JPH09283916A - Reflow furnace and soldering method using reflow furnace - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a reflow furnace by which a temperature is regulated freely and which can be heated according to a mounting board by installing a heating part by which a heating gas is blown selectively at a part to be soldered of a mounting board. SOLUTION: A conveyor 22 at a formal heating chamber 3 sets a mounting board 5 from a preliminary heating chamber 11 to a horizontal state so as to be conveyed to an exit chamber 4. During its conveyance, the mounting board 5 is stopped by a stopper 23, a heating gas from a heating part 24 is blown, and a soldering operation is performed. Nozzles 27 are attached to tip parts of respective electromagnetic induction heating devices 24a,... and the heating gas in a hot wind state from the six nozzles 27 is blown toward the mounting board 5. The temperature of the electromagnetic induction heating devices 24a,... can be regulated individually, and the heating gas can be turned on and off individually by switches which are installed at respective subducts 26. The exit chamber 4 carries out the soldered mounting board 5 into a box body 31 by a conveyor 32.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow furnace for a mounting board and a soldering method using a reflow furnace for soldering electronic parts and the like supplied to a board to a pattern formed on a printed board, and particularly to heated gas. Related to those whose temperature control is easy.

[0002]

2. Description of the Related Art As a conventional reflow furnace, for example, one disclosed in Japanese Patent Laid-Open No. 6-164130 is known. 4 of heating chamber, first soaking chamber, second soaking chamber, main heating chamber
The chambers are arranged in series, one heating unit is provided for each chamber, and the temperature of each chamber is adjusted. Further, a conveyor is provided in common in each room or in each room, and the mounting board conveyed by the conveyor is heated through each room. The heating unit is a combination of an electric heater, a far infrared heater and a hot air fan, and has a structure in which hot air is circulated in each room to adjust the temperature to a predetermined temperature.

In the reflow furnace having such a structure, the number of chambers is increased and the temperature is adjusted for each chamber in order to obtain a predetermined temperature profile. To adjust the temperature of each room, the capacity of the heater is changed.

[0004]

However, in the above-described reflow furnace, since a predetermined temperature profile is obtained by adjusting the temperature of each room, there is a problem that it is not possible to freely adjust the temperature to change the temperature distribution inside the room. there were.
Further, there is a problem that the temperature cannot be finely adjusted when the size of the component on the mounting board or the thickness of the mounting board changes. Furthermore, even if the mounting board is large or small, since the processing is performed with a predetermined temperature distribution, the entire furnace remains set for the large mounting board, and the energy loss is large for the small mounting board. was there.

The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide a reflow furnace in which the temperature can be freely adjusted and which can be heated according to the mounting board and a solder by the reflow. It is to propose the attachment method.

[0006]

In order to achieve the above-mentioned object, the invention according to claim 1 of the present invention is a reflow furnace for blowing a heating gas to a mounting substrate conveyed by a conveyor for soldering. A heating unit for selectively blowing heated gas to a portion of the mounting board to be soldered is provided. If the number of heating units for selectively blowing the heated gas is increased or the heating units are moved in the same plane as the mounting substrate, partial blowing is performed.

According to a second aspect of the present invention, in the first aspect, the heating section heats the gas with a heating element that generates heat by electromagnetic induction. In the electromagnetic induction heating, the heating element in contact with the gas is directly heated by the electromagnetic induction of the coil, so that the heat transfer efficiency is high and the response is also high.

According to a third aspect of the present invention, in the first or second aspect, a plurality of the heating portions are provided on the mounting board, and the temperature of each of the plurality of heating portions can be adjusted. The heating pattern for the mounting board becomes appropriate by individually turning on / off the heating units or individually adjusting the temperature.

According to a fourth aspect of the present invention, in the first or second aspect, the heating section is provided so as to be movable in a plane parallel to the mounting board, and the moving speed can be adjusted. . The heating pattern for the mounting board becomes appropriate by adjusting the moving speed and the moving path for moving the heating unit in the plane.

According to a fifth aspect of the present invention, there is provided a reflow furnace which blows heated gas to a mounting substrate conveyed by a conveyor for soldering, and a heating unit which blows the heating gas onto the mounting substrate. Visual recognition means for recognizing a portion of the mounting board to be soldered, and a position at which heated gas is blown from the heating section or heated gas from the heating section with respect to the portion recognized by the visual recognition means. And a control unit for controlling at least one of the temperatures. The part where the temperature hardly rises or the part where the temperature rises easily is recognized from the shape, and the blowing position is controlled so that the recognized part is heated positively or passively.

According to a sixth aspect of the present invention, there is provided a reflow furnace for blowing heated solder to a mounting substrate conveyed by a conveyor to solder the mounting substrate, the heating unit blowing the heating gas to the mounting substrate, and the mounting. A sensor unit for measuring the temperature of the substrate, and a blowing position of the heated gas from the heating unit according to the temperature of the actually measured substrate measured by the sensor unit,
Or a control unit for controlling at least one of the temperatures of the heated gas from the heating unit. The temperature of the mounting board is measured, and the mounting board is heated so that the temperature becomes uniform.

According to a seventh aspect of the present invention, in the sixth aspect, the temperature control unit controls the surface of the mounting board to be uniform so that the surface temperature of the mounting board becomes uniform. , There is no variation in the time when the solder melts.

The invention according to claim 8 is a soldering method by a reflow furnace for blowing a heating gas to a mounting board conveyed by a conveyor, wherein the mounting board is selectively soldered to a portion to be soldered. It is characterized by including a heating step of blowing heated gas. By adjusting the heating step of selectively blowing heated gas, a heating pattern according to the density of the mounting substrate can be adopted.

According to a ninth aspect of the present invention, in the eighth aspect, the heating step includes a step of heating the gas with a heating element that generates heat by electromagnetic induction. In electromagnetic induction heating, a heating element that is in contact with gas is heated directly by electromagnetic induction of a coil, so that a uniform heated gas can be created.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a device configuration diagram of a reflow furnace according to the present invention, and FIG. 2 is a diagram showing a soldering method using a plurality of heating units.

In FIG. 1, a reflow furnace 1 comprises a preheating chamber 2, a main heating chamber 3, and an outlet chamber 4 which are arranged in series in this order from upstream to downstream.

The preheating chamber 2 comprises a box body 11 in which a conveyor 12, a stopper 13, and a heating unit 14 are arranged. The conveyor 12 makes the mounting substrate 5 after the chip mounting in a horizontal state and conveys it from an inlet chamber (not shown) for blocking outside air to the main heating chamber 3. The mounting substrate 5 is stopped by the stopper 13 during the transportation, and hot air from the heating unit 14 is blown to the entire substrate to preheat it.

The heating unit 14 is connected to an electromagnetic induction heating device 15 for a gas supply device 6 such as air, nitrogen gas, hydrogen gas, etc., and a downward duct 16 for the electromagnetic induction heating device 15.
And the branch duct 17 are connected. From the outlet 16a of the downward duct 16, the hot air 18 heated to the preheating temperature by the electromagnetic induction heating device 15 is blown to the entire upper surface of the mounting substrate 5. The electromagnetic induction heating device 15 is configured by winding a coil 15b around an outer circumference of a non-conductive cylindrical body 15a made of ceramic or the like and disposing a heating element 15c made of a ferromagnetic material inside. By the feedback control from the temperature sensor 15d, the high frequency current generator 15 connected to the coil 15b
The supplied electric power from d is adjusted to obtain warm air 18 having a predetermined temperature. The warm air 18 blown into the room may be returned to the electromagnetic induction heating device 15 again in a circulation system. Also,
Instead of the electromagnetic induction heating device 15, a normal circulation heating device using a heater and a fan can be adopted.

The main heating chamber 3 is provided with a conveyer 2 in a box 21.
2, a stopper 23, and a heating unit 24 are arranged. The conveyor 22 makes the mounting substrate 5 from the preheating chamber 11 horizontal and conveys it to the outlet chamber 4. During this transportation, the mounting substrate 5 is stopped by the stopper 23, and the heating gas is blown from the heating unit 24 to perform main heating and soldering is performed.

The heating unit 24 is composed of a total of nine first electromagnetic induction heating devices 24a to ninth electromagnetic induction heating device 24f arranged in three units in the traveling direction × three units in the width direction ((a in FIG. 2). )
reference). Hot air is received from a main duct 25 flanged to the branch duct 17 of the preheating chamber 2, and a predetermined amount of preheated gas is supplied to each of the electromagnetic induction heating devices 24a and 24f via the sub duct 26. A blower in the room may be used instead of the diversion duct 17 that functions as a gas supply means. Each electromagnetic induction heating device 24
Nozzles 27 are attached to the tips of a to 24 f, and heated gas in the hot air state is blown from the six nozzles 27 toward the mounting substrate 5.

The temperature of each of the electromagnetic induction heating devices 24a to 24f can be adjusted individually, and the heating gas can be turned on / off individually by a switch (not shown) provided in each of the sub-ducts 26. The structure of the electromagnetic induction heating devices 24a to 24f is similar to that of the electromagnetic induction heating device 15 in the preheating chamber 2, but the detailed structure will be described later with reference to FIG.

The outlet chamber 4 is for exhausting the soldered mounting substrate 5 while blocking it from the outside air. The heating gas leaking from the main heating chamber 3 to the outlet chamber 4 is exhausted or collected outside the chamber. To do The mounting board 5 is carried into the box 31 by the conveyor 32.

The box body 11 of the preheating chamber 2, the box body 21 of the main heating chamber 3, and the box body 31 of the outlet chamber 4 can be separately separated and can be moved by wheels 33. is there. Therefore, the preheating chamber 2 is divided into two stages, and the main heating chamber 3
It is designed to be easily rearranged, such as by making it into a two-tier. It should be noted that it is convenient to connect the boxes 11, 21, 31 to each other by one-touch operation by using, for example, magnet chucking and mechanical chucking together.

Next, a soldering method using the above-described reflow furnace 1 will be described with reference to FIG. FIG. 2A is a top view showing an arrangement state of nozzles attached to the ends of the electromagnetic induction heating devices 24a to 24f, and FIGS. 2B and 2C.
[Fig. 3] is a top view showing an example of a heating pattern.

In FIG. 2B, it is assumed that the mounting density of the mounting substrate 5 has a density as shown in the drawing, and is a size that the heating portion can cover. At this time, the output of the electromagnetic induction heating device 24f is set to "high", the outputs of the electromagnetic induction heating devices 24c, 24d, 24e, and 24i are set to "medium", and the electromagnetic induction heating devices 24a, 24b, 24g, and 24h are set.
Is set to "low" and a heating pattern is set to match the mounting density of the mounting board 5.

In FIG. 2C, it is assumed that the mounting density of the mounting board 5 has a density as shown in the drawing, and is smaller than the area that can be covered by the heating portion. At this time, the electromagnetic induction heating devices 24g, 24h, and 24i are turned off to stop the blowing itself, and the electromagnetic induction heating device 2
The output of 4c is set to "high" and the electromagnetic induction heating devices 24a, 24
The outputs of 4b and 24f are set to "medium", and the electromagnetic induction heating device 2
The outputs of 4d and 24e are set to "low", and the heating pattern is set not only for the mounting density of the mounting board 5 but also for the size of the mounting board 5. In this way, the heating unit 24 of the main heating chamber 3
Is composed of a plurality of electromagnetic induction heating devices 24a to 24f, and each of the electromagnetic induction heating devices 24a to 24f is capable of temperature control by turning on and off and output adjustment separately.
The heated gas can be selectively blown to the portion to be soldered.

FIG. 3 shows electromagnetic induction heating devices 24a to 24f.
Shows the detailed structure of. Each device 24a to 24f has a column 5
1, a heating element 52 housed in the column 51, a coil 53 wound around the column 51, and a coil 5
3 for high frequency current generator 54. Reference numeral 27 is a nozzle, reference numeral 55 is a temperature sensor, reference numeral 56 is a damper for adjusting and turning on / off the air volume, and reference numeral 57 is a blower as a gas supply device.

The heating element 52 is formed by alternately stacking a first metal plate 61 and a flat second metal plate 62 that are bent in a zigzag chevron shape to form a cylindrical laminate 63 as a whole. As the material of the first metal plate 61 and the second metal plate 62, a ferromagnetic material such as SUS447J1 having excellent corrosion resistance of martensitic stainless steel is used. The ridges (or valleys) of the first metal plate 61 are arranged so as to be inclined by an angle α with respect to the central axis 64, and the ridges (or valleys) of the first metal plates 61 adjacent to each other with the second metal plate 62 interposed therebetween. ) Are arranged to intersect. Then, the first metal plate 61 and the second metal plate 62 are welded by spot welding at the intersections of the peaks (or valleys) in the adjacent first metal plates 61 so that they can be electrically conducted.

After all, a first small channel 65 inclined by an angle α is formed between the first metal plate 61 on the front side and the second metal plate 62, and the second metal plate 62 and the second metal plate on the back side are formed. A second small channel 66 inclined by an angle -α is formed between the first metal plate 61 and the first small channel 65 and the second small channel 66 have an angle of 2 × α.
Intersect at In addition, the first metal plate 61 and the second metal plate 6
The surface of 2 is provided with a large number of holes 67 as third small flow paths for causing turbulent flow of the fluid. Furthermore, the surfaces of the first metal plate 61 and the second metal plate 62 are not smooth,
The fine irregularities 68 are formed on the entire surface by satin processing or embossing. The unevenness 68 is so small that it can be ignored as compared with the height of the peak (or valley).

When a high-frequency current from a high-frequency current generator (not shown) is applied to the coil 53 to apply a high-frequency magnetic field to the laminated body 63, an eddy current is generated in the entire first metal plate 61 and the second metal plate 62, The laminated body 63 generates heat. At this time, the temperature distribution is an eyeball shape extending in the longitudinal direction of the first metal plate 61 and the second metal plate 62, and the central portion generates heat rather than the peripheral portion, and the fluid that tends to flow in the central portion is heated. It has an advantage.

In addition, a first small channel 65 and a second small channel 66 intersecting each other are formed in the laminated body 63 to diffuse the periphery and the center, and in addition, to form a third small channel. Due to the presence of 67, diffusion in the thickness direction between the first small channel 65 and the second small channel 66 is also performed. Therefore, these small channels 6
5, 66 and 67 cause macroscopic dispersion, diffusion, and volatilization of the fluid over the entire laminated body 63. In addition, microscopic unevenness 68 on the surface causes microscopic diffusion, diffusion, and volatilization. As a result, the fluid passing through the laminated body 62 becomes a substantially uniform flow, and the first metal plate 61 and the second metal plate 62.
And an even contact opportunity with the fluid. As a result, uniform heat transfer is ensured.

The coil 53 is formed by twisting litz wires together, and is wound around the outer periphery of the column 51 or is wound and embedded in the thickness of the column 51. Column 51
Since it holds the coil 53, defines a fluid passage, and accommodates the heating element 52 in the passage, it is made of a non-magnetic material having corrosion resistance, heat resistance, and pressure resistance. Specifically, an inorganic material such as ceramic, a resin material such as FRP (fiber reinforced plastic), a fluororesin, a non-magnetic metal such as stainless steel, or the like is used, but ceramic is most preferable.

The temperature of the hot air blown from the nozzle 27 is detected by the temperature sensor 55, and the desired heated gas 28
The output of the high frequency current generator 54 is adjusted so that Normally, the air volume of the gas from the blower 57 is constant, and the damper 56 turns the air volume on and off. The temperature of the heated gas is not adjusted by adjusting the air volume because the response is poor, and the high-frequency current generator 54 is used after the gas has a predetermined amount.
The temperature is adjusted by adjusting the output.

The electromagnetic induction heating device 24a having such a structure
~ 24f has a high output in spite of its small size,
It has the characteristics of excellent responsiveness and being able to blow out a uniform heating fluid without temperature unevenness at a predetermined temperature. For example, 50m
Even the heating element 52 having a diameter of m can output up to about 10 kW, and the temperature of the heated gas can be controlled up to ± 1 °.
Therefore, it is most suitable for selectively blowing heated gas to the portion to be soldered.

FIG. 4 is a diagram showing the structure and operation of another heating unit 41. One electromagnetic induction heating device 42 is operated by the X-axis driving unit 43, the Y-axis driving unit 44, and the Z-axis driving unit 45, and
The heating unit 41 can be moved to a predetermined position in the YZ space at a predetermined speed. That is, by controlling the number of rotations of the motor 43a of the X-axis drive unit 43 and the motor 44a of the Y-axis drive unit 44, the heating unit 41 can move an arbitrary movement pattern at an arbitrary movement speed. Furthermore, the height from the mounting substrate to the outlet of the electromagnetic induction heating device 42 can be arbitrarily changed by controlling the rotation speed of the motor (not shown) of the Z-axis drive unit 45. The air, the nitrogen gas, and the hydrogen gas are supplied to the electromagnetic induction heating device 42 through the flexible tube 46.

Assuming that the mounting substrate 5 has a rough density as shown in the drawing, the electromagnetic induction heating device 42 moves a rough portion roughly and a dense portion densely, and changes the heating pattern. You can Further, the moving speed of the electromagnetic induction heating device 42 can be increased in the rough portion and decreased in the dense portion. Further, the electromagnetic induction heating device 42 is raised and separated for the rough portion, and the electromagnetic induction heating device 4 for the dense portion.
When 2 is lowered and brought closer to each other, it becomes easier to change the heating pattern. Thus, by using the XYZ axis drive means, the electromagnetic induction heating device 42 can be positioned with respect to an arbitrary portion of the mounting board. Furthermore, X-
It is also possible to freely move the portion without mounting by the driving means of the YZ axes and temporarily stop at the mounting portion to heat intensively.

Next, a reflow furnace equipped with a control unit as shown in FIG. 4 capable of finely adjusting the heating suitable for the mounting substrate will be described with reference to FIG.

The equipment arrangement of the main heating chamber 3 is different from that shown in FIG. 1, and the heating unit 24 is arranged below the mounting substrate 5 conveyed on the conveyor 22 and above the mounting substrate 5. CC
A D camera 71, a light 72, and an infrared temperature sensor 73 are arranged.

The CCD camera 71 and the light 72 are CCD
The controller 7 is connected to the camera controller 74.
4 is connected to the personal computer 75. CCD camera 71
Has a large number of pixels arranged two-dimensionally, and the surface of the mounting substrate 5 can be captured as an image. The controller 74 is a part that performs image processing according to the setting conditions, performs determination / recognition, and outputs the result. The personal computer 75 is for controlling at least one of the position and the temperature of the heating unit based on the result of the judgment / recognition, as described below. Note that the image processing performed by the controller 74 includes binarized image processing, and the form of a part can be determined / recognized by a normalized correlation operation or the like. Therefore, the CCD camera 71 and the controller 74
Constitutes a visual recognition means for recognizing a portion to be soldered, and controls at least one of a position and a temperature for the personal computer 75 or the like to selectively spray the heating portion to the recognized portion of the mounting board. It constitutes the control unit.
In particular, the XYZ of the personal computer 75 and the heating unit 24 described later
The −θz stage constitutes a position control unit that adjusts the position of the heating unit with respect to the recognized portion of the mounting board.

The infrared temperature sensor 78 is connected to the infrared temperature sensor controller 79, and the controller 79 is connected to the personal computer 75. FIG. 6 shows a device configuration when an infrared radiation thermometer is used as the infrared temperature sensor 78. The vertical scanning mirror 78a, the horizontal scanning mirror 78b, and the optical system 78c scan the surface of the mounting substrate 5 to collect the infrared light emitted from the surface of the mounting substrate 5 into an electric signal by the detector 78d. Convert. This electric signal is output to the signal processing unit 79a forming the controller 79 via the amplifier 78e, and the temperature distribution on the surface of the mounting substrate 5 is stored in the buffer memory. Then, the personal computer 75 in FIG. 5 controls at least one of the position or the temperature of the heating unit based on the temperature distribution on the surface of the mounting substrate 5, as described below. Moreover, the temperature adjusting units 80a to 80n are attached to the respective electromagnetic induction heating devices 24a to 24n constituting the heating unit 24, and the heating gas blown from the respective electromagnetic induction heating devices 24a to 24n is blown. The temperature pattern can be changed. Therefore, the personal computer 75 calculates an appropriate spray pattern of the heating unit 24 for uniformizing the temperature pattern on the surface of the mounting substrate 5, and the temperature adjusting units 80a to 8a-8.
Give the required command to 0n. This temperature adjusting unit 80a-8
0n controls each of the electromagnetic induction heating devices 24a to 24n of the heating unit 24 by the PID control method or the like so that the relative error with respect to the indicated value is reduced. Therefore, the infrared temperature sensor 78, the controller 79, and the like constitute sensor means for measuring the temperature distribution on the surface of the mounting board, and the personal computer 7
5 and the like constitute a control unit that controls at least one of the position and temperature for selectively spraying the heating unit onto the surface of the mounting substrate. In particular, the personal computer 75, the temperature control units 80a to 80n, and the like constitute a temperature control unit that adjusts the temperature of the heated gas blown from the heating unit 24 according to the temperature distribution on the surface of the mounting substrate.

Further, the heating unit 24 can change not only the temperature pattern of the heated gas to be blown, but also the position of the heating unit 24 itself.
That is, the heating unit 24 uses the XYZ-θz stage 81.
Alternatively, the arm robot can control the position of the heating unit 24 with respect to the mounting substrate 5 with four degrees of freedom of XYZ-θz. The XYZ-θz stage 81 has a θz angle motor 81a, an X-axis motor 81b, a Y-axis motor 81c, and a Z-axis motor 81d as shown in the drawing in order to drive these motors 81a to 81d. Driver 82, and a multi-axis positioner 83 for sending the coordinate-converted necessary signal to the driver 82. The multi-axis positioner 83 is connected to the personal computer 75.

The personal computer 75 has a keyboard 76 and a monitor 77, and monitors the temperature pattern on the surface of the mounting substrate 5 measured by an infrared temperature sensor 78, for example.
7 or the image of the portion of the mounting board 5 to be soldered, which is recognized by the CCD camera 71, can be displayed on the monitor 77. Further, the keyboard 76 can freely change the settings of the control unit including the position control unit and the temperature control unit. Also, as shown in FIG.
Not only the case where the CD camera 71 and the infrared temperature sensor 78 are provided in parallel, but the infrared temperature sensor 78 may be provided with an image recognition function to serve also as a visual recognition means.

Next, the operation of the reflow furnace shown in FIG. 5 will be described. Various parts having different sizes and different materials are mounted on the mounting board 5. Therefore, it is difficult for the temperature of the specific portion for a certain component to rise, and the temperature of the other specific portion for the other portion tends to rise.
Such a specific portion is determined / identified by the CCD camera 71, and the position where the moving speed of the entire heating unit 24 is slowed or approached is controlled for the portion where the temperature is hard to rise. It is also possible to change the distribution pattern of the heated gas blown from the heating unit 24 to the mounting substrate 5 and control to blow the heated gas at a higher temperature to the portion where the temperature is hard to rise. In order to complete the soldering of the mounting substrate 5, it is necessary that the temperature of the part where the temperature is hard to rise is equal to or higher than the melting point of the solder. If there is a possibility of causing damage, but if a portion where the temperature is unlikely to rise is identified and heated positively and intensively, variation in the temperature on the mounting substrate 5 is less likely to occur, and thermal damage to the components should be prevented. You can

In addition to recognizing the portion of the mounting board 5, an infrared temperature sensor 78 capable of measuring the temperature pattern of the surface of the mounting board 5 is used in combination to detect the actual surface temperature pattern. it can. Depending on the temperature pattern of the surface, the moving speed and the height of the entire heating unit 24 are controlled or the position is controlled, or the distribution pattern of the heated gas blown from the heating unit 24 is changed. Take control. Then, the temperature of the entire surface of the mounting substrate 5 becomes uniform, not only the portion to be soldered. If the temperature of the surface of the mounting substrate 5 varies, the solder melts at a different time, and the surface tension generated at the moment when the solder melts causes one of the electrodes on both sides to separate from the land due to the surface tension. Although the phenomenon of chipping or chipping may occur, by making the temperature of the surface of the mounting substrate 5 uniform, it is possible to match the melting time of solder and prevent chipping or chipping.

In the embodiment of FIG. 5, not only the visual recognition means for recognizing the portion of the mounting board 5 but also the mounting board 5 is used.
Although the case where the sensor means for measuring the surface temperature of the mounting board 5 is used together is explained, only the visual recognition means for recognizing the portion of the mounting board 5 or only the sensor means for measuring the surface temperature of the mounting board 5 is used. According to the above, it is possible to prevent the heat damage to the components and the floating of the chips to some extent.

[0046]

As described above, according to the first aspect of the present invention, since the heating portion for selectively blowing the heated gas is provided, the flexible temperature control can be performed, and the low temperature can be achieved. An effect that energy can be realized is achieved.

In addition to the effect of the invention of claim 1, the invention of claim 2 has an effect of enabling temperature control with small size and high accuracy by electromagnetic induction heating.

In addition to the effect of the invention of claim 1 or 2, the invention of claim 3 has an effect that heating can be performed according to the density of the mounting substrate by controlling the temperature of each of the plurality of heating parts.

In addition to the effect of the invention of claim 1 or 2, the invention of claim 4 has an effect that heating can be performed according to the density of the mounting substrate by the movable heating part.

According to a fifth aspect of the present invention, there is provided a control unit that enables the heating unit to be selectively blown onto the portion recognized by the visual recognition means, and the temperature of the components on the mounting board rises. It is possible to determine whether the temperature is easy or the temperature is hard to rise. This has the effect of preventing damage.

According to a sixth aspect of the present invention, the mounting board is used as a base, which has a control section that enables selective blowing of the heating section according to the temperature of the actually measured board measured by the sensor means. It has the effect of enabling fine temperature control.

According to the invention of claim 7, in addition to the effect of the invention of claim 6, the electrode is separated from the land by making the temperature of the entire surface of the mounting substrate uniform. This has the effect of reducing such abnormal phenomena.

The invention relating to the method described in claim 8 has the effect that, like the invention of claim 1, flexible temperature control is possible and low energy can be realized.

In addition to the effect of the invention of claim 8, the invention of claim 9 has the effect of enabling highly accurate temperature control by electromagnetic induction heating.

[Brief description of drawings]

FIG. 1 is a device configuration diagram of a reflow furnace of the present invention.

FIG. 2 is a diagram showing a soldering method using a plurality of heating units.

FIG. 3 is a structural diagram of a heating unit.

FIG. 4 is a diagram showing a soldering method using a movable heating unit.

FIG. 5 is a device configuration diagram of another reflow furnace of the present invention.

FIG. 6 is a device configuration diagram of an infrared temperature sensor and its controller.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Reflow furnace 2 Pre-heating chamber 3 Main heating chamber 24 Heating part (plurality) 24a-24i Electromagnetic induction heating device 27 Nozzle 51 Column 52 Heat generating element 53 Coil 61 First metal plate 62 Second metal plate 71 CCD camera (visual recognition means) ) 74 CCD camera controller (visual recognition unit) 75 Personal computer (control unit, position control unit, temperature control unit) 78 Infrared temperature sensor (sensor unit) 79 Infrared ond sensor controller (sensor unit) 80a to 80n Temperature adjusting unit (temperature) Control means) 81 XYZ-θz stage (position control means)

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Bessho Seibun, Omron Co., Ltd. 10 Hanazono Todo-cho, Ukyo-ku, Kyoto City, Kyoto Prefecture (72) Inventor Taizo Kawamura 19-21 Misawa-cho, Ibaraki-shi, Osaka Seta Giken (72) Inventor Yoshitaka Uchibori 19-21 Misawa-cho, Ibaraki-shi, Osaka Seta Giken Co., Ltd.

Claims (9)

[Claims] 1. A reflow furnace for blowing heated gas to a mounting substrate conveyed by a conveyor for soldering, wherein a heating unit selectively blows the heating gas to a portion of the mounting substrate to be soldered. A reflow furnace characterized by being provided with. 2. The reflow furnace according to claim 1, wherein the heating unit heats the gas with a heating element that generates heat by electromagnetic induction. 3. The reflow furnace according to claim 1, wherein a plurality of the heating units are provided on the mounting substrate, and the temperature of each of the plurality of heating units can be adjusted. 4. The reflow furnace according to claim 1, wherein the heating unit is provided so as to be movable in a plane parallel to the mounting substrate, and the moving speed can be adjusted. 5. A reflow furnace for blowing heated solder to a mounting board conveyed by a conveyor for soldering, wherein a heating unit for blowing heated gas to the mounting board and soldering the mounting board Visual recognition means for recognizing a portion, with respect to the portion recognized by the visual recognition means, at least one of the blowing position of the heating gas from the heating portion, or the temperature of the heating gas from the heating portion. A reflow furnace comprising: a control unit for controlling. 6. A reflow furnace for blowing heated solder to a mounting substrate conveyed by a conveyor for soldering, and a heating unit for blowing the heating gas to the mounting substrate, and a sensor for measuring the temperature of the mounting substrate. And a control unit that controls at least one of a blowing position of the heated gas from the heating unit or a temperature of the heated gas from the heating unit according to the temperature of the actually measured substrate measured by the sensor unit. And a reflow furnace comprising: 7. The temperature control unit controls to make the entire surface of the mounting substrate uniform.
Reflow oven as described. 8. A soldering method using a reflow furnace for blowing heated gas to a mounting substrate conveyed by a conveyor, the heating step of selectively blowing heated gas to a portion of the mounting substrate to be soldered. A soldering method in a reflow furnace, comprising: 9. The soldering apparatus according to claim 5, wherein the heating step includes a step of heating the gas with a heating element that generates heat by electromagnetic induction.