JPH09298396A - Parts mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To continue parts mounting work without having to stop a parts mounting device by equipping the group of parts suction means of a block body with the same kind of spare parts suction means to be substituted for the parts suction means whose parts suction capacity has dropped. SOLUTION: An index plate 41 is equipped with block bodies 42-53, and they are set to the index plate 41, being assigned angles every 30 deg.. The block bodies 42-53 have suction nozzles 102-106. Out of the suction nozzles 102-106, the suction nozzles 102 and 103 are the same kind of nozzles, and the suction nozzles 104-106 are nozzles of different kinds from the suction nozzles 102 and 103. The suction nozzles 102-106 constitute a group of parts suction means, and suck electronic parts by a vacuum suction means 120. Hereby, the parts mounting work can be continued without having to stop the parts mounting device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus that can be used to mount a component such as an electronic component on an object such as a printed wiring board.

[0002]

2. Description of the Related Art In a component mounting apparatus for mounting electronic components on a printed wiring board, it is necessary to mount many types of electronic components at predetermined positions on the printed wiring board. In particular, due to the tendency of high-mix low-volume production of printed wiring boards, the types and number of electronic components to be mounted are increasing, and in order to respond to this, the component mounting device (mounting machine) has many nozzles for picking up components. Have As an example of a conventional component mounting device, a plurality of nozzle blocks are provided for an index plate, and a plurality of different types of suction nozzles are set in each block. That is, one nozzle block is provided with a nozzle for adsorbing a very small chip component, a nozzle for adsorbing an electronic component of a medium size, and a nozzle for adsorbing a relatively large electronic component.

[0003]

However, due to the demand for circuit miniaturization, a large number of microchip components are often mounted on a printed wiring board, and the frequency of use of nozzles for microchip components is medium. The frequency of use of nozzles for parts or nozzles for relatively large electronic parts is higher, the speed of parts mounting is increased, and the number of parts to be mounted is increasing. Therefore, the consumption of the nozzle for adsorbing the extremely small chip parts is becoming particularly severe. If the suction nozzle for sucking the micro chip component in a certain nozzle block is exhausted and the suction rate of the micro chip decreases, the suction nozzle for the micro chip component cannot be used. Therefore, the nozzle block including the nozzle for adsorbing the extremely small chip component cannot be used for component mounting work until the nozzle is replaced. Therefore, the productivity in the component mounting process is reduced by (unusable nozzle block / total number of nozzle blocks).

Further, when the nozzle for sucking the extremely small chip component is exhausted, the component mounting apparatus must be stopped and the exhausted nozzle must be replaced with another new nozzle, so that the replacement time also reduces the productivity. It was a factor. Therefore, the present invention solves the above problems and provides a component mounting apparatus that can continue the component mounting operation without stopping the component mounting apparatus even if the component suction means such as a certain type of nozzle is worn. Is intended.

[0005]

According to the present invention, there is provided a component mounting apparatus for mounting a component on an object, comprising a plurality of component suction means for detachably holding the component. However, a block body that constitutes a component suction means group by these component suction means is provided, and the component suction means group of the block body is a spare of the same kind to be used in place of the component suction means whose component suction capacity is lowered. This is achieved by the component mounting device including the component suction means. In the present invention, the block body has a plurality of component mounting means. These component mounting means form a component mounting means group. This component mounting means group includes the same type of spare component suction means that can be used in place of the component suction means having a reduced component suction capability. By doing so, even if a component suction means having a reduced component suction capability due to the suction of a large number of components is generated, a spare component suction means of the same type is used instead of the unusable component suction means. By using it, the component mounting work can be continued without stopping the component mounting apparatus.

[0006]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Note that the embodiments described below are preferred specific examples of the present invention,
Although various technically preferable limitations are given, the scope of the present invention is not limited to these modes unless otherwise specified to limit the present invention. 1 and 2 show a preferred embodiment of the component mounting apparatus of the present invention. The component mounting apparatus of FIGS. 1 and 2 is
This is a device for sequentially mounting electronic components on a printed wiring board OB. As shown in FIG. 1, the component mounting device includes a base 10, a transport unit 20 for the printed wiring board OB, an index device 40, a switching unit 60, a detection unit 80, a control unit 100, and the like.

The base 10 is a carrying section 20 for a printed wiring board.
I support. The transport unit 20 is a printed wiring board OB.
Can be moved in the direction of arrow X and the printed wiring board OB can be positioned at the positioning position PP. The index device 40 is arranged above the printed wiring board OB positioned at the positioning position PP. The index device 40 has an index plate 41, and the index plate 41 can be indexed by a motor 142 at a predetermined angle, for example, every 30 degrees or a multiple thereof.

The index plate 41 includes a plurality of block bodies 42 to 53. That is, as shown in FIG. 2 in particular, the block bodies 42 to 53 are set with respect to the index plate 41 by allocating angles every 30 degrees.

Each of the block bodies 42 to 53 has the same structure and has a plurality of suction nozzles 102 to 106 as shown in FIG. 3, respectively. These suction nozzles 1
Two suction nozzles 102 and 103 of 02 to 106
Is the same type of nozzle. Other suction nozzle 10
4, 105 and 106 are nozzles of a type different from the suction nozzles 102 and 103. Suction nozzles 102, 103
Is a nozzle for sucking an extremely small chip component, the suction nozzle 104 is a nozzle for sucking a medium-sized electronic component, and the suction nozzles 105 and 106 are the same type for sucking a relatively large electronic component. Nozzle of.

The suction nozzles 102 to 106 can be lowered in the arrow Z direction by actuators 102a to 106a, respectively. Each suction nozzle 102-106
Constitute a component suction means group, and vacuum suction means 12
With 0, electronic parts can be sucked. The operation of the vacuum suction means 120 can be controlled by the control means 100.

Next, the detecting means 80 shown in FIG. 1 will be described. The detection means 80 is for inspecting the component suction state of the suction nozzles 102 to 106 of the block body (for example, 48) indexed to the detection position DP shown in FIGS. 1 and 2. The detection unit 80 includes a camera 81 and a component suction inspection device 82. The camera 81 is, for example, a CCD camera (charge coupled device camera).

The detection means 80 can image the component suction state as shown in FIGS. FIG. 5 shows a state in which, for example, the suction nozzle 102 has completely sucked the extremely small chip-shaped electronic component PA. In FIG. 6, the suction nozzle 102 shows an incomplete state of the electronic component PA, that is, a state in which the electronic component PA is barely held in an inclined state. FIG. 7 shows a state in which the suction nozzle 102 is used many times and is consumed, and the suction surface 102a cannot successfully suck the electronic component PA.

The camera 81 captures a state in which the electronic components shown in FIGS. 5 to 7 are sucked or a state in which the electronic components are not sucked as an image and sends it to the component suction inspection device 82. In the component suction inspection device 82, the suction nozzle 102 is shown in FIG.
As shown in FIG. 6, whether the electronic component is securely held, the holding state is incomplete, or the electronic component cannot be held as shown in FIG. to decide. The component suction inspection device 82
The judgment result is sent to the control unit 100.

Next, the switching means 60 shown in FIGS. 1 and 2 will be described. The switching unit 60 is a device for switching between the suction nozzle 102 shown in FIG. 3 and the suction nozzle 103 of the same type as the suction nozzle 102 as an example. Therefore, each of the block bodies 42 to 53 can rotate about the central axis with respect to the index plate 41. Therefore, the motor 61 of the switching means 60 moves the block body (for example, 53) indexed to the switching position CP,
For example, by indexing every 72 degrees, the positions of the suction nozzle 102 and the suction nozzle 103 of the same type as the suction nozzle 102 can be switched. Suction nozzle 10
The information that 2 and the suction nozzle 103 are of the same type and the information that the suction nozzle 103 is a backup suction nozzle of the suction nozzle 102 are stored in the storage unit 101 of FIG. The control unit 100 gives a command signal S1 to the nozzle switching device 202 based on the information on the replacement stored in the storage unit 101, and the nozzle switching device 2
02 supplies a drive signal DS to the motor 61.

The motor 61 of the switching means 60 has a switching position C.
The block body (for example, 53) positioned at P is
As a mechanism for indexing each time, a structure as shown in FIG. 8 can be adopted as an example. In FIG. 8, a ring-shaped gear 41h is attached to the lower surface of the index plate 41. The gear 41h is rotatable with respect to the index plate 41. The gear 41h is integrated with the block body 42. The output shaft 61a of the motor 61 is a pinion 6
1b, and this pinion 61b meshes with the gear 41h. The motor 61 controls the command signal S1 of the control unit 100.
When driven based on the drive signal DS from the nozzle switching device 202, the gear 41h and the block body 42 can be indexed in the T direction, for example, every 72 degrees.

Next, an operation example of the above-described component mounting apparatus will be described. As shown in FIGS. 1 and 2, the index plate 41
Twelve block bodies 42 to 53 are attached to the. The motor 142 moves the index plate 41 at 30 degrees or 3 degrees according to the command signal S1 from the control unit 100.
It is possible to index in the R direction for each angle that is a multiple of 0 degrees.

In the block body (for example, 42) positioned at the detection position DP, the respective suction nozzles 102 to 1
06 holds and sucks electronic components of a predetermined size by the operation of the vacuum suction means 120.
The suction states of the electronic components of the suction nozzles 102 to 106 are as follows.
Images are sequentially captured by the camera 81 at the detection position DP. The situation is shown in FIG. As a result of the camera 81 imaging the suction states of the electronic components of the suction nozzles 102 to 106 as shown in FIG. 3, as shown in FIG.
If the component 2 accurately holds the electronic component PA, the component suction inspection device 82 of FIG. 2 sends information to the control unit 100 that the suction capability of the suction nozzle 102 has not deteriorated. Otherwise, the suction nozzle 102 has already been used for mounting electronic components many times and has been consumed, and as shown in FIG. 6, the suction nozzle 102 cannot suck and hold the electronic component PA in a proper posture, or Alternatively, as shown in FIG. 7, when the suction nozzle cannot hold the electronic component PA at all, the component suction inspection device 82 of FIG. 2 reduces the component suction capability of the suction nozzle 102 with respect to the control unit 100. And inform that it cannot be used.

Therefore, the control section 100 performs the following operation. That is, the motor 142 of FIG. 1 is operated to index the index plate 41 by a predetermined angle, and the block body 42 in question is positioned at the switching position CP as shown in FIG. 9B. And the operation means 140 of FIG.
Moves (raises) the motor 61 in the direction of the arrow W to engage the pinion 61b of the motor 61 with the gear 41h. Then, the control unit 100 obtains information based on the information regarding the replacement stored in the storage unit 101, that is, the information that the auxiliary suction nozzle 103 of the same type that can be used when the suction nozzle 102 is disabled is 103. Therefore, the control unit 100 determines the nozzle switching device 2 based on the information.
02, the nozzle switching device 202 gives the drive signal DS to the motor 61. The motor 61 can index the suction nozzle 103 to the position where the suction nozzle 102 was located by indexing the block body 42, for example, by 72 degrees based on the drive signal DS. And the suction nozzle 102
Without using the suction nozzle 103 of the same type,
The following electronic parts can be adsorbed. Therefore, the suction nozzle 103 can be lowered to a predetermined position on the printed wiring board OB shown in FIG. 1 by operating the actuator 103a shown in FIG. 3, and as shown in FIG. 9C, for example. The next component mounting work can be continued at the component mounting position IP.

As described above, when the component mounting apparatus according to the embodiment of the present invention is used, it is possible that any of the suction nozzles cannot accurately suck the electronic component or cannot suck the electronic component at all. Also, similar electronic component mounting work can be continued without stopping the operation of the component mounting device itself. From this, the component mounting efficiency of the component mounting apparatus can be improved, and the loss of mechanical time stoppage is eliminated, so that productivity is not reduced. Moreover, even for a block body having a suction nozzle with a reduced component suction capacity, another spare suction nozzle of the same type can be used, so that the activity of the block body itself does not stop, so the productivity of component mounting work is improved. Does not fall.

The present invention is not limited to the above embodiment. In the above-described embodiment, the electronic component is adopted as the component and the printed wiring board is used as the object. However, the present invention is not limited to this. For example, the object may be a flexible printed circuit board or a liquid crystal display other than the printed wiring board. Something like a panel can be adopted. The parts are not limited to electronic parts, but may be other kinds of parts. For example, the present invention can be applied to a component mounting device that operates like inserting a screw into a hole of a board. The component suction means of the present invention has shown the suction nozzle using the vacuum suction means in the above-mentioned embodiment, but the invention is not limited to this, and other component suction methods can be adopted.

[0021]

As described above, according to the present invention,
Even if the component suction means such as a certain type of suction nozzle is worn, the component mounting operation can be continued without stopping the component mounting device.

[Brief description of drawings]

FIG. 1 is a perspective view showing a preferred embodiment of a component mounting apparatus of the present invention.

FIG. 2 is a plan view conceptually showing the component mounting apparatus of FIG.

FIG. 3 is a side view showing one block body of the index plate of the component mounting apparatus of FIG.

FIG. 4 is a bottom view showing the block body of FIG.

5 is a diagram showing an example of one suction nozzle of the block body of FIG.

FIG. 6 is a diagram showing a state in which the suction nozzle is not correctly sucking an electronic component.

FIG. 7 is a view showing a suction nozzle in which a component suction capability in which an electronic component cannot be suctioned is lowered.

8 is a side view showing an example of the switching means of FIG.

FIG. 9 shows a state in which a state in which the component suction capability of the suction nozzle of the block body is detected to be reduced and the block body is switched from an unavailable suction nozzle to a spare suction nozzle of the same type to continue component mounting work. FIG.

[Explanation of symbols]

PP ... Positioning position, OB ... Printed wiring board (object), PA ... Electronic parts (parts), 10.
..Base, 20 ... conveying section, 40 ... index device, 42-53 ... block body, 60 ... switching means, 80 ... detecting means, 102 ... suction nozzle (component suction Means), 103 ... Preliminary suction nozzles (component suction means) of the same type as the suction nozzle 102, 102 to 10.
6 ... Suction nozzle that constitutes a component suction means group

Claims (3)

[Claims] 1. A component mounting apparatus for mounting a component on an object, comprising a plurality of component suction means for detachably holding the component, and these component suction means constitute a component suction means group. The component mounting apparatus is characterized in that the component suction means group of the block body is provided with a spare component suction means of the same kind to be used in place of the component suction means having a reduced component suction capability. 2. The component mounting apparatus according to claim 1, further comprising detection means for detecting the component suction capability of the component suction means. 3. By indexing block bodies,
The component mounting apparatus according to claim 2, further comprising: a component suction unit having a reduced component suction capability, and a switching unit configured to switch a spare component suction unit of the same type.