JPH09286032A - Curing of molded product - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce a flaw free molded product by more strictly measuring and controlling a mold curing process. SOLUTION: The signal outputted from the sensor such as the molded product embedding type sensor 5 attached to a mold curing apparatus is taken in an operator within a real time to be subjected to operation and a signal controlling a curing process is outputted on the basis of the operation result and the curing process is controlled by a control means 13 charging the curing control material arranged in the mold curing apparatus in a resin.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a method for curing a molded article.

[0002]

2. Description of the Related Art Molded products such as molded electromagnetic coils, GIS mold spacers, and integrated circuit packages are manufactured using resins such as epoxy resin and polyester resin. The method of curing these molded products manages the curing process by measuring the physical quantity of the resin with a sensor attached to the mold.

[0003]

It takes a long time to cure a molded product, and it is essential to shorten the time. In order to shorten the curing time, it is necessary to control the temperature of each resin portion injected into the mold and various physical quantities in detail. The present invention provides a method for curing a molded product that enables detailed management of various physical quantities of each resin part.

[0004]

The present invention can solve the problems by controlling the curing process by using various molded product embedded sensors that measure the physical quantity inside the cured resin in real time.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.
This will be described in detail with reference to the drawings.

FIG. 1 is a diagram showing the overall flow of the present invention, particularly a method of curing a molded product. Inside the metal mold 2 mainly made of metal, there is formed a resin product 3 to be cured including an insert material 4 made of one or several metal / resin molded products. The mold resin embedded type sensors 5 installed at one or a plurality of locations of the curing device including the resin product 3 and the mold 2 are connected to the measurement system 6 via the information transmission means. An input buffer 7, a trigger signal generator 9, a program ROM 10, a RAM 11, and an output buffer 12 are connected to the CPU 8. Curing device controller 13
Is connected to the mold 2 or the resin product 3, and the curing process is also controlled by the rupture of the capsule 14 containing the curing control material mixed in the resin product 3. A signal is output from the trigger signal generator 9 at regular intervals (for example, one minute intervals). When the signal from the trigger signal generator 9 is input to the CPU 8, the CPU 8 takes in the data accumulated in the input buffer 7. Now, the measurement system 6 receives in real time the signals output from the sensors 5 installed at one or a plurality of locations on the surface or inside of the mold 2 and the resin product 3, and the measurement system 6 further inputs the signals. It is designed to output to. When the data stored in the input buffer 7 is taken in, the CPU 8 performs an operation based on the data in the program RAM 11 in the program ROM 10 given in advance, and outputs the operation result to the output buffer 12. The calculation result input to the output buffer 12 is output as a signal to the curing device controller 13, and the curing device controller 13 sequentially controls the mold 2 and the resin product 3 based on the signal. The above-mentioned series of processes sends the signal from the trigger signal generator 9 to the CPU 8
It happens when you become aware of it.

FIG. 2 shows the connection between the mold resin and the mold to be cured inside the mold and the sensor. A mold embedded surface sensor 64 and a mold resin surface adhesive sensor 6 in the mold resin 62 and the mold 63 to be cured.
5. A molded product embedded sensor 66 is installed, and a thermometer, a dielectric constant meter, an AE, a mold are provided through a cable, an optical fiber, and a waveguide 68 that extend to the outside of the mold through a sensor outlet 67 and the like. It is connected to one or more of the process monitors 69. Mold embedded surface sensor 64
Type is mainly a mold temperature sensor, and the mold resin surface adhesion sensor 65 type is mainly a strain stress sensor,
There is a dielectric constant sensor, and the type of the molded product embedded sensor 66 is a sensor which is used by being embedded in a molded product at a place where an electric field is small, and mainly includes a resin temperature sensor, a strain stress sensor, and a resin viscosity sensor.

FIG. 3 shows various curing device controllers and curing methods. A resin injection pressure / speed controller 73 is attached to the resin injection port 72, and a mold temperature controller 74 is attached to the mold 63. Capsules 75 containing a curing control agent are mixed in the mold resin 62 at a constant ratio in each part of the mold resin 62 at a uniform density. The resin injection pressure / speed control controller 73 controls the pressure applied to the mold resin 62 by controlling the resin injection pressure / speed, and the mold temperature controller 74 indirectly controls the mold resin 62 by controlling the mold temperature. Control the temperature of. The capsule 75 has a melting point at a temperature equal to or higher than the temperature of the resin at the start of curing, and the capsule 75 bursts when the temperature of the resin rises. When the capsule 75 is ruptured, the curing control agent is uniformly introduced into the mold resin 62 to control the curing reaction rate.

FIG. 4 is a diagram showing a measuring method and an inputting method of data stored in the RAM 11 as initial condition data. One or several metal / resin molding is performed inside the metal mold 2 mainly made of metal. The resin product 3 to be cured includes an insert material 4 made of a product or the like. Sensors 5 installed at one or more locations of the curing device including resin and mold
Is connected to the measurement system 6 via the information transmission means.
The CPU 8 includes an input buffer 7, a trigger signal generator 9,
A program ROM 10 and a RAM 11 are connected.
In the method of measuring the data stored in the RAM 11, the measurement program 82 stored in the program ROM 10 is set to the execution state 84, then the power of the measurement system 6 is turned on, and finally the resin is injected into the mold. Then, the mold curing process is started, and the recording control 85 is performed on the RAM 11 for the data input from the measurement system 6 measured by the measurement program 82 until the end of the mold curing. Repeat the curing process several times. With respect to the measurement data for several times (for example, five times), the calculation is performed by the processing program using the measurement data as input data, and the calculation result 83 is stored in the RAM 11 as the initial condition data.

FIG. 5 shows an example of a resin-embedded sensor.
A two-path FF type optical fiber temperature sensor and its installation method were shown. (A) is a block diagram of a two-path type FF type optical fiber temperature sensor, in which the optical fiber for measurement 92 and the optical fiber for reference signal 93 are extended from the light source unit 94 to the outside, and the optical fiber for reference signal 93 is shown. Is connected to the light receiving unit 96 as it is, and the measuring optical fiber 92 is connected to the light receiving unit 96 after being folded back at the temperature measuring unit 95, and the measuring optical fiber 9 for the round trip to and from the temperature measuring unit 95.
2 are bundled and coated on the outside. The measurement optical fiber 92 and the reference signal optical fiber 93 are made of the same material, and the cores (optical transmission section) 115 and the cladding (light reflection section) 11 of the optical fiber are used as the configuration.
For glass 4, glass and glass were used. The light source unit 94 includes the laser source 10
0, a half mirror 101, and a mirror 102, and the laser light emitted from the laser source 100 is a half mirror 10.
1 is split into two paths, one of which is transmitted through the half mirror 101 and input to the reference signal optical fiber 93 (path A), and the other is reflected by the half mirror 101 and further reflected by the mirror 102 to be used as the measurement optical fiber. Input to 92 (route B). At this point, the phases of the laser lights on the paths A and B are the same. When the laser light on the path B reaches the temperature measuring unit 95, the laser beam detects the temperature of the temperature measuring unit 95 and causes a phase shift. The light receiving unit 96 includes a mirror 103, a half mirror 104, and an optical phase interferometer 105. The output (path A) from the reference signal optical fiber 93 is the mirror 10.
The light is reflected by 3 and is further reflected by the half mirror 104 to be input to the optical phase interferometer 105, while the output (path B) from the measurement optical fiber 92 is transmitted through the half mirror 104 and input to the optical phase interferometer 105. At this time point, the phase of the laser light on the path B is shifted by the temperature measuring unit 95, and therefore the phases of the laser light on the path A and the laser light on the path B are generally different, and optical interference appears in the optical phase interferometer 105. The interference pattern of light depends only on the temperature of the temperature measuring unit 95, and the optical phase interferometer 105 outputs the temperature value 106 of the temperature measuring unit 95. (b) shows how to install the two-path FF type optical fiber temperature sensor when measuring the internal resin temperature during the mold curing process. The appearance of the two-path type FF type optical fiber temperature sensor is such that the module 113 in which the light source unit 94 and the light receiving unit 96 are integrated, and the reciprocating portion of the measuring optical fiber 92 from the module 113 are bundled to cover the outside. Optical fiber cable 11
2. The temperature measuring unit 95 is configured to include the measuring optical fiber 91 at the tip of the optical fiber cable 112. The installation method is the temperature measuring unit 95 before pouring the resin.
When the resin 110 is inserted into the mold 111 from the hole of the mold 111 and the resin 110 flows into the mold 111, the resin 1
It is installed so as to be buried inside 10. When the resin 110 is injected into the mold 111 and the curing process is started, the temperature value 106 is output from the module 113 and transmitted to the measurement system in real time.

FIG. 6 shows an example of a resin-embedded sensor.
It shows a spectrum temperature sensor using a polysilane fiber and its installation method. (A) is a block diagram of the spectrum temperature sensor using the polysilane fiber, the measurement polysilane fiber 122 and the reference signal polysilane fiber 123 are extended from the light source unit 116 to the outside, and the reference signal polysilane fiber 123 is The measurement polysilane fiber 122 is directly connected to the light receiving unit 118, is folded back at the temperature measuring unit 117, and then is connected to the light receiving unit 118. The outside is covered. Light source unit 11
6 includes a mixed color light source 119, a half mirror 120, and a mirror 121. The mixed color light emitted from the mixed color light source is split into two paths by the half mirror 120, and one is transmitted through the half mirror 120 to be used as a reference signal. Input to the polysilane fiber 123 (path A), the other half mirror 12
The light is reflected at 0, further reflected by the mirror 121, and input to the measuring polysilane fiber 122 (path B). At this point, the wavelength peak height spectra of the mixed color light input to the paths A and B are the same. The mixed color light input to the polysilane fiber in both (path A) and (path B) is transmitted through the polysilane fiber due to repeated absorption and emission of silicon contained in the polysilane fiber. Temperature measuring unit 117
Since the light absorption / emission spectrum of silicon contained in the polysilane fiber changes depending on the temperature of (a), the wavelength peak height spectrum temperature measuring device 124 in the light receiving unit 118 is input from (path A) and (path B). Since a difference appears in the wavelength peak height spectrum, the wavelength peak height spectrum temperature measuring device 124 converts the difference in the wavelength peak height spectrum into a temperature value 125 and outputs it. Here, the measurement polysilane fiber 122 and the reference signal polysilane fiber 1
As the material of 23, the main complex of silicon Si is an organic polymer group P
The polysilane 126 in which is bonded is used. (b) shows an installation method of a spectrum temperature sensor using a polysilane fiber when measuring the resin internal temperature during the mold curing process. The appearance of the spectrum temperature sensor using the polysilane fiber is the module 12 in which the light source unit 116 and the light receiving unit 118 are integrated.
7. Module 12 of measuring polysilane fiber 122
7, the polysilane fiber cable 128, which is bundled with the round trip portion from 7 and is coated on the outside, and the polysilane fiber 122 for measurement is attached to the tip of the polysilane fiber cable 128.
Is configured to include a temperature measuring unit 117.
Before the resin is poured, the temperature measuring unit 117 is inserted into the mold 129 from the holed portion of the mold 129, and when the resin 130 flows into the mold 129, the resin 130 is installed.
Install it so that it is buried inside. Resin 130 mold 1
When it is injected into 29 and the curing process is started, the temperature value 125 is output from the module 127 and is transmitted to the measurement system in real time.

FIG. 7 shows the results of calculation of the type of foreign matter (sensor end) and the distribution of equipotential lines using electromagnetic field analysis software. Software is also used as an actual product design tool for electric power equipment, and it has been proved that the reliability of analysis results is considerably high.
(a) is a sectional view showing the positions of the resin mold coil and the foreign matter (sensor end) 133 of the target analysis model. There is a mold resin 132 that has been impregnated and cured around the coil 131 that is an insert material, and the coil 1 in the mold resin 132
A foreign substance (sensor end) 133 on the line is present near the 31st corner. A positive DC potential of V (kv) is applied to the coil, and the coil 13 has a cross section outside the molding resin 122 (dielectric constant E1).
1. There is a ground electrode at a position similar to 1 and having a similarity ratio of 1: 2 to 3, and 1 / 3L from the corner of the coil 131 (L: coil 1
It was assumed that the foreign substance (sensor end) 133 was located at the position of the long side of 31 and the potential distribution was analyzed. Coil 1
Regarding the 31 corners and the vicinity 134 of the foreign matter (sensor end) 133, the analysis result when the foreign matter (sensor end) 133 is the metal electric wire 135 is (b), and the foreign matter (sensor end) 133 is the optical fiber 136. The analysis result is (c). (B)
It is clear from the comparison between (c) and (c) that the equipotential line is disturbed by the presence of the metal electric wire 135 in (b), while the radius is about twice the radius of the optical fiber 136 in (c). Outside the concentric circle that shares the center with the central axis of the optical fiber 136, the equipotential lines have the same equipotential line distribution as when the optical fiber 136 does not exist. It turns out that even if it exists, it is not disturbed. Based on the above analysis results, as shown in (d), after the resin 139 is cured in a state where the sensor end including the temperature measuring unit 137 and the optical fiber cable 138 is embedded in the resin 139, (e) is obtained. Resin 139 as shown
Of product 141 consisting of and optical fiber cable 138
The optical fiber cable 138 was cut at the intersection point 142 to complete the product 141. (B) shows a method of installing a spectrum temperature sensor using a polysilane fiber when measuring the resin internal temperature during the mold curing process. The appearance of the spectrum temperature sensor using the polysilane fiber is such that the module 127 in which the light source unit 116 and the light receiving unit 118 are integrated, and the round trip portion from the module 127 of the polysilane fiber 122 for measurement are bundled to cover the outside. The polysilane fiber cable 128 and the temperature measuring unit 117 that encloses the measuring polysilane fiber 122 at the tip of the polysilane fiber cable 128 are configured. The installation method is such that before the resin is poured, the temperature measuring unit 117 is inserted into the mold 129 from the holed portion of the mold 129 so that when the resin 130 flows into the mold 129, it is buried inside the resin 130. To install. When the resin 130 is injected into the mold 129 and the curing process is started, the temperature value 125 is output from the module 127 and transmitted to the measurement system in real time.

FIG. 8 shows an example of a resin-embedded sensor.
The appearance, electrode shape and installation method of the resin viscosity sensor that measures the capacitance of each part of the resin were described. In the resin viscosity sensor, the measurement module 151 and the measurement unit 152 are connected via the electric wire 153. The measuring unit 152 has a parallel electrode 15
8 is attached. One parallel electrode 158 is 5 mm
The size is × 10 mm, and the distance between the electrode plates is 3 mm. AC power supply 1
By applying 54 Hz / 100 V by 54, the variable capacitor 155 is adjusted, and the resistor 157, the coil 156, the variable capacitor 155, and the parallel electrode 15 are adjusted.
The capacitance of the parallel electrode 158 is derived from the capacitance of the variable capacitor 155 when resonance occurs in the closed circuit of No. 8. As the electrode for the measuring unit 152,
It was confirmed that the cylindrical electrode 160 and the conductive core 159 could be used. The appearance of the resin viscosity sensor is the measurement module 1
The cable 163 is formed by bundling the electric wires 153 connecting the measuring module 151 and the measuring unit 152, and the electric wire 153 connecting the measuring module 151 and the measuring unit 152. As for the installation method, before pouring the resin, the measuring unit 152 is installed at the position where the capacitance is to be measured, and the cable 163 is discharged from the lead-out portion of the mold 162 to the outside. When the resin 161 is injected after the installation of the measurement unit 152 is completed, the measurement unit 1
Resin 161 is filled between 52 parallel electrodes 158,
It is possible to measure the capacitance of the resin 161 between the parallel electrodes 158. During curing of the resin 161, the variable capacitor 155 was adjusted to cause resonance in the closed circuit of the resistor 157, the coil 156, the variable capacitor 155, and the parallel electrode 158, and the capacitance of the resin 161 at that time was measured. After curing, die 162 to finished product 164
Then, the cable 163 protruding outward from the finished product 164 was cut along the outer surface 165 of the finished product 164.

FIG. 9 shows details of the electrodes used in the resin viscosity sensor. An electric wire 172 extends from the electrode 171 and is connected to the measurement system. By bending the end portion 173 of the electrode 171 inwardly by 20 to 30 degrees over all sides, the resin flowing between the electrodes 171 at the time of resin injection is securely fixed between the electrodes 171 as the curing progresses, and further externally. Electrode 171 produced by the presence of electrode 171 in an electric field
In order to cope with the electric field concentration near the end portion 173, a high dielectric constant ceramic 174 is baked on the bent end portion 173 so as to cover the entire bent portion to prevent electric breakdown due to electric field concentration. The electrode 171 processed as described above is embedded in a finished product of a molded product, and can sufficiently withstand use in an environment to which an electric field is applied.

[0015]

According to the present invention, since a permanent mold embedded sensor is used, the curing process can be strictly measured, and the process of removing the sensor from the finished product can be omitted, so that the manufacturing process can be simplified. As a material for the sensor end, a material having a dielectric constant close to that of a resin is used, or a processed material that can withstand use in an electric field is embedded in the sensor end, so that the electrical characteristics of the finished product are not deteriorated.

The curing control agent is injected into the resin by bursting the capsule containing the curing control agent mixed in the resin during the curing process by an external factor, so that the curing is performed uniformly without being biased to the part of the molded product. You can proceed,
It is possible to manufacture a finished product that is electrically and mechanically highly resistant.

[Brief description of drawings]

FIG. 1 is a block diagram showing a method for curing a molded product according to the present invention.

FIG. 2 is an explanatory view of a molded product to be cured inside a mold and a connection form between the mold and a sensor.

FIG. 3 is an explanatory diagram of a curing device controller and a curing method.

FIG. 4 is an explanatory diagram showing an input method of data stored in a RAM 11.

FIG. 5 is an explanatory diagram showing a two-path FF type optical fiber temperature sensor and a method of installing the same.

FIG. 6 is an explanatory view showing a polysilane fiber temperature sensor and a method of installing the temperature sensor.

FIG. 7 is an explanatory diagram showing the relationship between the type of foreign matter (sensor end) and the distribution of equipotential lines.

FIG. 8 is an explanatory view showing the appearance of a resin viscosity sensor, the shape of electrodes, and the installation method.

FIG. 9 is an explanatory diagram of electrodes of a resin viscosity sensor.

[Explanation of symbols]

 5 ... Sensor, 13 ... Curing device controller.

Claims (5)

[Claims] 1. A time series of a resin curing process,
While the resin is being cured using the molded product embedded sensor,
A method for curing a molded article, which comprises controlling a curing process by measuring a physical quantity of each part of the resin and incorporating the control system. 2. An optical system material fiber made of a silicon compound is used as a measuring medium, a measuring section is embedded in an arbitrary position of a molded article to be cured, and light is used as a probe to measure and control the temperature. Method for curing molded products. 3. An optical fiber made of an organic polymer compound is used as a measuring medium, a measuring section is embedded at an arbitrary position in a molding object to be cured, and light is used as a probe to measure and control the temperature. A method for curing the described molded article. 4. An electrode sensor end obtained by processing a conductive electrode is embedded in one or more molded articles to be cured, and the capacitance of the resin existing between the electrodes is measured to determine the viscosity of the resin. The method for curing a molded product according to claim 1, which is derived and controlled. 5. The method for curing a molded article according to claim 1, wherein the elements uniformly mixed in the resin are controlled by an external factor to control the curing process.