JPH09251536A - Device and method for inspection by pattern matching - Google Patents

Abstract

PROBLEM TO BE SOLVED: To execute an inspection by means of pattern matching with precision and with good work efficiency by surely and quickly selecting and deciding an optimum standard pattern to be reference at the time of pattern matching. SOLUTION: The respective plural inspected objects 1-5 in an picked-up image are successively adopted as the temporary reference patterns P1, P2...P5, an operation for obtaining the whole coincidence degree (lowest score) of the temporary reference pattern 1 with at least whole other inspected objects 2-5 in the picked-up image is repeatedly executed, the whole matching degrees are obtained at every temporary reference pattern and, in result, the temporary reference pattern P3 where the whole matching degree (lowest score) becomes max. is finally selected as the reference pattern.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for inspecting defects such as IC leads by pattern matching.

[0002]

2. Description of the Related Art When inspecting an image in which a large number of IC leads, connector pins, and the like having the same shape are picked up, for example, defects of the leads or defects such as bending of the leads, In the case of inspecting a lead pitch defect, it is general to inspect the image using a pattern matching method. in this case,
It is necessary to determine a reference pattern in pattern matching. The determination of the reference pattern is performed as follows.

In the case of inspecting a lead defect, for example, the operator selects one lead, which is considered to be the most standard, by enclosing it in a rectangle from among many leads in an image, and selects this lead. Register as a reference pattern.
Then, pattern matching is performed to match this reference pattern to other leads, the similarity with the reference pattern is calculated as a score for each lead, and the validity as the reference pattern is determined.

Here, when the score of the selected reference pattern is lower than a certain reference, it is determined that the reference pattern is unsuitable and another lead is selected as the reference pattern and re-registered, or the reference is selected. I was trying to edit and recreate the pattern.

[0005]

However, as described above, when the method of selecting the reference pattern by the operator's judgment is adopted, the selected reference pattern is optimum depending on the intuition and experience of the operator. There was no guarantee that. Therefore, the selection of the reference pattern has to be redone many times, and it takes a lot of time and effort to determine the reference pattern.

The present invention has been made in view of these circumstances, and it is possible to surely and quickly select and determine the optimum reference pattern that serves as a reference when performing pattern matching, and thus the inspection by pattern matching is performed. It is an object of the present invention to provide an inspection device and an inspection method by pattern matching that can be performed with high accuracy and work efficiency.

[0007]

Therefore, in the main invention of the present invention, the inspection object and the reference pattern of the inspection object are butted against each other, the degree of coincidence is calculated, and the value of the calculated degree of coincidence is calculated. In the inspection device by pattern matching for determining the quality of the shape of the inspection object according to, an imaging unit that simultaneously images a plurality of the inspection objects, and one inspection object in the captured image as a temporary reference pattern, The degree of coincidence between the temporary reference pattern and another inspection object in the captured image is sequentially calculated, and the temporary reference pattern and other points in the captured image are calculated based on the calculated values of the respective degrees of coincidence. The calculating means for obtaining the total matching degree with all the inspection objects, and the calculating means for each of the plurality of inspection objects in the captured image are sequentially set as the temporary reference pattern. It was repeated, so that comprising a selecting means for selecting as a reference pattern provisional reference pattern said full agreement degree is maximized.

According to this structure, each of the plurality of inspection objects in the captured image is sequentially set as the temporary reference pattern, and the temporary reference pattern and all other inspection objects in the captured image are completely matched. The calculation for obtaining the degree is repeatedly performed, and the total matching degree is obtained for each temporary reference pattern. As a result, the temporary reference pattern having the highest total matching degree is finally selected as the reference pattern.

As described above, the optimum reference pattern serving as a reference when performing pattern matching is reliably and quickly selected,
As a result, the inspection by pattern matching can be performed accurately and efficiently.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an inspection apparatus and an inspection method by pattern matching according to the present invention will be described below with reference to the drawings.

FIG. 2 shows a plurality of leads 1 to 5 arranged laterally of the IC body 10 to be inspected in this embodiment. That is, it is assumed that the pattern matching is used to inspect whether or not there are defects such as chipping and bending of the leads and whether the lead pitch is good or bad.

FIG. 1 is a flow chart for explaining a procedure for selecting and deciding a reference lead pattern (hereinafter referred to as a reference pattern) which is required when performing the pattern matching. Each lead 1 of the IC shown in FIG.
Since items 5 to 5 are for selecting the reference pattern, all are assumed to be “non-defective”.

A description will be given below with reference to this flowchart.

First Embodiment In the first embodiment, step 10 in FIG. 1 is performed.
Consider that there are no 7, 109, 117, 118.

First, as shown in FIG. 1, the positions of the leads 1 to 5 of the IC in the captured image are detected (step 101).

That is, a non-defective IC is mounted on a table for imaging so that the ICs are not tilted in the captured image, and the leads 1 to 5 of the IC mounted on the table are shown at the same time. An image is captured by a camera and captured in a memory as a captured image as shown in FIG.

Then, a line A is drawn in the lead arrangement direction on the picked-up image, and the line A is drawn in the longitudinal direction C of the lead.
The distribution of the lightness on the line A is sequentially obtained while sequentially moving to. Then, from the light distribution on the line A when the line A is sequentially moved in the lead longitudinal direction C, the leads 1 to
It is determined that the line A is located at the tip of the line 5. The line A located at the tips of the leads 1 to 5 is A0.

Further, a line B is drawn in the direction perpendicular to the lead arrangement direction (lead longitudinal direction) on the picked-up image, and while sequentially moving the line B in the lead arrangement direction D, the distribution of lightness on the line B is successively obtained. Is required. The line B when the line B is sequentially moved in the read arrangement direction D
From the light distribution above, line B is centered in the longitudinal direction of leads 1-5.
Is determined to have been located. The line B located at the center of the leads 1 to 5 in the longitudinal direction is B0.

Therefore, the line A obtained as described above
The positions of the leads 1 to 5 are obtained as the intersections of 0 and the line B0 (indicated by "+" in FIG. 2) (step 101), and the number of leads in the captured image (5; Actually, there are a large number of leads larger than five, but for convenience of explanation, it is assumed that there are five leads in total) are detected (step 102).

As a method of detecting the positions of the leads 1 to 5, the following method may be adopted in addition to the above method.

(A) If the relative positional relationship between the camera and the IC on the table is known in advance, the coordinate position of the lead tip on the captured image should be specified in advance based on this relative positional relationship. You can Therefore, the coordinate position on the image specified in advance may be used as the lead tip position.

(B) The brightness of each pixel of the image picked up by the camera is binarized by a predetermined threshold value. Then, the lead and its background are identified by the lightness of two gradations of light and dark. Therefore,
The lead tip position can be detected from the boundary between light and dark.

(C) The operator manually surrounds the tip portion of one of the five leads 1 to 5 in a rectangle on the image pickup screen, and surrounds this with a temporary reference pattern (for example, the temporary pattern in FIG. 2). It is registered as the reference pattern P1). After that, during the pattern matching in which the provisional reference pattern P1 and the other lead tip portion are abutted (steps 103 to 114), the other lead tip portions are sequentially searched as a rectangular portion. The rectangular portions thus formed are designated as temporary reference patterns P2 to P5. By doing so, it becomes possible to directly determine the temporary reference pattern without detecting the position of each lead in step 101.

In the next step 103, as a result of matching the temporary reference pattern and the lead tip portion, the degree of matching between the lead tip portion and the temporary reference pattern obtained, that is, the maximum value Sc Max of the similarity Sc, The content is set to 0. The similarity Sc has a value of 0 to 100, and the larger the value, the larger the degree of coincidence. A value of 100 is for "complete match", and a value of 0 is for "no match" or "pattern matching failed" (step 103). Then, the code i for identifying the temporary reference pattern
Are initialized to 1 (step 104), and a temporary reference pattern Pi is created.

That is, as shown in FIG. 2, if the temporary reference pattern Pi, for example, P1 is taken as an example, step 101
A rectangular portion of a predetermined size centered on the tip position (see + mark) of the lead 1 detected in step 3 is cut out on the image, and this is registered as the temporary reference pattern 1. In addition,
Each time i is incremented by 1 in step 116,
Similarly to the lead 1, the provisional reference patterns P2 to P5 corresponding to the other leads 2 to 5 are created and registered (step 105).

Then, the code j for identifying the lead to be matched with the temporary reference pattern registered in the above step 105 is initialized to 1 (step 10).
6).

Next, pattern matching is performed in which the currently registered provisional reference pattern Pi and the lead j are matched, and as a result, the similarity Sc (i, j) in this combination (i, j) is the "score". (Step 108).

Unless the current lead j has reached the number of leads (5) (determination N in step 110).
O), the lead j is incremented by +1 (step 1
15), the same processing is repeatedly executed from step 107 to step 110. As a result, step 110
Then, when the number of leads j reaches the number of leads, the pattern matching between the temporary reference pattern Pi and all the leads 1 to 5 is completed, and the similarity Sc (i,
1), Sc (i, 2), ... Sc (i, 5) are obtained.

Then, these similarities Sc (i, 1), Sc
The minimum value (minimum score: see FIG. 3) of (i, 2), ... Sc (i, 5) is calculated, and this minimum value and the current Sc
Max is compared, and the larger one is updated as a new Sc Max (step 111). Therefore, the code i of the reference pattern from which the updated Sc Max is obtained is stored as the content of k (step 112).

Thereafter, as long as i has not reached the number of leads (NO at step 113), i is sequentially incremented by +1 (step 116), and pattern matching between the new temporary reference pattern i and each lead j is performed. Is performed, Sc Max is sequentially updated, and the code k of the reference pattern from which the updated Sc Max is obtained is sequentially updated (steps 105 to 112).

This will be described with reference to FIG.
The similarity Sc ("1 obtained for the temporary reference pattern P1
The minimum value (minimum score) of "00", "98", "84", "90", and "80") is "80", so the minimum value at the stage when the pattern matching by the provisional reference pattern P1 is completed. The maximum score Sc Max is "80",
The content of k is set to "1" (temporary reference pattern P1). However, every time i is updated, Sc Max is “80” (the lowest score “71” obtained at the pattern matching end stage with the temporary reference pattern P2 and the current Sc Max “8”).
"0" is compared), "82" (the lowest score "82" obtained at the end of the pattern matching with the temporary reference pattern P3 is compared with the current Sc Max "80"), and " 82 ”(the lowest score“ 7 ”obtained at the stage of ending the pattern matching with the provisional reference pattern P4)
9 "is compared with the current Sc Max" 82 "), and" 82 "(the lowest score" 71 "obtained at the end of the pattern matching with the temporary reference pattern P5 and the current Sc Max" 82 ". Are compared with) and are updated (step 111). As a result, the final contents of k are
Each minimum score "80", "71", "82", "7"
"3" indicating the provisional reference pattern P3 that gives the maximum value Sc Max "82" of "9" and "71" is set as the content of k (step 112), and this provisional reference pattern P3 is finally obtained. Selected and determined as a reference pattern (step 1
13: YES, step 114).

In this embodiment, the provisional reference pattern that has been subjected to the best pattern matching with all the leads 1 to 5 is determined as the reference pattern. Then, as the evaluation value for evaluating that the pattern matching with all the leads is performed well, the lowest score among the similarities Sc obtained for each of the leads 1 to 5 is adopted. There is.

However, the present invention is not limited to this, as long as it is an evaluation value that can evaluate that the pattern matching with all the leads 1 to 5 is performed most favorably, for example, each of the leads 1 to 5. Each similarity Sc obtained for each
Values (for example, “100”, “98”, “84”, “90” in the temporary reference pattern P1 of FIG.
The height of “80” which is the average value) may be used as the evaluation value.

As described above, according to this embodiment,
Each of the plurality of inspection objects 1 to 5 in the captured image is sequentially
The provisional reference patterns P1, P2, ... P5 are defined as the provisional reference patterns P1 ,.
The calculation of the total matching degree (minimum score) with 5 is repeated, and the total matching degree is calculated for each provisional reference pattern. As a result, the total matching degree (minimum score) becomes the largest (ScMax The temporary reference pattern P3 (where the final updated value is obtained) is finally selected as the reference pattern. Therefore, the optimum pattern P3 serving as a reference when performing pattern matching can be reliably and promptly selected and determined.

Then, using this reference pattern P3,
If the leads of each IC are inspected, the inspection by pattern matching can be performed accurately and efficiently.

In order to perform the arithmetic processing in the above-described first embodiment at a higher speed, it is possible to appropriately omit the arithmetic operation as shown below.

Second Embodiment In this embodiment, in the first embodiment, as shown in FIG.
Step 117 is added.

That is, after the processing of step 106 is completed, the routine proceeds to step 117, where the code i currently registered as the temporary reference pattern matches the code j of the lead to be matched with the temporary reference pattern. It is determined whether or not (step 117). In step 117, j =
If it is determined that i is the case in which the lead from which the provisional reference pattern is cut out and the lead to be matched match, the similarity Sc obtained as a result of pattern matching is the maximum value (complete It is clear that the match: 100) is taken, so the procedure moves to step 110 without performing pattern matching.

As described above, the pattern matching process for the combination of j = i is omitted, and the calculation process is performed at high speed.

Note that the similarity is always 100 in the case of a combination of j = i, so it can be said that it is irrelevant to the calculation of the lowest score. Therefore, when calculating the lowest score, j =
The similarity 100 of the combination of i may be excluded (the value of “100” in FIG. 3 may be excluded).

Third Embodiment In this embodiment, in the first embodiment, as shown in FIG.
Steps 107 and 118 are added.

That is, after the processing of step 106 is completed, the process proceeds to step 107, and whether the code i currently registered as the temporary reference pattern is smaller than the code j of the lead to be matched with the temporary reference pattern. Is determined (step 107). Here, step 107
If the result of the determination is YES, it means that the pattern matching of the combination (i, j) has not been executed yet, and therefore the pattern matching is performed in the next step 108.

However, if NO in step 107, the process proceeds to the next step 118, and the value of the similarity Sc (i, j) to be obtained is already obtained and stored. The similarity Sc (j, i) is used as the value (step 118), and the procedure proceeds to step 109 without actually performing pattern matching for the combination (i, j).

For example, the temporary reference pattern P3 and the lead 1
When the pattern matching with the lead reference pattern P1 and the lead 3 is already performed, the similarity Sc (1,3) obtained at that time is obtained.
(= “84”: see FIG. 3) is the similarity Sc (3,1) between the tentative reference pattern P3 to be subjected to pattern matching and the lead 1 (= “84”: see FIG. 3) (see FIG. 3). Step 118).

As described above, when the combination of i and j matches, the duplicate pattern matching process can be omitted and the calculation process can be performed at high speed.

Fourth Embodiment In this embodiment, in the first embodiment, as shown in FIG.
Step 109 is added.

That is, after the processing of step 108 is completed, the process proceeds to step 109, and it is determined whether or not the value of the similarity Sc (i, j) obtained in step 108 is smaller than the current value of Sc Max. (Step 109).

If the determination result in step 109 is YES, there is no possibility that the lowest score of the currently registered provisional reference pattern Pi exceeds the current value of Sc Max, that is, the current registration. It is determined that the temporary reference pattern Pi currently registered is not likely to be finally determined as the reference pattern, and the subsequent pattern matching with the currently registered temporary reference pattern Pi is interrupted, and the procedure is stepped. It is moved to 113. As a result, pattern matching for a new temporary reference pattern in which i is incremented by +1 is started, or pattern matching for all temporary reference patterns is completed.

For example, the temporary reference pattern P4 and the lead 2
Similarity S obtained as a result of pattern matching with
c (4,2) (= “79”: see FIG. 3) is the current Sc M
Since the value of ax is smaller than "82" (minimum score of the temporary reference pattern P3: see FIG. 3), the current temporary reference pattern P4
The lowest score (at most "79") is not likely to exceed the current Sc Max value "82", that is, the current provisional reference pattern P4 is not likely to be finally determined as the reference pattern. Judgment, the subsequent combinations (i, j) = (4, 3) based on the current temporary reference pattern P4,
The pattern matching by (4, 4) and (4, 5) is omitted.

As described above, when the similarity Sc obtained as a result of pattern matching falls below the current value of Sc Max, the subsequent pattern matching with the current temporary reference pattern Pi may be omitted. Therefore, the arithmetic processing can be performed at high speed.

The second to fourth embodiments described above can be implemented in an appropriate combination. Of course, it is also possible to implement using all of the second to fourth embodiments. Fifth Embodiment Next, an embodiment suitable for inspecting the quality of the shape of the predetermined character “A” printed on the IC body 10 as shown in FIG. 4 will be described. Also in this case, the reference pattern required for the inspection of the character "A" can be determined in the same manner as the processing shown in FIG. That is, the leads 1, 2, 3, 4, 5 in FIG. 2 may be replaced with the IC bodies A-1, A-2, A-3, A-4, A-5 in FIG. it can.

Here, the shape of the character “A” to be inspected is
Although it varies within a predetermined width due to the sag of the rubber for printing, if there is a difference in the shape within the predetermined width, it may be desired to determine all as “non-defective”. Therefore,
As the limit sample, IC main bodies (all of which are "non-defective") in which the shape of the letter "A" (thickness of line, thinness) is different within the above-mentioned predetermined width are A-1 and A- in FIG. 2, A-
Plural pieces are prepared as shown in Nos. 3, A-4, and A-5.

Therefore, unlike the case of FIG. 2, these I
The C main bodies are imaged one by one by the camera, stored in the memory as separate captured images, and the position of the character "A" is detected for each IC main body (step 101).

Based on the detected position of the character "A", one temporary reference pattern P1, P2 ... P5 is sequentially cut out from each captured image, and these are designated as temporary reference patterns P1, P2 ... P5. It is sequentially registered (step 105, step 116: see FIG. 4).

Here, the temporary reference patterns P1 to P5 are
The method of (c) described above can be applied as the method of cutting out.

That is, the operator manually encloses "A" on the IC main body in a rectangle on one image pickup screen and registers this as a temporary reference pattern (for example, temporary reference pattern P1 in FIG. 4). . Thereafter, while performing pattern matching by matching the provisional reference pattern P1 with the character "A" on the IC main body in another captured image (steps 103 to 114), the character "A" in the other captured image is changed. Since the surrounding rectangular portion is sequentially searched, the searched rectangular portion is set as the temporary reference patterns P2 to P5. By doing this, in step 101, the character "A" is set for each IC body.
The temporary reference pattern can be directly obtained without detecting the position of.

In this way, the processing proceeds in the same manner as in the case of FIG. 2, and the final contents of k in step 112 are the minimum scores "61" shown in FIG.
It is set to "3" indicating the temporary reference pattern P3 from which the maximum value Sc Max "72" among "71", "72", "66", and "61" is obtained (step 112), and this temporary reference pattern P3 is obtained. Is finally selected and determined as the reference pattern (YES in step 113, step 114).

Then, using this reference pattern P3,
If the shape of the letter "A" of each IC body is inspected, the inspection by pattern matching can be performed accurately and efficiently.

As in the case of FIG. 2, the second embodiment to the fourth embodiment may be incorporated as appropriate to perform the arithmetic processing at high speed.

Sixth Embodiment In the fifth embodiment, when each IC body is to be captured as separate captured images, the shape of the character “A” to be pattern-matched is on the table or tray. It may vary depending on the degree of inclination of the IC body. If the variation in the inclination degree is also within a predetermined range,
In some cases, you may want to judge all products as “good”.

Therefore, the IC body A- of the fifth embodiment is
Similar to 1 to A-5, ICs having different inclination degrees
A plurality of main bodies may be prepared, and the plurality of IC main bodies may be sequentially imaged to similarly cut out the temporary reference patterns P1 to P5, and the reference pattern may be similarly determined from the temporary reference patterns. .

Seventh Embodiment In the fifth embodiment, when each IC body is to be captured as a separate captured image, the shape of the character “A” to be pattern-matched is the IC body on the table. May vary depending on the distance from the camera. In other words, due to the different distances, the focus may be different, the size of the imaged character may be different, and the shape of the character “A” may vary. If the variation in the distance between the camera and the IC body is also within a predetermined width, it may be desired to determine all as “non-defective”.

Therefore, the IC body A- of the fifth embodiment is
Similar to 1 to A-5, a plurality of IC bodies having different distances between the camera and the IC body are prepared, and the plurality of IC bodies are
The temporary reference patterns P1 to P5 may be similarly cut out by sequentially imaging the main body, and the reference pattern may be similarly determined from the temporary reference patterns.

Eighth Embodiment In the fifth embodiment, when each IC body is to be captured as a separate captured image, the character “A” to be pattern-matched is irradiated onto this character. The light may vary depending on the light. In other words, the intensity of light applied to a character varies depending on the illumination conditions such as weather and time, and the contour of the imaged character may vary due to this, and the shape of the character “A” may vary. . If the variation of the irradiated light is also within a predetermined width,
In some cases, you may want to judge all products as “good”.

Therefore, the IC body A- of the fifth embodiment is
Similarly to 1 to A-5, a plurality of IC bodies having different intensity of light emitted to the IC bodies are prepared, and the plurality of IC bodies are sequentially imaged to similarly obtain the temporary reference patterns P1 to P1. P5 may be cut out and a reference pattern may be similarly determined from these temporary reference patterns.

The fifth to eighth embodiments described above can be implemented in appropriate combination. Of course, it is also possible to implement using all of the fifth to eighth embodiments.

In addition, in the embodiment described above, the inspection target is the IC (lead of the IC, characters on the IC main body), but of course the invention is not limited to this. It is applicable to the target.

The following cases can be considered as modes for carrying out the above-described embodiment.

That is, the processing contents of the first to eighth embodiments may be appropriately stored in a floppy disk and distributed or distributed to users and operators who perform inspection by pattern matching. The storage medium distributed and distributed may be a storage medium such as a hard disk other than a floppy disk, an IC card, or a CD-ROM.

Further, as the distribution mode, not only the distribution mode of the portable storage medium as described above, but also the hardware using the software of this embodiment and the software of this embodiment are developed. However, a development computer that accommodates this software may be communicably connected by a public line or a network and distributed through these networks or the like.

In order to install the software on the hardware that uses the software (inspection device by pattern matching) at the time of distribution and distribution,
The software may be distributed and distributed with an installer attached, or data obtained by compressing the capacity of the software may be distributed and distributed.

[Brief description of drawings]

FIG. 1 is a flowchart showing a processing procedure in an embodiment of an inspection apparatus or inspection method by pattern matching according to the present invention.

FIG. 2 is a diagram showing a plurality of leads arranged on one side of an IC main body.

FIG. 3 is a table showing a result of performing pattern matching using each lead shown in FIG. 2 as a temporary reference pattern.

FIG. 4 is a diagram showing characters printed on each IC body.

5 is a table showing the results of pattern matching using the characters on each IC body shown in FIG. 4 as a temporary reference pattern.

[Explanation of Codes] P1 to P5 Temporary reference patterns 1 to 5 Lead (inspection object) A-1 to A-5 IC main body (inspection object)

Claims (16)

[Claims] 1. A pattern matching for matching an inspection object with a reference pattern of the inspection object, calculating the degree of coincidence, and determining the quality of the shape of the inspection object according to the calculated value of the degree of coincidence. In the inspection apparatus according to the above, an imaging unit that simultaneously captures a plurality of the inspection objects, and one inspection object in the captured image is a temporary reference pattern, and the temporary reference pattern and other inspection objects in the captured image. And sequentially calculating the degree of coincidence with each other, based on the value of each calculated degree of coincidence, calculating means for obtaining the total degree of coincidence between the temporary reference pattern and all other inspection objects in the captured image, Each of the plurality of inspection objects in the captured image is sequentially used as the temporary reference pattern, and the calculation unit is repeatedly executed to obtain the maximum total matching degree. An inspection apparatus by pattern matching, comprising: a selecting unit that selects a pattern as a reference pattern. 2. A pattern matching for matching an inspection object and a reference pattern of the inspection object, calculating a degree of coincidence, and judging whether the shape of the inspection object is good or bad according to the value of the calculated degree of coincidence. In the inspection apparatus according to the above, an imaging unit that simultaneously captures a plurality of the inspection objects, and one inspection object in the captured image is a temporary reference pattern, and the temporary reference pattern and other inspection objects in the captured image. And a plurality of inspection objects in the picked-up image are sequentially calculated, respectively, by calculating a coincidence degree with each other and calculating the lowest value of the coincidence degree from the calculated values of the coincidence degree. As the reference pattern, the selecting means is configured to repeatedly perform the calculating means, and to select a temporary reference pattern having the highest minimum matching degree as the reference pattern. Inspection device by the provided pattern matching. 3. A pattern matching for matching an inspection object with a reference pattern of the inspection object, calculating the degree of coincidence, and determining the quality of the shape of the inspection object according to the value of the calculated degree of coincidence. In the inspection apparatus according to the above, an imaging unit that sequentially captures the plurality of inspection objects, one inspection object in the captured image is a temporary reference pattern, and the temporary reference pattern and each inspection in other captured images. The degree of coincidence with the object is sequentially calculated, and the degree of coincidence between the temporary reference pattern and all other inspection objects in all the other captured images is obtained based on the calculated values of the degree of coincidence. A calculation unit and a temporary reference pattern with which the total degree of coincidence is maximized by causing the calculation unit to repeatedly perform the inspection objects in the plurality of captured images sequentially as the temporary reference pattern. An inspection apparatus by pattern matching, which comprises a selecting means for selecting a pattern as a reference pattern. 4. A pattern matching for matching an inspection object and a reference pattern of the inspection object, calculating the degree of coincidence, and determining the quality of the shape of the inspection object according to the value of the calculated degree of coincidence. In the inspection apparatus according to the above, an imaging unit that sequentially captures the plurality of inspection objects, one inspection object in the captured image is a temporary reference pattern, and the temporary reference pattern and each inspection in other captured images. A calculation unit that sequentially calculates the degree of coincidence with the object and obtains the lowest value of the degree of coincidence from the calculated values of the degree of coincidence, and sequentially inspects each inspection object in the plurality of captured images. As a reference pattern, the pattern calculating means is repeatedly performed, and a provisional reference pattern having the highest minimum matching degree is selected as a reference pattern. Inspection device by means of screen matching. 5. If the combination of the provisional reference pattern for which the matching degree is to be calculated and the inspection object is the same as the combination for which the matching degree has already been calculated, the calculating means determines the matching degree. The provisional reference pattern for which the degree of coincidence is to be calculated, with the value of the degree of coincidence for the combination of the temporary reference pattern and the inspection object to be calculated as the value of the degree of coincidence for the same combination for which the degree of coincidence is already calculated 5. The pattern matching inspection apparatus according to claim 1, wherein the calculation of the degree of coincidence of the combination of the inspection object and the inspection object is omitted. 6. The selecting means updates the maximum value of the minimum values of the matching degrees sequentially obtained by the calculating means each time the temporary reference pattern is updated, and finally the updated matching pattern is obtained. This is for selecting a temporary reference pattern from which the maximum value of the minimum value of the degree is obtained, and the calculation means, the value of the degree of coincidence between the currently calculated temporary reference pattern and the inspection object is currently updated. 5. The pattern matching inspection apparatus according to claim 2, wherein when the matching degree is smaller than the maximum value, the calculation for determining the matching degree for the temporary reference pattern is omitted. 7. The inspection object has a shape to be pattern-matched that varies within a predetermined width, and the imaging unit prepares a plurality of inspection objects having different shapes within the predetermined width. 5. The pattern matching inspection apparatus according to claim 3, wherein the plurality of inspection objects are sequentially imaged. 8. The inspection object has a shape to be pattern-matched that varies depending on the degree of inclination of the inspection object, and the imaging unit prepares a plurality of inspection objects having different degrees of inclination, The pattern matching inspection apparatus according to claim 3, wherein the plurality of inspection objects are sequentially imaged. 9. The inspection object has a shape to be pattern-matched that varies depending on the distance between the inspection object and the image pickup means, and the image pickup means changes the distance to the inspection object from each other. The inspection apparatus by pattern matching according to claim 3, wherein a plurality of objects are prepared and the plurality of inspection objects are sequentially imaged. 10. The inspection object has a shape to be pattern-matched that varies depending on the light irradiated to the inspection object, and the imaging unit has an inspection object in which the light irradiated to the inspection object is different from each other. The inspection apparatus by pattern matching according to claim 3, wherein a plurality of objects are prepared and the plurality of inspection objects are sequentially imaged. 11. An inspection object and a reference pattern of the inspection object are butted against each other, and the degree of coincidence is calculated,
In an inspection method by pattern matching for determining the quality of the shape of the inspection object according to the value of the calculated coincidence degree, an image capturing step of simultaneously capturing a plurality of the inspection objects, and an inspection in the captured image The object is used as a temporary reference pattern, the degree of coincidence between the temporary reference pattern and other inspection objects in the captured image is sequentially calculated, and the temporary reference pattern is calculated based on the calculated values of the respective degrees of coincidence. And a calculation step of obtaining a total degree of coincidence with all other inspection objects in the captured image, and a plurality of inspection objects in the captured image are sequentially set as the temporary reference pattern, and the calculation step is repeated. The pattern matching including the selection step of selecting the temporary reference pattern having the highest total matching degree as the reference pattern. Inspection method. 12. An inspection object and a reference pattern of the inspection object are butted against each other, and the degree of coincidence is calculated,
In an inspection method by pattern matching for determining the quality of the shape of the inspection object according to the value of the calculated coincidence degree, an image capturing step of simultaneously capturing a plurality of the inspection objects, and an inspection in the captured image The object is used as a temporary reference pattern, the degree of coincidence between this temporary reference pattern and another inspection object in the captured image is sequentially calculated, and the lowest degree of coincidence is calculated from among the calculated values of the degree of coincidence. A calculation step for obtaining a value, and a plurality of inspection objects in the captured image are sequentially set as the temporary reference pattern, and the calculation step is repeatedly performed, and the temporary reference pattern in which the minimum value of the degree of coincidence is the largest. An inspection method by pattern matching comprising a selection step of selecting as a reference pattern. 13. An inspection object and a reference pattern of the inspection object are butted against each other, and the degree of coincidence is calculated,
In an inspection method by pattern matching that determines the quality of the shape of the inspection object according to the value of the calculated coincidence degree, an imaging step of sequentially imaging the plurality of inspection objects; The inspection object is used as a temporary reference pattern, the degree of coincidence between the temporary reference pattern and each inspection object in another captured image is sequentially calculated, and the temporary reference is calculated based on the calculated values of the respective degrees of coincidence. A calculation step of obtaining a total degree of coincidence between the pattern and all other inspection objects in all other captured images; and each calculation object in the plurality of captured images sequentially as the temporary reference pattern, the calculation step And a repeating step of selecting the temporary reference pattern with the highest degree of total matching as a reference pattern. Method. 14. An inspection object and a reference pattern of the inspection object are butted against each other, and the degree of coincidence is calculated,
In an inspection method by pattern matching that determines the quality of the shape of the inspection object according to the value of the calculated coincidence degree, an imaging step of sequentially imaging the plurality of inspection objects; The inspection object is used as a temporary reference pattern, the degree of coincidence between the temporary reference pattern and each inspection object in another captured image is sequentially calculated, and the degree of coincidence is calculated from among the calculated values of the respective degrees of coincidence. A calculation step of obtaining a minimum value, and sequentially the inspection objects in the plurality of captured images as the temporary reference pattern, the calculation step is repeatedly performed, and the temporary reference pattern in which the minimum value of the matching degree is the largest An inspection method by pattern matching comprising a selection step of selecting as a reference pattern. 15. The calculation step, if the combination of the temporary reference pattern for which the matching degree is to be calculated and the inspection object is the same combination as the combination for which the matching degree has already been calculated, determines the matching degree. The provisional reference pattern for which the degree of coincidence is to be calculated, with the value of the degree of coincidence for the combination of the temporary reference pattern and the inspection object to be calculated as the value of the degree of coincidence for the same combination for which the degree of coincidence has already been calculated. The calculation for obtaining the degree of coincidence between the combination of the inspection object and the inspection object is omitted.
The inspection method by the pattern matching according to 1 or 12 or 13 or 14. 16. The selecting step updates the maximum value of the minimum values of the matching degrees sequentially obtained in the calculating step each time the temporary reference pattern is updated,
The value of the degree of coincidence between the currently calculated provisional reference pattern and the inspection object is selected in order to select a provisional reference pattern from which the lowest updated maximum value of the degree of coincidence is obtained. Is smaller than the maximum value of the minimum value of the matching degree that is currently being updated, the pattern matching according to claim 12 or 14, wherein the calculation of the matching degree for the provisional reference pattern is omitted. Inspection methods.