JPH09285007A - Circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit device of a simple structure which makes it possible to achieve miniaturizing and reduction in production cost. SOLUTION: DC input terminal blocks 21, 22 which supply a DC power to semiconductor elements 12a, 12b (not shown in figure), 12c, 13, 14, are provided above the semiconductor elements 12a, 12b, 12c near an opposed space formed between the semiconductor elements 12a, 12b, 12c and semiconductor devices 3, 4. The securing stand of circuit breakers 36, 37 are mounted on the DC input terminal blocks 21, 22. By supplying a DC power from the common DC input terminal blocks 21, 22 to the semiconductor elements 12a, 12b, 12c, 13, 14, wiring is simplified compared with the wiring to each element. Also, reduction in total conducting sectional area enables the device to be miniaturized and the production cost to be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit device, and more particularly to a device using the circuit device for a control device for an electric vehicle.

[0002]

2. Description of the Related Art Conventionally, when a circuit device requiring a plurality of semiconductor devices is mounted on a common cooler, for example, a terminal block and a circuit breaker are fixed near a DC power input portion on the semiconductor device mounting surface. A base or the like is provided, and wiring is branched from each to each semiconductor device to supply power to each semiconductor device.

[0003]

Each semiconductor device of the conventional circuit device as described above requires individual plus and minus power wirings. Since it is necessary to check the margin of the current-carrying capacity of each power wiring in accordance with the power supplied to each semiconductor device, the total current-carrying cross-sectional area of each wiring becomes large, making it difficult to reduce the size and cost. In addition, the circuit breaker is generally mounted directly on the mounting surface of the cooler via a fixing base, and if a fuse having a fusing property is used for the circuit breaker, in order to facilitate maintainability, No other component can be mounted above the circuit breaker.
Therefore, there is a problem that it is difficult to reduce the semiconductor device mounting area of the cooler, and it is difficult to reduce the size of the circuit device.

The present invention has been made to solve such a problem, and an object of the present invention is to provide a circuit device which can be downsized and reduced in cost with a simple structure. Another object of the present invention is to provide an electric vehicle control device that can be downsized and reduced in cost with a simple configuration.

[0005]

According to the circuit device of claim 1 of the present invention, a common DC input terminal member is provided in a space facing the first semiconductor device and the second semiconductor device and in the vicinity thereof. By supplying electric power to the first semiconductor device and the second semiconductor device, it is possible to reduce the number of wiring points to the further subdivided device elements constituting each semiconductor device. Further, since the energization cross-sectional area of the DC input terminal member is smaller than the total energization cross-sectional area individually wired in consideration of the margin of the energization capacity for each device element, the space required for wiring is reduced. Therefore, it is possible to simplify the wiring, reduce the size and weight of the circuit device as a whole, and reduce the cost.

According to the second aspect of the present invention, since the circuit breaker can be mounted above the DC input terminal member, the mounting space for the circuit breaker on the semiconductor device mounting surface becomes unnecessary. Therefore, it is possible to further reduce the size of the circuit device. According to the third aspect of the circuit device of the present invention, the first semiconductor device and the second semiconductor device are slightly increased by slightly increasing the current-carrying cross-sectional area in consideration of the margin of the power supplied to the first semiconductor device. Can be powered.

According to the fourth aspect of the present invention, it is possible to reduce the size and cost of the electric vehicle control device with a simple configuration.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 showing an embodiment in which the circuit device of the present invention is applied to a control device for an electric vehicle.
And FIG. A refrigerant passage (not shown) is provided in the cooling plate 5 of the circuit device 1 shown in FIG. 1, and the electric components mounted on the cooling plate 5 are cooled by the refrigerant introduced into and discharged from the cooling plate 5. On the first mounting surface 5a of the cooling plate 5, semiconductor elements 12a, 12b, 12c constituting a semiconductor device 2 as a first semiconductor device for controlling a driving motor 11 (see FIG. 3) of an electric vehicle are attached. There is.
On the second mounting surface 5b adjacent to the first mounting surface 5a, the semiconductor elements 13 and 14 forming the second semiconductor device are mounted. The semiconductor element 13 constitutes the semiconductor device 3, and the semiconductor element 14 constitutes the semiconductor device 4. The cooling plate 5 is for radiating heat generated when the semiconductor elements 12a, 12b, 12c, 13, 14 are driven. In the vicinity of the facing space formed between the semiconductor elements 12a, 12b and 12c and the semiconductor elements 13 and 14, DC input terminal plates 21 and 22 as DC input terminal members are arranged as shown in FIG. There is.

As shown in FIG. 3, semiconductor elements 12a, 1
Reference numerals 2b and 12c are semiconductor switching elements that form a known inverter circuit that converts direct-current power from the on-vehicle battery 15 into three-phase alternating-current power and controls the drive motor 11 of the electric vehicle. The semiconductor elements 13 and 14 are switching elements that configure the semiconductor devices 3 and 4 that supply power to the other loads 16 and 17, respectively. The semiconductor elements 13 and 14 have lower driving power than the semiconductor elements 12a, 12b, and 12c. In this embodiment, an IGBT module is assumed as each semiconductor element.

The DC input terminal plates 21 and 22 are semiconductor elements 1
DC power is supplied to 2a, 12b, 12c, 13 and 14, and the semiconductor element 1 in the vicinity of the facing space described above is provided.
It is arranged above the 2a, 12b, and 12c. The wiring length is shortened by disposing the DC input terminal plates 21 and 22 closer to the semiconductor elements 12a, 12b, and 12c as the first semiconductor device having a larger amount of power supply than the semiconductor devices 3 and 4. This is to reduce power loss. DC power is supplied from the vehicle-mounted battery 15 to the DC input terminal plates 21 and 22. As shown in FIG. 1, the DC input terminal plate 21 on the negative electrode side has a branch terminal 2 on the negative electrode side.
3, 25 and 27 are respectively connected, and the positive electrode side DC input terminal plate 22 is connected to the positive electrode side branch terminals 24, 26a,
28a is electrically connected. Branch terminals 23, 2
4, 25, 26a, 27, 28a are DC input terminal plates 2
It may be formed integrally with the first and the second terminals 22 or may be formed separately from the DC input terminal plates 21 and 22 and connected by screws. The circuit breakers 36 and 37 are fixed to an insulating fixing base 38 serving as a fixing member, and the fixing base 38 is fixed by a screw (not shown) to the DC input terminal board 21.
It is fixed to.

The branch terminal 23 on the negative electrode side and the branch terminal 24 on the positive electrode side are respectively semiconductor elements 12a, 12b and 12c.
Is directly electrically connected to. Branch terminal 2 on the negative electrode side
5 and 27 are directly electrically connected to the semiconductor elements 13 and 14, but the positive branch terminals 26a and 28a are connected to the positive branch terminals 26b and 28b via the circuit breakers 36 and 37.
Is electrically connected to the semiconductor elements 13 and 14 to supply DC power.

In FIGS. 1 and 2, the semiconductor element 12 is shown.
AC wiring and semiconductor elements 12a, 12b, 12c, 1 for supplying electric power from the output terminals of a, 12b, 12c, 13 and 14 to the driving motor 11 and the loads 16 and 17.
A control circuit board for controlling the driving of 3 and 14 is not shown. It is also possible to additionally mount a plurality of semiconductor devices as other semiconductor devices mounted on the second mounting surface 5b. In this embodiment, the circuit breakers 36, 37
As a fuse is assumed.

Next, the operation of the circuit device 1 will be described.
The DC power of the on-vehicle battery 15 is the semiconductor elements 12a, 12
In b and 12c, it is converted into AC power by high frequency switching and supplied to the drive motor 11. Semiconductor device 13,
14 also carries out high frequency switching of the DC power of the on-vehicle battery 15 to convert it into AC power and supplies it to the loads 16 and 17. Fluctuations in current and voltage that occur when the semiconductor elements 12a, 12b, 12c, 13 and 14 perform high-frequency switching of DC power are caused by the power supply smoothing capacitors 31, 32, and 3.
Smoothed and stabilized by 3, 34. Further, in the case where the semiconductor elements 12a, 12b, 12c, 13, 14 are short-circuited, they are arranged near the circuit breakers 36, 37 and the vehicle battery 15 in order to protect the DC input terminal plates 21, 22 and each branch terminal. The circuit breaker 39 and the circuit breaker cut off the circuit to stop the supply of DC power to each semiconductor element.

In the above-described embodiment of the present invention described above, since power is supplied to each semiconductor element from the common DC input terminal plates 21 and 22, each semiconductor element is individually considered in consideration of the margin of the current-carrying capacity. The current-carrying cross-sectional area of the DC input terminal member in consideration of the margin is smaller than the total current-carrying cross-sectional area of the wiring. This is because the power consumption of all the semiconductor elements does not peak at the same time, and the conduction cross-sectional areas of the DC input terminal plates 21 and 22 of the common wiring can be made smaller than the sum of the conduction cross-sectional areas of the individual wirings. As a result, the wiring can be simplified, the circuit device as a whole can be reduced in size and weight, and the cost can be reduced.

Further, the semiconductor elements 12a, 12b, 12
Since the driving power of c is relatively larger than the driving power of the semiconductor elements 13 and 14, the semiconductor elements 12a, 12b and 12c
It is possible to supply power to each semiconductor element by slightly increasing the current-carrying cross-sectional area of the DC input terminal plates 21 and 22 in comparison with the current-carrying cross-sectional area in consideration of the margin of the current-carrying capacity. Therefore, it is possible to further reduce the size and weight of the circuit device as a whole and to reduce the cost.

Furthermore, since the DC power is branched from the DC input terminal plates 21 and 22 to the semiconductor devices 2, 3 and 4, a terminal block for branching is not required on the semiconductor element mounting surface. Therefore, it is possible to reduce the size and cost of the circuit device. Further, since the DC input terminal plates 21 and 22 supply the driving power of the drive motor 11, the DC input terminal plates 21 and 22 have a large cross-sectional area and are robust, and in addition, the semiconductor elements 12a, 12b and 12c connected to the DC input terminal plates 21 and 22 are connected. The part is also robust. Therefore, by mounting the fixed base 38 of the circuit breakers 36 and 37 on the DC input terminal plates 21 and 22, the circuit breakers 36 and 37 can be reliably mounted against vibration.

Furthermore, since the fixing bases 38 of the circuit breakers 36 and 37 are fixed to the DC input terminal plates 21 and 22, it is not necessary to dispose the fixing bases of the circuit breakers directly on the semiconductor element mounting surface, and the circuit device is not necessary. Can be miniaturized. In addition, since the circuit breaker can be installed in the upper layer of the control device component of the electric vehicle, it is excellent in maintainability when a circuit breaker such as a fuse that has fusing property and requires maintainability is used. A circuit device for an electric vehicle can be provided.

Although the DC input terminal member is formed in a plate shape in this embodiment, the shape of the DC input terminal member is not limited to a plate shape as long as electric power can be commonly supplied to each semiconductor device. Further, in this embodiment, the semiconductor element 12 is a known IGBT module in which one AC phase is contained in one case.
Although a, 12b, and 12c have been described, an IGBT module that accommodates three alternating-current phases in one case may be used. Further, the semiconductor elements 13 and 14 have been described as the known IGBT module that accommodates three AC phases in one case.
A module in which the phase components are contained in one case may be used.
Further, each semiconductor element may be a MOS-FET or a power transistor.

In this embodiment, the number of power supply smoothing capacitors provided on the semiconductor element is four, but the number can be reduced depending on the required capacity of each semiconductor element. It is also possible to reduce the capacity of the power supply smoothing capacitors and increase the number thereof. Further, in this embodiment, only the on-vehicle battery is handled as the DC power supply source, but it is also possible to supply the DC obtained by rectifying the AC.

Further, the cooling system may be a liquid cooling system in which a cooling liquid is made to flow in the cooling plate, or may be an air cooling system in which fin processing is performed on the cooling plate or attached to a separate fin for air cooling. A heat pipe system in which a heat pipe is provided inside the cooling plate may be used. Further, in the present embodiment, the example in which the fuse is used as the circuit breaker has been mentioned, but an open / close type circuit breaker such as a relay may be adopted, or the fuse and the relay may be used together. 1 and 2, the circuit breakers are shown as having the same shape, but they are not limited to the same shape.

In this embodiment, the circuit breaker 39 of the circuit device 1 is arranged outside the circuit device 1, but it may be arranged on the circuit device 1.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment in which a circuit device of the present invention is applied to a control device for an electric vehicle.

FIG. 2 is a view in the direction of arrow II in FIG. 1;

FIG. 3 is a circuit configuration diagram of the present embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Circuit device 2 Semiconductor device (1st semiconductor device) 3, 4 Semiconductor device (2nd semiconductor device) 5 Cooling plate 11 In-vehicle motor (driving motor) 12a, 12b, 12c Semiconductor element (1st semiconductor device) 13, 14 Semiconductor element (second semiconductor device) 21, 22 DC input terminal plate (DC input terminal member) 36, 37, 39 Circuit breaker 38 Fixed base (fixed member)

Claims (4)

[Claims] 1. A first semiconductor device having at least a first semiconductor device and a second semiconductor device, the first semiconductor device being disposed between an opposing space formed between the first semiconductor device and the second semiconductor device and in the vicinity thereof. It is possible to electrically connect the DC input terminal member directly connected to the device, the second semiconductor device and the DC input terminal member, and cut off the power supplied from the DC input terminal member to the second semiconductor device. Circuit breaker, and a circuit device comprising: 2. The circuit device according to claim 1, wherein a fixing member of the circuit breaker is fixed to the DC input terminal member. 3. The circuit device according to claim 1, wherein the power supplied to the first semiconductor device is larger than the power supplied to the second semiconductor device. 4. A control device for an electric vehicle, wherein the circuit device according to claim 1, 2 or 3 is used in a control device for an electric vehicle, and a drive motor of the electric vehicle is controlled by the first semiconductor device. .