JPH0929360A - Cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To use even a water of worse quality onto a 1st order side by installing a heat exchanger to exchange and transfer the heat of a secondary cooling system to the primary cooling system. SOLUTION: In a cooling device, a primary cooling system and a secondary cooling system 12 are installed. For example, a device to be cooled of a die device or a injection machine, etc., is cooled with the secondary cooling system 12, a heat exchanger 1 in order to exchange and transfer the heat of the secondary cooling system 12 to the primary cooling system is interposed between the primary cooling system and the secondary cooling system, and both cooling systems 11, 12 are connected mutually. The primary cooling system provides a discharge opening of a pump to send the cooling water, a discharge piping 7 to connect and connect through the primary side passage 6 of the heat exchanger 1, and a return piping 9 to return the cooling water being heat-exchanged at the heat exchanger 1 and being raised in the temperature to a cooling tower body. In the secondary cooling system 12, the heated water is returned in the return stream piping 19 to the high temperature H side of the tank 13. The water is sent with the pump 20 to the heat exchanger 1, and the cooled water is sent to the low temperature L side. Therefore, scale, rust and slime, etc., can be hardly generated inside the device to be cooled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cooling a mold apparatus, an injection molding machine and the like.

[0002]

2. Description of the Related Art Generally, water is widely used as a cooling medium, but conventionally, a cooling water circulation type cooling device for cooling a cooled device such as a mold device or an injection molding machine with only a primary cooling system has been used. ing.

[0003]

However, in the cooling water system used in the above-mentioned conventional circulation type cooling apparatus, corrosion, scale, and generation of slime have become problems. For example, when a cooling tower is used, the cooling water is gradually concentrated, and the above-mentioned corrosion, scale, and slime (hereinafter, sometimes referred to as “water obstacle”) tend to be promoted.

[0004] With such an obstacle to the water, the cooling efficiency is reduced, and it is difficult to control the cooling with high accuracy.

[0005]

A cooling device according to the present invention comprises a primary cooling system and a secondary cooling system, and cools a device to be cooled such as a mold device or a molding machine by a secondary cooling system. A heat exchanger for exchanging and transferring the heat of the secondary cooling system to the primary cooling system was interposed between the primary cooling system and the secondary cooling system.

Further, it is provided with a primary cooling system and a secondary cooling system,
It has a heat exchanger that cools the cooled equipment such as mold equipment and molding machine by the secondary cooling system, and exchanges and transfers the heat of the secondary cooling system to the primary cooling system, and further the cooling medium of the secondary cooling system. The dissolved oxygen reducing means for reducing the dissolved oxygen of water is attached to the secondary cooling system.

As the dissolved oxygen reducing means, a decompression container which intermittently takes in water as a cooling medium for the secondary cooling system was used.

[0008]

An embodiment of the present invention will be described with reference to the drawings.

FIG. 1, FIG. 2, and FIG. 3 are views in which a simplified piping system diagram of a cooling device of the present invention is divided into three parts, and symbols,;, and; are connected to each other. ing. 1, 2, and 3, the range shown in FIG. 1 is the primary cooling system 11, and most of FIG. 2 and the range shown in FIG. 3 are the secondary cooling system 12. The cooling device M such as a mold device or an injection molding machine is cooled by the secondary cooling system 12, and the heat exchanger 1 for exchanging and transmitting the heat of the secondary cooling system 12 to the primary cooling system 11 is subjected to primary cooling. The two cooling systems 11, 12 are connected to each other by being interposed between the system 11 and the secondary cooling system 12.

Therefore, the primary cooling system 11 and the secondary cooling system 12
"Water" is used as the cooling medium in each case. In addition, dissolved oxygen reducing means D is provided in the secondary cooling system 12 in order to reduce dissolved oxygen in the cooling medium (water) of the secondary cooling system 12.

That is, as the dissolved oxygen reducing means D, a decompression vessel 2 is used which intermittently takes in water as a cooling medium of the secondary cooling system 12 and removes dissolved oxygen by negative pressure.

More specifically, referring to FIGS. 1 to 3, the primary cooling system 11 includes a cooling tower 3, a primary side pump 4, a suction pipe 5, and a pump 4 for sending cooling water (medium). Discharge pipe 7 for communicating and connecting the discharge port of the heat exchanger 1 with the primary side passage 6 of the heat exchanger 1, and a return pipe for returning the cooling water (medium) that has been heated by the heat exchanger 1 and heated to the cooling tower body 8. 9 is provided.

As the primary cooling system 11, groundwater or seawater may be passed through the primary passage 6 of the heat exchanger 1 by a one-pass system (not shown) in addition to the above-described example.

Next, the secondary cooling system 12 has, for example, the following configuration. Reference numeral 13 denotes a tank, the inside of which is divided into a high temperature H side and a low temperature L side by a partition wall 14, and a small communication hole 15 is opened in the partition wall 14. 16 is the low temperature L of the tank 13
The other end is connected to an external feed pump 17 for sending cooling water (medium) to the device to be cooled M, which is a suction pipe for sucking cooling water (medium) in the side. The pump 17 sends cooling water (medium) to a device to be cooled M such as an injection molding machine or a metal mold by an external feed pipe 18.

Return water (medium) that has been heated by cooling the device M to be cooled is supplied to the high temperature H of the tank 13 through the reflux pipe 19.
Reflux to the side. Since the communication hole 15 penetrates through the tank 13, the high temperature H side and the low temperature L side are maintained at the same water level.

Reference numeral 20 denotes a secondary side pump which sucks water (medium) from the high temperature H side of the tank 13 through the suction pipe 21 and sends it to the heat exchanger 1 through the discharge pipe 22. The water (medium) cooled on the secondary side of the heat exchanger 1 flows through the pipe 23 through the tank 13.
Is sent to the low temperature L side.

By the way, first and second on-off valves 25, 26 and a solenoid valve 27 are provided in a branch pipe 24 branched from the middle of the discharge pipe 22, and the branch pipe 24 is intermittently connected to the decompression container 2. Is connected to supply water (medium).

Further, 28 is a reflux pipe for returning the water (medium) after the reduction of dissolved oxygen to the tank 13 from the decompression container 2, and more specifically, it is connected and joined to the pipe 23 at the joining portion 29, Send reflux water to the low temperature L side of the tank. Further, another solenoid valve 30 and an on-off valve 31 are interposed in the middle of the return pipe 28.

The decompression container 2 is stretched with an oxygen permeable membrane 32 that allows only oxygen to pass therethrough without passing water (medium), below which water (medium) is filled, and above which is an empty chamber. hand,
A vacuum evacuation pipe 34 provided with a solenoid valve 33 is connected to a vacuum generator 41 such as an aspirator. The vacuum generating device 41 is configured, for example, to branch water (medium) from the discharge pipe 7 constituting the primary cooling system 11 and send it to the aspirator, and return water (medium) from the aspirator to the return pipe 9. (Not shown).

The decompression container 2 is used as follows.
In other words, the solenoid valve 27 is opened (with the on-off valves 25 and 26 opened), a part of the discharge flow of the secondary pump 20 is sent into the depressurizing container 2, and when full, the solenoid valve 27 is closed. Dissolved oxygen is reduced by opening the solenoid valve 33 and maintaining a vacuum of, for example, 5 mmHg to 70 mmHg in the decompression container 2 by the vacuum generator 41 for a predetermined time.

After that, the solenoid valves 27 and 30 are opened to recirculate the water (medium) with reduced dissolved oxygen to the low temperature L side of the tank.

The treated water (medium) from which the dissolved oxygen is reduced from the intermittent decompression container 2 is used as the secondary cooling water (medium).
For example, water (medium) with dissolved oxygen of 8 ppm can be reduced to 2.5 ppm in 20 days, thereby reducing the use of difficult-to-handle chemicals such as hydrated hydrazine (or zero). It is possible to almost completely eliminate water disturbances (including those caused by bacterial outbreaks).

In FIG. 2, reference numeral 42 is a strainer (filter), which diverts a part of the flow of the secondary cooling system 12 to purify water (medium).

According to the present invention, the secondary cooling system having the above-mentioned structure is provided.
12 water (medium) is dissolved oxygen reducing means D 手段 pressure reducing vessel 2
For example, the temperature is always maintained at 4.5 ppm or less by the equality, and it is possible to prevent corrosion of the device to be cooled M, water damage such as scale and slime. In addition, concentration of water (medium) does not occur. Of course, even better results can be obtained by adding chemicals to the secondary cooling system 12, but there is an advantage that the amount of use can be significantly reduced.

Since the water is not disturbed, the heat conductivity of the heat transfer surface can be maintained well for a long period of time, and a stable cooling action is exhibited.

[0026]

The present invention has the following remarkable effects.

The secondary cooling system 12 (according to claim 1)
No impurities are mixed in and no concentration occurs. Therefore, scale, rust, slime, etc. are unlikely to occur in the cooled device M. In addition, there is an advantage that even poor quality water can be used on the primary side.

(According to claim 2 or 3, the dissolved oxygen in the water (medium) of the secondary cooling system 12 is reduced, and the damage of water such as corrosion, scale, slime, etc. can be prevented more reliably, and long-term , Can exert a stable cooling action. Moreover, the use of the depressurized container 2 makes it possible to easily control the dissolved oxygen to be low with a relatively inexpensive and simple configuration.

[Brief description of drawings]

FIG. 1 is a partial piping system diagram showing one embodiment of the present invention.

FIG. 2 is a partial piping system diagram showing another part.

FIG. 3 is a partial piping system diagram showing still another portion.

[Explanation of symbols]

 Reference Signs List 1 heat exchanger 2 decompression vessel 11 primary cooling system 12 secondary cooling system M device to be cooled D means for reducing dissolved oxygen

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location B29C 45/72 7365-4F B29C 45/72

Claims (3)

[Claims] A primary cooling system and a secondary cooling system;
A heat exchanger 1 that cools a cooled device M such as a mold device or a molding machine by a secondary cooling system 12 and transfers the heat of the secondary cooling system 12 to the primary cooling system 11 is connected to the primary cooling system 11 and the secondary cooling system 11. A cooling device characterized by being interposed between the secondary cooling systems 12. 2. A primary cooling system 11 and a secondary cooling system 12 are provided,
It has a heat exchanger 1 that cools a cooled device M such as a mold device or a molding machine by a secondary cooling system 12, and exchanges and transfers the heat of the secondary cooling system 12 to the primary cooling system 11. Dissolved oxygen reducing means D for reducing dissolved oxygen in water as a cooling medium of the cooling system 12
Is attached to the secondary cooling system 12 described above. 3. The cooling device according to claim 2, wherein as the dissolved oxygen reducing means D, a decompression container 2 which intermittently takes in water as a cooling medium of the secondary cooling system 12 is used.