JPH09278913A - Production of prepreg - Google Patents

Production of prepreg

Info

Publication number
JPH09278913A
JPH09278913A JP8967296A JP8967296A JPH09278913A JP H09278913 A JPH09278913 A JP H09278913A JP 8967296 A JP8967296 A JP 8967296A JP 8967296 A JP8967296 A JP 8967296A JP H09278913 A JPH09278913 A JP H09278913A
Authority
JP
Japan
Prior art keywords
prepreg
resin
base material
organic solvent
carbon dioxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8967296A
Other languages
Japanese (ja)
Inventor
Hiroshi Suwabe
拓 諏訪部
Kunio Iketani
国夫 池谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP8967296A priority Critical patent/JPH09278913A/en
Publication of JPH09278913A publication Critical patent/JPH09278913A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Reinforced Plastic Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a prepreg giving a voidless base plate for printed circuit boards of high circuit density having a fine pattern by replacing air included in fibrous base material with carbon dioxide before it is impregnated with a resin varnish. SOLUTION: A fibrous base material (preferably yarn prepared by bundling monofilaments) is impregnated with a resin varnish prepared by a thermosetting resin and/or a thermoplastic resin in an organic solvent and dried. The air included in fibrous material is replaced with carbon dioxide before impregnation. In the case that the resin is an epoxy resin, or that the organic solvent is selected from acetone, methyl ethyl ketone, and in the case that the resin is an epoxy resin and dicyandiamide is used as a curing agent, dimethylformamide or diethylformamide and the like is preferably used as an organic solvent.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、気泡の残存が極め
て少ないプリプレグの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a prepreg in which air bubbles are extremely small.

【０００２】[0002]

【従来の技術】通常、プリント回路板等の積層板を製造
するために使用される繊維基材は、ガラス織布を代表例
とする織布が使用されている。織布は繊維のモノフィラ
メントを集束したヤーンを織ったものであり、そのまま
直接樹脂ワニスを浸漬あるいは塗布等により含浸する
と、モノフィラメント間の隙間に多くの空気を含んだプ
リプレグが得られる。そのため、さらに加熱等により樹
脂ワニスが繊維基材に浸透しても、幾らかの空気がモノ
フィラメント間に残存し、通常ニードルボイドと称され
る空気溜まりが生じ、積層板を得るための工程である加
熱加圧成形において不良品を多く発生させる原因とな
る。2. Description of the Related Art Generally, a woven cloth represented by a glass woven cloth is used as a fiber base material used for producing a laminated board such as a printed circuit board. The woven cloth is woven of yarns in which monofilaments of fibers are bundled, and when the resin varnish is directly impregnated as it is, a prepreg containing a large amount of air in the gaps between the monofilaments can be obtained. Therefore, even if the resin varnish permeates the fiber base material due to heating or the like, some air remains between the monofilaments, and air pools usually called needle voids are generated, which is a step for obtaining a laminated plate. This causes a large number of defective products in the heat and pressure molding.

【０００３】ニードルボイドの生じる原因としては、閉
じこめらた空気の圧力が、容積の減少に反比例して高く
なり、ある時点で繊維基材に浸透してきた樹脂ワニスの
浸透力と等しくなり、そのままの状態で繊維基材内に固
定されるためと考えられている。このため、従来はニー
ドルボイドが発生した後塗布乾燥中や、硬化成形中に、
圧力、熱又は真空、超音波等により、閉じこめられた空
気を追い出していた。根本的な対策としては、初めから
空気を含まない基材に樹脂ワニスを含浸するという考え
方もあった。しかし、前者の空気を追い出す方法では基
材全面を均一に処理することが難しく、さらに、連続的
に移動している繊維基材においては、含浸時又は含浸後
乾燥前の限られた時間での処理操作であった。また、最
初から空気を含まない繊維基材を得ようとすることはこ
れまでになされておらず、仮に可能であるとしても非常
にコスト高になると考えられる。The cause of needle voids is that the pressure of the trapped air rises in inverse proportion to the decrease in volume, and becomes equal to the penetrating force of the resin varnish that has penetrated into the fiber substrate at a certain point. It is believed that this is because it is fixed in the fiber base material in this state. Therefore, conventionally, during coating and drying after the needle void is generated, or during curing molding,
The trapped air was expelled by pressure, heat or vacuum, ultrasonic waves, and the like. As a fundamental measure, there was also the idea of impregnating a base material containing no air with a resin varnish from the beginning. However, it is difficult to uniformly treat the entire surface of the base material by the former method of expelling air, and in the case of a fibrous base material that is continuously moving, the time during impregnation or after the impregnation and before the drying is limited. It was a processing operation. Further, it has not been attempted to obtain a fiber base material containing air from the beginning, and it is considered that the cost will be extremely high even if it is possible.

【０００４】[0004]

【発明が解決しようとする課題】本発明は、気泡残存の
極めて少ないプリプレグを得るために種々検討した結果
完成されたものであり、含浸前の繊維基材に含まれる空
気を、後で含浸する樹脂ワニスに使用している有機溶剤
への溶解性に優れた気体に置換することにより所期の目
的を達成することができたものである。The present invention has been completed as a result of various studies in order to obtain a prepreg with extremely few remaining bubbles, and the air contained in the fiber base material before the impregnation is impregnated later. The intended purpose could be achieved by substituting a gas having excellent solubility in the organic solvent used for the resin varnish.

【０００５】[0005]

【課題を解決するための手段】本発明は、熱硬化性樹脂
及び又は熱可塑性樹脂を有機溶剤に溶解した樹脂ワニス
を繊維基材に含浸し、乾燥することによりプリプレグを
製造する方法において、繊維基材に樹脂ワニスを含浸す
るに先だって、繊維基材の中に含まれている空気を二酸
化炭素に置換することを特徴とするプリプレグの製造方
法、に関するものである。二酸化炭素は有機溶剤に対す
る溶解性が大きく、このため、繊維基材の中に含まれて
いる空気を二酸化炭素に置換し、この置換された繊維基
材を有機溶剤を含む樹脂ワニスに含浸すると、基材内の
二酸化炭素が有機溶剤に溶解するため、樹脂ワニスは基
材の繊維間に浸透し、繊維基材内にボイドの残存が極め
て少なくなる。従って、得られたプリプレグは極めてボ
イドの少ないものとなる。The present invention provides a method for producing a prepreg by impregnating a fiber base material with a resin varnish prepared by dissolving a thermosetting resin and / or a thermoplastic resin in an organic solvent and drying the prepreg. The present invention relates to a method for producing a prepreg, which comprises substituting carbon dioxide for air contained in a fiber base material before impregnating the base material with a resin varnish. Carbon dioxide has a high solubility in organic solvents, and therefore, the air contained in the fiber base material is replaced with carbon dioxide, and the substituted fiber base material is impregnated with a resin varnish containing an organic solvent, Since carbon dioxide in the base material dissolves in the organic solvent, the resin varnish penetrates between the fibers of the base material, and the voids remaining in the fiber base material are extremely reduced. Therefore, the obtained prepreg has extremely few voids.

【０００６】巻かれた繊維基材において、空気を二酸化
炭素に置換する方法としては、基材全体を容器内に置き
この容器を真空にした後、二酸化炭素を導入することに
より基材全体に二酸化炭素を含ませることができる。ま
た、巻き出された繊維基材に樹脂ワニスを含浸する直前
に、加圧された二酸化炭素を噴射することによっても、
かなり二酸化炭素に置き換えることができる。更に、樹
脂ワニスを含浸する直前に、繊維基材を真空にするゾー
ンとこれに続く二酸化炭素が充填されたゾーンとの組合
わせを１回以上通過させることにより、効果的な二酸化
炭素置換を行うことができる。また、塗布工程中の一部
で、繊維基材に張力が強く作用している場合、その部分
では置換の効果が発揮されにくいので、張力の小さい部
分を選んで行うことが望ましい。As a method for replacing air with carbon dioxide in the wound fiber base material, the whole base material is placed in a container, the container is evacuated, and then carbon dioxide is introduced into the container to oxidize the entire base material. It can contain carbon. Also, just before impregnating the unrolled fiber base material with the resin varnish, by injecting pressurized carbon dioxide,
Can be considerably replaced by carbon dioxide. Further, immediately before impregnation with the resin varnish, effective carbon dioxide substitution is carried out by passing through a combination of a zone in which the fiber base material is evacuated and a subsequent zone filled with carbon dioxide one or more times. be able to. In addition, when tension is strongly acting on the fiber base material in a part of the application step, the effect of substitution is difficult to be exerted in that part, so it is desirable to select a part having a low tension.

【０００７】巻かれた繊維基材に一度浸入した二酸化炭
素は容易には逃げないが、置換後長い時間空気中に放置
したり、樹脂ワニスに浸漬するまで幾つものロールを通
るような場合、その間に空気が再度浸入してくるので、
置換後浸漬又は塗布までの距離又は時間をなるべく短く
する、巻かれた繊維基材を密封する等の工夫をすること
により効果を持続させることができる。また、通常気体
は低温ほど大きな質量となるので、置換する際の二酸化
炭素の温度は低い方が、後に室温にまで戻ったときに負
圧になることがなく、含浸までに二酸化炭素が逃げ出す
ことが少なくなる。Carbon dioxide once infiltrated into the wound fiber base material does not easily escape, but if it is left in the air for a long time after replacement or if it passes through several rolls until it is immersed in the resin varnish, it may be lost during that time. Because air re-enters the
The effect can be maintained by devising such measures as shortening the distance or time until the dipping or coating after the substitution as much as possible, and sealing the wound fiber base material. Also, since the normal gas has a larger mass at lower temperatures, the lower the temperature of carbon dioxide during replacement, the more negative the pressure will not be when the temperature returns to room temperature later, and the carbon dioxide will escape before impregnation. Is less.

【０００８】本発明において、熱硬化性樹脂あるいは熱
可塑性樹脂はプリプレグを作製するために使用されるも
のであれば如何なるものでもよく、特に限定されない
が、通常は、エポキシ樹脂、ポリイミド樹脂等の熱硬化
性樹脂である。繊維基材は、ガラス繊維織布等の織布、
紙等であり、特に限定されない。In the present invention, the thermosetting resin or the thermoplastic resin may be any one as long as it can be used for preparing a prepreg and is not particularly limited, but usually a thermosetting resin such as an epoxy resin or a polyimide resin is used. It is a curable resin. The fiber base material is a woven fabric such as a glass fiber woven fabric,
It is paper or the like and is not particularly limited.

【０００９】有機溶剤は特に限定されないが、樹脂とこ
の樹脂を溶解する有機溶剤、及び二酸化炭素との関連に
おいて、適宜選択される。The organic solvent is not particularly limited, but is appropriately selected in relation to the resin, the organic solvent that dissolves the resin, and carbon dioxide.

【００１０】本発明において、熱硬化性樹脂がエポキシ
樹脂である場合、一般的には有機溶剤としてアセトン、
メチルエチルケトンを使用するのが好ましい。これらの
有機溶剤は二酸化炭素の溶解量が多く効果的である。必
要により他の溶剤も一部組み合わせて使用することも可
能である。熱硬化性樹脂がエポキシ樹脂であり、ノボラ
ック樹脂を硬化剤とする場合、トルエンを溶剤として使
用することも同様にして有効である。In the present invention, when the thermosetting resin is an epoxy resin, acetone is generally used as an organic solvent,
Preference is given to using methyl ethyl ketone. These organic solvents are effective because they have a large amount of dissolved carbon dioxide. If necessary, it is possible to use some other solvents in combination. When the thermosetting resin is an epoxy resin and the novolac resin is the curing agent, it is also effective to use toluene as the solvent.

【００１１】熱硬化性樹脂がエポキシ樹脂であり、硬化
剤としてジシアンジアミドを使用する場合、ジシアンジ
アミドを溶解するか又は溶解しているジシアンジアミド
を析出させない程度の溶解性を有し、二酸化炭素の溶解
性のよい有機溶剤が好ましい。かかる有機溶剤としてＤ
ＭＦ、ＤＥＦ、ＤＭＡＣ又はＤＭＳＯが好ましい。必要
により他の溶剤も一部組み合わせて使用することも可能
である。When the thermosetting resin is an epoxy resin and dicyandiamide is used as a curing agent, it has a solubility to the extent that it dissolves dicyandiamide or does not precipitate dissolved dicyandiamide, and the solubility of carbon dioxide Good organic solvents are preferred. D as such an organic solvent
MF, DEF, DMAC or DMSO are preferred. If necessary, it is possible to use some other solvents in combination.

【００１２】上記のような有機溶剤の使用により、繊維
基材を樹脂ワニスに含浸する際、繊維基材中のニードル
ボイド化しうる気体を有機溶剤に溶け込ませることによ
り、ニードルボイドの容積を大幅に減らすことができ
る。これらの溶剤は、２回含浸を行う場合、一次含浸の
樹脂ワニスに使用することが特に効果がある。二次含浸
の樹脂ワニスにも使用する方が望ましいことは当然であ
る。一次含浸に前記溶剤だけを使用しても効果がある
が、プリプレグの保存性や積層板の耐熱性及び外観が低
下することがあるので、注意する必要がある。When the resin varnish is impregnated with the fiber base material by using the organic solvent as described above, the gas capable of forming needle voids in the fiber base material is dissolved in the organic solvent to significantly increase the volume of the needle void. Can be reduced. When these solvents are impregnated twice, it is particularly effective to use them in the resin varnish for primary impregnation. Obviously, it is preferable to use the resin varnish for secondary impregnation. It is effective to use only the above solvent for the primary impregnation, but care must be taken because the storage stability of the prepreg and the heat resistance and appearance of the laminated plate may be deteriorated.

【００１３】二酸化炭素は、液化された二酸化炭素の使
用も考えられるが、臨界温度、臨界圧力の点から、現状
では実用化するのは難しいと思われる。Although it is possible to use liquefied carbon dioxide as carbon dioxide, it seems that it is difficult to put it into practical use at present in view of the critical temperature and the critical pressure.

【００１４】本発明の構成に従うと、従来問題となって
いたニードルボイドの数あるいは容積を、大きく、通常
１０ないし５０分の１以下に減少させることできる。本
発明と同様の効果を発現させるためには、基材の中に通
常入っている空気、特に窒素を溶解する有機溶剤（この
ようなものとしてはエーテル等がある）を使用する方法
が一応考えられるが、通常安全に取り扱われる有機溶剤
は実用的には存在しない。空気と置換しうる有機溶剤に
溶解する気体としては、たとえば、アセチレン、硫化水
素、二酸化イオウ、二酸化炭素等があり、実際に有効で
あることを確認したが、取り扱いが容易で、安全なもの
として炭酸ガスが最適である。According to the structure of the present invention, the number or volume of needle voids, which has been a problem in the past, can be reduced to a large value, usually 10 to 50 times or less. In order to exert the same effect as the present invention, it is considered to use an organic solvent which is usually contained in the substrate, particularly an organic solvent capable of dissolving nitrogen (such as ether). However, there is practically no organic solvent that can be safely handled. As the gas dissolved in an organic solvent that can be replaced with air, for example, acetylene, hydrogen sulfide, sulfur dioxide, carbon dioxide, etc. have been confirmed to be actually effective, but easy to handle and safe Carbon dioxide is the best choice.

【００１５】この方法で得られたプリプレグを使用して
積層板を作製する場合、プリプレグの中のボイドが非常
に小さくなり、さらにこのため積層板成形時の成形性が
向上するため、積層板の不良率の大幅な減少を達成する
ことができる。更に成形圧力を小さくすることができる
ので、成形ひずみの小さい、即ち反りが小さく寸法精度
の良好な積層板を得ることができる。気泡残存の少ない
プリプレグは成形時のフローが小さくても良好な特性の
積層板を得ることができる。フローを小さくすることに
より、成形された積層板の厚み精度が向上する他、プレ
ス装置の周囲を汚すことが少ない。さらに、積層板の加
工工程に及ぼす影響として、メッキ液がドリル加工やパ
ンチング等で形成された穴の断面からニードルボイドを
経て浸透していく距離を小さくすることができ、銅マイ
グレーション等の絶縁不良が減少するので、隣接するス
ルホール間隔が近接しているような高密度プリント配線
板に使用される積層板に適したプリプレグを得ることが
できる。When a laminated board is produced using the prepreg obtained by this method, voids in the prepreg become very small, and the moldability at the time of molding the laminated board is improved. A significant reduction in defect rate can be achieved. Further, since the molding pressure can be reduced, it is possible to obtain a laminated plate with a small molding strain, that is, a small warp and a good dimensional accuracy. A prepreg with few remaining bubbles can provide a laminate having good characteristics even if the flow during molding is small. By reducing the flow, the accuracy of the thickness of the formed laminated plate is improved, and the surroundings of the pressing device are not polluted. Furthermore, as an effect on the processing step of the laminated plate, it is possible to reduce the distance that the plating solution penetrates through the needle void from the cross section of the hole formed by drilling, punching, etc., resulting in insulation failure such as copper migration. Therefore, it is possible to obtain a prepreg suitable for a laminated board used for a high-density printed wiring board in which adjacent through holes are close to each other.

【００１６】[0016]

【実施例】以下、本発明を実施例及び比較例に基づき詳
細に説明する。The present invention will be described below in detail based on examples and comparative examples.

【００１７】（実施例１）２１０ｇ／ｍ2 のガラス織布
の巻物を密封容器に収容し、内部を真空にした後二酸化
炭素を導入した。そのまま５分間放置した後取り出し下
記の配合にエポキシ樹脂ワニス中に浸漬含浸した。取出
し後１５０℃にて乾燥してプリプレグを得た。 （エポキシ樹脂ワニスの配合） ビスフェノールＡ型エポキシ樹脂（エポキシ当量 190） ２５重量部 Ｂｒ化ビスフェノールＡ型エポキシ樹脂（エポキシ当量 750）４０重量部 （Ｂｒ化率２５％） テトラブロムビスフェノールＡ ３５重量部 ジシアンジアミド １重量部 メチルエチルケトン ６５重量部 ２−エチル−４−メチルイミダゾール ０.３重量部(Example 1) A roll of glass woven fabric of 210 g / m 2 was placed in a hermetically sealed container, the inside of which was evacuated, and carbon dioxide was introduced. It was left as it was for 5 minutes and then taken out and immersed in an epoxy resin varnish with the following composition by immersion. After taking out, it was dried at 150 ° C. to obtain a prepreg. (Composition of epoxy resin varnish) Bisphenol A type epoxy resin (epoxy equivalent 190) 25 parts by weight Br-ized bisphenol A type epoxy resin (epoxy equivalent 750) 40 parts by weight (Br conversion 25%) Tetrabromobisphenol A 35 parts by weight Dicyandiamide 1 part by weight Methyl ethyl ketone 65 parts by weight 2-Ethyl-4-methylimidazole 0.3 parts by weight

【００１８】（実施例２）２１０ｇ／ｍ2 のガラス織布
の巻物を巻出し、これに二酸化炭素を２ｋｇ／ｃｍ２の
圧力にて噴射した。続いて実施例１に使用したエポキシ
樹脂ワニスに浸漬含浸した後、取り出し１５０℃にて乾
燥してプリプレグを得た。Example 2 A roll of glass woven fabric of 210 g / m 2 was unwound, and carbon dioxide was sprayed onto it at a pressure of 2 kg / cm 2. Subsequently, the epoxy resin varnish used in Example 1 was dipped and impregnated, taken out and dried at 150 ° C. to obtain a prepreg.

【００１９】（実施例３）下記のエポキシ樹脂ワニスを
使用する以外は、実施例１と同様にしてプリプレグを得
た。 （エポキシ樹脂ワニスの配合） ビスフェノールＡ型エポキシ樹脂（エポキシ当量 190） ２５重量部 Ｂｒ化ビスフェノールＡ型エポキシ樹脂（エポキシ当量 750）４０重量部 （Ｂｒ化率２５％） テトラブロムビスフェノールＡ ３５重量部 ジシアンジアミド １重量部 ジメチルホルムアミド ６５重量部 ２−エチル−４−メチルイミダゾール ０.３重量部(Example 3) A prepreg was obtained in the same manner as in Example 1 except that the following epoxy resin varnish was used. (Composition of epoxy resin varnish) Bisphenol A type epoxy resin (epoxy equivalent 190) 25 parts by weight Br-ized bisphenol A type epoxy resin (epoxy equivalent 750) 40 parts by weight (Br conversion 25%) Tetrabromobisphenol A 35 parts by weight Dicyandiamide 1 part by weight Dimethylformamide 65 parts by weight 2-Ethyl-4-methylimidazole 0.3 parts by weight

【００２０】（実施例４）２１０ｇ／ｍ2 のガラス織布
の巻物を巻出し、これに二酸化炭素を２ｋｇ／ｃｍ２の
圧力にて噴射した。続いて実施例３に使用したエポキシ
樹脂ワニスに浸漬含浸した後、取り出し１５０℃にて乾
燥してプリプレグを得た。Example 4 A roll of 210 g / m 2 glass woven cloth was unwound and carbon dioxide was sprayed onto it at a pressure of 2 kg / cm 2. Subsequently, the epoxy resin varnish used in Example 3 was dipped and impregnated, taken out and dried at 150 ° C. to obtain a prepreg.

【００２１】（比較例）上記実施例において、ガラス織
布中の空気を二酸化炭素に置換することなくプリプレグ
を作製した。(Comparative Example) In the above examples, a prepreg was produced without replacing the air in the glass woven fabric with carbon dioxide.

【００２２】以上の実施例及び比較例にて得られたプリ
プレグについて、顕微鏡で１平方センチあたりのボイド
の数を調べた。結果は次の通りであり、実施例により得
られたプリプレグはボイドの数が大幅に減少しているこ
とがわかる。With respect to the prepregs obtained in the above Examples and Comparative Examples, the number of voids per square centimeter was examined with a microscope. The results are as follows, and it can be seen that the prepregs obtained in the examples have a significantly reduced number of voids.

【００２３】（プリプレグ中のボイドの数） 実施例１ １〜 ５ 実施例２ ５〜２０ 実施例３ ３〜 ５ 実施例４ １０〜２０ 比較例 １００〜２００以上(Number of Voids in Prepreg) Examples 1 to 5 Example 2 5 to 20 Example 3 3 to 5 Example 4 10 to 20 Comparative Example 100 to 200 or more

【００２４】[0024]

【発明の効果】本発明の方法により得られたプリプレグ
は、残存するボイドが大幅に減少しているので、このプ
リプレグを使用した積層板はボイドレスであり、ファイ
ンパターンの高密度プリント配線板用基板として特に好
適である。EFFECTS OF THE INVENTION The prepreg obtained by the method of the present invention has a significantly reduced number of remaining voids. Therefore, a laminated board using this prepreg is voidless, and a fine pattern high-density printed wiring board substrate. Is particularly suitable as

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 熱硬化性樹脂及び又は熱可塑性樹脂を有
機溶剤に溶解した樹脂ワニスを繊維基材に含浸し、乾燥
することによりプリプレグを製造する方法において、繊
維基材に樹脂ワニスを含浸するに先だって、繊維基材の
中に含まれている空気を二酸化炭素に置換することを特
徴とするプリプレグの製造方法。1. A method for producing a prepreg by impregnating a fiber varnish with a resin varnish prepared by dissolving a thermosetting resin and / or a thermoplastic resin in an organic solvent, and drying the prepreg. Prior to the step 1, a method for producing a prepreg, characterized in that air contained in the fiber base material is replaced with carbon dioxide. 【請求項２】 有機溶剤がアセトン、メチルエチルケト
ン、メチルイソブチルケトン、メチルセロソルブ及びト
ルエンの１種又は２種以上である請求項１記載のプリプ
レグの製造方法。2. The method for producing a prepreg according to claim 1, wherein the organic solvent is one or more of acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve and toluene. 【請求項３】 有機溶剤がジメチルホルムアミド（ＤＭ
Ｆ）、ジエチルホルムアミド（ＤＥＦ）、ジメチルスル
ホキジド（ＤＭＳＯ）及びジメチルアセトアミド（ＤＭ
ＡＣ）の１種又は２種以上である請求項１記載のプリプ
レグの製造方法。3. The organic solvent is dimethylformamide (DM
F), diethylformamide (DEF), dimethylsulfoxide (DMSO) and dimethylacetamide (DM)
The method for producing a prepreg according to claim 1, wherein the prepreg is one or more of AC). 【請求項４】 繊維基材がモノフィラメントを集束した
ヤーンを用いた織布である請求項１、２又は３記載のプ
リプレグの製造方法。4. The method for producing a prepreg according to claim 1, wherein the fiber base material is a woven fabric using a yarn in which monofilaments are bundled.
JP8967296A 1996-04-11 1996-04-11 Production of prepreg Pending JPH09278913A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8967296A JPH09278913A (en) 1996-04-11 1996-04-11 Production of prepreg

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8967296A JPH09278913A (en) 1996-04-11 1996-04-11 Production of prepreg

Publications (1)

Publication Number Publication Date
JPH09278913A true JPH09278913A (en) 1997-10-28

Family

ID=13977247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8967296A Pending JPH09278913A (en) 1996-04-11 1996-04-11 Production of prepreg

Country Status (1)

Country Link
JP (1) JPH09278913A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013203786A (en) * 2012-03-27 2013-10-07 Mitsubishi Rayon Co Ltd Methods for producing thermoplastic resin-impregnated fiber prepreg and fiber-reinforced thermoplastic resin sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013203786A (en) * 2012-03-27 2013-10-07 Mitsubishi Rayon Co Ltd Methods for producing thermoplastic resin-impregnated fiber prepreg and fiber-reinforced thermoplastic resin sheet

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