JPH09293756A - Conductive ball mounting device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive ball mounting device which is capable of vacuum-sucking only one conductive ball with its one suction hole. SOLUTION: A conductive ball mounting device is equipped with a conductive ball feed section 21, a work positioning section 29, a suction head 42 with a suction hole provided to its underside to vacuum-suck a conductive ball, a moving means which moves the suction head 42 between the feed section 21 and the positioning section 29, and a removing jig 27 which removes an extra ball attached to the underside of the head 42. A recess which houses the upper part of the conductive ball is provided around the suction hole of the head 42, and when the suction head 42 is relatively moved for the removing jig by the moving means to remove the extra ball, the upper edge of the removing jig is so positioned as to be located between a lower limit, of position where the underside of the head 42 is located lower than the underside of the head 42 by the diameter of the conductive ball and an upper limit of position where the underside of the head 42 is located higher than the lower limit of position by the height of the recess.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball mounting device and a conductive ball mounting method for mounting conductive balls on a work such as a substrate in order to form bumps on the work.

[0002]

2. Description of the Related Art As a means for forming bumps (protruding electrodes) on electrodes of a work such as a substrate or a chip, a method is known in which conductive balls are mounted on a work and then the conductive balls are heated to melt and solidify. There is. Generally, a large number of bumps are formed on a work, and therefore a large number of conductive balls are mounted on the work. Hereinafter, a conventional conductive ball mounting device for mounting a large number of conductive balls on a workpiece all at once will be described.

FIG. 4 is a side view of a conventional conductive ball mounting apparatus, and FIG. 5 is a partial sectional view of a head of the conventional conductive ball mounting apparatus. In FIG. 4, reference numeral 1 is a conductive ball supply unit, which is configured as follows. Reference numeral 2 denotes a container in which the conductive balls 3 are stored. 4 is container 2
It is a pillar of. A vibrator 5 is attached to the lower surface of the container 2. When the vibrator 5 is driven, the container 2 vibrates and the conductive balls 3 inside are fluidized.

Reference numeral 6 denotes a board positioning portion, which is constructed as follows. Reference numeral 7 denotes a movable table, on which a pole 8 is erected. A clamper 9 is provided on the upper end of the pole 8 and the substrate 10 is clamped by the clamper 9. The position of the substrate 10 is adjusted by driving the movable table 7 and moving the substrate 10 in the horizontal direction.

Reference numeral 11 denotes a head, which is held at the lower end of the shaft 12. The shaft 12 is held by the block 13. Vertical movement means (not shown) for vertically moving the shaft 12 is incorporated in the block 13.
When the vertical movement means is driven, the head 11 moves up and down. 14
Is a horizontally long moving table, which is installed between the supply unit 1 and the positioning unit 6. The moving table 14 is provided with a horizontal feed screw 15. A nut 16 provided on the back surface of the block 13 is screwed onto the feed screw 15.
Therefore, when the motor 17 is driven and the feed screw 15 is rotated, the block 13 and the head 11 move laterally along the moving table 14. A suction device 18 is connected to the head 11 via a tube 19. A plurality of suction holes 11a for the conductive balls 3 are formed on the lower surface of the head 11 (see FIG. 5). By driving the suction device 18, the conductive balls 3 are vacuum-sucked to the suction holes 11a. It

The conventional conductive ball mounting device is constructed as described above, and its operation will be described below. Motor 17
Is driven to move the head 11 above the container 2, and the vertical moving means provided in the block 13 is driven there to lower and raise the head 11, and the conductive balls 3 are vacuum-sucked to the lower surface of the head 11. . At this time, by driving the vibrator 5 to vibrate the container 2, the conductive balls 3 in the container 2 are entirely fluidized, so that the conductive balls 3 are inserted into the suction holes 11a on the lower surface of the head 11. Easy to vacuum suction.

When the head 11 picks up the conductive balls 3 by vacuum suction, the motor 17 is driven to move the head 11 above the substrate 10. Next head 11
Is lowered to land the conductive balls 3 on the lower surface thereof on the upper surface of the substrate 10, whereupon the vacuum suction state of the conductive balls 3 by the suction device 18 is released. Next, when the head 11 is raised, the conductive balls 3 drop off from the suction holes 11a and are mounted on the substrate 10. Next, the head 11 moves above the container 2, and the above-described operation is repeated.

[0008]

However, the conventional conductive ball mounting device has the following problems. That is, the head 11 moves down and up with respect to the container 2 to vacuum-suck the conductive balls 3 into the suction holes 11a and pick up the balls.
Only one conductive ball 3 must be adsorbed on a. However, in this case, as shown in FIG. 5, the plurality of conductive balls 3 are likely to be vacuum-sucked (sucking error) to one suction hole 11a, and the plurality of conductive balls 3 are directly attached to the substrate 10. There was a problem that it would be installed.

Therefore, it is an object of the present invention to provide a conductive ball mounting device capable of vacuum-sucking only one conductive ball in one suction hole.

[0010]

SUMMARY OF THE INVENTION A conductive ball mounting apparatus according to the present invention comprises a conductive ball supply section, a workpiece positioning section, and a recess for accommodating the upper part of one conductive ball on the lower surface. A head having suction holes communicating with the recess formed on the lower surface, moving means for moving the head between the supply unit and the positioning unit, and removing extra balls located outside the recess and adhering to the lower surface of the head. Equipped with a jig,
When the head is moved relative to the removing jig by the moving means to remove the extra balls, the position of the upper edge of the removing jig is lower than the lower surface of the head by the diameter of the conductive ball. And the upper limit position which is above the lower limit position by the height of the recess.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A conductive ball mounting apparatus according to a first aspect of the present invention is provided with a conductive ball supply section, a work positioning section, a recess for accommodating an upper part of one conductive ball on the lower surface, and this recess. A head having an adsorption hole communicating with the lower surface, a moving means for moving the head between the supply section and the positioning section, and a removal treatment for removing extra balls that are located outside the concave section and adhere to the lower surface of the head. When the head is moved relative to the removing jig by the moving means to remove the extra balls, the position of the upper edge of the removing jig is only the diameter of the conductive ball from the lower surface of the head. It is located between the lower limit position below and the upper limit position above the lower limit position by the height of the recess.
Therefore, the conductive ball correctly attracted to the attraction hole has the upper portion housed in the concave portion, and the lower portion is always above the upper edge of the removing jig, and does not contact the removing jig. On the other hand, the extra balls are not housed in the recesses, but come into contact with the removing jig, are attracted by the movement of the head, and are removed from the head. As a result, only one conductive ball is sucked into one suction hole, and a correct transfer operation can be performed.

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a conductive ball mounting device according to an embodiment of the present invention. In FIG. 1, 20 is a base. Reference numeral 21 is a conductive ball supply unit, and of these, 22 is a container for storing a large number of conductive balls 23. Reference numeral 24 is a base portion which is disposed on the base 20 and supports the container 22. Further, 25 is a pillar standing upright on the side of the base 24, 26 is an elastic body attached to the upper part of the pillar 25, and 27 is a removing jig whose lower part is fixed to the upper part of the elastic body 26. The removing jig 27 has a positional relationship which will be described in detail later, and is for scraping and removing the extra balls that are excessively attached to other than the predetermined positions. Further, 28 is a container 2 for removing the extra balls.
In order to return to 2, the inclined plate is inclined downward from the removal jig 27 side toward the container 22.

Further, 29 is a supply unit 21 on the base 20.
The positioning unit is arranged at a position away from. Of these, 31 is a holder that holds the substrate 30 horizontally, and 32 is a movable table that is provided on the base 20 and positions the substrate 30 at a predetermined position by moving the holder 31 in the XY directions. Further, 33 is the removal jig 27 and the positioning portion 2.
9 is a light source that is disposed between the light source 9 and the light source 9 and emits light upward (arrow N1). The light from the light source 33 is, as described later,
It is used to recognize the quality of adsorption.

Reference numeral 37 denotes a frame disposed laterally above and above the supply section 21 and the positioning section 29, 38 a feed screw rotatably supported by the frame 37, and 39 a moving means for rotating the feed screw 38. Is the motor of. Four
Reference numeral 0 denotes a moving plate provided with a feed nut (not shown) on its back, and this feed nut is screwed into the feed screw 38. Therefore, when the motor 39 is driven, the feed screw 3
8 can be rotated to move the moving plate 40 laterally.

Reference numeral 41 is a block mounted on the front surface of the moving plate 40 so as to be able to move up and down, and 43 is a lift motor for moving the block 41 up and down. At the lower end of the block 41, the lower surface 4
A head 42 having a plurality of suction holes 42b (FIG. 2) formed in 2a is fixed.

Next, the positional relationship of the removing jig 27 will be described with reference to FIG. As described above, the head 42 has the suction hole 42b on the lower surface 42a side thereof, and at the lower portion of the suction hole 42b, the concave portion 42c formed coaxially with the suction hole 42b and having a conical shape. Are formed. When the conductive balls 23 are correctly attracted to the suction holes 42b, the upper portions of the conductive balls 23 are recessed 42.
The conductive balls 23 are housed in c and are positioned at positions concentric with the suction holes 42b. At this time, the upper end portion of the conductive ball 23 is recessed 4 more than the lower surface 42 a of the head 42.
It is above the height h of 2c. The position of the lower end portion of the conductive ball 23 at this time is defined as the upper limit position L1.

By the way, as described above, when the conductive balls 23 are sucked by the head 42, excess balls may be sucked at a position outside the suction holes 42b.
Here, in this specification, this extra ball is referred to as an extra ball.

As shown in FIG. 2, since the extra ball 23x (hatched portion) is out of the suction hole 42b, the upper portion of the extra ball 23x is naturally recessed 42c.
Never enter. Therefore, the extra ball 23
The lower end portion of x is lower limit position L2 below the lower surface 42a of the head 42 by the diameter D of the conductive ball, or this lower limit position L.
It is below 2.

Therefore, in this embodiment, the position of the upper edge 27a of the removing jig 27 is between the upper limit position L1 and the lower limit position L2. In this way, the upper edge 27a does not contact the conductive ball 23 that is correctly attracted to the attraction hole 42b, but only the extra ball 23x that is not in the recess 42c.

Therefore, the conductive balls 23 are picked up from the container 22 by the head 42, the head 42 is positioned by the elevating motor 43 and the motor 39 is driven so as to have the above-mentioned positional relationship, and the arrow N2 in FIG. As shown, when the head 42 is moved in the horizontal direction relative to the removing jig 27, only the extra balls 23x are removed by the upper edge 27a of the removing jig 27. The removed extra balls 23x drop onto the inclined plate 28 as shown by the chain line in FIG. 2, slide down on the inclined plate 28, and are collected in the container 22.

Next, referring to FIG. 3, the recognition unit 4
4 and the like will be described. As shown in FIG. 3, the transparent plate 4 is provided between the lower part of the recognition unit 44 and the upper part of the head 42.
5 is included. This closes the top of the head 42,
The negative pressure by the suction device is applied to the inside of the head 42, and the upward light in the head 42 can be transmitted to the recognition unit 44.

A lens 46 is provided in the recognition unit 44.
A sensor 47 for detecting light is arranged. here,
When the conductive balls 23 are attracted to all of the suction holes 42b, the upper portions of the conductive balls 23 close the recesses 42c, so that even if the head 42 reaches the light source 33, it is indicated by a dashed arrow in FIG. As described above, the light does not reach the sensor 47.

However, as shown by the solid line arrow in FIG. 3, when even one of the suction holes 42b does not suck the conductive ball 23 (insufficient suction), the sensor 47 is detected.
Detects light.

Therefore, in the conductive ball mounting apparatus of this embodiment, if the sensor 47 detects no light, it is determined that the adsorption is successful, and if even one sensor 47 detects the light, it is determined that the adsorption is insufficient. .

The overall operation will be briefly described here. First, the conductive balls 23 are attracted to the head 42, and the removal jig 27
If there is an extra ball, remove it. next,
Conductive balls 2 that have been correctly attracted by this removal operation
Since there is a possibility that up to 3 will be removed, it is inspected whether there is insufficient suction, if not, it is mounted on the substrate 30,
If there is, the suction operation is performed again.

[0026]

According to the conductive ball mounting apparatus of the present invention, a conductive ball supply section, a workpiece positioning section, a head having suction holes for vacuum suction of the conductive ball formed on the lower surface, and a supply section are provided. Equipped with a moving means for moving between the positioning part and a removing jig which is located outside the suction holes and removes extra balls adhering to the lower surface of the head, and the upper part of the conductive balls is stored around the suction holes. When the head is moved relative to the removing jig by the moving means in order to remove the extra balls, the position of the upper edge of the removing jig is from the lower surface of the head to the conductive balls. Since it is located between the lower limit position which is below the lower limit position and the upper limit position which is above the lower limit position by the height of the recess, be sure to remove the extra balls and perform correct transfer. It can be.

[Brief description of drawings]

FIG. 1 is a side view of a conductive ball mounting device according to an embodiment of the present invention.

FIG. 2 is an operation explanatory diagram of the conductive ball mounting device according to the embodiment of the present invention.

FIG. 3 is a partially enlarged view of a conductive ball mounting device according to an embodiment of the present invention.

FIG. 4 is a side view of a conventional conductive ball mounting device.

FIG. 5 is a partial sectional view of a head of a conventional conductive ball mounting device.

[Explanation of symbols]

 21 Supply Part 23 Conductive Ball 27 Removal Tool 29 Positioning Part 42 Head

Claims (2)

[Claims] 1. A conductive ball supply unit, a work positioning unit, a recess for accommodating an upper part of one conductive ball on the lower surface, and a head having a suction hole formed on the lower surface for communicating with the recess. The extra ball is provided with a moving means for moving the head between the supply part and the positioning part, and a removal jig which is located other than the concave part and removes extra balls adhering to the lower surface of the head. To exclude
When the head is relatively moved with respect to the removing jig by the moving means, the position of the upper edge of the removing jig is a lower limit position below the lower surface of the head by the diameter of the conductive ball, A conductive ball mounting device, characterized in that it is located between an upper limit position which is above the lower limit position by the height of the concave portion. 2. A head is placed in a conductive ball supplying section,
A step of adsorbing a conductive ball to the suction hole of the head and storing the upper part of the conductive ball in a recess formed around the suction hole; and moving the head relative to a removal jig, During this movement, the upper edge of the removing jig is between the lower limit position which is below the lower surface of the head by the diameter of the conductive ball and the upper limit position which is above the lower limit position by the height of the recess. And removing the extra balls that are located other than the suction holes and that adhere to the lower surface of the head, and then transfer the conductive balls that are attracted to the suction holes to the work. Characteristic conductive ball mounting method.