JPH09298223A - Ic test device and probe card used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable probe cards of different sizes to be used in an IC test device in common by a method wherein a first contact group which come into contact with a first electrode group provided in the peripheral edge of a probe card of a small diameter and a second contact group formed outside the first contact group are brought into contact with a first and a second electrode group formed on a probe card of a large diameter. SOLUTION: A first contact group 23A which come into contact with a first electrode group provided in the peripheral edge of a first probe card 22A of a small diameter and a second contact group 23b located outside the first contact group 23A are provided. The first contact group 23A and the second contact group 23b are brought into contact with a first electrode group and a second electrode group formed on a second probe card of a large diameter, and the probe card 22A of the small diameter are brought into contact with only the first contact group 23A. A proper gap G is provided between the first contact group 23A and the second contact group 23B, whereby the second contact group 23B is restrained from interfering with the first probe card 22A of the small diameter.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC tester for testing whether a chip-shaped IC formed on a semiconductor wafer operates normally.

[0002]

2. Description of the Related Art Conventionally, an IC for testing whether or not an IC formed on a semiconductor wafer operates normally.
The test equipment is in practical use. This type of IC testing device is equipped with a probe support board called a probe card, and the probe group supported by this probe card is brought into contact with the electrode portion of the IC formed on the semiconductor wafer, and the IC to be tested is passed through this probe group. Is electrically connected to the IC test device to perform the test.

FIG. 4 shows a schematic configuration thereof. In the figure, 10 is a semiconductor wafer on which an IC is formed, 11 is the semiconductor wafer 10 mounted, and the position of the semiconductor wafer 10 is X-
Wafer supporting device for moving in Y direction and Z direction, 20
Indicates a test head. The test head 20 has a first probe card 2 that supports a probe group 21 by projecting it downward.
2A and a first electrode group 25A (see FIG. 5) formed on the upper surface of the first probe card 22A so as to electrically connect each probe to an IC test apparatus body (not particularly shown). The contact group 23A and the casing 24 that supports the first probe card 22A are included.
The probe group 21 is generally attached to the first probe card 22A in a posture of projecting downward. Therefore, the wafer supporting device 11 mounts the IC formation surface of the semiconductor wafer 10 in an upward posture, approaches the probe group 21 from the lower side, and positions the probe group on each electrode of the IC formed on the semiconductor wafer 10. 21 is contacted.

The semiconductor wafer 10 has, for example, 16 × 4 =
128 ICs are formed. First probe card 22
In A, for example, a probe group 21 that contacts 16 ICs
Is prepared. The number of probe groups 21 is, for example, about 110 for one IC, and is 16 × 1 as a whole.
10 = 1760 probes are provided. The probe group 21 is attached to the central portion of the first probe card 22A. Each probe of the probe group 21 is a first probe formed on the peripheral portion of the first probe card 22A by a printed wiring technique.
It is electrically connected to the electrode group 25A (FIG. 5).

The first electrode group 25A is formed on the surface opposite to the projecting surface of the probe group 21, and the first contact group 23A called a pogo pin is brought into contact with the first electrode group 25A, and the first contact group 23A is passed through. It is electrically connected to the IC test equipment. FIG. 6 shows a support structure for the first probe card 22A. The contact support ring 28 is supported by the insert ring 27. The first contact group 23A is attached to the lower surface of the contact support ring 28 so as to project downward in an annular shape. The first contact group 23A is composed of contacts called pogo pins as described above. As is well known, the pogo pin has a movable rod that is biased by a biasing force of a spring so as to project, and this movable rod is a first rod formed on the first probe card 22A.
The structure is such that each electrode of the electrode group 25A elastically contacts.

In other words, the first member is in the elastically protruding state.
The electrode of the first probe card 22A is pressed against each pogo pin of the contact group 23A, and the card holder 26 is fastened to the insert ring 27 with, for example, a bolt while pushing the movable rod of the pogo pin, so that the first probe card 22A becomes the card holder 26. It is sandwiched between the first contact groups 23A to maintain the electrical contact between the first probe card 22A and the test head 20.

[0007]

Conventionally, probes which contact 16 ICs at a time have been prepared. However, the recent tendency is that the shape of the semiconductor wafer becomes large, and one probe The number of ICs formed on a semiconductor wafer also tends to increase. Therefore, there is a demand to increase the number of ICs tested at one time in order to complete the test in a short time. The current shape of the first probe card 22A cannot increase the number of the first electrode groups 25A. In order to satisfy this requirement, it is necessary to expand the diameter of the first probe card 22A and use a new size probe card.
When there are probe cards having different diameters, it becomes difficult to mount the probe cards having two different sizes on the same test head 20 and share them. A dedicated test head may be used for each size depending on the size of the probe card. However, when configured in this way, an IC test apparatus that cannot be operated occurs depending on the size of the semiconductor wafer, which is uneconomical. Is.

An object of the present invention is to provide an IC test apparatus of this type which can share probe cards having different sizes.

[0009]

According to claim 1 of the present invention, a first contact group that contacts the same first electrode group that is annularly formed on the periphery of a first probe card having a small diameter, and the first contact group. A second contact group is provided outside the group, and the first contact group and the second contact group are brought into contact with the first electrode group and the second electrode group formed on the second probe card having a large diameter, and the diameter is small. The probe card has a structure in which only the first contact group is contacted.

Further, the second aspect of the present invention proposes a probe card having a first electrode group on a probe card having a large diameter and a second electrode group formed on the outside of the first electrode group in a ring shape with a gap. It is a thing.

[0011]

Therefore, according to the structure of the present invention, it is possible to mount and use both a conventionally used probe card having a small diameter and a newly made probe card having a large diameter. .

[0012]

1 shows an embodiment of an IC test apparatus according to the present invention. In FIG. 1, parts corresponding to those in FIG. 6 are designated by the same reference numerals. In the example shown in FIG. 1, the first probe card 22A having a small diameter is mounted.
The first probe card 22A having a small diameter is formed on the surface of the flange of the card holder 26 for holding the first probe card 22A having a small diameter in the first contact group 23A.
A case is shown in which a recess is formed with a diameter of, and the first probe card 22A is mounted by aligning with the recess. By providing an appropriate gap G between the first contact group 23A (first electrode group 25A) and the second contact group 23B (second electrode group 25B), the first contact group having a small diameter can be formed.
When mounting the probe card 22A, it is possible to prevent the second contact group 23B from interfering with the first probe card 22A having a small diameter.

FIG. 2 shows a second probe card 2 having a large diameter.
The case where 2B is attached is shown. In this case, the card holder 26 has a flat shape on the entire surface of the flange, and is configured to hold the second probe card 22B on the entire surface of the flange.

[0014]

As described above, according to the present invention, the first head arranged on the test head 20 side along a circle having a small diameter.
Since the contact group 23A and the second contact group 23B are provided outside the first contact group 23A with a gap G, both the first probe card 22A having a small diameter and the second probe card 22B having a large diameter can be mounted. Can be operated. Therefore, it is possible to obtain the practical benefit of efficiently operating the IC tester.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining a main part of the present invention.

FIG. 2 is a sectional view similar to FIG. 1;

FIG. 3 is a plan view for explaining the structure of the probe card proposed by the present invention.

FIG. 4 is a side view for explaining a conventional technique.

FIG. 5 is a plan view for explaining the structure of a conventionally used probe card.

FIG. 6 is a sectional view for explaining a conventional probe card support structure.

[Explanation of symbols]

 10 Semiconductor Wafer 11 Wafer Supporting Device 20 Test Head 21 Probe Group 22A First Probe Card with Small Diameter 22B Second Probe Card with Large Diameter 23A First Contact Group 23B Second Contact Group 25A First Electrode Group 25B Second Electrode Group

Claims (2)

[Claims] 1. A first contact group contacting a first electrode group formed in a ring shape on the periphery of a probe card having a small diameter, and a second contact group formed outside the first contact group in a ring shape.
And a structure in which the first contact group and the second contact group are respectively brought into contact with the first electrode group and the second electrode group formed on the probe card having a large diameter. IC test equipment. 2. A first electrode group is formed in an annular shape on the periphery of a disk-shaped insulating plate, and a second electrode group is formed outside the first electrode group with a space therebetween to form the first and second electrodes. A probe card characterized in that each electrode of the electrode group is electrically connected to each probe of the probe group provided at substantially the center of the insulating plate.