JPH09290365A - Polishing device for wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate mounting/demounting work of a surface plate, by providing a vacuum device mutually sucking a polishing surface plate and a surface plate receiving part so that the surface plate and the surface plate receiving part integrally formed can make a relative motion relating to a wafer. SOLUTION: In a surface mounting a surface plate 14 of a flat plate part 12a in a surface plate receiving part 12, a groove-shaped vacuum passage 15 for vacuum sucking the surface plate 14 is formed. Further, the vacuum passage 15 is formed in a surface of the flat plate part 12a, to communicate with a vacuum source through a passage 15a of a shaft part 16. A reason that an area of the vacuum passage 15 is widely set even as compared with an area receiving the surface plate 14 is for increasing suction force, the passage is formed almost uniformly in a total surface, so as to disperse suction force, deformation of the surface plate 14 is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer polishing apparatus. The wafer polishing apparatus includes a polishing apparatus and a lapping apparatus. As a basic configuration of the polishing apparatus, a wafer holding portion, a polishing platen having a polishing surface arranged to face the wafer holding portion to polish the wafer, and a wafer surface to bring the wafer surface into contact with the polishing surface. A contact / separation mechanism for moving the holding part and the polishing platen in and out, a pressing mechanism for pressing the wafer held by the wafer holding part against the polishing surface with a predetermined pressing force, and the wafer contacting the polishing surface of the polishing platen. It is provided with a drive mechanism for relatively moving the wafer and the polishing platen by rotating and / or reciprocating in a state of being in contact with and being pressed, a supply mechanism of a liquid abrasive containing slurry and the like. The polishing platen is a platen composed of a platen body made of a metal plate or a ceramics plate and a cloth or felt-like cloth, or a sponge or brush-like member fixed on the surface of the platen, and the platen. It is configured to include a surface plate receiving portion that receives and supports the plate. According to this polishing apparatus, a wafer that is a thin plate-shaped member to be polished (for example, the surface of a brittle member such as a silicon wafer for a semiconductor device or a thin glass plate material) can be polished into a mirror surface.

[0002]

2. Description of the Related Art In a conventional wafer polishing apparatus, a surface plate is simply placed on a surface plate receiving portion that receives and supports the surface plate. As the surface plate main body, which is the base of the surface plate, high rigidity is used because high flatness is always required in order to improve the polishing accuracy of the wafer. In particular, the flatness of silicon wafers, which are the raw material for semiconductor chips, is required to have sub-micron accuracy, so the platen body is not allowed to undergo slight deformation, and the platen body is required to have extremely high rigidity. . In order to increase the rigidity, it is sufficient to increase the plate thickness of the platen body, so that the platen body is very heavy. As a material of the conventional surface plate main body, stainless steel is generally used in the case of a polishing apparatus because of its chemical resistance, and cast iron is used in the case of a lapping apparatus.

By the way, the fact that the main body of the surface plate is very heavy has the following advantages. That is, when the surface plate is mounted on the surface plate receiving portion, it is not easily lifted or skid due to its weight even if it is simply mounted without being fixed by screwing or the like. If the surface plate body and the surface plate receiving part are made of different materials, the coefficients of thermal expansion will be different, so if the surface plate body and the surface plate receiving part are completely fixed together, they will warp in a bimetal state due to temperature changes. Can be considered. However, when the surface plate is simply placed on the surface plate receiving portion, the force due to thermal expansion can be released, so that the above-mentioned problem of warpage does not occur. Further, since the platen is only placed on the platen receiving portion, there is no need for a work process for fixing means (for example, screw fixing) when the polishing platen is attached and detached, and the replacement of the cloth is accompanied. The work of attaching and detaching the surface plate can be simplified.

[0004]

However, since the platen is very heavy, the work of attaching and detaching the platen is not easy and dangerous. In particular, in the case of a polishing apparatus, it is necessary to refill the cloth frequently (for example, once every several days), and the weight of the surface plate has been a problem in handling the cloth. Moreover, when the weight of the surface plate is increased, the movement mechanism for driving the surface plate becomes large in size. Further, when considering the surface plate body and the surface plate receiving portion as a whole, the rigidity may be excessively set.

Therefore, it is an object of the present invention to maintain the flatness of the surface plate main body as it is conventionally, to securely fix the surface plate to the surface plate receiving portion, and to reduce the weight of the surface plate. It is therefore an object of the present invention to provide a wafer polishing apparatus that facilitates the work of attaching and detaching the surface plate when the cloth is reattached.

[0006]

To achieve the above object, the present invention has the following arrangement. That is, the present invention
In a wafer polishing apparatus for polishing a wafer surface by bringing the wafer surface into contact with the polishing surface of a polishing surface plate and relatively moving the wafer and the polishing surface plate while applying a predetermined load to the wafer, The platen includes a surface plate provided with a polishing surface and a surface plate receiving portion that receives and supports the surface plate, and the surface plate and the surface plate receiving portion are integrated with each other with respect to the wafer. A vacuum device is provided for adhering the polishing platen and the platen receiving portion to each other so that the polishing platen and the platen can be moved manually.

Further, the platen is provided by fixing a member constituting a polishing surface such as cloth or felt-like cloth to the surface of a platen body made of a ceramic plate, so that the platen can be polished. The weight of can be reduced.

Further, a support base portion for supporting the surface plate and the surface plate receiving portion, which are integrally attracted to each other, rotatably about an axis perpendicular to the polishing surface of the surface plate, and the support base portion. A rotary drive means for rotating the surface plate around the axis with respect to a support base, a base for supporting the support base, and the polishing of the support base for the base. A wafer can be more uniformly and suitably polished by including a circular motion device that performs a circular motion that does not rotate in a plane parallel to the plane.

[0009]

Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a schematic sectional view showing an embodiment of a wafer polishing apparatus according to the present invention, and FIG. 2 is a plan view schematically showing the configuration of the embodiment shown in FIG. 1 and 2, the wafer surface is brought into contact with the polishing surface 10a of the polishing platen 10, and the wafer 2
Wafer 20 and polishing platen 10 while applying a predetermined load to 0.
2 shows a mechanism on the side of the polishing platen 10 in a wafer polishing apparatus that performs relative movements of and to polish the wafer surface to a mirror surface. Further, FIG. 3 is a cross-sectional view showing details of the configuration of the polishing platen 10.

The polishing surface plate 10 is provided so as to be divided into a surface plate receiving portion 12 and a surface plate 14 placed on the surface plate receiving portion 12. The surface plate 14 is a surface plate receiving portion 12. It is detachably fixed on the top by suction. That is, the surface plate 14
A vacuum device (not shown) is provided so that the platen receiving part 12 and the platen receiving part 12 can move relative to the wafer 20 integrally.
It is provided so as to be mutually adsorbed by.

The platen 14 has a metal plate or a ceramic plate as a base (hereinafter referred to as a platen body), and a cloth or felt-like cloth, or a sponge or a short-hair brush-like member is fixed to the surface thereof. Composed. Surface plate 14
If is a ceramic plate, the weight can be reduced and the rigidity can be improved. Further, for example, if the platen 14 is a ceramic containing alumina as a main component, the density is about 3.9 g /
cc, which is about half the density of cast iron materials (about 7.9 g / cc). Therefore, the weight can be reduced to about half, and the work of attaching / detaching the surface plate 14 at the time of replacing the cloth can be facilitated. When the surface plate 14 is a ceramic plate as described above, the weight is reduced, so that the function of integrating the surface plate 14 with the surface plate receiving portion 12 is reduced. However,
Since the surface plate 14 is fixed to the surface plate receiving portion 12 by vacuum suction, the surface plate 14 and the surface plate receiving portion 12 can be reliably integrated. By the way, the weight of the surface plate 14 can be reduced by reducing the thickness thereof. The rigidity of the polishing platen 10 depends on both the platen 14 and the platen receiving portion 12, and it may not be necessary for the platen 14 to have a rigidity not lower than a predetermined value.

The platen receiving portion 12 is a two-layer flat plate portion 1.
It is composed of 2a and 12b. Flat plate part 12b
Further, a shaft portion 16 is integrally fixed, and a surface plate receiving portion 12 is formed in which the shaft portion 16 is integrally projected in a direction opposite to a side for receiving the surface plate 14. It is desirable that the material of the platen receiving portion 12 is one that is less likely to be deformed by heat. For example, a low thermal expansion material (for example, a special cast iron material) can be used. The low thermal expansion material has a linear expansion coefficient of 3.0 × 1.
0 ^-6 / K ・ 20-100 ° C or less, and as a more accurate one, the linear expansion coefficient is 1.0 × 10 ^-6 / K ・ 20-10
Those below 0 ° C are known. By using the surface plate receiving portion 12 made of such a material that is less likely to be deformed by heat, the polishing accuracy of the wafer can be improved.
That is, if the surface plate receiving portion 12 is not largely deformed, the surface plate 1
Since 4 is fixed according to the shape of the surface plate receiving portion 12, it is possible to prevent the flatness thereof from being lowered. When the surface plate 14 is a ceramic containing alumina as the main component as described above, the linear expansion coefficient is 7.0 × 10 ⁻⁶ / K · 40−.
Although the temperature is about 500 ° C., the suction action of the vacuum device causes the surface plate 14 to be fixed to the surface plate receiving portion 12 so that the force due to the thermal expansion can be released, so that it does not warp in a bimetal shape. , Flatness does not decrease.

Surface plate 14 of flat plate portion 12a of surface plate receiving portion 12
A groove-shaped vacuum passage 15 for vacuum-sucking the surface plate 14 is formed on the surface on which is mounted. The vacuum passage 15 is formed on the surface of the flat plate portion 12a as shown in FIG. 4, and communicates with a vacuum source (not shown) through the passage 15a of the shaft portion 16. As shown in FIG. 4, the area of the vacuum passage 15 is set to be larger than the area for receiving the surface plate 14 in order to increase the suction force, and the vacuum passage 15 should be formed substantially evenly over the entire surface. Thus, the adsorption force is prevented from being dispersed and the surface plate 14 is deformed. Reference numeral 17 denotes a gasket, which has a V-shaped cross section and is formed in a ring shape. Further, as shown in FIG. 3, when the surface plate 14 is adsorbed to the surface plate receiving portion 12, the airtight seal is provided.

A circulating water passage 13 is formed between the flat plate portion 12b and the flat plate portion 12a so that cooling water can circulate. The circulating water passage 13 communicates with the cooling water supply passage 13a and the cooling water discharge passage 13b which penetrate the shaft portion 16, and the cooling water is supplied and circulated by a cooling water supply source and a cooling water suction device (not shown). Reference numeral 17a denotes a ring-shaped packing, which is the flat plate portion 12
A watertight seal is made between a and the flat plate portion 12b. Flat plate part 1
The circulating water channel 13 provided on the surface of 2b is in the form of a groove as shown in FIG. In this way, the cooling water inlet 13c and the outlet 13d are provided so as to be on opposite sides of the groove, and are formed in a pleated shape so that the cooling water circulates in a directional manner and the cooling water is suitable for the entire surface. This is because it is circulated to improve the cooling efficiency. A trochoid pump, which is a suction device, can be used as the power unit for introducing the cooling water. In the case of suction, there is an advantage that no matter how much the degree of vacuum is raised, only one atmosphere is attained, and the deformation of the polishing platen does not exceed a certain level. However, it goes without saying that a high-pressure flow may be used.

Reference numeral 12c is a pin fixed to the flat plate portion 12a, and is fitted in a concave portion 14a provided in the surface plate 14.
The pin 12c and the recess 14a are plural (in this embodiment, 2
The surface plate 1 for the surface plate receiving portion 12 is provided.
4 is used for positioning. Also, this pin 12c
Also has a role of preventing side slip of the surface plate 14. Surface plate 14
The recess 14a formed in the
S). The reason why the pin 12c is engaged with the surface plate 14 made of ceramics via the SUS material in this manner is to protect the surface plate 14 by dispersing the force applied to the brittle ceramics by the pin 12c.

Reference numeral 22 denotes a support base which supports the polishing platen 10 rotatably about an axis perpendicular to the polishing surface 10a. The shaft portion 16 of the polishing platen 10 is inserted into a through hole 22a that penetrates through the center of the support table 22, and the polishing table 10 is supported by the thrust bearing 23 and the radial bearings 18, 18, 19, and 19. The portion 22 is rotatably supported about its axis.

Reference numeral 25 denotes a rotation driving means, which is a support base 22.
And the polishing platen 10 is rotated about the axis with respect to the support base 22. This rotation driving means 2
Reference numeral 5 denotes a rotary motion motor 24 (see FIG. 2) fixed to the support base 22 and a worm gear 26 fixed to the output shaft of the rotary drive motor 24, as in this embodiment.
And a worm wheel 27 meshed with the worm gear 26 and fixed to the polishing platen 10 side. The worm wheel 27 is connected and fixed by the shaft 16 and the key 28 so as to rotate integrally. Reference numeral 29 denotes a distributor, which is substantially the same as a distributor 92 of the wafer pressing device 40 described later, and supplies cooling water to the circulating channel 13 even when the shaft 16 rotates.
And a vacuum source is provided so as to communicate with the vacuum passage 15.

A base 30 supports the support base 22. The base 30 shown in FIG. 1 is a part of the frame of the main body of the apparatus, and in reality, a support frame (not shown)
It is fixed on the foundation surface. 32 is a circular exercise device,
The support table 22 is caused to make a circular motion that does not rotate with respect to the base 30 within a plane parallel to the polishing surface 10a. This circular motion device 32
Comprises an eccentric arm 34 and a circular motion motor 36 as in this embodiment, for example.

The eccentric arm 34 is parallel to the base-side shaft 35 rotatably provided on the base 30 about an axis parallel to the axis of the polishing platen 10, and the base-side shaft 35. At the same time, a shaft 38 on the support base portion side rotatably provided on the support base portion 22 about an axis decentered by a predetermined distance is integrally formed in a crank shape. Then, an eccentric arm 34 of the same shape in which the eccentric distance L between the base-side shaft 35 and the support-base-side shaft 38 is the same is provided between the base 30 and the support-base 22 as shown in FIG. It is distributed in three places. In the present embodiment, the case where the eccentric arms 34 are arranged at three places has been described. However, the present embodiment is not limited to this, and the eccentric arms 34 are provided at four or more places in order to support the support base 22 on the base 30 with good balance. Of course, they may be arranged.

The circular motion motor 36 synchronously rotates the eccentric arms 34 arranged at least at three positions,
The support base 22 operates as a circular movement driving means for causing the support base 22 to make a circular movement without rotating with respect to the base 30. Circular motion motor 36
Are arranged corresponding to the respective eccentric arms 34, and are fixed to the base 30. The circular motion motor 36 can drive the support base 22 even with one motor 36. Further, the circular movement driving means need not be directly connected to the eccentric arm 34 like a circular movement motor, and needless to say, may be any mechanism capable of suitably rotating the shaft 35 on the base side.

Next, the wafer pressing device 40 will be described with reference to FIG. The wafer pressing device 40 includes:
The wafer 20 is held above the polishing surface plate 10 so that the wafer surface is brought into contact with the polishing surface 10 a of the polishing surface plate 10, and the wafer 20 is pressed against the polishing surface 10 a of the polishing surface plate 10. Reference numeral 50 denotes a holding member, which can hold the wafer 20 on the surface 50a by the surface tension of a liquid such as water (water in this embodiment). The holding member 50 has a ceramic plate as a base material, and is formed by attaching a backing material, which is an elastic material and has an excellent adsorptivity for adsorbing the wafer 20, to the surface of the ceramic plate by adhesion or the like.
The material of the backing material is a microporous sheet made of a polymer material mainly composed of polyurethane.

The template 52 is attached to the surface of the holding member 50 by adhesion. The template 52 is formed in a ring shape, and
To prevent sliding movement of the wafer 20. The inner diameter of the template 52 is set so that the side slip of the wafer 20 is suppressed and the wafer 20 is easily fitted inside. Further, the thickness is set to about two thirds of the thickness of the wafer 20. Note that the template 52 may be mounted in a fitting manner.

Reference numeral 53 is a concave portion, which is open downward. Numeral 54 denotes a plate-shaped elastic member, which is formed in a donut-shaped flat plate shape by, for example, a hard rubber plate material, and has an outer peripheral portion fixed to an outer peripheral step on the inner upper surface of the concave portion 53 and an inner peripheral portion of the holding member 50. The holding member 50 is fixed to the upper surface.
Is vertically suspended within a very small range in the vertical and horizontal directions. Reference numeral 55 is a pressure chamber, and the recess 53 is defined by the holding member 50 and the plate-shaped elastic member 54. A fluid having a predetermined pressure can be supplied into the pressure chamber 55 by a fluid supply means (not shown).

Further, reference numeral 62 is a main shaft, which is formed in a cylindrical shape, and a tube 64 which communicates with a compressed air source (not shown) which is a high pressure fluid source is inserted in the cylindrical shape. This tube 64
Communicates with the pressure chamber 55, and when compressed air is introduced into the pressure chamber 55 when the surface of the wafer 20 is brought into contact with the polishing surface 10a of the polishing platen 10 (see FIG. 1). ,
A uniform pressure is applied to substantially the entire upper surface of the holding member 50. As a result, the polished surface 10 a
Can be pressed. At this time, since the compressed air filled in the pressure chamber 55 is a fluid (air in this embodiment), the entire surface of the holding member 50 is pressed evenly and the wafer 20 is pressed.
Can quickly follow the inclination of the polishing surface 10a.

Reference numeral 66 denotes a base member, which is movably provided so as to supply the wafer 20 held by the holding member 50 onto the polishing surface 10a and discharge it from the polishing surface 10a. Further, the wafer holding section 42 fixed to the tip of the main shaft 62 is rotatably supported via the main shaft 62 and the like.

Reference numeral 68 denotes a locking portion, which is provided on the upper portion of the main shaft 62 and has a smaller diameter than the lower side. The locking portion 68 is locked to the arm portion 74 fixed to the rod 72 of the cylinder device 70 via bearing portions 76 and 76 that bear in both the rotational and thrust directions. Also,
The main shaft 62 provided integrally with the wafer holding portion 42 includes:
It is inserted into a rotation transmission member 80 rotatably provided to the base member 66 via rotary bearings 78. The rotary bearings 78 are mounted in an upright cylindrical portion 82 integrally fixed to the base member 66. The rotation transmitting member 80 and the main shaft 62 are linked by a key 84 fixed on the main shaft 62 side facing a key groove 81 provided on the rotation transmitting member 80 side. Therefore, the rotation transmitting member 80 and the main shaft 62 integrally rotate. Further, since the keyway 81 is provided to be long in the axial direction, which is the longitudinal direction, the main shaft 62 can be moved up and down with respect to the base member 66 within a predetermined range by the cylinder device 70. In addition, in FIG. 3, the wafer holder 42 is a cylinder device 7.
The state has been moved upward by 0. Reference numeral 86 denotes a drive motor, which rotates a rotation transmission member 80 connected via a key 91 with the driven gear 90 via a pinion gear 88 and a driven gear 90. The rotation transmitting member 80 is provided between the rotation bearing 7 and the base member 66.
8, 78, it is provided rotatable with respect to the base member 66.

Reference numeral 92 is a distributor section, which is a connection port section for communicating with the compressed air source. The tip portion 62 of the main shaft 62 fitted in the distributor portion 92
a so that the tip 62a can rotate. A communication passage 94 communicates with the pipe 64. Further, 96 is a seal member, and these seal members 96, 9
6 to form a ring-shaped space 97 around the entire circumference, and a high-pressure source connection port 98 is provided in communication with the ring-shaped space 97. For this reason, the tip portion 62a
Rotates, the compressed air source remains at the high pressure source connection port 98,
It can always communicate with the pressure chamber 55 through the ring-shaped space 97, the communication passage 94, and the pipe 64. An encoder device 100 detects the rotational position of the main shaft 62 and functions as a detection device of a fixed position stop device that stops the wafer holding unit 42 at a predetermined position.

According to the wafer polishing apparatus having the above-described movement mechanism, the polishing platen 10 is moved circularly without rotating the support base 22 by the plurality of eccentric arms 34 (this circular movement that does not rotate). , Which will be simply referred to as a circular motion below) and a motion of rotating (spinning) with respect to the support base 22. On the side of the wafer pressing device 40, the wafer holding unit 42 moves so as to rotate (rotate) the wafer 20. The circular motion is different from the rotary motion, in that any point on the polishing platen 10 generates the same speed, and any point on the wafer 20 can be polished under the same conditions. Therefore, the surface of the wafer 20 can be polished very uniformly and accurately. When the other conditions are the same, the flatness of 0.5 μm for an 8-inch silicon wafer in the conventional wafer polishing apparatus is easily 0.2 μm or less in the wafer polishing apparatus of the present invention. I got it. Also, because it can be uniformly polished in this way,
The wear of the cloth itself constituting the polishing surface of the polishing platen 10 is made uniform, the adjustment work of the polishing platen 10 can be simplified, and the polishing work can be made efficient.

The wafer polishing apparatus described above uses the holding member 50 to which the backing material is adhered as the ceramic plate of the wafer pressing apparatus.
This is because ceramics have a smaller coefficient of linear expansion and are less likely to be deformed than metal materials, and are therefore effective for uniformly and accurately polishing the wafer 20, but instead of ceramic plates, metal materials or resin materials are used. Of course, a plate made of Further, the holding member is not limited to a plate-shaped member that is not easily deformed, and includes a thin-film member formed of an elastic member. Even with such a holding member, it is possible to bring the wafer 20 into contact with the polishing surface 10a with a uniform pressure via the liquid pressure.

The wafer holder 42 holds the wafer 20 by pasting the wafer 20 onto the holding member 50 with water.
However, the present invention is not limited to this, and may have another configuration. For example, supply and discharge while holding the wafer 20 by suction,
In actual polishing, the wafer 20 is not sucked.
May be used as the wafer holding unit 42 that presses the wafer. In the embodiment described above, the case where the wafer 20 is pressed against the polishing surface by the compressed air via the holding member 50 has been described. However, other fluid pressure, for example, water pressure or oil pressure can be used. Further, when the holding member 50 is provided in a large size so as to hold a plurality of wafers 20,
A plurality of holes into which the wafers 20 are fitted are provided in the template 52, and the plurality of wafers 20 can be polished simultaneously.

In the above embodiments, the case where the polishing platen is applied to the wafer polishing apparatus which rotates about the central axis thereof and also has the above-mentioned circular motion to prevent uneven polishing of the wafer has been described. However, the present invention is not limited to this, and in terms of reducing the weight of the platen and facilitating the replacement work thereof, the platen is rotated and linearly reciprocated (oscillated) to uniformly polish the wafer. Of course, it can be suitably applied to a wafer polishing apparatus provided with a moving mechanism. As described above, various preferred embodiments of the present invention have been described. However, the present invention is not limited to these embodiments, and it goes without saying that many more modifications can be made without departing from the spirit of the invention. That is.

[0032]

According to the wafer polishing apparatus of the present invention,
The polishing surface plate and the surface plate receiving portion can be detachably attached to each other by a vacuum device so that the surface plate and the surface plate receiving portion can move relative to the wafer integrally. Therefore, according to the present invention, the flatness of the surface plate main body can be preferably maintained as it is, and the surface plate can be securely fixed to the surface plate receiving portion. It has a remarkable effect that the work of attaching and detaching the surface plate can be easily performed when re-installing.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a wafer polishing apparatus according to the present invention.

FIG. 2 is a schematic plan view of the embodiment of FIG.

FIG. 3 is a cross-sectional view showing details of a polishing platen according to the embodiment of FIG.

FIG. 4 is a plan view showing one form of the vacuum passage of the embodiment of FIG.

5 is a plan view showing one form of the circulating water channel of the embodiment of FIG. 1. FIG.

FIG. 6 is a cross-sectional view of a wafer pressing device used in the wafer polishing apparatus according to the present invention.

[Explanation of symbols]

 10 polishing surface plate 10a polishing surface 12 surface plate receiving portion 12a flat plate portion 12b flat plate portion 12c pin 13 circulating water channel 14 surface plate 14a recessed portion 15 vacuum passage 16 shaft portion 20 wafer 22 support base portion 24 rotation drive motor 25 rotation drive means 26 Worm gear 27 Worm wheel 30 Base 32 Circular movement device 34 Eccentric arm 35 Base side shaft 36 Circular movement motor 38 Support base side shaft 40 Wafer pressing device

 ─────────────────────────────────────────────────── --- Continuation of the front page (72) Inventor Fukushima Government Law 1650 Kiyono, Matsushiro-cho, Nagano City, Nagano Prefecture Fujikoshi Machine Industry Co., Ltd.

Claims (3)

[Claims] 1. A wafer polishing apparatus for polishing a wafer surface by bringing a wafer surface into contact with a polishing surface of a polishing surface plate and relatively moving the wafer and the polishing surface plate while applying a predetermined load to the wafer. In the above, the polishing surface plate includes a surface plate provided with a polishing surface and a surface plate receiving portion that receives and supports the surface plate, and the surface plate and the surface plate receiving portion are integrated with each other. A wafer polishing apparatus comprising a vacuum device for adhering a polishing platen and a platen receiving portion to each other so as to be able to move relative to the wafer. 2. The platen is characterized in that a member constituting a polishing surface such as cloth or felt-like cloth is fixedly provided on the surface of a platen body made of a ceramic plate. Item 2. A wafer polishing apparatus according to Item 1. 3. A support base portion that supports the surface plate and the surface plate receiving portion, which are integrally adsorbed to each other, rotatably about an axis perpendicular to the polishing surface of the surface plate, and the support base portion. A rotation driving means for rotating the surface plate around the axis with respect to a support base, a base for supporting the support base, and the polishing for polishing the support base with respect to the base. 3. A polishing apparatus for a wafer according to claim 1, further comprising a circular motion device for performing a circular motion that does not rotate in a plane parallel to the plane.