JPH09260267A - Scanning type exposing equipment and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the reset of an attenuation filter at the time of alignment which is due to deterioration of a light source unnecessary, improve throughput, make a circuit for two modes which is installed in a power supply of the light source simpler, miniaturize the light source, and reduce the cost. SOLUTION: At the time of scanning exposure when an exposure shutter 5 is opened, exposure light is controlled in a constant illuminance mode, on the basis of the exposure light on an exposure light path on the side of a substrate 7 to be exposed from the shutter 5. At the time of non-scanning exposure when the shutter 5 is closed, postion alignment between an original sheet 6 and the substrate to be exposed is performed by the light led out from the exposure light path in this side from the shutter 5. At the time of non-scanning exposure, the constant illuminance mode control of exposure light is performed, on the basis of the light on the exposure light path on this side from the shutter 5 or the light led out from the path. Thereby the exposure light can be always controlled in a constant illumination mode, independently of exposure time and non-exposure time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus used in a semiconductor device manufacturing process, and more particularly to a projection exposure apparatus for projecting and transferring a reticle pattern onto a wafer, and more particularly to projecting a reticle pattern onto a wafer. At this time, the present invention relates to a scanning type exposure apparatus and method for synchronously scanning by moving a reticle and a wafer relative to a projection optical system.

[0002]

2. Description of the Related Art The recent progress in the manufacturing technology of semiconductor devices is remarkable, and the progress in the fine processing technology is also remarkable. In particular, the optical processing technology is mainly a step-type reduction projection exposure apparatus having a resolution of submicron, commonly known as a stepper. To further improve the resolution, the numerical aperture (NA) of the optical system is increased.
And the exposure wavelength has been shortened.

Further, a conventional scanning exposure apparatus of the same magnification using a reflection optical system is remodeled, a refraction element is incorporated in a projection optical system, and the reflection element and the refraction element are combined, or only the refraction element is constituted. Attention has also been focused on a scanning exposure apparatus which uses the reduction projection optical system described above to synchronously scan both the original stage (reticle stage) and the exposure substrate stage (wafer stage) at a speed ratio corresponding to the reduction magnification.

These step exposure type and scanning exposure type exposure apparatuses are provided with an exposure amount control mechanism for adjusting the exposure amount of each shot on the wafer to a predetermined value. FIG. 4 shows a step exposure type exposure apparatus having a conventional exposure amount control mechanism. In this exposure apparatus, as shown in FIG. 4, the light emitted from the mercury lamp 1 is condensed by the elliptical mirror 2 and reaches the exposure shutter 5 via the mirror switching mechanism 4 for branching the light to the alignment system. The exposure shutter 5 is controlled to be opened and closed by the exposure amount control means 41.
When the exposure shutter 5 is open, the light passes through the condenser lens 21 and the band pass filter 23, and then the reticle 6
The fly's eye lens 24 for uniformizing the illuminance on the surface is irradiated. A part of the light emitted from the fly-eye lens 24 is taken out by the half mirror 25, enters the integrating exposure meter 11, and the illuminance is measured. Since the integration exposure meter 11 is installed at a conjugate position of the reticle 6, the illuminance proportional to the illuminance on the surface of the wafer 7 can be accurately measured. The illuminance data obtained by the measurement is transmitted to the exposure amount control means 41 for controlling the exposure amount. Most of the light emitted from the fly-eye lens 24 is collimated by the collimator lens 27 and is uniformly irradiated onto the reticle 6. The device pattern on the reticle 6 is reduced by the projection lens 28, and the wafer 7
The image is transferred onto the image.

Further, the light used for aligning the reticle 6 and the wafer 7 is guided to the alignment system by inserting the mirror switching mechanism 4 in the optical path. The light guided to the alignment system is an attenuation filter 31 for adjusting the amount of light.
The light amount is adjusted to an optimum light amount by the irradiation, and the alignment mark on the reticle 6 and the alignment mark previously formed on the wafer 7 in the previous step are irradiated. The alignment mark image on the reticle 6 and the alignment mark image on the wafer 7 are collectively observed by the observation camera 33, the deviation amount of each alignment mark image is calculated, and the reticle 6 or the wafer 7 is calculated.
The reticle 6 and the wafer 7 are aligned with each other by driving the correction.

Next, the exposure amount control in the step-exposure type exposure apparatus having this configuration will be described. At the same time when the exposure shutter 5 is opened by the exposure amount control means 41, measurement of the illuminance is started by the integrating exposure meter 11 and the illuminance is temporally integrated to obtain the exposure energy of the light applied to the wafer 7. When the calculated exposure energy reaches the preset exposure energy optimum for the exposure of the wafer 7, the exposure shutter 5 is closed. In this case, even if the illuminance changes during the exposure, the wafer 7 is irradiated with the exposure energy equal to the set exposure amount only by changing the opening time of the exposure shutter 5 according to the change amount. Therefore, the mercury lamp 1 is generally used in a constant power mode in which constant power is supplied from the mercury lamp power supply 42.

The constant power mode is also used during alignment. The temporal change of the illuminance is controlled to a constant value by switching the attenuation rate of the attenuation filter 31 together with the change of the reflectance of the alignment mark on the wafer 7, and the optimum value is made incident on the observation camera 33. There is.

Therefore, in a step exposure type exposure apparatus that collectively exposes the exposure area of each shot, the mercury lamp 1 is generally controlled in a constant power mode during both exposure and alignment.

However, in a recent scanning exposure apparatus, which is drawing attention due to the miniaturization and large area of semiconductor circuit patterns, the mercury lamp 1 has two modes such as a constant illuminance mode during exposure and a constant power mode during alignment. Used by switching.

FIG. 3 shows a scanning exposure type exposure apparatus having a conventional exposure amount control mechanism. In FIG. 3, the light emitted from the mercury lamp 1 is condensed by the elliptical mirror 2 and reaches the exposure shutter 5 via the mirror switching mechanism 4 for branching the light to the alignment system. The exposure shutter 5 is controlled to be opened and closed by the exposure amount control means 41. When the exposure shutter 5 is open, the light passes through the condenser lens 21 and the bandpass filter 23 and is applied to the fly-eye lens 24 for equalizing the illuminance on the surface of the reticle 6. A part of the light emitted from the fly-eye lens 24 is a half mirror 25.
The light illuminance is measured by the integrated exposure meter 11. Since the integration exposure meter 11 is installed at a conjugate position of the reticle 6, the illuminance proportional to the illuminance on the surface of the wafer 7 can be accurately measured. The illuminance data obtained by the measurement is transmitted to the exposure amount control means 41 for controlling the exposure amount. Most of the light emitted from the fly-eye lens 24 is shaped into a rectangular beam whose longitudinal direction is the direction perpendicular to the scanning direction of the reticle stage 51, and then is collimated by a collimator lens 27 to be collimated light. 6 is illuminated. The device pattern on the reticle 6 is reduced by the projection lens 28 and image-transferred onto the wafer 7 on the wafer stage 52.

The light used for aligning the reticle 6 and the wafer 7 is guided to the alignment system by inserting the mirror switching mechanism 4 in the optical path. The light guided to the alignment system is an attenuation filter 31 for adjusting the amount of light.
The light amount is adjusted to an optimum light amount by the irradiation, and the alignment mark on the reticle 6 and the alignment mark previously formed on the wafer 7 in the previous step are irradiated. The alignment mark image on the reticle 6 and the alignment mark image on the wafer 7 are collectively observed by the observation camera 33, the deviation amount of each alignment mark image is calculated, and the reticle 6 or the wafer 7 is calculated.
The reticle 6 and the wafer 7 are aligned with each other by driving the correction.

Next, the exposure amount control in the scanning exposure type exposure apparatus having this configuration will be described. At the same time when the stage drive control means 43 starts the synchronous scanning of the reticle stage 51 and the wafer stage 52, the exposure amount control means 41 opens the exposure shutter 5. The scanning exposure is started from one end of the device pattern area of the reticle 6 with the exposure beam shaped so that the direction perpendicular to the scanning direction becomes the longitudinal direction, and ends when the other end is reached. Therefore, if there is a change in the illuminance of the exposure beam during this scanning exposure, the exposure amount becomes uneven. Therefore, in the case of scanning exposure, in order to make the illuminance of the exposure beam constant, the exposure amount control means 41 controls the mercury lamp power supply 42 so that the illuminance data obtained from the integrating exposure meter 11 becomes constant. Therefore, the mercury lamp 1 is generally used in a constant illuminance mode in which electric power is supplied from the mercury lamp power source 42 so that the illuminance of the mercury lamp 1 is constant.

However, the constant power mode is used during alignment. This is because the exposure shutter 5 is closed so as not to expose the wafer during alignment, and as a result, the exposure beam does not reach the integrating exposure meter 11 placed after the exposure shutter 5. Therefore, the integrated exposure meter 11
This is because the constant illuminance mode control of the mercury lamp 1 using the illuminance data of 1 cannot be used.

Therefore, in a scanning exposure type exposure apparatus which scans and exposes the exposure area of each shot, it is general to control the mercury lamp 1 in a constant illuminance mode during exposure and in a constant power mode during alignment.

[0015]

However, the conventional example of the above-mentioned scanning exposure apparatus has the following drawbacks because the mercury lamp 1 is controlled in the constant illuminance mode during exposure and in the constant power mode during alignment.

When the mercury lamp 1 is used in the constant power mode, the illuminance decreases to about 70% due to deterioration. The decrease in the brightness of the alignment mark image due to the deterioration in illuminance is corrected by controlling the attenuation amount of the attenuation filter 31 of the alignment system. The brightness of the alignment mark image on the wafer 7 also changes depending on the surface condition of the wafer 7. Therefore, the brightness of the alignment mark image due to the change of the surface condition is also adjusted by controlling the attenuation rate of the attenuation filter 31. There is. The brightness of the alignment mark image due to the difference in the surface state is almost determined by the type of device processed on the wafer 7 in the previous process and the process thereof. The specified wafer always has almost the same brightness of the alignment mark image. Therefore, in the job file in which the device type and the detailed items to be processed in this step are recorded, the attenuation amount of the attenuation filter 31 that can obtain the optimum brightness of the alignment mark image after performing the alignment once is set. If it is recorded, in the case of a wafer that can be processed by the same job file again, the alignment mark image can be observed without dimming the alignment mark. However, in reality, since the illuminance of the mercury lamp 1 is deteriorated, the resetting of the attenuation filter 31 is executed every time alignment is performed even on a wafer processed by the same job file, which has a disadvantage of decreasing throughput.

Further, since the mercury lamp power source 42 is also used in two modes of the constant power mode and the constant illuminance mode, it is necessary to equip a circuit structure corresponding to each mode, so that the outer shape of the mercury lamp power source 42 becomes large. However, it also has the drawback of being expensive.

Therefore, a first object of the present invention is to improve the throughput by eliminating the need to reset the attenuation filter at the time of alignment due to the deterioration of the illuminance of the mercury lamp.

A second object of the present invention is to make the circuit for two modes equipped in the mercury lamp power supply simpler, to reduce the size of the mercury lamp power supply and to reduce the cost.

[0020]

To achieve this object, in the present invention, a light source such as a mercury lamp is used only in a constant illuminance mode regardless of exposure or alignment. In order to realize this, in the present invention, the illuminance of the exposure light is measured on the light source side of the exposure shutter, and the light source is controlled in the constant illuminance mode based on the illuminance data. That is, the illuminance of the exposure light can be measured even when the exposure shutter is closed. In this way, by using the illuminance data measured on the light source side of the exposure shutter, even when the illuminance data from the conventional integrating exposure meter is unusable when the exposure shutter is closed as in alignment, the light source It is possible to control in the constant illuminance mode.

As a result, even during alignment, the alignment mark can always be illuminated with a constant illuminance regardless of the deterioration of the light source, so that it is possible to omit dimming of the alignment mark image due to the deterioration of the light source. Throughput is improved. In addition, since the power source of the light source can always be used in the constant illuminance mode regardless of the exposure and alignment, it is possible to remove the circuit of the constant power mode from the power source of the light source, and the power source of the light source can be downsized and the price can be reduced. There is an effect that can be realized.

[0022]

FIG. 1 shows a scanning exposure type exposure apparatus having an exposure amount control mechanism according to an embodiment of the present invention. FIG. 2 is a flowchart of the operation of this device. As shown in FIG. 1, in this device, light emitted from a mercury lamp 1 having a bright line spectrum such as i-line is condensed by an elliptical mirror 2 and a mirror switching mechanism 4 for branching the light to an alignment system is provided. After that, the exposure shutter 5 is reached. The exposure shutter 5 is controlled to be opened and closed by the exposure amount control means 41. When the exposure shutter 5 is open, the light passes through the condenser lens 21 and the bandpass filter 23,
The fly-eye lens 24 for uniformizing the illuminance on the surface of the reticle 6 is irradiated. A part of the light emitted from the fly-eye lens 24 is taken out by the half mirror 25, enters the integrating exposure meter 11, and the illuminance of the light is measured. Since the integration exposure meter 11 is installed at a conjugate position of the reticle 6, the illuminance proportional to the illuminance on the surface of the wafer 7 can be accurately measured. The measured illuminance data is transmitted to the exposure amount control means 41 for controlling the exposure amount. Most of the light emitted from the fly-eye lens 24 is shaped into a rectangular beam whose longitudinal direction is the direction perpendicular to the scanning direction of the reticle stage 51, and then is collimated by the collimator lens 27,
The reticle 6 is irradiated. The device pattern on the reticle 6 is reduced by the projection lens 28 and image-transferred onto the wafer 7 on the wafer stage 52.

The light used for aligning the reticle 6 and the wafer 7 is guided to the alignment system by inserting the mirror switching mechanism 4 in the optical path. The light guided to the alignment system is adjusted to an optimum light quantity by the attenuation filter 31 for adjusting the light quantity, and is irradiated on the alignment mark on the reticle 6 and the alignment mark previously formed on the wafer 7 in the previous step. The alignment mark image on the reticle 6 and the alignment mark image on the wafer 7 are collectively observed by the observation camera 33, the deviation amount of each alignment mark image is calculated, and the reticle 6 or the wafer 7 is corrected and driven to correct the reticle 6. The wafer 7 is aligned.

A part of the light of the mercury lamp 1 taken out by the half mirror 29 inserted in the optical path of the arc monitor 3 for observing the arc position of the mercury lamp 1 is detected by the illuminance sensor 12 of the exposure shutter 5. Irrespective of the open / closed state, it is always converted into illuminance data proportional to the illuminance of the mercury lamp 1.

Next, the exposure amount control in this configuration will be described with reference to the flowchart of FIG. First, the exposure amount control during alignment will be described.

Prior to scanning exposure, alignment between the device pattern on the reticle 6 and the device pattern on the wafer 7 is performed. Therefore, first, the mirror switching mechanism 4 is inserted into the optical path to guide the light emitted from the mercury lamp 1 to the alignment system (step a).

During alignment, the exposure shutter 5 is closed so that the wafer is not exposed, and as a result, the exposure beam does not reach the integrating exposure meter 11 placed on the reticle 6 side of the exposure shutter 5. Therefore, the constant illuminance mode control using the illuminance data of the integrating exposure meter 11 cannot be used. Therefore, the constant illuminance mode using the illuminance data measured by the illuminance sensor 12 installed on the mercury lamp 1 side of the exposure shutter 5 is used. That is, the exposure control means 41 performs the constant illuminance mode control by supplying a command signal such as a voltage to the illuminance data of the illuminance sensor 12 to a predetermined value to the external control terminal of the mercury lamp power supply 42 (step b). .

Next, the attenuation rate of the attenuation filter 31 inserted in the alignment optical path so that the alignment mark images on the reticle 6 and the wafer 7 can be observed by the observation camera 33 with appropriate brightness is stored in advance in the job file. Set to the recorded value (step c).

Then, the deviation amount between the alignment mark images on the reticle 6 and the wafer 7 is measured, and the reticle stage 51 or the wafer stage 52 is corrected and driven (step d).

Next, the exposure amount control during scanning exposure will be described. First, the exposure light is guided to the exposure shutter 5 by moving the mirror switching mechanism 4 out of the optical path (step e).

Next, the stage drive control means 43 starts synchronous scanning of the reticle stage 51 and the wafer stage 52, and at the same time, the exposure amount control means 41 opens the exposure shutter 5 (step f). This scanning exposure starts from one end of the device pattern area of the reticle 6 by the exposure beam shaped in the longitudinal direction perpendicular to the scanning direction and ends when it reaches the other end, but during this scanning exposure If there is a change in the illuminance of the exposure beam, it will result in uneven exposure amount.

Therefore, during the scanning exposure period, in order to keep the illuminance of the exposure beam constant, the exposure amount control means 41 controls the mercury lamp power supply 42 so that the illuminance data obtained from the integrating exposure meter 11 becomes constant. That is, the mercury lamp 1 is used in a constant illuminance mode in which electric power is supplied from the mercury lamp power supply 42 so that the illuminance of the mercury lamp 1 is constant. Mercury lamp power supply 4
2 is designed so that the electric power supplied to the mercury lamp 1 changes based on a control command such as a voltage applied to its external control terminal. Therefore, the exposure amount control means 41 performs constant illuminance mode control by supplying a command signal such as a voltage to the illuminance data of the integrating exposure meter 11 to a predetermined value to the external control terminal of the mercury lamp power source 42 (step g). ).

When the scanning with the exposure beam reaches the end of the device pattern of the reticle 6, the exposure shutter 5 is closed and the scanning exposure is completed (step h).

The electric power supplied to the mercury lamp 1 in the constant illuminance mode at the time of exposure and the electric power supplied to the mercury lamp 1 in the constant illuminance mode at the time of alignment other than the exposure may be the same or different. May be. That is, the optimum target illuminance of the mercury lamp 1 may be set for each of the exposure and the alignment, and the supplied power may be controlled so that the illuminance is set.

If the illuminance of the mercury lamp 1 at the time of alignment is set to a constant value, the alignment mark image is observed by the observation camera 33.
Since the brightness of the image when captured in step 1 is almost determined by the surface condition of the wafer 7 in the previous step, the dimming by the attenuation filter 31 is performed only once in the wafer in which the previous step is the same. However, if the optimum attenuation rate is obtained, thereafter, the attenuation rate may be recorded in a job file or the like and used.

In this embodiment, the incident light to the illuminance sensor 12 installed on the mercury lamp 1 side of the exposure shutter 5 is extracted by inserting the half mirror 29 in the optical path of the arc monitor 3. Illuminance sensor 12
The position at which the incident light is extracted may be in the optical path of the alignment system or in the optical path of the exposure light as long as it is on the mercury lamp 1 side of the exposure shutter 5.

Further, although the mercury lamp is used as the exposure light source in this embodiment, a pulse laser such as an excimer may of course be used.

[0038]

As described above, according to the present invention,
Since the light source can be used in the constant illuminance mode not only at the time of scanning exposure but also at the time of alignment, it is possible to ignore the influence of a decrease in illuminance due to deterioration of the mercury lamp at the time of alignment. As a result, for wafers of the same type processed in the same pre-process, by using the attenuation factor of the attenuation filter obtained by dimming the same type of wafer once, It is possible to omit the dimming of the light, and there is an effect that the throughput is improved.

Further, since the light source is always controlled in the constant illuminance mode, the control circuit required for the constant power mode, which is provided in the conventional mercury lamp power supply, becomes unnecessary, and the mercury lamp power supply can be downsized and the cost can be reduced. There is an effect.

[Brief description of drawings]

FIG. 1 is a diagram showing an entire exposure apparatus according to an embodiment of the present invention.

2 is a flowchart of an exposure process in the apparatus of FIG.

FIG. 3 is a diagram showing a conventional scanning exposure type exposure apparatus.

FIG. 4 is a diagram showing a conventional step exposure type exposure apparatus.

[Explanation of symbols]

1: Mercury lamp, 2: Elliptical mirror, 3: Arc monitor, 4:
Mirror switching mechanism, 5: exposure shutter, 6: reticle,
7: wafer, 11: integrating exposure meter, 12: illuminance sensor, 2
1: Condenser lens, 22: Mirror, 23: Bandpass filter, 24: Fly's eye lens, 25: Half mirror, 26: Mirror, 27: Collimator lens, 28: Projection lens, 29: Half mirror, 31: Attenuation filter ,
32: half mirror, 33: observation camera, 41: exposure amount control means, 42: mercury lamp power supply, 43: stage drive control means, 51: reticle stage, 52: wafer stage.

Claims (9)

[Claims] 1. A first movable stage on which an original plate on which a transfer pattern is formed is placed and moved; a second movable stage on which a photosensitive substrate is placed and moved; and a first movable stage formed on the original plate. A projection optical system for projecting the pattern on the photosensitive substrate, and means for moving the first and second movable stages relative to the projection optical system to synchronously scan the original plate and the substrate. An electric power supply unit for supplying electric power to the exposure light source; an exposure light shielding unit for shielding the exposure light emitted from the exposure light source toward the original plate; an illuminance measuring unit for measuring the illuminance of the exposure light; An exposure amount control unit that controls the power supply unit according to the illuminance of the exposure light to perform a constant illuminance mode control so that the illuminance of the exposure light during exposure is maintained at a predetermined value, the exposure light source, and the exposure. Light between the light blocking means In a scanning type exposure apparatus provided with an alignment unit that aligns the original plate and a substrate with the exposure light taken out from above, the illuminance measuring unit is exposed regardless of whether the exposure light is shielded by the exposure light shielding unit. It is possible to measure the illuminance of light, and the exposure amount control means can perform constant illuminance mode control based on the illuminance regardless of whether the exposure light is shielded by the exposure light shield means. A scanning exposure apparatus characterized in that 2. The illuminance measuring means is disposed on an exposure light path between the exposure light shielding means and the original plate, and the first exposure amount measuring means measures the exposure energy of the exposure light, and the exposure light. A second exposure amount measuring unit arranged on an exposure optical path on the exposure light source side of the shielding unit or on an optical path branched from the exposure light source, for measuring the exposure energy of the exposure light; At the time, the power supply unit is controlled in the constant illuminance mode based on the exposure energy measured by the first exposure amount measuring unit, and when the exposure light is shielded except during the scanning exposure or when the exposure light shielding unit shields the exposure light. 2. The scanning type exposure apparatus according to claim 1, wherein the power supply means is controlled in a constant illuminance mode based on the exposure energy measured by the second exposure amount measuring means. 3. An alignment means for aligning the original plate and the substrate with exposure light extracted from an exposure light path between the exposure light source and the exposure light shield means,
3. The exposure amount control means controls the power supply means at a constant illuminance mode based on the exposure energy measured by the second exposure amount measuring means during the alignment. Scanning exposure equipment. 4. The exposure amount control means sets the target illuminance in the constant illuminance mode control during the scanning exposure and the target illuminance in the constant illuminance mode control during the alignment between the original and the substrate to be the same or 4. The scanning exposure apparatus according to claim 1, which is different. 5. The scanning type exposure apparatus according to claim 1, wherein the exposure light source is a mercury lamp for i-line or the like. 6. The scanning exposure apparatus according to claim 1, wherein the exposure light source is a pulse laser such as an excimer. 7. A first movable stage on which an original plate on which a transfer pattern is formed is placed and a second movable stage on which a photosensitive substrate is placed are moved relative to a projection optical system. A scanning exposure method for performing scanning exposure by projecting the pattern of the original onto the substrate through the projection optical system while performing synchronous scanning, wherein the exposure is emitted from an exposure light source toward the original. A step of switching the state of light between a shielded state and a non-shielded state by a shielding means; and, in the non-shielded state, based on a measured value of energy of exposure light on the original side from the shielding means during scanning exposure. And an exposure amount control step of controlling a constant illuminance mode so that the exposure light maintains a predetermined illuminance, wherein the exposure amount control step is the original plate in the shielded state. When aligning the substrate and the substrate prior to scanning exposure, the method further comprises the step of controlling the exposure light in a constant illuminance mode based on the energy of the exposure light in an unshielded portion of the optical path of the exposure light. Scanning exposure method. 8. In scanning exposure with the exposure shutter opened, the exposure light is controlled in a constant illuminance mode based on the exposure light on the exposure optical path on the side of the substrate to be exposed from the exposure shutter, and the non-scanning with the exposure shutter closed. At the time of exposure, in the scanning type exposure method in which the original plate and the substrate to be exposed are aligned by the light taken out from the exposure light path before the exposure shutter, the light is taken out on or from the exposure light path before the exposure shutter at the time of non-scanning exposure. By performing constant illuminance mode control of exposure light based on the light on the optical path,
A scanning exposure method characterized in that exposure light can be controlled in a constant illuminance mode regardless of whether it is exposed or not. 9. A scanning exposure means for transferring a pattern of an original onto a substrate to be exposed by scanning exposure, an exposure shutter provided on an exposure optical path, and a substrate to be exposed from the exposure shutter at the time of scanning exposure when the exposure shutter is opened. The exposure light control means for controlling the exposure light in the constant illuminance mode based on the exposure light on the exposure light path on the side, and the light extracted from the exposure light path in front of the exposure shutter during non-scanning exposure when the exposure shutter is closed. In a scanning type exposure apparatus provided with an alignment means for aligning the original plate and the substrate to be exposed, the exposure light control means, in the non-scanning exposure, on the exposure light path in front of the exposure shutter or on the light path taken out therefrom. By controlling the constant illuminance mode of the exposure light based on the light, the exposure light can be controlled in the constant illuminance mode regardless of whether it is exposed or not. A scanning exposure apparatus characterized by the above.