JPH09292440A - Resin-mold removing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the workability of resin-mold removing work by alleviating the hazard in the resin-mold removing work and the hazard of the damage to electronic parts. SOLUTION: The electronic part covered by resin mold is heated in the water, and the resin mold covering the electronic part is activated (S1). Then, the heated electronic part is immersed into organic solvent, and the resin mold is made to swell by the organic solvent (S2). The resin mold, which is swelled by the organic solvent, is removed from the electronic part by stripping or scraping (S3).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin mold removing method, and more particularly to a resin mold removing method for covering the outer periphery of an electronic component or the like.

[0002]

2. Description of the Related Art Conventionally, as a removal method of this kind, when carrying out a failure analysis of a resin-molded electronic component, the electronic component is immersed in an acid or an organic solvent to melt or swell the resin mold. I have removed it.

When the material of the resin mold is unknown and the method of removal is unknown, organic solvents are used in the order in which the materials such as solder, plastic, nickel, aluminum, and copper are less likely to be attacked so as not to affect electronic parts as much as possible. Is selected,
It is dipped in order in the selected organic solvent.

If the resin mold does not dissolve even when immersed in the selected organic solvent, an attempt is made to remove the resin mold by immersing the electronic component in acid.

[0005]

In the above-described conventional resin mold removing method, when the resin mold is removed by immersing the resin-molded electronic component in the acid, the acid easily attacks other than the resin mold. Therefore, the removal work is dangerous.

[0006] Further, since acid easily attacks major materials such as solder, plastic, nickel, aluminum, and copper which are often used inside electronic parts, there are cases in which the parts that should be left behind are melted, and the electronic parts This may interfere with investigations such as failure analysis.

Furthermore, when the resin mold is soaked in a heated organic solvent to remove the resin mold, the organic solvent is rapidly vaporized by the heating, which increases the risk of ignition, and the removal work is difficult. There will be danger.

Therefore, an object of the present invention is to solve the above problems and to reduce the risk in the work of removing the resin mold and the risk of damaging the electronic parts, and to improve the workability of the work of removing the resin mold. It is to provide a method for removing a resin mold that can be improved.

[0009]

A resin mold removing method according to the present invention is a resin mold removing method for removing a resin mold covering an outer periphery of an electronic component, wherein the electronic component covered with the resin mold is submerged in water. The first step of heating, the second step of immersing the heated electronic component in an organic solvent to swell the resin mold with the organic solvent, and the electronic mold of the resin mold swollen with the organic solvent. The third step is to remove it from the part.

Another resin mold removing method according to the present invention uses acetone at room temperature as the organic solvent in the above step.

Another resin mold removing method according to the present invention uses isopropyl alcohol at room temperature as the organic solvent in the above step.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, the operation of the present invention will be described below.

The electronic component covered with the resin mold is heated in water and then immersed in an organic solvent, and the resin mold swollen with the organic solvent is removed from the electronic component. As a result, by using a relatively common organic solvent that does not attack internal materials without using a solvent such as a highly soluble acid, there is a risk of working and a risk of damage to electronic components. Can be reduced. In this case, since the organic solvent is not directly heated, it is possible to eliminate the risk of the organic solvent rapidly vaporizing and igniting.

As a pretreatment for immersing the electronic component in an organic solvent, the electronic component covered with the resin mold is heated in water to activate the resin mold on the exterior of the electronic component. As a result, the organic solvent easily penetrates into the resin mold, and the resin mold is easily swollen by the organic solvent.

Further, in the case of the prior art, a strong acid is used for a resin mold which cannot be dissolved by a less dangerous solvent, or an organic solvent having a high ignitability is heated and immersed, which is not a little dangerous. Although it is removed by a method that accompanies it, as a pretreatment for immersing the electronic component in the organic solvent, the electronic component covered with the resin mold is heated in water to swell the resin mold with the organic solvent at room temperature. Can be removed.

Therefore, it is possible to relatively safely perform the resin mold removing work, and since the acid is not used for the resin mold removing work, the facility can be simplified. Therefore, it is possible to reduce the risk in the work of removing the resin mold and the risk of damaging the electronic component, and it is possible to improve the workability of the work of removing the resin mold.

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a process diagram showing the processing operation of an embodiment of the present invention. A resin mold removing operation according to an embodiment of the present invention will be described with reference to this drawing.

When removing the resin mold covering the outer periphery of the electronic component, first, the electronic component covered with the resin mold is heated in water (step S1 in FIG. 1) to activate the resin mold of the exterior of the electronic component. .

Subsequently, the heated electronic component is dipped in an organic solvent (eg, acetone or isopropyl alcohol) to swell the resin mold with the organic solvent (step S2 in FIG. 1). The resin mold swollen with the organic solvent is peeled off or scraped off and removed from the electronic component (step S3 in FIG. 1).

FIG. 2 is a perspective view showing an example of a processing target according to an embodiment of the present invention. In the figure, a mica paper capacitor is shown as an example of molded parts.

That is, in this molded component example, the mica paper capacitor 2 which is an electronic component is covered with the resin mold 1. In this case, although the detailed material of the resin mold for the exterior is unknown, it is necessary to take out the mica paper capacitor 2 without damaging it.

FIG. 3 is a diagram showing a resin mold removing operation for the example of the mold part shown in FIG. FIG. 3A shows FIG.
Fig. 3 shows the process of heating the mold part in Fig. 3 in water.
3B shows a step of immersing the heated mold part in FIG. 3A in an organic solvent, and FIG. 3C shows a mold part of the resin mold swollen with the organic solvent in FIG. 3B. 3D shows the electronic component after removing the resin mold from the molded component swollen with the organic solvent of FIG. 3C.

The operation of removing the resin mold according to the embodiment of the present invention will be described in detail with reference to FIGS. Here, an example in which acetone is used as the organic solvent is described.

First, the entire mold part (5 cm square) from which the resin mold 1 is removed is immersed in 500 ml of water 3 in the beaker, and the water 3 in the beaker is continuously heated for about 2 hours so that the inside of the mold part is sufficiently warmed. [See FIG. 3A].

Then, the heated mold part is immediately immersed in acetone 4 sufficiently prepared in a 500 ml beaker [see FIG. 3 (b)]. In this case, pay attention to the amount of acetone 4 so that the entire molded part is sufficiently immersed, and place the molded part in acetone 4 in the beaker about 4 times.
Immerse in time, and mold resin mold 1 of mold parts with acetone 4
Swell with.

When the resin mold 1 of the molded part is swollen with acetone 4 and the swollen resin mold 1'becomes soft and becomes a hard rubber, the molded part is taken out from the acetone 4 in the beaker [see FIG. 3 (c)]. ].

In the molded part taken out from the acetone 4 in the beaker, since the resin mold 1 of the exterior is soft, the swollen resin mold 1'is scratched with a cutter such as a cutter to be peeled off, or with a knife. The resin mold 1 is removed from the mica paper capacitor 2 by shaving or the like [see FIG. 3 (d)].

However, since acetone 4 easily volatilizes, if it takes time to remove the swollen resin mold 1 ', acetone 4 volatilizes and the swollen resin mold 1'hardens again. Repeat to soften the resin mold 1 and remove it from the mica paper capacitor 2. Although acetone 4 is used as the organic solvent in the above example, the resin mold 1 can be removed similarly to acetone 4 when isopropyl alcohol is used as the organic solvent.

As described above, by heating the electronic component coated with the resin mold in water and then immersing it in an organic solvent, and removing the resin mold swollen with the organic solvent from the electronic component, a highly soluble acid is obtained. By using a relatively common organic solvent that does not attack the internal material without using such a solvent as described above, it is possible to reduce the risk of work and the risk of damage to electronic components. In this case, since the organic solvent is not directly heated, it is possible to eliminate the risk that the organic solvent is rapidly vaporized and ignited.

As a pretreatment for immersing the above-mentioned electronic component in an organic solvent, the electronic component coated with the resin mold is heated in water to activate the resin mold of the exterior of the electronic component. The resin mold easily penetrates, and the resin mold is easily swollen by the organic solvent.

Further, in the case of the conventional technique, a strong acid is used for a resin mold which cannot be dissolved with a less dangerous solvent, or an organic solvent having a high ignitability is heated and dipped. Although it is removed by a method that accompanies it, as a pretreatment for immersing the electronic component in the organic solvent, the electronic component covered with the resin mold is heated in water to swell the resin mold with the organic solvent at room temperature. Since the resin mold can be removed, the resin mold can be removed relatively safely. In addition, since acid is not used for the work of removing the resin mold, the facility can be simplified.

Therefore, the risk of removing the resin mold and the risk of damaging the electronic components can be reduced, and the workability of the resin mold removing operation can be improved.

[0033]

As described above, according to the present invention, an electronic component covered with a resin mold is heated in water and then immersed in an organic solvent, and the resin mold swollen with the organic solvent is removed from the electronic component. By removing the resin mold, the risk in the work of removing the resin mold and the risk of damaging the electronic component can be reduced, and the workability of the work of removing the resin mold can be improved.

[Brief description of drawings]

FIG. 1 is a process diagram showing a processing operation of an embodiment of the present invention.

FIG. 2 is a perspective view showing an example of a processing target according to an embodiment of the present invention.

3A is a diagram showing a process of heating the mold component of FIG. 2 in water, FIG. 3B is a diagram showing a process of immersing the mold component heated in FIG. 2A in an organic solvent, and FIG. Is (b)
FIG. 3 is a diagram showing a mold part obtained by swelling a resin mold with an organic solvent in FIG. 4, and (d) is a diagram showing an electronic part after the resin mold swollen with an organic solvent in (c) is removed from the mold part.

[Explanation of symbols]

 1 Resin Mold 1'Swelled Resin Mold 2 Mica Paper Capacitor 3 Water 4 Acetone

Claims (3)

[Claims] 1. A resin mold removing method for removing a resin mold covering an outer periphery of an electronic component, the first step of heating an electronic component covered with the resin mold in water, and the heated electronic component. A second step of immersing the component in an organic solvent to swell the resin mold with the organic solvent; and a third step of removing the resin mold swelled with the organic solvent from the electronic component. Characteristic resin mold removal method. 2. The method for removing a resin mold according to claim 1, wherein acetone at room temperature is used as the organic solvent. 3. The method for removing a resin mold according to claim 1, wherein isopropyl alcohol at room temperature is used as the organic solvent.