, the SOP type has a shape in which the lead terminals project from the corresponding two surfaces (FIG. 7), and when supplying the SOP type semiconductor element to the measuring apparatus, the free fall method by its own weight is used. The semiconductor elements are supplied by dropping one by one from an upper supply section along a guide rail set at an appropriate angle. The free-fall method is a mainstream supply of semiconductor elements having an outer shape that allows free-fall because the supply time of semiconductor elements is short and the space is narrow.

On the other hand, the QFP type has a shape in which the lead terminals project from all four sides (FIG. 8).
When supplying an FP type semiconductor device to a measuring device, SOP
Unlike the mold, the free fall method cannot be adopted because the leads come out from four sides. For that purpose, the outer shape of the QFP type is chucked with a measuring arm or the like, and the measuring arm is moved along the X axis, Y axis, and Z axis.
It was supplied by moving in each of the axial directions. This measuring arm method can be used for semiconductor devices of any external shape such as SOP type and QFP type.
There is a drawback in that the measurement index time is long because the supply time is long because it moves in three directions, the axis and the Z axis.

[0005]

As described above, the measuring methods for SOP type and QFP type semiconductor devices are different from each other.
The free fall method adopted for P-type semiconductor devices is QFP.
Type semiconductor device is not applicable because of its shape.
The P-type measuring arm method can commonly measure SOP-type and QFP-type semiconductor elements, but the measurement efficiency is sacrificed for SOP-type semiconductor elements because the measurement index time is long. Therefore, the measuring device cannot be shared, and the SOP-type and QFP-type dedicated measuring machines require separate space and cost. An object of the present invention is to provide a semiconductor device measuring device that solves the above problems.

[0006]

In order to solve the above problems, the present inventor has made a measurement arm capable of vacuum chucking both SOP type semiconductor devices and QFP type semiconductor devices in order to solve the above problems. The semiconductor element is supplied to the measurement unit by using, and the measurement index time, which was long in the case of the conventional measurement arm, is shortened by setting the moving position of the measurement arm, that is, the position of the measurement unit vertically rotated by 90 °. planned.

That is, an object of the present invention is to vacuum-chuck a semiconductor element to be measured in a semiconductor device measuring apparatus and to rotate the sample by 90 ° to transfer and fix the semiconductor element to be measured to a measuring means. The present invention provides a semiconductor device measuring apparatus characterized in that the vertical rotating device comprises at least one rotation measuring arm for transferring the semiconductor device to the measuring device.

A further object of the present invention is to provide a semiconductor device measuring apparatus as described above, wherein the shape of the semiconductor device is SOP.
It is an object of the present invention to provide a semiconductor element measuring device characterized by being capable of measuring any shape of a mold and a QFP type.

A further object of the present invention is to provide a semiconductor device measuring apparatus as described above, wherein the time required for the semiconductor device to be measured to move to the measuring device after being vacuum chucked by the vertical rotating device is 0.7 seconds or less. The present invention is to provide a semiconductor device measuring apparatus characterized by:

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 2 shows a conceptual diagram of the whole semiconductor device measuring apparatus of the present invention. As shown in FIG. 2, the semiconductor device measuring apparatus includes a housing unit (1) housing a semiconductor device and a measuring unit (2) for measuring the semiconductor device.
Divided into two. The storage unit (1) and the measuring unit (2) are separated.

The storage unit (1) is an SOP type, QFP
Both molds can be stored. For example, as shown in FIG. 3, the semiconductor elements (3) having respective shapes are stored in the semiconductor element storage tray (4) in the storage unit (1). The semiconductor elements (3) stored in the storage tray (4) are conveyed one by one from the storage tray (4) to the measurement unit unit (2) and are measured. It is stored in 1). In this storage unit (1), the semiconductor element (3) may be stored in a storage stick (not shown) instead of the storage tray (4).

The measuring unit (2) of the present invention is shown schematically in FIG.

The measuring section unit (2) comprises a measuring section (5), a supply section (6) and an unloading section (7). Measuring unit (5)
Is a part for measuring a semiconductor device. The supply section (6)
The unmeasured semiconductor device (3) is taken out from the storage unit (1) by the supply robot (8) and supplied to the supply position (9) of the horizontal movement mechanism (12) in the measurement unit (5). vice versa,
The carry-out section (7) uses the carry-out robot (10) to store the measured semiconductor element (3) moved to the carry-out position (11) of the horizontal movement mechanism (12) in the measuring section (5) by the carry-out robot (10). Carry out to 1). Also, this supply unit (6)
Is a case where the unmeasured semiconductor element (3) is directly supplied from the storage unit (1) to the measuring section (5), and the unmeasured semiconductor element (3) is once transferred to the heating stage (22), Here, it may be supplied to the measuring section (5) after being subjected to heat treatment such as heating and cooling.

A characteristic point of the present invention is that the unmeasured semiconductor element (3) is moved horizontally from the housing unit (1) to the horizontal movement mechanism (1).
When supplying to the supply position (9) of 2) by the supply robot (8), it is possible to supply either the SOP type semiconductor element or the QFP type semiconductor element. Similarly, the measured semiconductor device (3) is moved to the carry-out position (1) of the horizontal movement mechanism (12).
Carry-out robot (10) from 1) to storage unit (1)
It is the same when carrying out with.

The measuring unit (5) provided in the measuring apparatus of the present invention will be specifically described with reference to FIGS. 1, 5 and 6.

The measuring section (5) is a semiconductor device (3) to be measured.
A horizontal moving mechanism (12) for horizontally moving the vehicle, a vertical rotating mechanism (13), and a measuring device (14).

As shown in FIG. 5, a horizontal movement mechanism (12)
Is a horizontal moving stage (18) including a first stage (16) for an unmeasured semiconductor device and a second stage (17) for a measured semiconductor device, and horizontally moving the horizontal moving stage (18). An actuator (not shown) for

The vertical rotation mechanism (13) comprises a rotation measuring arm (19) having a tip block (20) at its tip.

The measuring device (14) has a measuring socket (21).
And a measuring probe (not shown) electrically connected to the measuring socket (21).

As shown in FIG. 5, the unmeasured semiconductor element (3) is positioned at the supply position (9) of the horizontal movement mechanism (12) by the supply robot (8) in the measuring section (5). It is supplied on one stage (16). The first stage (16) on which the semiconductor element (3) is placed is sent to the measurement position (15) by the horizontal movement motion of the horizontal movement stage (18) in the direction of arrow C. The measurement position (15) is
The semiconductor element (3) that has moved moves to the rotation measurement arm (1
It is provided directly below the tip block (20) of 9) so as to face the tip block (20). (That is, the vertical rotation mechanism (13) is provided above the measurement position (15).) The unmeasured semiconductor element (3) moves from the supply position (9) of the horizontal movement mechanism (12) to the measurement position ( When sent to 15),
As shown in FIG. 1, the rotation measuring arm (19) moves rotationally onto the semiconductor element (3) at the measurement position (15), and the tip block (2) at the tip of the rotation measuring arm (19) is moved.
0) vacuum chucks the semiconductor element (3). In this way, the semiconductor device (3) becomes the first stage (16).
When removed, the rotation measuring arm (19) vertically rotates 90 ° in the direction of arrow A to transfer the semiconductor element (3) chucked by the tip block (20) to the measuring instrument (14). Here, the semiconductor element (3) has a tip block (2
0) to the measuring socket (21) for measurement.

When a plurality of rotation measuring arms are provided, the rotation measuring arms may rotate independently of each other, or may rotate while being fixed to each other at a constant angle. May be.

On the other hand, when the unmeasured semiconductor device (3) is removed from the first stage (16), the horizontal movement stage (1
8) moves horizontally again in the direction opposite to the arrow C direction,
As shown in FIG. 5, it returns to its original position and is used for supplying the next semiconductor element (3). Alternatively, the horizontal movement stage (18) does not return to the original position after the semiconductor element (3) is disengaged, or after the semiconductor element (3) is returned to the horizontal movement stage (18) as described below, and the measured semiconductor element (3) is Used for receiving and unloading.

Here, a further characteristic feature of the present invention is that at least one rotation measuring arm (19) is provided, and these (these) rotate 90 ° vertically in the direction of arrow A. The semiconductor element (3) vacuum-chucked to the tip block (20) is attached to the measuring socket (2
Similarly, when the semiconductor element that has been set to 1) and has already been measured is reset from the measurement socket (21), the rotation measurement arm (19) is rotated by 270 ° in the direction of arrow A and returned to the measurement position (15) again. That is the point. At this time, when only one rotation measuring arm (19) is equipped, the rotation measuring arm (19) may be rotated by 90 ° in the direction of arrow B and returned to the measurement position (15). The rotation speed of the rotation measuring arm (19) is increased by increasing the speed of the motor that drives the rotation measuring arm (19), and the measurement index time can be shortened.

The semiconductor element (3) for which the measurement has been completed as described above is indicated by the arrow A of the rotation measuring arm (19).
Rotation in the direction returns to the measuring position (15). Here, the above-mentioned horizontal movement stage (18) horizontally moves so that the second stage (17) is located at the measurement position (15) [that is, immediately below the tip block (20)], and the tip block (20) is moved. ), The semiconductor element (3) which has been measured is received by releasing the vacuum chuck, and horizontally moved in the direction of arrow D as shown in FIG. 6 to be carried out to the carry-out position (11).
The measured semiconductor elements (3) transferred to the unloading position (11) in this way are moved by the unloading robot (10) of the unloading section (7) to the semiconductor element storage tray in the storage section unit (1). It is stored in (4) and the measurement is completed.

Therefore, in the semiconductor device measuring apparatus of the present invention, the feeding robot (8) and the carry-out robot (10) capable of chucking both the SOP semiconductor device and the QFP semiconductor device supply and carry out the rotation measuring arm ( 1
The measurement index time is shortened by increasing the rotation speed in 9). In this way, the SOP semiconductor element and the QFP semiconductor element can be measured by the same device, and it is possible to achieve that the measurement index time does not become long and the measurement efficiency does not decrease.

Further, in the semiconductor device measuring apparatus of the present invention, since the vertical rotation mechanism (13) is provided with a plurality of rotation measuring arms (19), not only the measurement index time for one semiconductor device but also the measurement efficiency can be improved. Also improves.

[0027]

EXAMPLE In this example, a semiconductor device measuring apparatus equipped with two rotation measuring arms is taken as an example, and its measuring procedure and measuring method will be described more specifically with reference to FIGS.

First, the unmeasured SOP type semiconductor element or QFP type semiconductor element (3) is stored in a dedicated tray (4) of the storage unit (1) as shown in FIG.

As shown in FIG. 4, the supply robot (8) moves X-axis and Y-axis by an actuator (not shown) to a specific position of the tray, and Z by an air cylinder (not shown). The shaft is moved, and the unmeasured semiconductor element (3) at a specific position of the tray (4) is vacuum-chucked by the tip of the supply robot (8). When the unmeasured semiconductor element (3) does not need to be heat-treated, the supply robot (8) holds the unmeasured semiconductor element (3) in a vacuum chuck while heating the heating stage (22).
Without passing through the first stage (1
Supply directly to 6).

The unmeasured semiconductor device (3) is, as shown in FIG. 5, the first stage (1) located at the supply position (9).
6) It is again vacuum-chucked and conveyed to the measuring position (15) by an actuator (not shown).

As shown in FIG. 1, the vertical rotation mechanism (13) of the semiconductor device measuring apparatus according to this embodiment has two rotation measuring arms [that is, a first rotation measuring arm (19) and a second rotation measuring arm (19)). Measuring arm (19 ')]. The two rotary measuring arms (19 and 19 ') are provided so that they can rotate independently of each other.

When the unmeasured semiconductor element (3) is transferred to the measuring position (15) of the horizontal moving mechanism (12) in the direction of arrow C, the first rotation measuring arm (19) moves to the measuring position (1).
It descends to the first stage (16) in 5). Then, as shown in FIG. 1, a tip block (20) provided at the tip of the tip chucks the semiconductor element (3) in a vacuum and raises it again to rotate 90 ° vertically in the direction of arrow A. The position rotated by 90 ° can be positioned by preliminarily adjusting the position so that the unmeasured semiconductor element (3) is directly above the measurement socket (21). After the rotation measuring arm (19) has rotated right above the measuring socket (21), the tip block (20) sets the unmeasured semiconductor element in the measuring socket (21).

On the other hand, the horizontal movement stage (18) in which the unmeasured semiconductor device (3) is separated from the first stage (16)
Shows a second unmeasured semiconductor device (not shown) on the emptied first stage (16) after moving horizontally in the direction opposite to the arrow C direction and returning to the original position. Will be supplied. This second unmeasured semiconductor element is transferred from the supply position (9) of the horizontal movement mechanism (12) to the measurement position (15) in the same manner as above. Here, the second rotation measuring arm (19 ′) and the tip block (20 ′) at the tip end thereof have the same structure as the first rotation measuring arm (19) and the tip block (20). The second unmeasured semiconductor element is vacuum-chucked and conveyed to the measurement socket (21) by vertical rotation for measurement.

While the measurement of the second semiconductor element is performed in this manner, the measurement of the first semiconductor element (3) is completed.
First rotation measuring arm (19) with the chuck being chucked
Further rotates 270 ° in the direction of arrow A and returns to the measurement position (15). Here, the vacuum chuck of the tip block (20) is released, and the measured semiconductor element (3) is
The measurement position (15) is placed on the second stage (17) of the horizontal movement stage (18) that has moved horizontally so as to be located directly below the tip block (20).
The tip block (20) of the rotary measuring arm (19) is empty. The horizontal movement stage (18) horizontally moves in the direction of arrow D so that the second stage (17) is located at the carry-out position (11), and at this position, the measured semiconductor element (3) is carried out. It is carried out by the robot (10) to the storage unit (1). At this time, the horizontal movement mechanism (12) is provided with the second device on which the measured semiconductor element (3) is placed.
The first stage (16) on which the third unmeasured semiconductor element (3) is placed is designed to be located at the measurement position (15) when the stage (17) moves to the carry-out position. Therefore, the measured semiconductor element (3) is not moved to the carry-out position (1
When moved to 1), the third unmeasured semiconductor element is in the measuring position (15) and is located directly below the emptied first rotary measuring arm (19) as described above. Then, it is vertically transferred and measured. In this way, by providing a plurality of rotation measuring arms and synchronizing the movements of the rotation arms with the movement of the horizontal movement stage,
The measurement efficiency can be significantly improved.

In the measuring socket (21) of the measuring instrument (14), the lead of the unmeasured semiconductor element (3) is electrically connected to the measuring probe (not shown) for the measurement.

[0036]

According to the present invention, by changing the conventional measuring arm system to the 90 ° vertical rotating measuring arm system,
The measurement index time was shortened. It was possible to reduce the measurement index time of 0.6 seconds under the same measurement conditions from 1.0 second in the conventional measurement arm method.

At the same time, the measurement index time of the SOP type semiconductor device by the conventional free fall method is not so slow, so that a measuring device sharing the measurement of the SOP type semiconductor device and the QFP type semiconductor device has become possible. .

Further, according to the present invention, in the vertical rotation mechanism of the semiconductor device measuring apparatus, by providing a plurality of rotation measuring arms, the time until the next semiconductor device is measured is shortened, and therefore the measurement efficiency is improved. Was improved.

Further, by sharing the SOP type and QFP type semiconductor elements in the measuring apparatus, not only space and cost can be saved, but also time and labor for switching between the SOP type semiconductor element and the QFP type semiconductor element can be saved. became.

[Brief description of drawings]

FIG. 1 is a partial schematic view for explaining an example of a typical vertical rotation mechanism used in a measuring unit in a semiconductor device measuring apparatus of the present invention.

FIG. 2 is a schematic overall view of a semiconductor device measuring apparatus of the present invention.

FIG. 3 is a schematic diagram illustrating a storage unit of the semiconductor device measuring apparatus of the present invention.

FIG. 4 is a schematic diagram illustrating a measuring unit of the semiconductor device measuring apparatus according to the present invention.

FIG. 5 illustrates movement of a semiconductor element supplied on the first stage for an unmeasured semiconductor element from a supply position to a measurement position in a horizontal movement mechanism in the measuring unit of the semiconductor element measuring apparatus of the present invention. FIG.

FIG. 6 illustrates movement of a semiconductor element carried on a second stage for a measured semiconductor element from a measurement position to a carry-out position in a horizontal movement mechanism in a measuring section unit of the semiconductor element measuring apparatus of the present invention. FIG.

FIG. 7 is a schematic diagram of an SOP semiconductor element used in the semiconductor element measuring apparatus of the present invention.

FIG. 8 is a schematic view of a QFP semiconductor element used in the semiconductor element measuring apparatus of the present invention.

[Explanation of symbols]

 1 Storage Section Unit 2 Measuring Section Unit 3 Semiconductor Element 4 Semiconductor Element Storage Tray 5 Measuring Section 6 Supply Section 7 Unloading Section 8 Supply Robot 9 Supply Position 10 Unloading Robot 11 Unloading Position 12 Horizontal Movement Mechanism 13 Vertical Rotation Mechanism 14 Measuring Instrument 15 Measurement position 16 First stage for unmeasured semiconductor element 17 Second stage for measured semiconductor element 18 Horizontal movement stage 19, 19 'Rotation measuring arm 20, 20' Tip block 21 Measuring socket 22 Heating stage

Claims (3)

[Claims] 1. A semiconductor device measuring apparatus comprising vertical rotating means for vacuum chucking a semiconductor element to be measured and vertically rotating it by 90 ° to transfer and fix the semiconductor element to be measured to a measuring means. , The vertical rotation means,
A semiconductor device measuring apparatus comprising at least one rotation measuring arm for transferring a semiconductor device to a measuring means. 2. The semiconductor device measuring apparatus according to claim 1, wherein the semiconductor device can be measured in any of a SOP type and a QFP type. 3. The time required for moving the semiconductor device to be measured to the measuring device after being vacuum-chucked by the vertical rotating device is 0.7 seconds or less. Semiconductor device measuring device.