JPH09239944A - Method for processing thermosensible stencil paper and transfer sheet employed therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for processing thermosensible stencil paper having no occurrence of hole making failures or pinholes, besides, making holes with low energy, and also provide a transfer sheet employed therefor. SOLUTION: The method of processing thermosensible stencil paper is such that the light and heat conversion material part 2 of a transfer sheet 13 provide with a character image like light and heat conversion material part 2 on the carrier 1 and the thermoplastic resin film surface 6 of a thermosensible stencil paper 12 having a thermosensible resin film 6 are brought in close contact with each other, and the carrier 1 of the transfer sheet 13 is separated in order to transfer the light and heat conversion material part 2 onto the thermoplastic resin film 6, and thereafter the thermoplastic resin film 6 is subjected to hole making operation by irradiating visible rays or infrared rays to the transferred light and heat conversion material part 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for making a heat-sensitive stencil sheet and a transfer sheet used therefor. More specifically, it is possible to prevent perforation defects and pinholes and to efficiently perforate them by irradiation with visible light or infrared rays. The present invention relates to a heat-sensitive stencil sheet making method and a transfer sheet used therefor.

[0002]

2. Description of the Related Art Conventionally, stencil printing is widely known as a simple printing method, and as a method for making a heat-sensitive stencil sheet used for stencil printing, a prepared original such as a handwritten original or an electrophotographic method is used. A document having a photothermal conversion material such as a toner image part is superposed on the heat-sensitive stencil sheet, and the image part of the document is heated by the light of a flash lamp, an infrared lamp, etc. A method of melt perforating a thermoplastic resin film is known. However, in the above plate making method, due to poor adhesion between the thermoplastic resin film of the heat-sensitive stencil sheet and the heat-absorbed original, perforation failure occurs, dust on the original surface or toner in the non-image area absorbs heat. There has been a problem that a phenomenon other than a desired punched portion is punched, that is, a so-called pinhole is generated. Further, in the above plate making method,
When the thermoplastic resin film is melted and perforated by heating the image portion composed of the photothermal conversion material portion on the original, the original document and the photothermal conversion material portion formed on the original must be heated. A large amount of irradiation energy is required to melt and perforate a plastic resin film, which has a drawback of low energy efficiency.

[0003]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, to make a heat-sensitive stencil sheet which is free from perforation defects and pinholes and can be perforated with low energy, and It is to provide a transfer sheet used for this.

[0004]

The inventions claimed in this application are as follows. (1) The light-heat converting material portion of a transfer sheet provided with a character-image-like light-heat converting material portion on a support and the thermoplastic resin film surface of a heat-sensitive stencil sheet having a thermoplastic resin film are adhered to each other, After peeling the support of the transfer sheet to transfer the light-heat converting material portion onto the thermoplastic resin film, irradiating the transferred light-heat converting material portion with visible light or infrared rays to perforate the thermoplastic resin film. A method for making a heat-sensitive stencil sheet, characterized by: (2) The transfer sheet used in (1), which has a photo-thermal conversion material portion in the form of a character image on the support. (3) The softening point or melting point of the photothermal conversion material portion is 40 to 150.
The transfer sheet according to (2), which is in the range of ° C. (4) The transfer sheet used in (1), wherein the photothermal conversion material portion and the adhesive material portion are sequentially laminated on the support in the form of a character image. (5) The transfer sheet according to (4), wherein the photothermal conversion material portion and the adhesive material portion have a softening point or a melting point in the range of 40 to 150 ° C. (6) A release material portion, a photothermal conversion material portion, and an adhesive material portion are sequentially laminated in a character image on the support.
Transfer sheet used in (1). (7) The transfer sheet according to (6), wherein the peeling material portion, the light-heat converting material portion and the adhesive material portion have a softening point or a melting point in the range of 40 to 150 ° C. (8) The transfer sheet according to (6) or (7), wherein the total thickness of the release material portion, the photothermal conversion material portion and the adhesive material portion is in the range of 0.001 to 20 μm. (9) The transfer sheet according to any one of (4) to (8), characterized in that a release sheet is provided on the adhesive material portion. (10) The transfer sheet according to any one of (2) to (9), wherein at least one surface of the support is peeled off.

According to the plate-making method of the present invention, the photothermal conversion material portion in the form of a character image is directly transferred onto the surface of the thermoplastic resin film by using a transfer sheet prepared in advance, and the desired portion is directly transferred onto the thermoplastic resin film. Since the character image can be provided, the problem of perforation failure due to poor adhesion between the original and the thermoplastic resin film at the time of light irradiation does not occur unlike the conventional case. Further, it is possible to prevent dust from adhering to an original prepared in advance or pinholes caused by toner in the non-image portion of the original copied by the electrophotographic method.

Further, there is no original document on the transferred light-heat converting material portion, and the total energy supplied to the light-heat converting material portion is converted into heat energy to directly melt the thermoplastic resin film. Since it can be perforated with high energy efficiency, it is possible to perforate with low energy.
Further, in the present invention, the materials of the adhesive material portion and the release material portion, which are provided above and below the photothermal conversion material portion as needed, are materials having a small heat capacity as will be described later, and even if these are provided, they are the same as in the conventional case. Does not require large irradiation energy.

The transfer sheet used in the present invention is one in which a character image-like photothermal conversion material portion is provided on a support, and an adhesive material portion may be provided on the photothermal conversion material portion. . By providing the adhesive material portion, the adhesion with the thermoplastic resin film becomes good. It is also possible to provide a character image-shaped release material portion on the support and provide a photothermal conversion material portion and an adhesive material portion in that order on the layer. By providing such a release material portion, the support of the transfer sheet after being bonded to the thermoplastic resin film and the photothermal conversion material portion can be easily released.
Further, it is preferable that at least one surface of the support of the transfer sheet is subjected to a peeling treatment. By subjecting the support to a peeling treatment, it is possible to efficiently prevent the support surface, on which the light-heat converting material portion is not present, from adhering to the thermoplastic resin film, and the support is easily peeled. Further, by performing a peeling treatment on the surface of the support having no photothermal conversion material portion, it is possible to prevent the transfer sheets from sticking to each other when the transfer sheets are stacked and stored.

The photothermal conversion material used in the present invention includes:
A material that can efficiently convert light energy into heat energy is preferable. For example, carbon black, lamp black, silicon carbide, carbon nitride, metal powder, metal oxides, inorganic pigments, organic pigments, organic dyes and the like are used. Among the organic dyes, those having large absorption efficiency in a specific light wavelength region such as anthraquinone dye, phthalocyanine dye, cyanine dye, squarylium dye, and polymethine dye are preferable. These materials may be used alone or in combination, and may be dissolved or dispersed in a solvent or water together with a resin or the like, if necessary, and applied in a character image form on a support of a transfer sheet to form a light conversion material layer. .

Examples of the adhesive used in the present invention include polyvinyl acetate, ethylene-vinyl acetate copolymer,
Vinyl chloride-vinyl acetate copolymer, acrylic resin, polyester, polyurethane, styrene-butadiene copolymer, polyisobutylene, polyisoprene, butyl rubber,
Hydrophilic or hydrophobic polymer compounds such as polyacrylamide, rosin resin and terpene resin are used. These materials, alone or in combination, are dissolved or dispersed in a solvent or water, and applied on the light-to-heat conversion material portion in the character image of the transfer sheet to form an adhesive material portion.

When the thermoplastic resin film of the heat-sensitive stencil sheet and the light-heat converting material portion of the transfer sheet are brought into close contact with each other, the adhesive force of the pressure-sensitive adhesive portion is more than that of the light-heat converting material portion and the transfer sheet support. The adhesive force between the conversion material portion and the thermoplastic resin film is set to be stronger. With this, after the thermoplastic resin film of the heat-sensitive stencil sheet and the light-heat converting material portion of the transfer sheet are brought into close contact with each other, the support of the transfer sheet can be peeled off while the light-heat converting material portion is transferred onto the thermoplastic resin film. .

Examples of the release agent used in the present invention include compounds such as fluorine compounds, silane compounds, waxes, higher fatty acids, higher fatty acid amides, and polyolefins. Specifically, tetrafluoroethylene resin,
Ethylene tetrafluoride-hexafluoropropylene copolymer, ethylene tetrafluoride-perfluoroalkyl vinyl ether copolymer, silicone resin, dimethyl silicone oil,
Methylphenyl silicone oil, cyclic dimethyl siloxane, modified silicone oil, carnauba wax, microcrystalline wax, polyethylene wax, montan wax, paraffin wax, Cadeline wax, shellac wax, oxidation wax, ester wax, beeswax, wood wax, whale wax , Stearic acid, lauric acid, behenic acid, caproic acid, palmitic acid, stearic acid, lauric acid, behenic acid, caproic acid, palmitic acid, stearic acid amide, lauric acid amide, behenic acid amide, caproic acid amide, palmitic acid amide , Polyethylene, polypropylene, etc. are used.

When a hydrophobic resin film is used as the support, a polymer compound having substantially no adhesive property such as polyvinyl alcohol, polyvinyl ether, methyl cellulose, carboxymethyl cellulose, polyvinyl butyral, polyvinyl acetate, polyacrylamide, etc. The hydrophilic resin can be used as a release material. These materials, alone or in combination, are dissolved or dispersed in a solvent or water, and then, on a support of a transfer sheet,
Before forming the above-mentioned photothermal conversion material portion, it is applied in the form of a character image to form a release material portion. The release material portion has a function of facilitating the release of the support after the thermoplastic resin film and the transfer sheet are brought into close contact with each other.

The softening point or melting point of the release material portion, the light-heat converting material portion and the adhesive material portion used in the present invention is 40 respectively.
It is preferably in the range of to 150 ° C, preferably 60 to 120 ° C. If the softening point or melting point is less than 40 ° C., the transfer sheet may be affected by the ambient temperature, and the mechanical properties and thermal properties of the transfer sheet may change, causing troubles during use. On the other hand, if the temperature exceeds 150 ° C., a large amount of irradiation energy is required, the plate making time becomes long, and the plate making apparatus becomes large.

The total thickness of the release material portion, the photothermal conversion material portion and the adhesive material portion is preferably 0.001 to 20 μm, more preferably 0.01 to 10 μm. If the total thickness is less than 0.001 μm, the amount of the photothermal conversion material required for perforation may be insufficient, and the adhesive force of the adhesive material portion may be reduced, so that these layers may not be transferred onto the thermoplastic resin film.
On the other hand, if it exceeds 20 μm, a large amount of irradiation energy is required, the plate making time becomes long, and the plate making apparatus becomes large.

The support of the transfer sheet used in the present invention is not particularly limited, but a thermoplastic or thermosetting polymer resin film, release paper or the like is used. Specifically, polyethylene, polypropylene, polyvinyl chloride,
Films or papers of polyvinylidene chloride, polyethylene terephthalate, polybutylene terephthalate, polystyrene, polycarbonate, polyphenylene sulfide, polyimide, polyamide and the like are used.

It is preferable that at least one surface of these supports is subjected to a peeling treatment. By performing the release treatment, the support and the release material portion can be easily released, and unnecessary adhesion with the adhesive material portion when the transfer sheets are stacked and stored can be prevented. For the peeling treatment, the above-mentioned peeling material or the like is used, and a silicone resin treatment, a wax treatment or the like is performed. The transfer sheet of the present invention is prepared by preparing a coating liquid containing the above-mentioned release material, photothermal conversion material or adhesive material, and coating these coating liquids on the above-mentioned support such as a gravure coater and a wire bar coater. It can be obtained by sequentially coating by means and drying.

The heat-sensitive stencil base paper used in the present invention may be a base paper of a thermoplastic resin film alone or a base paper obtained by laminating a thermoplastic resin film and a porous support.
Examples of the thermoplastic resin film include polyethylene,
Polypropylene, polyvinyl chloride, polyvinylidene chloride, polyethylene terephthalate, polybutylene terephthalate, polystyrene, polyurethane, polycarbonate, polyvinyl acetate, acrylic resin, silicone resin and the like are used. These resin components may be used alone or in combination, or as a copolymer. The thickness of the thermoplastic resin film is usually 0.5 to 50 μm, preferably 1 to 20 μm. If the resin film is too thin, the handling and strength will be poor, and if it is too thick, a large amount of perforation energy will be required, which is not economical.

As the porous support used in the present invention, natural fibers such as Manila hemp, pulp, Mitsumata, Kozo and Japanese paper, synthetic fibers such as polyester, nylon, vinylon and acetate, metal fibers, glass fibers and the like may be used alone or Examples include thin paper, non-woven fabric, screen gauze and the like that are used by mixing. The basis weight of these porous supports is from 1 to 20 from the viewpoint of strength as a base paper and ink permeability during printing.
range of g / m ^2, more preferably from 5 to 15 g / m ^2. Also, the thickness of the porous support is preferably in the range of 5 to 100 μm, more preferably 10 for the same reason.
５０50 μm.

In the plate making method of the present invention, the photothermal conversion material portion or the like on the support of the transfer sheet prepared in advance is brought into close contact with the surface of the thermoplastic resin film of the heat-sensitive stencil sheet, and then the support of the transfer sheet is attached. It comprises a step of peeling and transferring the light-heat converting material portion or the like onto the thermoplastic resin film, and a step of irradiating the transferred light-heat converting material portion or the like with visible light or infrared rays to perforate the thermoplastic resin film. In the present invention, visible light or infrared light is used as an energy source, and these are irradiated by a xenon lamp, a flash lamp, a halogen lamp, an infrared heater or the like.

The stencil sheet prepared by the above method can be used for general stencil printing. For example, place the ink on one surface of the stencil printing base paper that was made,
Overlay the printing paper on the other side and press the above ink,
A printed matter is obtained by passing the ink through the perforated portion of the base paper and transferring the ink to the printing paper by means such as decompression and squeegee. .
Printing inks include conventionally known oil-based inks, water-based inks,
Water-in-oil (W / O) type emulsion ink, oil-in-water (O / W) type emulsion ink, heat-meltable ink and the like are used.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view of transfer sheets (a) to (d) showing an example used in the plate making method of the present invention. In FIG. 1, (a) is a transfer sheet having a photothermal conversion material portion 2 on a support 1, (b) is a transfer sheet in which a photothermal conversion material portion 2 and an adhesive material portion 3 are sequentially laminated on the support 1, (c) ) Is a transfer sheet in which a release material part 4, a photothermal conversion material part 2 and an adhesive material part 3 are sequentially laminated on a support 1, and (d) is a release paper 5 further laminated on the adhesive material part 3 of the transfer sheet (c). It is a transfer sheet.

2A to 2F are plate making process diagrams showing an embodiment of the plate making method of the present invention using the transfer sheet (a) shown in FIG. In FIG. 2, a heat-sensitive stencil sheet 12 (step of comprising a thermoplastic resin film 6 and a porous support 7)
After the surface of the thermoplastic resin film 6 of (A)) and the surface of the transfer sheet 13 of the support 1 and the photothermal conversion material portion 2 (step (B)) are brought into close contact with each other (step (C)),
The release paper 5 is released from the photothermal conversion material portion 2 (step (D)).
Then, a light beam 10 is emitted from a light source 8 having a light reflection plate 9 (step (E)) to obtain a perforated heat-sensitive stencil sheet 14 having perforated portions 11 (step (F)). (A) of FIG.
(D) is a process explanatory view until the release material part 4, the photothermal conversion material part 2 and the adhesive material part 3 are transferred to the heat-sensitive stencil sheet 12 using the transfer sheet (d) of FIG. 1. In FIG. 3, after peeling the release paper 5 of the transfer sheet 13 (step (B)
), The adhesive portion 3 of the transfer sheet is brought into close contact with the thermoplastic resin film 6 of the heat-sensitive stencil sheet 12 (step (C)), and the support 1 is peeled off (step (D)). Hereinafter, the present invention will be described with reference to Examples, but the present invention is not limited thereto.

Example 1 A thickness of 40 μ, which was subjected to a one-side peeling treatment with a silicone resin.
On the peeling treated surface of the polyester film of m, a character image was printed with a coating liquid containing carbon black as a photothermal conversion material to provide a photothermal conversion material portion. Next, an adhesive material part containing butyl rubber as a main component is applied in a character image form on the character image-shaped photothermal conversion material part by the same means, and the photothermal conversion material part and the adhesive material part are laminated on the support. The transfer sheet (b) shown in FIG. 1 was prepared. The total thickness of the photothermal conversion material part and the adhesive material part is 4 μm, and the softening point of the two layers mixed is 70.
° C.

Next, the adhesive surface of the obtained transfer sheet was superposed on and adhered to the surface of the thermoplastic resin film of the heat-sensitive stencil sheet (Ideal High Mesh Master, made by Ideka Kagaku Kogyo Co., Ltd.), and the polyester film of the transfer sheet was converted into a photothermal conversion material. The adhesive layer and the light-heat conversion layer were separated from each other and transferred onto the heat-sensitive stencil sheet. Then, when xenon flash was performed with a photographic strobe from the photothermal conversion material side of the heat-sensitive stencil sheet, the thermoplastic resin film was melt-perforated by the heat absorbed by the character image area, and the heat-sensitive stencil sheet was made. A high-mesh ink (manufactured by Ideal Science Co., Ltd.) was placed on the polyester fiber side of the plate-made heat-sensitive stencil, and printing was carried out with Print Gocco (manufactured by Ideal Science Co., Ltd.) to obtain a clear image.

Example 2 50 μm thickness which was subjected to one-side peeling treatment with a silicone resin
A release material part containing polyvinyl butyral as a main component was provided on the surface opposite to the release-treated surface of the polypropylene film of m. Next, a photothermal conversion material portion and an adhesive material portion similar to those in Example 1 were sequentially provided on the release material portion, and the release material portion, the photothermal conversion material portion and the adhesive material portion were sequentially laminated on the support. The transfer sheet (c) shown in was prepared. The total thickness of the release material portion, the photothermal conversion material portion, and the adhesive material portion is 5 μm.
The softening point at which the layers were mixed was 80 ° C. Even when the obtained transfer sheet was wound into a roll and stored, the problem that the pressure-sensitive adhesive portion and the support were adhered to each other did not occur.

Next, the adhesive surface of the obtained transfer sheet is overlapped and adhered to the surface of the thermoplastic resin film of the heat-sensitive stencil sheet (Print Gocco CD Master, manufactured by Ideal Science Co., Ltd.), and the polypropylene film of the transfer sheet is peeled from the release material portion. Then, the three layers of the adhesive material portion, the photothermal conversion material portion, and the release material portion were transferred onto the heat-sensitive stencil sheet. Then, when xenon flash was performed in the same manner as in Example 1, the thermoplastic resin film in the portion where the light-heat conversion material portion was transferred was melt-punched, and the heat-sensitive stencil sheet was made. A high-mesh ink (manufactured by Ideal Science Co., Ltd.) was placed on the polyester fiber side of the heat-sensitive stencil sheet thus prepared, and printed with Print Gokko (manufactured by Ideal Science Co., Ltd.) to obtain a clear image.

Example 3 Thickness of 40 μ which was peeled on one side with a silicone resin
A release material part containing polyethylene wax as a main component was provided on the release-treated surface of the polyester film m. Then, a character image was printed on the release material portion with a coating liquid containing carbon black as a light-heat converting material to provide a light-heat converting material portion. Next, an adhesive material having an acrylic resin as a main component was applied onto the light-heat converting material portion to provide an adhesive material portion, and the release material portion, the light-heat converting material portion and the adhesive material portion were sequentially laminated on the support. Figure 1
To obtain the transfer sheet (c). Further, a release sheet treated with a silicone resin was stuck on the adhesive material portion to obtain a transfer sheet (d) shown in FIG. As a result, it was possible to prevent unnecessary adhesion between transfer sheets before use.

Next, the release paper of the transfer sheet is peeled off, and the surface of the adhesive material and the thermoplastic resin film surface of the heat-sensitive stencil sheet (Print Gokko CD Master, manufactured by Ideal Science Co., Ltd.) are overlapped and adhered, and the polyester film of the transfer sheet is peeled off After peeling from the material portion, the three layers of the adhesive material portion, the photothermal conversion material portion and the release material portion were transferred onto the heat-sensitive stencil sheet. Then, when xenon flashing was performed in the same manner as in Example 1, the thermoplastic resin film in the portion where the light-heat converting material portion was transferred was melted and perforated to prepare a heat-sensitive stencil sheet. A high-mesh ink (manufactured by Ideal Science Co., Ltd.) was placed on the polyester fiber side of the heat-sensitive stencil sheet thus prepared, and printed with Print Gokko (manufactured by Ideal Science Co., Ltd.) to obtain a clear image.

[0029]

According to the plate-making method of the present invention, the photothermal conversion material portion is transferred onto the heat-sensitive stencil sheet using the transfer sheet prepared in advance, and this portion is directly irradiated with visible light or infrared rays to obtain heat-sensitive material. Since the stencil sheet can be plate-made, there is no perforation failure due to poor contact with the original as in the past, pinholes are not generated, and the heat-sensitive stencil sheet can be efficiently made with less irradiation energy.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of transfer sheets (a) to (d) which is an example used in the plate making method of the present invention.

2 is a plate making process diagram showing an example of the plate making method of the present invention using the transfer sheet (a) of FIG. 1. FIG.

FIG. 3 is a process explanatory view of transferring the release material portion, the photothermal conversion material portion and the adhesive material portion to the heat-sensitive stencil sheet using the transfer sheet (d) of FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Support body, 2 ... Photothermal conversion material part, 3 ... Adhesive material part, 4 ... Release material part, 5 ... Release paper, 6 ... Thermoplastic resin film, 7 ...
Porous support, 8 ... Light source, 9 ... Light reflection plate, 10 ... Rays,
11 ... Perforated part, 12 ... Heat-sensitive stencil sheet, 13 ... Transfer sheet, 14 ... Plated heat-sensitive stencil sheet.

Claims (10)

[Claims] 1. A light-heat converting material portion of a transfer sheet having a character-image-like light-heat converting material portion provided on a support, and the thermoplastic resin film surface of a heat-sensitive stencil sheet having a thermoplastic resin film. Then, after peeling the support of the transfer sheet to transfer the photothermal conversion material portion onto the thermoplastic resin film, the transferred photothermal conversion material portion is irradiated with visible light or infrared rays to perforate the thermoplastic resin film. A method for making a heat-sensitive stencil sheet, which comprises: 2. The transfer sheet used in claim 1, wherein the support has a light-to-heat conversion material portion in the form of a character image on the support. 3. The light-heat conversion material portion has a softening point or melting point of 40.
The transfer sheet according to claim 2, wherein the transfer sheet has a temperature in the range of to 150 ° C. 4. The transfer sheet used in claim 1, wherein the photothermal conversion material portion and the adhesive material portion are sequentially laminated in the form of a character image on the support. 5. The transfer sheet according to claim 4, wherein the photothermal conversion material portion and the adhesive material portion have a softening point or a melting point in the range of 40 to 150 ° C. 6. The transfer sheet used in claim 1, wherein a release material portion, a photothermal conversion material portion and an adhesive material portion are sequentially laminated in a character image form on a support. 7. The transfer sheet according to claim 6, wherein the peeling material portion, the photothermal conversion material portion and the adhesive material portion have a softening point or a melting point in the range of 40 to 150 ° C. 8. The transfer sheet according to claim 6, wherein the total thickness of the release material portion, the photothermal conversion material portion and the adhesive material portion is in the range of 0.001 to 20 μm. 9. The transfer sheet according to claim 4, wherein a release sheet is provided on the adhesive material portion. 10. The transfer sheet according to claim 2, wherein at least one surface of the support is subjected to a peeling treatment.