JPH09247361A - Linear illuminator - Google Patents

Linear illuminator

Info

Publication number
JPH09247361A
JPH09247361A JP8054611A JP5461196A JPH09247361A JP H09247361 A JPH09247361 A JP H09247361A JP 8054611 A JP8054611 A JP 8054611A JP 5461196 A JP5461196 A JP 5461196A JP H09247361 A JPH09247361 A JP H09247361A
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
transparent plate
element array
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8054611A
Other languages
Japanese (ja)
Inventor
Tetsuro Nakamura
哲朗 中村
Eiichiro Tanaka
栄一郎 田中
Takahiko Murata
隆彦 村田
Hirotaka Hongou
弘貴 本郷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8054611A priority Critical patent/JPH09247361A/en
Publication of JPH09247361A publication Critical patent/JPH09247361A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To improve the lighting efficiency of the linear illuminator, increase document surface illuminance, and minimize illuminance variance. SOLUTION: On a circuit board 81, LED chips 82 are mounted at certain equal intervals by using a die mounter, and on them, a 1st transparent plate 83A and a 2nd transparent plate 83B which has a triangular-wave surface 84 on its incidence surface are optically mounted by using high-transmissivity UV setting type insulating resin. As for the linear illuminator which is thus manufactured, illumination lights emitted by the LED chips 82 pass through the transparent plate 83A and are guided to its projection surface without being diffused in a vertical scanning direction, and further diffused only in a horizontal scanning direction by the triangular-wave surface 84 formed on the incident surface of the 2nd transparent plate 83B, so that the lights pass through the 2nd transparent plate 83B and are guided to a document without being diffused in the vertical scanning direction.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、例えば光学的画像
読み取り装置において原稿面を主走査方向に線状に照明
する線状照明装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a linear illumination device that linearly illuminates a document surface in a main scanning direction in an optical image reading device, for example.

【0002】[0002]

【従来の技術】従来の線状照明装置を便宜上、光学的読
み取り装置を例にとって説明する。
2. Description of the Related Art A conventional linear illumination device will be described by taking an optical reading device as an example for convenience.

【0003】近年、光学的画像読み取り装置は、ファク
シミリやスキャナー及びバーコードリーダー等の読み取
り装置として広く使用されており、この種の装置の原稿
照明系にはLEDチップを一列状に並べたLEDアレイ
が使用されている。
In recent years, optical image reading devices have been widely used as reading devices for facsimiles, scanners, bar code readers, etc., and an LED array in which LED chips are arranged in a line in a document illumination system of this type of device. Is used.

【0004】以下図面を参照しながら、上記した従来の
光学的原稿読み取り装置に使用されている線状照明装置
の一例について説明する。
An example of the linear illumination device used in the above-mentioned conventional optical document reading device will be described below with reference to the drawings.

【0005】図10は従来の光学的画像読み取り装置の
構造図を示すものである。図10において101は原
稿、102は原稿を照射する線状照明装置としてのLE
Dアレイ、103は原稿で反射した光情報を正立等倍で
導くロッドレンズアレイ、104はロッドレンズアレイ
103により導かれた光情報を取り込み電気信号に変換
する光電変換素子アレイである。また、図11は従来の
LEDアレイの構成を示したものであり、回路導体層を
施した基板111上にLEDチップ112を複数個、直
線状に並べて作製している。
FIG. 10 is a structural diagram of a conventional optical image reading apparatus. In FIG. 10, 101 is an original, and 102 is an LE as a linear illumination device that illuminates the original.
D array, 103 is a rod lens array that guides the light information reflected by the original with an equal magnification, and 104 is a photoelectric conversion element array that takes in the light information guided by the rod lens array 103 and converts it into an electrical signal. Further, FIG. 11 shows a structure of a conventional LED array, in which a plurality of LED chips 112 are linearly arranged on a substrate 111 having a circuit conductor layer.

【0006】以上のように構成された光学的画像読み取
り装置及び線状照明装置に関して、以下にその動作を説
明する。
The operation of the optical image reading device and the linear illumination device configured as described above will be described below.

【0007】まず、LEDアレイ102からの光を読み
取るべき原稿101に照射し、その反射光をロッドレン
ズアレイ103で正立等倍で光電変換素子アレイ104
に導き、電気信号に変換して原稿読み取りを行ってい
た。
First, the original 101 to be read is irradiated with the light from the LED array 102, and the reflected light is erected at the same magnification by the rod lens array 103 and the photoelectric conversion element array 104 is used.
Then, the original was read by converting it into an electric signal.

【0008】[0008]

【発明が解決しようとする課題】しかしながら上記のよ
うな構成の線状光源装置(LEDアレイ)102では、
LEDチップ112の指向特性のため、照明効率が低く
(副走査方向に広がる)、また原稿面照度のばらつきが
大きくなるため、画像読み取りの性能を低下させてい
た。また原稿101からLEDアレイ102までは、あ
る程度距離をおく必要があり、ユニット自体のサイズも
大きなものとなり、さらに数多くのLEDチップを使用
するためコストアップの要因となっていた。
However, in the linear light source device (LED array) 102 having the above configuration,
Due to the directional characteristics of the LED chip 112, the illumination efficiency is low (spreads in the sub-scanning direction), and the illuminance of the document surface is greatly varied, which deteriorates the image reading performance. In addition, it is necessary to keep a certain distance from the original 101 to the LED array 102, the size of the unit itself becomes large, and more LED chips are used, which causes a cost increase.

【0009】[0009]

【課題を解決するための手段】上記問題点を解決するた
めに本発明の線状照明装置は、従来のLEDアレイのL
EDチップ上に、光の入出射面に主走査方向に三角波等
の処理を施した透明板を1枚ないし2枚設けたり、回路
基板のLEDチップが実装される部分及びその周辺を鏡
面にしてくぼみ形状をつける等してLEDチップの指向
特性を最適化(副走査方向に狭く、主走査方向に広く)
し、光の伝送効率を向上させる構成としたものである。
In order to solve the above-mentioned problems, the linear illumination device of the present invention has a conventional LED array L
On the ED chip, one or two transparent plates that have been processed with a triangular wave or the like in the main scanning direction are provided on the light input / output surface, or the portion of the circuit board on which the LED chip is mounted and its periphery are mirror-finished. Optimizing the directional characteristics of the LED chip by forming a concave shape (narrow in the sub-scanning direction and wide in the main-scanning direction)
However, the configuration is such that the transmission efficiency of light is improved.

【0010】[0010]

【発明の実施の形態】本発明の線状照明装置は、従来の
線状照明装置(LEDアレイ)のLEDチップ上に、光
の入出射面に主走査方向に三角波等の処理を施した透明
板を設けたり、回路基板のLEDチップが実装される部
分及びその周辺に凹部を設け、その表面を鏡面にするこ
と等により、LEDチップの指向特性を最適化(副走査
方向に狭く、主走査方向に広く)し、光の伝送効率を向
上させる構成としたものである。
BEST MODE FOR CARRYING OUT THE INVENTION The linear lighting device of the present invention is a transparent linear lighting device (LED array) on which an input / output surface of light is subjected to a process such as a triangular wave in the main scanning direction on an LED chip. Optimizing the directional characteristics of the LED chip (narrow in the sub-scanning direction, main scanning by providing a plate, forming a recess in the area where the LED chip is mounted on the circuit board and its periphery, and making the surface a mirror surface). (Wide in the direction) to improve the light transmission efficiency.

【0011】その結果、原稿面照度を上げ、原稿面照度
ばらつきをおさえることができ、さらに画像読み取りの
性能を向上させることができる。また、LEDアレイか
ら原稿面までの距離を短くすることができ、LEDチッ
プ数の削減による低コスト化を可能にするとともに、光
学的原稿読み取り装置自体の小型・軽量化も実現可能と
する。
As a result, it is possible to increase the illuminance on the document surface, suppress variations in illuminance on the document surface, and further improve the image reading performance. Further, the distance from the LED array to the document surface can be shortened, the cost can be reduced by reducing the number of LED chips, and the size and weight of the optical document reading device itself can be reduced.

【0012】以下、本発明の線状照明装置について、図
面を参照しながら説明する。図1の(a)、(b)は各
々本発明の線状照明装置の基本構成を表す断面図及び平
面図を示すものである。11は回路基板、12は回路基
板上に一列に実装されたLEDチップ、13は各LED
チップ12の上面に近接して配置した透明板である。
The linear lighting device of the present invention will be described below with reference to the drawings. 1A and 1B are a sectional view and a plan view, respectively, showing the basic configuration of the linear lighting device of the present invention. 11 is a circuit board, 12 is an LED chip mounted in a line on the circuit board, and 13 is each LED
It is a transparent plate arranged close to the upper surface of the chip 12.

【0013】以上のように基本構成された線状照明装置
について、透明板13に各種の光学的処理を施した線状
照明装置が本発明である。
With respect to the linear lighting device having the above basic structure, the present invention is a linear lighting device in which the transparent plate 13 is subjected to various optical treatments.

【0014】(第1の実施形態)本発明の線状照明装置
の第1の実施形態について、図2を参照しながら説明す
る。図2は、第1の実施形態に係る線状照明装置の構成
を示す側面図である。図に示すように、回路基板21上
には複数のLEDチップ22が一列に実装され、各LE
Dチップ22上に、入射面かつ/またわ出射面に三角波
面(のこぎり波状の面)24を施した透明板23が設け
られている。
(First Embodiment) A first embodiment of the linear lighting device of the present invention will be described with reference to FIG. FIG. 2 is a side view showing the configuration of the linear lighting device according to the first embodiment. As shown in the figure, a plurality of LED chips 22 are mounted in a line on the circuit board 21 and
A transparent plate 23 having a triangular wave surface (sawtooth wave surface) 24 on the entrance surface and / or the exit surface is provided on the D chip 22.

【0015】以上のように構成された第1の実施形態に
係る線状照明装置について、さらに具体的に説明する。
まず、ダイマウンターを用いて、LEDチップ22を所
定のピッチで回路基板21上に実装する。LEDチップ
22としては、GaP又は高輝度のものが必要な場合に
は4元系の例えばAlGaInP等のベアチップを樹脂
モールドしたものを用いる。また、カラー画像読み取り
用の線状照明装置の場合にはR(赤)、G(緑)、B
(青)の3色のLEDチップを交互に並べて実装すれば
よい。
The linear illumination device according to the first embodiment configured as described above will be described more specifically.
First, the LED chips 22 are mounted on the circuit board 21 at a predetermined pitch using a die mounter. As the LED chip 22, a GaP or a high-luminance LED chip is used which is a resin-molded bare chip of a quaternary system such as AlGaInP. In the case of a linear illumination device for reading a color image, R (red), G (green), B
The LED chips of three colors (blue) may be mounted alternately.

【0016】次に、LEDチップ22上に、ガラスまた
わアクリルやポリカーボネイト等の透明樹脂によりイン
ジェクション成形により入射面かつ/または出射面に三
角波面(のこぎり波状の面)24を有する透明板23を
光学的方法を用いて実装する。透明板23は、長さがほ
ぼ回路基板21と同じ長さ(照明幅)で、厚みがLED
チップ22の短手方向(副走査方向)の幅もしくはそれ
よりおおきめで、幅がおよそLEDチップ22から照明
する原稿面までの距離というディメンジョンを有する。
光学的実装方法としては、アクリレート系の高透過性紫
外線硬化型絶縁樹脂を用い、LEDチップ22に透明板
23をアライメントした後、紫外線光を照射して硬化さ
せる。高透過性紫外線硬化型絶縁樹脂の代わりにエポキ
シ樹脂等の高透過性熱硬化型絶縁樹脂を用いることもで
きる。また、透明板に用いる透明樹脂に関しては、イン
ジェクション成形の寸法精度を向上させるためには、熱
硬化性の樹脂が適している。
Next, a transparent plate 23 having a triangular wave surface (sawtooth wave surface) 24 on the entrance surface and / or the exit surface is formed on the LED chip 22 by injection molding with a transparent resin such as glass or acrylic resin or polycarbonate. It is implemented using a dynamic method. The transparent plate 23 has substantially the same length (illumination width) as the circuit board 21, and has a thickness of LED.
The width of the chip 22 in the lateral direction (sub-scanning direction) or larger than that is the width, and the width has a dimension of the distance from the LED chip 22 to the illuminated document surface.
As an optical mounting method, an acrylate-based highly transparent ultraviolet curable insulating resin is used, and after aligning the transparent plate 23 with the LED chip 22, ultraviolet light is irradiated to cure it. A highly transparent thermosetting insulating resin such as an epoxy resin may be used instead of the highly transparent ultraviolet curable insulating resin. As for the transparent resin used for the transparent plate, a thermosetting resin is suitable for improving the dimensional accuracy of injection molding.

【0017】このようにして作製した第3の実施形態に
係る線状照明装置の動作原理及び特性について説明す
る。LEDチップ22から出力された照明光は、透明板
23を通してその他端まで導かれ、その近傍にある原稿
を照明する。この際、入射面かつ/またわ出射面にある
三角波面(のこぎり波状の面)により、主走査方向のみ
照明光が拡散されるため、原稿面照度のばらつきを小さ
く(従来のLEDアレイい比べて約半分)でき、また副
走査方向には照明光は拡散されずに導かれるため、原稿
面を効率よく線状に照明することができた(従来のLE
Dアレイに比べて照度が約3倍になった)。これによ
り、従来のLEDアレイと比較して、LEDチップ数を
約1/3に削減することができた。
The operation principle and characteristics of the linear illumination device according to the third embodiment thus manufactured will be described. The illumination light output from the LED chip 22 is guided to the other end through the transparent plate 23 and illuminates the document in the vicinity thereof. At this time, since the illumination light is diffused only in the main scanning direction due to the triangular wave surface (sawtooth wave surface) on the incident surface and / or the exit surface, the unevenness of the illuminance of the document surface is small (compared to the conventional LED array. Since the illumination light is guided in the sub-scanning direction without being diffused, the document surface can be efficiently illuminated linearly (conventional LE).
The illuminance is about 3 times that of the D array). As a result, the number of LED chips could be reduced to about 1/3 as compared with the conventional LED array.

【0018】また、同様に原稿面照度のばらつきを抑え
るには、図6(側面図)に示すような複数の空洞(三角
柱や円柱)を持つ透明板63を用いても効果がある(空
洞により照明光が主走査方向に拡散される)。また、同
様に原稿の照明効率を上げるには、図3(断面図)に示
すような出射面に副走査方向にRがついている透明板3
3や、図4(断面図)に示すような入射面から出射面に
行くにしたがって厚み(副走査方向の幅)がちいさくな
っていく透明板43を用いても効果がある。さらに図5
(断面図)に示すような出射面が副走査方向に関して傾
斜を持った透明板53を用いると線状の照明位置が自由
に変えることができ、光学的画像読み取り装置自体の設
計の自由度をもたせることができまた、装置自体の小型
化も可能となる。
Similarly, in order to suppress variations in the illuminance of the original, it is also effective to use a transparent plate 63 having a plurality of cavities (triangular prisms or cylinders) as shown in FIG. 6 (side view) (depending on the cavities. Illumination light is diffused in the main scanning direction). Similarly, in order to increase the illumination efficiency of the original, the transparent plate 3 having an R on the exit surface as shown in FIG. 3 (cross-sectional view) in the sub-scanning direction.
3 or a transparent plate 43 whose thickness (width in the sub-scanning direction) becomes smaller as it goes from the entrance surface to the exit surface as shown in FIG. 4 (cross-sectional view). Further FIG.
If a transparent plate 53 having an emission surface inclined with respect to the sub-scanning direction as shown in (cross-sectional view) is used, the linear illumination position can be freely changed, and the degree of freedom in designing the optical image reading device itself can be increased. In addition, the device itself can be downsized.

【0019】(第2の実施形態)本発明の線状照明装置
の第2の実施形態について、図7及び図8を参照しなが
ら説明する。図7及び図8の(a)、(b)は、各々第
2の実施形態に係る線状照明装置の構成を示す側面図と
断面図である。図に示すように、回路基板71(81)
上には複数のLEDチップ72(82)が一列に実装さ
れ、各LEDチップ72(82)上に、第一透明板73
A(83A)及びこれに近接して第二透明板73B(8
3B)が設けられている。図7の構成では第一透明板の
出射面に三角波(のこぎり歯状の面)74を設け、図8
の構成では第二透明板の入射面に三角波(のこぎり波状
の面)84が設けられている。
(Second Embodiment) A second embodiment of the linear illumination device of the present invention will be described with reference to FIGS. 7 and 8. FIGS. 7 and 8A and 8B are a side view and a cross-sectional view, respectively, showing the configuration of the linear lighting device according to the second embodiment. As shown in the figure, the circuit board 71 (81)
A plurality of LED chips 72 (82) are mounted in a row on the upper side, and the first transparent plate 73 is mounted on each LED chip 72 (82).
A (83A) and the second transparent plate 73B (8
3B) is provided. In the configuration of FIG. 7, a triangular wave (sawtooth surface) 74 is provided on the emission surface of the first transparent plate, and
In the above configuration, a triangular wave (sawtooth wave surface) 84 is provided on the incident surface of the second transparent plate.

【0020】以上のように構成された第2の実施形態に
係る線状照明装置について、さらに具体的に説明する。
まず、ダイマウンターを用いて、LEDチップ72(8
2)を所定のピッチで回路基板71(81)上に実装す
る。LEDチップ72(82)としては、GaP又は高
輝度のものが必要な場合には4元系の例えばAlGaI
nP等のベアチップを樹脂モールドしたものを用いる。
また、カラー画像読み取り用の線状照明装置の場合には
R(赤)、G(緑)、B(青)の3色のLEDチップを
交互に並べて実装すればよい。
The linear illumination device according to the second embodiment having the above-described structure will be described more specifically.
First, using a die mounter, the LED chip 72 (8
2) is mounted on the circuit board 71 (81) at a predetermined pitch. As the LED chip 72 (82), if a GaP or a high brightness LED chip is required, a quaternary system such as AlGaI is used.
A bare chip of nP or the like molded with resin is used.
In the case of a linear illumination device for reading a color image, LED chips of three colors R (red), G (green), and B (blue) may be alternately arranged and mounted.

【0021】次に、LEDチップ72(82)上に、ガ
ラスまたわアクリルやポリカーボネイト等の透明樹脂に
よりインジェクション成形により出射面に三角波面(の
こぎり波状の面)74を有する第一透明板73A及び第
二透明板73Bを光学的方法を用いて実装する。この構
成は第一透明板83Aと入射面に三角波面(のこぎり歯
状の面)84を有する第二透明板透明板83Bを光学的
接続方法を用いて実装してもよい。この第一及び第二透
明板73A(83A)、73B(83B)は、長さがほ
ぼ回路基板71(81)と同じ長さ(照明幅)で、厚み
がLEDチップ72(82)の短手方向(副走査方向)
の幅もしくはそれよりおおきめで、幅の和(第一と第二
透明板の幅の和)がおよそLEDチップ72(82)か
ら照明する原稿面までの距離というディメンジョンを有
する。光学的実装方法としては、アクリレート系の高透
過性紫外線硬化型絶縁樹脂を用い、LEDチップ72
(82)に第一透明板73A(83A)をアライメント
した後、紫外線光を照射して硬化させる。高透過性紫外
線硬化型絶縁樹脂の代わりにエポキシ樹脂等の高透過性
熱硬化型絶縁樹脂を用いることもできる。更に第二透明
板73B(83B)に関しては、治具により第一透明板
73A(83A)に近接して配置するか、またわ第一と
第二の透明板の主走査方向の両端のみを接着剤で接着し
てもよい。また、透明板に用いる透明樹脂に関しては、
インジェクション成形の寸法精度を向上させるために
は、熱硬化性の樹脂が適している。
Next, on the LED chip 72 (82), a first transparent plate 73A having a triangular wave surface (sawtooth wave surface) 74 on the emission surface by injection molding of a transparent resin such as glass or acrylic or polycarbonate, and the first. The second transparent plate 73B is mounted using an optical method. In this configuration, the first transparent plate 83A and the second transparent plate transparent plate 83B having a triangular wave surface (sawtooth surface) 84 on the incident surface may be mounted by using an optical connection method. The first and second transparent plates 73A (83A) and 73B (83B) have the same length (illumination width) as the circuit board 71 (81) and a short thickness of the LED chip 72 (82). Direction (sub scanning direction)
The width (or the width of the first and second transparent plates) has a dimension of the distance from the LED chip 72 (82) to the illuminated document surface. As the optical mounting method, an acrylate-based highly transparent UV-curable insulating resin is used, and the LED chip 72 is used.
After aligning the first transparent plate 73A (83A) with (82), it is cured by irradiation with ultraviolet light. A highly transparent thermosetting insulating resin such as an epoxy resin may be used instead of the highly transparent ultraviolet curable insulating resin. Further, the second transparent plate 73B (83B) is placed close to the first transparent plate 73A (83A) by a jig, or only the both ends of the first and second transparent plates in the main scanning direction are bonded. You may adhere with an agent. Regarding the transparent resin used for the transparent plate,
Thermosetting resins are suitable for improving the dimensional accuracy of injection molding.

【0022】このようにして作製した第3の実施形態に
係る線状照明装置の動作原理及び特性について説明す
る。LEDチップ72から出力された照明光は、第一透
明板73Aを通して副走査方向には拡散される事なくそ
の他端まで導かれ、その出射面にある三角波面(のこぎ
り波状の面)74により主走査方向のみに拡散され、さ
らに第二透明板73Bを通して副走査方向には拡散され
る事なく出射面まで導かれ、その近傍にある原稿面を線
状に効率よく、ばらつきなく照明する。またこの構成
は、第一透明板83Aと入射面に三角波面(のこぎり波
状の面)84をもつ第二透明板83Bを用いた構成でも
同じ効果がある。この際、入射面かつ/またわ出射面に
ある三角波面(のこぎり波状の面)により、主走査方向
のみ照明光が拡散されるため、原稿面照度のばらつきを
小さく(従来のLEDアレイい比べて約1/3)でき、
また副走査方向には照明光は拡散されずに導かれるた
め、原稿面を効率よく線状に照明することができた(従
来のLEDアレイに比べて照度が約4倍になった)。こ
れにより、従来のLEDアレイと比較して、LEDチッ
プ数を約1/4に削減することができた。
The operation principle and characteristics of the linear illumination device according to the third embodiment thus manufactured will be described. The illumination light output from the LED chip 72 is guided to the other end without being diffused in the sub-scanning direction through the first transparent plate 73A, and main scanning is performed by the triangular wave surface (sawtooth wave surface) 74 on the exit surface. The light is diffused only in the direction, and is further guided to the exit surface through the second transparent plate 73B without being diffused in the sub-scanning direction, and the document surface in the vicinity thereof is illuminated linearly efficiently and without variation. In addition, this configuration has the same effect even when the first transparent plate 83A and the second transparent plate 83B having a triangular wave surface (sawtooth wave surface) 84 on the incident surface are used. At this time, since the illumination light is diffused only in the main scanning direction by the triangular wave surface (sawtooth wave surface) on the incident surface and / or the exit surface, the unevenness of the illuminance of the document surface is small (compared to the conventional LED array. About 1/3) done,
Further, since the illumination light is guided in the sub-scanning direction without being diffused, the document surface can be efficiently illuminated linearly (the illuminance is approximately four times that of the conventional LED array). As a result, the number of LED chips could be reduced to about 1/4 as compared with the conventional LED array.

【0023】(第3の実施形態)次に、本発明の線状照
明装置の第3の実施形態について、図9を用いて説明す
る。図9において、(a)は第3の実施形態に係る線状
照明装置に用いるLEDアレイの側部断面図であり、
(b)はその平面図である。図9に示すように、回路基
板91上には複数のLEDチップ92が一列に実装さ
れ、各LEDチップ92が実装される部分及びその周辺
には、それぞれ凹反射面23が形成されている。
(Third Embodiment) Next, a third embodiment of the linear lighting device of the present invention will be described with reference to FIG. In FIG. 9, (a) is a side sectional view of an LED array used in the linear lighting device according to the third embodiment,
(B) is a plan view thereof. As shown in FIG. 9, a plurality of LED chips 92 are mounted in a line on the circuit board 91, and the concave reflection surface 23 is formed at the portion where each LED chip 92 is mounted and its periphery.

【0024】以上のように構成された第3の実施形態に
係る線状照明装置について、さらに具体的に説明する。
まず、アルミニウム基板の表面に絶縁樹脂を塗布し絶縁
層を形成しその上に回路導体層を設けることにより回路
基板91を作製する。さらに、この回路基板91の表面
に、プレスにより所定形状の凹反射面93を形成する。
凹反射面93の表面は前記回路導体層であるため、その
表面に入射した光は所定方向に反射される(特に反射率
を上げるためには、凹反射面の表面を金メッキ処理をす
る)。次に、回路基板91の凹反射面93にダイマウン
ターによりLEDチップ92をダイボンドし、さらにワ
イヤーボンドして実装を完了する。さらに、この上面
に、前記第1及び第2の実施形態で使用した各種の透明
板を実装する。
The linear illumination device according to the third embodiment having the above-described structure will be described more specifically.
First, an insulating resin is applied to the surface of an aluminum substrate to form an insulating layer, and a circuit conductor layer is provided on the insulating layer, whereby the circuit board 91 is manufactured. Further, a concave reflection surface 93 having a predetermined shape is formed on the surface of the circuit board 91 by pressing.
Since the surface of the concave reflection surface 93 is the circuit conductor layer, the light incident on the surface is reflected in a predetermined direction (especially, in order to increase the reflectance, the surface of the concave reflection surface is plated with gold). Next, the LED chip 92 is die-bonded to the concave reflection surface 93 of the circuit board 91 by a die mounter, and further wire-bonded to complete the mounting. Further, various transparent plates used in the first and second embodiments are mounted on the upper surface.

【0025】このようにして作製した第3の実施形態に
係る線状照明装置の動作原理及び特性について説明す
る。LEDチップ92から出力された照明光のうち、前
方に出射された光成分はそのまま透明板に導かれる。ま
た、横及び後方に出射された光成分はそれぞれ、凹反射
面93により反射され、前方へ進み、透明板に導かれ
る。
The operation principle and characteristics of the linear illumination device according to the third embodiment thus manufactured will be described. Of the illumination light output from the LED chip 92, the light component emitted forward is directly guided to the transparent plate. The light components emitted laterally and rearward are reflected by the concave reflecting surface 93, travel forward, and are guided to the transparent plate.

【0026】このようにして、従来のLEDアレイで
は、照明光に寄与していなかった横及び後方に発射され
る光の成分を利用することにより照明に利用される光の
量が従来のLEDに比べ約2倍となった。また、この凹
反射面93の形状を変化させることにより、原稿面照度
とそのばらつきも自由に変えることができた。
In this way, in the conventional LED array, the amount of light used for illumination is changed to that of the conventional LED by utilizing the components of light emitted laterally and backward which did not contribute to the illumination light. It is about twice as much. Further, by changing the shape of the concave reflection surface 93, the illuminance on the document surface and its variation can be freely changed.

【0027】[0027]

【発明の効果】以上のように本発明によれば、原稿面へ
の照明効率が高く、照度ばらつきが小さい線状照明装置
を可能とし、低コストで、高品質、高分解能で画像を読
み取れる小型・軽量の光学的画像読み取り装置を実現す
ることができる。
As described above, according to the present invention, it is possible to provide a linear illuminating device which has a high efficiency of illuminating a document surface and a small illuminance variation, and is small in size and capable of reading an image with high quality and high resolution at a low cost. -A lightweight optical image reading device can be realized.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)本発明の線状照明装置の基本構成を示す
側面図 (b)本発明の線状照明装置の基本構成を示す平面図
FIG. 1A is a side view showing a basic configuration of a linear lighting device of the present invention. FIG. 1B is a plan view showing a basic configuration of a linear lighting device of the present invention.

【図2】本発明の第1の実施形態における線状照明装置
の側面図
FIG. 2 is a side view of the linear lighting device according to the first embodiment of the present invention.

【図3】本発明の第1の実施形態における線状照明装置
の断面図
FIG. 3 is a sectional view of the linear lighting device according to the first embodiment of the present invention.

【図4】本発明の第1の実施形態における線状照明装置
の断面図
FIG. 4 is a sectional view of the linear lighting device according to the first embodiment of the present invention.

【図5】本発明の第1の実施形態における線状照明装置
の断面図
FIG. 5 is a sectional view of the linear lighting device according to the first embodiment of the present invention.

【図6】本発明の第1の実施形態における線状照明装置
の側面図
FIG. 6 is a side view of the linear lighting device according to the first embodiment of the present invention.

【図7】(a)本発明の第2の実施形態における線状照
明装置の側面図 (b)本発明の第2の実施形態における線状照明装置の
断面図
FIG. 7A is a side view of a linear lighting device according to a second embodiment of the present invention. FIG. 7B is a cross-sectional view of the linear lighting device according to a second embodiment of the present invention.

【図8】(a)本発明の第2の実施形態における線状照
明装置の側面図 (b)本発明の第2の実施形態における線状照明装置の
断面図
FIG. 8A is a side view of the linear lighting device according to the second embodiment of the present invention. FIG. 8B is a sectional view of the linear lighting device according to the second embodiment of the present invention.

【図9】(a)本発明の第3の実施形態における線状照
明装置に用いるLEDアレイの側部断面図 (b)本発明の第3の実施形態における線状照明装置に
用いるLEDアレイの平面図
FIG. 9 (a) is a side sectional view of an LED array used in the linear lighting device according to the third embodiment of the present invention. (B) An LED array used in the linear lighting device according to the third embodiment of the present invention. Plan view

【図10】光学的画像読み取り装置の断面図FIG. 10 is a sectional view of an optical image reading device.

【図11】従来のLEDアレイの構成図FIG. 11 is a configuration diagram of a conventional LED array.

【符号の説明】[Explanation of symbols]

11 回路基板 12 LEDチップ 13 透明板 21 回路基板 22 LEDチップ 23 透明板 24 三角波面(のこぎり歯状の面) 33 透明板 43 透明板 53 透明板 63 透明板 71 回路基板 72 LEDチップ 73A 第一透明板 73B 第二透明板 74 三角波面(のこぎり波状の面) 81 回路基板 82 LEDチップ 83A 第一透明板 83B 第二透明板 84 三角波面(のこぎり波状の面) 91 回路基板 92 LEDチップ 93 凹反射面 101 原稿 102 LEDアレイ 103 ロッドレンズアレイ 104 光電変換素子アレイ 111 基板 112 LEDチップ 11 Circuit Board 12 LED Chip 13 Transparent Plate 21 Circuit Board 22 LED Chip 23 Transparent Plate 24 Triangular Wave Front (Sawtooth Surface) 33 Transparent Plate 43 Transparent Plate 53 Transparent Plate 63 Transparent Plate 71 Circuit Board 72 LED Chip 73A First Transparent Plate 73B Second transparent plate 74 Triangular wave surface (sawtooth surface) 81 Circuit board 82 LED chip 83A First transparent plate 83B Second transparent plate 84 Triangular wave surface (sawtooth surface) 91 Circuit board 92 LED chip 93 Concave reflection surface 101 original 102 LED array 103 rod lens array 104 photoelectric conversion element array 111 substrate 112 LED chip

───────────────────────────────────────────────────── フロントページの続き (72)発明者 本郷 弘貴 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroki Hongo 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (18)

【特許請求の範囲】[Claims] 【請求項1】回路基板上に一列に配列された発光素子ア
レイと、前記配列された発光素子アレイ上に設けられた
透明板を具備し、前記透明板の長さは前記発光素子アレ
イの配列の長さとほぼ等しく、厚みは前記発光素子アレ
イの配列方向に直交する方向における前記発光素子の幅
と同程度もしくは大きめで、幅は前記発光素子アレイか
ら照射される原稿までの距離にほぼ等しい線状照明装置
において、前記透明板の、前記発光素子アレイからの光
が入射する入射面に、特定の角度及びピッチを持つ三角
波面が前記発光素子アレイの配列方向に並んだ構成の線
状照明装置。
1. A light emitting device array arranged in a line on a circuit board, and a transparent plate provided on the arranged light emitting device array, wherein the length of the transparent plate is the arrangement of the light emitting device arrays. Is approximately equal to the length of the light emitting element array, and the thickness is about the same as or larger than the width of the light emitting element in the direction orthogonal to the array direction of the light emitting element array, and the width is approximately equal to the distance from the light emitting element array to the document to be irradiated. Linear illumination device, wherein a triangular wave surface having a specific angle and a specific pitch is arranged in an array direction of the light emitting element array on an incident surface of the transparent plate on which light from the light emitting element array is incident. .
【請求項2】回路基板上に一列に配列された発光素子ア
レイと、前記配列された発光素子アレイ上に設けられた
透明板を具備し、前記透明板の長さは前記発光素子アレ
イの配列の長さとほぼ等しく、厚みは前記発光素子アレ
イの配列方向向に直交する方向における前記発光素子の
幅と同程度もしくは大きめで、幅は前記発光素子アレイ
から照射される原稿までの距離にほぼ等しい線状照明装
置において、前記透明板の、前記発光素子アレイからの
光が出射する出射面に、特定の角度及びピッチを持つ三
角波面が前記発光素子アレイの配列方向に並んだ構成の
線状照明装置。
2. A light emitting element array arranged in a line on a circuit board, and a transparent plate provided on the arranged light emitting element array, wherein the length of the transparent plate is the arrangement of the light emitting element arrays. Is approximately equal to the length of the light emitting element array, and the thickness is approximately the same as or larger than the width of the light emitting element in the direction orthogonal to the array direction of the light emitting element array, and the width is substantially equal to the distance from the light emitting element array to the document to be irradiated. In the linear illumination device, a linear illumination having a configuration in which a triangular wave surface having a specific angle and a pitch is arranged in an array direction of the light emitting element array on an emission surface of the transparent plate from which the light from the light emitting element array is emitted. apparatus.
【請求項3】回路基板上に一列に配列された発光素子ア
レイと、前記配列された発光素子アレイ上に設けられた
透明板を具備し、前記透明板の長さは前記発光素子アレ
イの配列の長さとほぼ等しく、厚みは前記発光素子アレ
イの配列方向に直交する方向における前記発光素子の幅
と同程度もしくは大きめで、幅は前記発光素子アレイか
ら照射される原稿までの距離にほぼ等しい線状照明装置
において、前記透明板の、前記発光素子アレイからの光
が入射する入射面と、光が出射する出射面の両面に、特
定の角度及びピッチを持つ三角波面が前記発光素子アレ
イの配列方向に並んだ構成の線状照明装置。
3. A light emitting element array arranged in a line on a circuit board, and a transparent plate provided on the arranged light emitting element array, wherein the length of the transparent plate is the arrangement of the light emitting element arrays. Is approximately equal to the length of the light emitting element array, and the thickness is about the same as or larger than the width of the light emitting element in the direction orthogonal to the array direction of the light emitting element array, and the width is approximately equal to the distance from the light emitting element array to the document to be irradiated. In the flat illumination device, triangular wave fronts having a specific angle and pitch are arranged on the transparent plate on both the incident surface on which the light from the light emitting element array is incident and the exit surface on which the light is emitted. A linear lighting device that is lined up in one direction.
【請求項4】回路基板上に一列に配列された発光素子ア
レイと、前記配列された発光素子アレイ上に設けられた
透明板を具備し、前記透明板の長さは前記発光素子アレ
イの配列の長さとほぼ等しく、厚みは前記発光素子アレ
イの配列方向に直交する方向における前記発光素子の幅
と同程度もしくは大きめで、幅は前記発光素子アレイか
ら照射される原稿までの距離にほぼ等しい線状照明装置
において、前記透明板の、出射面が副走査方向にRが付
いた線状照明装置。
4. A light emitting element array arranged in a line on a circuit board, and a transparent plate provided on the arranged light emitting element array, wherein the length of the transparent plate is the arrangement of the light emitting element arrays. Is approximately equal to the length of the light emitting element array, and the thickness is about the same as or larger than the width of the light emitting element in the direction orthogonal to the array direction of the light emitting element array, and the width is approximately equal to the distance from the light emitting element array to the document to be irradiated. In the linear illumination device, the emission surface of the transparent plate is R-shaped in the sub-scanning direction.
【請求項5】回路基板上に一列に配列された発光素子ア
レイと、前記配列された発光素子アレイ上に設けられた
透明板を具備し、前記透明板の長さは前記発光素子アレ
イの配列の長さとほぼ等しく、厚みは前記発光素子アレ
イの配列方向に直交する方向における前記発光素子の幅
と同程度もしくは大きめで、幅は前記発光素子アレイか
ら照射される原稿までの距離にほぼ等しい線状照明装置
において、前記透明板の厚みが光の入射面から出射面に
行くにしたがって小さくなる線状照明装置。
5. A light emitting device array arranged in a line on a circuit board, and a transparent plate provided on the arranged light emitting device array, wherein the length of the transparent plate is the arrangement of the light emitting device arrays. Is approximately equal to the length of the light emitting element array, and the thickness is about the same as or larger than the width of the light emitting element in the direction orthogonal to the array direction of the light emitting element array, and the width is approximately equal to the distance from the light emitting element array to the document to be irradiated. In the linear illumination device, the thickness of the transparent plate decreases from the light incident surface to the light emission surface.
【請求項6】回路基板上に一列に配列された発光素子ア
レイと、前記配列された発光素子アレイ上に設けられた
透明板を具備し、前記透明板の長さは前記発光素子アレ
イの配列の長さとほぼ等しく、厚みは前記発光素子アレ
イの配列方向に直交する方向における前記発光素子の幅
と同程度もしくは大きめで、幅は前記発光素子アレイか
ら照射される原稿までの距離にほぼ等しい線状照明装置
において、前記透明板の光の出射面が副走査方向に関し
て傾斜をもった構造とした線状照明装置。
6. A light emitting element array arranged in a line on a circuit board, and a transparent plate provided on the arranged light emitting element array, wherein the length of the transparent plate is the arrangement of the light emitting element arrays. Is approximately equal to the length of the light emitting element array, and the thickness is about the same as or larger than the width of the light emitting element in the direction orthogonal to the array direction of the light emitting element array, and the width is approximately equal to the distance from the light emitting element array to the document to be irradiated. In the linear illumination device, the light emitting surface of the transparent plate has a structure inclined with respect to the sub-scanning direction.
【請求項7】回路基板上に一列に配列された発光素子ア
レイと、前記配列された発光素子アレイ上に設けられた
透明板を具備し、前記透明板の長さは前記発光素子アレ
イの配列の長さとほぼ等しく、厚みは前記発光素子アレ
イの配列方向に直交する方向における前記発光素子の幅
と同程度もしくは大きめで、幅は前記発光素子アレイか
ら照射される原稿までの距離にほぼ等しい線状照明装置
において、前記透明板中に、複数の空洞を形成すること
により屈折率の違う領域を設け、光を拡散させる構成と
した線状照明装置。
7. A light emitting element array arranged in a line on a circuit board, and a transparent plate provided on the arranged light emitting element array, wherein the length of the transparent plate is the arrangement of the light emitting element arrays. Is approximately equal to the length of the light emitting element array, and the thickness is about the same as or larger than the width of the light emitting element in the direction orthogonal to the array direction of the light emitting element array, and the width is approximately equal to the distance from the light emitting element array to the document to be irradiated. In the linear illumination device, a plurality of cavities are formed in the transparent plate to provide regions having different refractive indexes to diffuse light.
【請求項8】空洞の形状が副走査方向に中心軸を持つ円
柱である請求項7記載の線状照明装置。
8. The linear illumination device according to claim 7, wherein the shape of the cavity is a cylinder having a central axis in the sub-scanning direction.
【請求項9】空洞の形状が副走査方向に中心軸を持つ三
角柱で、その頂点の一つが透明板の入射面を垂直に指す
構成となる請求項7記載の線状照明装置。
9. The linear illuminator according to claim 7, wherein the shape of the cavity is a triangular prism having a central axis in the sub-scanning direction, and one of the vertices points vertically to the incident surface of the transparent plate.
【請求項10】回路基板上に一列に配列された発光素子
アレイと、前記配列された発光素子アレイ上に設けられ
た第一透明板と、前記第一透明板の光の出射面に近接し
てその入射面が設けられた第二透明板を具備し、前記第
一及び第二の透明板の長さは前記発光素子アレイの配列
の長さとほぼ等しく、前記第一及び第二の透明板の厚み
は前記発光素子アレイの配列方向に直交する方向におけ
る前記発光素子の幅と同程度もしくは大きめで、前記第
一及び第二の透明板の幅の和は、前記発光素子アレイか
ら照射される原稿までの距離にほぼ等しい線状照明装置
において、前記第一透明板の、光の出射面に、特定の角
度及びピッチを持つ三角波面が前記発光素子アレイの配
列方向に並んだ構成の線状照明装置。
10. A light emitting element array arranged in a line on a circuit board, a first transparent plate provided on the arranged light emitting element array, and a light emitting surface of the first transparent plate in proximity to the light emitting surface. A second transparent plate provided with an incident surface thereof, the lengths of the first and second transparent plates being substantially equal to the array length of the light emitting element array, and the first and second transparent plates. Has the same or larger thickness as the width of the light emitting element in the direction orthogonal to the array direction of the light emitting element array, and the sum of the widths of the first and second transparent plates is irradiated from the light emitting element array. In a linear lighting device having a distance substantially equal to the distance to the original, a linear wave structure in which triangular wavefronts having a specific angle and pitch are arranged in the light emitting element array array direction on the light emitting surface of the first transparent plate. Lighting equipment.
【請求項11】回路基板上に一列に配列された発光素子
アレイと、前記配列された発光素子アレイ上に設けられ
た第一透明板と、前記第一透明板の光の出射面に近接し
てその入射面が設けられた第二透明板具を備し、前記第
一及び第二の透明板の長さは前記発光素子アレイの配列
の長さとほぼ等しく、前記第一及び第二の透明板の厚み
は前記発光素子アレイの配列方向に直交する方向におけ
る前記発光素子の幅と同程度もしくは大きめで、前記第
一及び第二の透明板の幅の和は、前記発光素子アレイか
ら照射される原稿までの距離にほぼ等しい線状照明装置
において、前記第二透明板の、光の入射面に、特定の角
度及びピッチを持つ三角波面が前記発光素子アレイの配
列方向に並んだ構成の線状照明装置。
11. A light emitting element array arranged in a line on a circuit board, a first transparent plate provided on the arranged light emitting element array, and a light emitting surface of the first transparent plate in proximity to the light emitting surface. A second transparent plate member provided with an incident surface thereof, the lengths of the first and second transparent plates being substantially equal to the array length of the light emitting device array, and the first and second transparent plates. The thickness of the plate is the same as or larger than the width of the light emitting element in the direction orthogonal to the array direction of the light emitting element array, and the sum of the widths of the first and second transparent plates is irradiated from the light emitting element array. In the linear illumination device having a distance substantially equal to the distance to the original, a line having a configuration in which triangular wave fronts having a specific angle and pitch are arranged in the light emitting element array arrangement direction on the light incident surface of the second transparent plate. Lighting device.
【請求項12】第二透明板の、出射面が副走査方向にR
が付いた請求項10または11記載の線状照明装置。
12. The emission surface of the second transparent plate is R in the sub-scanning direction.
The linear lighting device according to claim 10 or 11, which is provided with.
【請求項13】第一及び第二の透明板の、副走査方向の
幅が光の入射面から出射面に行くにしたがって小さくな
る請求項10または11記載の線状照明装置。
13. The linear illumination device according to claim 10, wherein the widths of the first and second transparent plates in the sub-scanning direction become smaller from the light incident surface to the light emitting surface.
【請求項14】第二透明板の光の出射面が副走査方向に
関して傾斜をもった構造とした請求項10または11記
載の線状照明装置。
14. The linear illumination device according to claim 10, wherein the light emitting surface of the second transparent plate has a structure inclined with respect to the sub-scanning direction.
【請求項15】第一及び第二の透明板中に、複数の空洞
を形成することにより屈折率の違う領域を設け、光を拡
散させる構成とした請求項10または11記載の線状照
明装置。
15. The linear illumination device according to claim 10 or 11, wherein a plurality of cavities are formed in the first and second transparent plates to provide regions having different refractive indexes to diffuse light. .
【請求項16】空洞の形状が副走査方向に中心軸を持つ
円柱である請求項15記載の線状照明装置。
16. The linear illumination device according to claim 15, wherein the shape of the cavity is a cylinder having a central axis in the sub-scanning direction.
【請求項17】空洞の形状が副走査方向に中心軸を持つ
三角柱で、その頂点の一つが透明板の入射面を垂直に指
す構成となる請求項15記載の線状照明装置。
17. The linear illumination device according to claim 15, wherein the shape of the cavity is a triangular prism having a central axis in the sub-scanning direction, and one of the vertices points vertically to the incident surface of the transparent plate.
【請求項18】回路基板上の発光素子アレイの発光素子
が各々実装される部分及びその近傍にそれぞれ設けられ
た凹反射面を具備する請求項1〜17のいずれか1項に
記載の線状照明装置。
18. The linear structure according to claim 1, further comprising a concave reflection surface provided in a portion where each light emitting element of the light emitting element array is mounted on the circuit board and in the vicinity thereof. Lighting equipment.
JP8054611A 1996-03-12 1996-03-12 Linear illuminator Pending JPH09247361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8054611A JPH09247361A (en) 1996-03-12 1996-03-12 Linear illuminator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8054611A JPH09247361A (en) 1996-03-12 1996-03-12 Linear illuminator

Publications (1)

Publication Number Publication Date
JPH09247361A true JPH09247361A (en) 1997-09-19

Family

ID=12975546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8054611A Pending JPH09247361A (en) 1996-03-12 1996-03-12 Linear illuminator

Country Status (1)

Country Link
JP (1) JPH09247361A (en)

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Publication number Priority date Publication date Assignee Title
US7551329B2 (en) * 2002-06-20 2009-06-23 Rohm Co., Ltd. Led chip mounting structure and image reader having same
JP2005077982A (en) * 2003-09-03 2005-03-24 Sankyo Seiki Mfg Co Ltd Optical reading apparatus
JP2006205430A (en) * 2005-01-26 2006-08-10 Seiko Epson Corp Electrooptical device, method of manufacturing the same, image printer, and image reading device
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US8325392B2 (en) 2008-03-28 2012-12-04 Kyocera Document Solutions Inc. Image reading device and image forming device
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