JPH09266389A - Module board latching mechanism - Google Patents

Module board latching mechanism

Info

Publication number
JPH09266389A
JPH09266389A JP7361296A JP7361296A JPH09266389A JP H09266389 A JPH09266389 A JP H09266389A JP 7361296 A JP7361296 A JP 7361296A JP 7361296 A JP7361296 A JP 7361296A JP H09266389 A JPH09266389 A JP H09266389A
Authority
JP
Japan
Prior art keywords
latch
module board
connector
memory module
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7361296A
Other languages
Japanese (ja)
Inventor
Hidenori Mukoudaka
秀紀 向高
Mitsuyuki Niwa
光之 丹羽
Tsuneo Baba
恒男 馬場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7361296A priority Critical patent/JPH09266389A/en
Publication of JPH09266389A publication Critical patent/JPH09266389A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a module board having a large flexibility for a dimensional accuracy. SOLUTION: When a module board 4 is fixed to a connector 1 by engaging latches 2 provided in the connector 1 into notches 3 made in the module board 4, a dimensional variation may cause the notches 3 of the module board 4 to be shifted from top points of the latches 3, so that a latching mechanism will not work properly. In order to avoid such a situation, the notches 3 of the module board 4 are made into a rectangular shape. Thereby the flexibility of dimensional accuracy of the connector and module board can be made large.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明はメモリ等のモジュー
ル基板をコネクタ側に設けられたラッチにセルフロック
動作にて固定するモジュール基板のラッチ機構に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a latch mechanism of a module board for fixing a module board such as a memory to a latch provided on a connector side by a self-locking operation.

【0002】[0002]

【従来の技術】モジュール基板を固定する機構として、
モジュール基板をコネクタに挿入すると同時にコネクタ
側に設けたラッチがセルフロック動作にて上記モジュー
ル基板に係合してモジュール基板を固定するラッチ機構
が提案されている。米国標準化機構であるJEDEC
(Joint Eelectron Device E
ngineering Council)はMO−16
0(規格)で、メモリモジュール基板として、ラッチの係
合する部分に半径2mmの半円の切り欠きを設ける構造
を提案している。メモリーモジュール基板をコネクタに
挿入しかつラッチの方向に押し込むと、この半円形の切
り欠き部分でバネ性を持ったラッチを押し広げる。さら
にモジュール基板を押し込むと、切り欠き部分がラッチ
の下に入り込み、ラッチが元の位置に戻ってモジュール
基板の上面に来るので、モジュール基板はラッチにより
固定される。
2. Description of the Related Art As a mechanism for fixing a module board,
A latch mechanism has been proposed in which a module board is inserted into a connector and a latch provided on the connector side is engaged with the module board by a self-locking operation to fix the module board. JEDEC, American National Standards Organization
(Joint Electron Device E
Nineering Council) is MO-16
In 0 (standard), as a memory module substrate, a structure is proposed in which a semicircular cutout having a radius of 2 mm is provided in the engaging portion of the latch. When the memory module board is inserted into the connector and pushed in the direction of the latch, the semi-circular cutout portion spreads the springy latch. When the module board is further pushed in, the notch portion enters under the latch, and the latch returns to its original position and comes to the upper surface of the module board, so that the module board is fixed by the latch.

【0003】[0003]

【発明が解決しようとする課題】この半円形のような切
り欠き形状の場合、モジュール基板をラッチ方向に押し
て切り欠き部分でラッチを押し広げてラッチを掛ける形
式の機構は、モジュール基板をラッチ方向に押しても、
コネクタとモジュール基板の寸法公差や組立作業の誤差
によりラッチの先端がモジュール基板の切り欠き部分ま
で広がらず、ラッチ機構が働かない場合がある。また、
その後も強く押し続けると、ラッチや基板の破損につな
がる。このように従来の機構はコネクタや基板の寸法精
度が厳しい。
In the case of the cutout shape such as the semicircular shape, a mechanism of pushing the module board in the latch direction and expanding the latch at the cutout portion to latch the module board is used. Even if you press
The latch mechanism may not work because the tip of the latch does not spread to the cutout portion of the module substrate due to the dimensional tolerance between the connector and the module substrate and an error in assembly work. Also,
If you continue to press it hard after that, it may damage the latch or the board. As described above, in the conventional mechanism, the dimensional accuracy of the connector and the board is severe.

【0004】本発明の目的は寸法精度の自由度が大きい
モジュール基板ラッチ機構を提供することにある。
An object of the present invention is to provide a module substrate latch mechanism having a large degree of freedom in dimensional accuracy.

【0005】[0005]

【課題を解決するための手段】本発明は、モジュール基
板をコネクタに挿入すると同時にコネクタ側に設けたラ
ッチがセルフロック動作にてモジュール基板に係合して
モジュール基板を固定するモジュール基板ラッチ機構に
おいて、ラッチが係合するモジュール基板の切り欠きの
形状を矩形とすることにより目的を達成する。
SUMMARY OF THE INVENTION The present invention provides a module board latch mechanism in which a module board is inserted into a connector and at the same time a latch provided on the connector side engages the module board by a self-locking operation to fix the module board. The object is achieved by making the notch of the module substrate with which the latch engages rectangular.

【0006】[0006]

【発明の実施の形態】以下、本発明の一実施例を図面を
参照して説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

【0007】図1、2はその全体の構成を示し、図1は
メモリーモジュール基板実装時の全体斜視図、図2はメ
モリーモジュール実装前の全体斜視図を示す。コネクタ
1はリード5と補強金具6を基板10に半田付けされ、
基板10に取り付けられている。メモリーモジュール基
板4には多数のIC8が搭載され、メモリーモジュール
を構成している。メモリーモジュール基板4は逆差し防
止キー9の向きに合わせ斜め方向からコネクタ1のリセ
プタクルコンタクト12に挿入する。メモリモジュール
基板4とコネクタ1は基板4の接栓11とコネクタ1の
コンタクト12で接続する。ただしこの時点ではコンタ
クト12とメモリーモジュールの接栓11の接続は不安
定である。その為、斜めにかん合されたメモリモジュー
ル基板4は基板10の方向に押してコネクタ1側に設け
られたラッチ2をモジュール基板4に設けた矩形形状の
切り欠き3の部分に係合させて固定し、コンタクト12
との間で適切な接触力を維持する。
FIGS. 1 and 2 show the entire structure thereof, FIG. 1 is an overall perspective view when a memory module substrate is mounted, and FIG. 2 is an overall perspective view before the memory module is mounted. In the connector 1, the lead 5 and the reinforcing metal member 6 are soldered to the substrate 10,
It is attached to the substrate 10. A large number of ICs 8 are mounted on the memory module substrate 4 to form a memory module. The memory module substrate 4 is inserted into the receptacle contact 12 of the connector 1 from an oblique direction in accordance with the direction of the reverse insertion prevention key 9. The memory module substrate 4 and the connector 1 are connected by the connector 11 of the substrate 4 and the contact 12 of the connector 1. However, at this point, the connection between the contact 12 and the plug 11 of the memory module is unstable. Therefore, the memory module board 4 which is diagonally engaged is fixed in the direction of the board 10 by engaging the latch 2 provided on the connector 1 side with the rectangular cutout 3 provided on the module board 4. Contact 12
Maintain proper contact force with.

【0008】図3、4および5はラッチ機構部分の拡大
図を示す。図3はラッチを掛ける直前のラッチ機構部分
の拡大図、図4はラッチが掛かる最中のラッチ機構部分
の拡大図、図5はラッチが掛かった後の拡大図を示す。
ラッチ2の形状は部分2aを頂点に上下左右にテーパー
がかかっている。メモリーモジュール基板4は基板10
の方向に押され、メモリーモジュール基板4の矩形状の
切り欠き3の部分がラッチ2の頂点2aに入ると切り欠
き3の基板端面がラッチ2のテーパー部を押す。ラッチ
2はバネ性を有しており、それに伴いラッチ2は可動用
切り溝14を中心に円を描き横に広がる構造になってい
る。ラッチ2の先端2bがメモリーモジュール基板4の
切り欠き3の範囲内に入ると、ラッチ2は元の位置に戻
りラッチ先端2bはメモリーモジュール基板4の上面に
くる。それによりメモリーモジュール基板4はラッチ2
が上面にあるため元の斜めの位置に戻れず、基板4はそ
の位置に固定される。
3, 4 and 5 show enlarged views of the latch mechanism portion. 3 is an enlarged view of the latch mechanism portion immediately before latching, FIG. 4 is an enlarged view of the latch mechanism portion during latching, and FIG. 5 is an enlarged view after latching.
The shape of the latch 2 is such that the portion 2a is tapered at the top and bottom and left and right. The memory module substrate 4 is the substrate 10
When the rectangular notch 3 of the memory module substrate 4 is pushed into the apex 2a of the latch 2, the substrate end face of the notch 3 pushes the taper portion of the latch 2. The latch 2 has a spring property, and accordingly, the latch 2 has a structure that draws a circle around the movable kerf 14 and spreads laterally. When the tip 2b of the latch 2 enters the range of the notch 3 of the memory module board 4, the latch 2 returns to the original position and the latch tip 2b comes to the upper surface of the memory module board 4. As a result, the memory module substrate 4 has the latch 2
Since it is on the upper surface, it cannot return to the original diagonal position, and the substrate 4 is fixed at that position.

【0009】メモリモジュール基板4の抜去は、ラッチ
2の解除金具7を外側に押し広げることによりラッチが
解除され、メモリーモジュール基板4は挿入時の斜めの
角度に戻る。斜めに挿入されているメモリーモジュー基
板4は指で挟み抜き取る。
When the memory module substrate 4 is removed, the latch is released by pushing the release metal fitting 7 of the latch 2 outward, and the memory module substrate 4 returns to the oblique angle at the time of insertion. The memory module board 4 inserted at an angle is pinched with fingers.

【0010】図6は図3に対応した従来例を示す。メモ
リーモジュール基板4aの切り欠き3aは、ラッチ2を
取り巻くように半円形の形状となっている。なおここで
本発明によるメモリモジュール基板4との違いを説明す
るため、図6には本発明によるメモリーモジュール基板
4の切り欠き3(矩形形状)を破線で示した。基板端面
と平行でラッチ2の頂点2aを通る線を仮想線13で示
す。仮想線より解除金具7側の外側の方で切り欠き3a
があたると、ラッチ2は狭まる方向に力が加わり、押し
広げられる方向に動かず、ラッチ機構を働かせることが
出来ない。しかし仮想線より内側で切り欠き3aがあた
ると切り欠き3aはラッチ2を広げながら基板10の方
向に進めラッチを掛けることが出来る。図6のように切
り欠き3aとラッチ2がズレている場合、切り欠き3a
とラッチ2が最初にあたるのは、部分2cである。部分
2cは仮想線13より外側である解除金具7側のため、
モジュール基板4aを押してもラッチ2が下に変形する
だけで、ラッチ2は横に広がらない。しかし本発明では
破線3のように切り欠きしているため、ラッチ2と切り
欠き3が最初にあたるのは常に部分2dであり、仮想線
13より常に内側のためメモリーモジュール基板4は切
り欠き3でラッチを広げながら基板10の方向に進むこ
とができる。
FIG. 6 shows a conventional example corresponding to FIG. The notch 3a of the memory module substrate 4a has a semicircular shape so as to surround the latch 2. In order to explain the difference from the memory module substrate 4 according to the present invention, the notch 3 (rectangular shape) of the memory module substrate 4 according to the present invention is shown by a broken line in FIG. An imaginary line 13 indicates a line that is parallel to the substrate end face and that passes through the apex 2a of the latch 2. Notch 3a on the outside of the release metal fitting 7 side from the virtual line
When hit, the latch 2 is applied with a force in a narrowing direction, does not move in a pushing-out direction, and the latch mechanism cannot be operated. However, if the notch 3a hits the inside of the imaginary line, the notch 3a can be extended toward the substrate 10 while unfolding the latch 2 to engage the latch. When the notch 3a and the latch 2 are displaced as shown in FIG. 6, the notch 3a
The latch 2 first hits the portion 2c. Since the portion 2c is the release metal fitting 7 side which is outside the imaginary line 13,
Even if the module board 4a is pushed, the latch 2 is only deformed downward, and the latch 2 does not spread laterally. However, in the present invention, since the notch is shown as the broken line 3, the latch 2 and the notch 3 always come first in the portion 2d, and since the memory module substrate 4 is always inside the virtual line 13, the notch 3 is present. The latch can be unfolded and advanced towards the substrate 10.

【0011】図7、8はメモリーモジュールの基板の全
体図を示しており、図7は本発明の一実施例を示し、図
8は従来例を示している。本発明は切り欠き形状を四角
い矩形の形状にしてラッチ頂点を広い範囲で待ち受け、
ラッチ頂点の摺動部分を短くすることが出来る。切り欠
き内の角の部分は最小限のコーナーRがあってもよい。
これにより従来例の半円形状と比べるとラッチ頂点を待
ち受ける範囲が広がる為、コネクタのラッチと基板切り
欠きとの相対位置のズレの誤差を吸収することが出来
る。
7 and 8 show an overall view of the substrate of the memory module, FIG. 7 shows one embodiment of the present invention, and FIG. 8 shows a conventional example. The present invention makes the notch shape into a rectangular shape and waits for the latch apex in a wide range,
The sliding part of the latch apex can be shortened. The corner portion in the cutout may have a minimum corner R.
As a result, the range of waiting for the latch apex is widened as compared with the semi-circular shape of the conventional example, so that it is possible to absorb the error in the relative position deviation between the connector latch and the board cutout.

【0012】[0012]

【発明の効果】本発明によれば、コネクタとモジュール
基板の寸法公差が吸収できるので、コネクタと基板の寸
法精度をあげる必要がなくなり、寸法精度の自由度を大
きくすることができる。また組み立てのバラツキを気に
しなくてよくなる為、組み立て性が容易になる。
According to the present invention, the dimensional tolerances of the connector and the module board can be absorbed, so that it is not necessary to increase the dimensional accuracy of the connector and the board, and the degree of freedom of the dimensional accuracy can be increased. In addition, it is easy to assemble because there is no need to worry about variations in assembly.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示すメモリモジュール基板
実装時の全体斜視図。
FIG. 1 is an overall perspective view of a memory module substrate mounted on an embodiment of the present invention.

【図2】図1に示したメモリモジュール基板の実装前の
全体斜視図。
2 is an overall perspective view of the memory module substrate shown in FIG. 1 before mounting.

【図3】図1に示したラッチを掛ける直前のラッチ機構
部分の拡大図。
FIG. 3 is an enlarged view of a latch mechanism portion immediately before the latch shown in FIG. 1 is applied.

【図4】図1に示したラッチが掛かる最中のラッチ機構
部分の拡大図。
FIG. 4 is an enlarged view of a latch mechanism portion in the middle of engaging the latch shown in FIG.

【図5】図1に示したラッチが掛かった後のラッチ機構
部分の拡大図。
5 is an enlarged view of a latch mechanism portion after the latch shown in FIG. 1 is engaged.

【図6】従来のラッチ機構を示す図。FIG. 6 is a view showing a conventional latch mechanism.

【図7】図1に示したメモリモジュール基板の外形図。7 is an external view of the memory module substrate shown in FIG.

【図8】従来のメモリモジュール基板の外形図。FIG. 8 is an external view of a conventional memory module board.

【符号の説明】[Explanation of symbols]

1:コネクタ、2:ラッチ、2a:ラッチ頂点、2b:
ラッチ先端、3:切り欠き、4:メモリーモジュール基
板、5:リード、6:補強金具、7:解除金具、8:I
C、9:逆差し防止キー、10:基板、11:接栓、1
2:コンタクト
1: Connector, 2: Latch, 2a: Latch apex, 2b:
Latch tip, 3: Notch, 4: Memory module board, 5: Lead, 6: Reinforcing metal fitting, 7: Release metal fitting, 8: I
C, 9: Reverse insertion prevention key, 10: substrate, 11: plug, 1
2: Contact

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】モジュール基板をコネクタに挿入すると同
時にコネクタ側に設けたラッチがセルフロック動作にて
上記モジュール基板に係合してモジュール基板を固定す
るモジュール基板ラッチ機構において、上記ラッチが係
合するモジュール基板の切り欠きの形状を矩形としたこ
とを特徴とするモジュール基板ラッチ機構。
1. A module board latch mechanism for fixing a module board by inserting a module board into a connector and engaging a latch provided on the connector side with the module board in a self-locking operation at the same time. A module board latch mechanism, wherein a notch of the module board has a rectangular shape.
JP7361296A 1996-03-28 1996-03-28 Module board latching mechanism Pending JPH09266389A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7361296A JPH09266389A (en) 1996-03-28 1996-03-28 Module board latching mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7361296A JPH09266389A (en) 1996-03-28 1996-03-28 Module board latching mechanism

Publications (1)

Publication Number Publication Date
JPH09266389A true JPH09266389A (en) 1997-10-07

Family

ID=13523341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7361296A Pending JPH09266389A (en) 1996-03-28 1996-03-28 Module board latching mechanism

Country Status (1)

Country Link
JP (1) JPH09266389A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8605456B2 (en) 2009-10-02 2013-12-10 Kabushiki Kaisha Toshiba Electronic apparatus
JP2015035546A (en) * 2013-08-09 2015-02-19 東芝シュネデール・インバータ株式会社 Print circuit board
JP2017208412A (en) * 2016-05-17 2017-11-24 三菱電機株式会社 Electronic control device
JP2019054109A (en) * 2017-09-15 2019-04-04 日立アプライアンス株式会社 Operation panel and refrigerator including the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8605456B2 (en) 2009-10-02 2013-12-10 Kabushiki Kaisha Toshiba Electronic apparatus
JP2015035546A (en) * 2013-08-09 2015-02-19 東芝シュネデール・インバータ株式会社 Print circuit board
JP2017208412A (en) * 2016-05-17 2017-11-24 三菱電機株式会社 Electronic control device
JP2019054109A (en) * 2017-09-15 2019-04-04 日立アプライアンス株式会社 Operation panel and refrigerator including the same

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