JPH09237663A - Mcm package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable numerous pins to be engaged or disengaged by a small operating force without using any ZIF structure by providing a substrate made of a flexible material and coaxial connectors. SOLUTION: A substrate 11 is molded with a synthetic resin material having flexibility. Small-sized coaxial connectors 12 are packaged at predetermined intervals on the margin of the substrate 11. On a counterpart base board 3, counterpart small-sized coaxial connectors 32 are provided in such a manner as to be engagingly connected to the respective coaxial connectors 12 of an MCM package 1. In this way, since the substrate 11 has flexibility, the coaxial connectors 12, 32 can be engagingly connected in sequence from one end toward the other end.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an MCM package, and more particularly to a connector used to mount the MCM package on a board and a connector for connecting the boards.

[0002]

2. Description of the Related Art MCM (Multi Chip Mod)
ule) is a package in which a plurality of elements are mounted on a substrate such as ceramic or plastic, and the processing capacity of the MCM has been remarkably improved recently.
As a result, the number of signal terminals increases and the signal transmission speed also keeps increasing. With such an increase in signal transmission speed, it becomes necessary to strengthen the ground to suppress deterioration of signal transmission, and as a result, the number of ground terminals also increases in proportion to the increase in the number of signal terminals. Therefore, the total number of terminals of the MCM package is also increasing.

Further, this brings about an improvement in the processing capability of various electronic equipment such as a computer having the MCM or LSI mounted therein, the number of signal terminals of the electronic equipment is increased, and the signal transmission speed is also increased. It is going to rise. Therefore, in order to suppress the deterioration of signal transmission in the entire electronic device, the ground must be strengthened, which also increases the number of ground terminals in the electronic device and the total number of connected terminals in the electronic device. It has become something to do.

[0004]

By the way, the former MC
In the case of the M package, this MCM package is a pin grid array type MC as shown in FIG.
In the case of M90, the small coaxial connector 91 is
The MCM 90 and the board 93 are electrically connected by being fitted into the mating coaxial connector 94 mounted on the board 93 as shown in FIG. In this case, as the number of pins increases, the mating / disengaging force increases and ZIF (Z
Without an auxiliary structure such as ero Insertion Force, it has become impossible to fit and disengage both. However, when such a ZIF structure is incorporated into a connector of an MCM package, the size of the connector is enlarged, and the packaging density of the package cannot be increased.

[0007] Such a problem still remains in the latter electronic equipment, even when the terminals of the electronic equipment are connected by using pins and sockets.

The present invention has been proposed in view of the above problems of the prior art. The problem is that even in a pin-socket type connector, a large number of pins are fitted with a light operating force without using the ZIF structure. -To provide a connector that can be disconnected and has good high-speed signal transmission characteristics.

[0007]

According to the present invention, there is provided an MCM package connected to an object to be connected, the substrate having a predetermined number of elements mounted thereon, the substrate being made of a flexible material, and the substrate being opposed to the substrate. An MCM package is obtained, which is configured by providing a mating connector mounted on a side connection target and a coaxial connector that is fitted and connected.

Further, according to the present invention, in the connector for connecting the boards to each other, the coaxial flexible cables are provided at both ends of the coaxial flexible cable to be fitted and connected to the mating coaxial connectors respectively mounted on the boards. It is possible to obtain a connector for board-to-board connection that is characterized by being provided.

[0009]

Embodiments of the present invention will be described below in detail with reference to the drawings.

First, the MCM package according to the present invention will be described. FIG. 1 shows a small coaxial connector 1 on a substrate 11.
2 shows the mounted MCM package 1, and the substrate 11 is molded from a flexible synthetic resin material. In the embodiment of the present invention, the substrate 11 has a square shape, and small coaxial connectors 12 are mounted around the substrate 11 at predetermined intervals instead of general terminals. The contacts of the miniature coaxial connector 12 are, of course, electrically connected to the element mounted on the substrate 11 (the element shown in the central portion of FIG. 1B).

FIG. 2 shows a mating substrate 3 on which the MCM package 1 is mounted. On the substrate 3, a mating small-sized coaxial connector 32 that is fitted and connected to the small-sized coaxial connector 12 of the MCM package 1 is provided.

Small coaxial connector 1 of MCM package 1
2 and the small coaxial connector 32 of the mating substrate 3 are of a type that is so-called snap-type fitted and connected.

FIG. 3 shows a process in which the MCM package 1 is mounted on the mating substrate 3, and since the substrate 11 of the MCM package 1 is flexible,
The small-sized coaxial connectors 12 and 32 on the end side can be sequentially fitted and connected toward the opposite end. FIG.
It shows a state where all of the small coaxial connectors 12 of the CM package 1 are fitted and connected to the small coaxial connectors 32 of the mating substrate 3.

When the MCM package 1 mounted on the board 3 is detached, the small coaxial connector 12 of the MCM package 1 is opposite to the mounting from the small coaxial connector 32 of the mating board 3 on the end side. You can pull them away from.

According to the present invention, since it is not necessary to fit and connect all the connectors at the same time, the MC can be operated with a small operation force.
The M package 1 can be fixed to the substrate 3. Further, similarly, the detaching operation can be performed with a small operation force.

In the present embodiment, the small coaxial connector 12 of the MCM package 1 is directly connected to the small coaxial connector 32 of the mating substrate 3 by mating connection. Through the FPC configured by stripline, various substrates such as substrate to substrate, back panel to back panel, MCM package to MCM package, package board to package board, substrate to MCM package, etc. (normal circuit board , Back panel, MCM package substrate, package board). Note that the MCM package connected here is different from the one described above, and the substrate on which the element and the small-sized coaxial connector are mounted is made of a material having no ordinary flexibility such as ceramics and plastics. Is.

Next, the inter-board connector according to the present invention will be described.

FIG. 5 shows the structure of the inter-board connector 4 according to the second invention. A coaxial flat cable 40 having a plurality of signal lines (10 in the illustrated embodiment) has a predetermined length. The small coaxial connectors 42 are connected to both ends of these signal lines, respectively.

FIG. 6 shows two mating boards 5A and 5B connected to the board-to-board connector 4, and these two boards
The small coaxial connectors 5 are fitted and connected to the small coaxial connector 42 of the inter-board connecting connector 4 on the surfaces of the opposite boards 5A and 5B facing the inter-board connecting connector 4, respectively.
2 are provided.

As shown in FIG. 7, the board 5A and the board 5B are connected by a small coaxial connector 42 of the board-to-board connector 4.
Is applied to the small coaxial connector 52 of the mating substrate 5A, 5B, and the hooks are fitted from one end (the left end in the figure) toward the opposite end in order. Finally, as shown in FIGS. 8 (a) and 8 (b), both boards 5A and 5B are connected by the board-to-board connector 4.
Will be conductively connected. In the present embodiment, the coaxial small connectors 52 on both substrates 5A and 5B have the same size (form), but the present invention is not limited to this, and the coaxial small connectors on both substrates 5A and 5B are small. The connectors may have different sizes and configurations.

In the present embodiment, the coaxial flat cable 40 is used as the inter-board connector 4, but instead of this, an FPC 60 constituted by a microstrip line as shown in FIG. 9 may be used. . Reference numeral 62 is a coaxial small connector.

The board-to-board connector 6 was used to connect ordinary circuit boards, but as shown in FIG. 10, it is used to connect back panels 7A and 7B instead of connecting boards. Good.

In FIG. 11, the board-to-board connector 4 is an MCM.
It shows an example used to connect the packages 8A and 8B to each other. Since the MCM packages 8A and 8B have the elements mounted on the board and the mating connector to which the inter-board connector 4 is mated and connected is also provided on the board on which the elements are mounted, the MCM packages are connected to each other. Even if it does, it has been described as an inter-board connector.

FIG. 12 shows an example in which the board-to-board connector 4 is connected between the boards 9A and 9B arranged in parallel in a separated state.

The present embodiment is not limited to these, and the MCM package 8A and the substrates 5A and M are not limited thereto.
It goes without saying that the CM package 8 and the back panel 7 may be connected, or a combination other than these may be used for connection.

[0026]

As described above, according to the MCM package of the present invention, the substrate on which the elements of the MCM package are mounted is made of a flexible material, and the small coaxial connector is arranged on the flexible substrate. In addition, the board on which the MCM package is mounted is also provided with the small-sized coaxial connector that is fitted and connected to the small-sized coaxial connector, so that it is sufficient to sequentially fit or disconnect the connectors one by one. It requires less operation force for mating / unmating. Moreover, since the ZIF structure is not adopted even with such a small operation force, the connector can be downsized.

Further, according to the inter-board connecting connector of the present invention, the connectors used for connecting the boards (circuit board, back panel, MCM package, package board) to each other are composed of coaxial flat cables or microstrip lines. Using the FPC as a conductor,
Moreover, since coaxial small connectors are provided at both ends of the flexible coaxial flat cable and the like, and the small coaxial connectors are fitted and connected to the counterpart small coaxial connectors provided on the substrate, the electronic device It is possible to increase the degree of freedom of connection in the interior and enable various connections.

[Brief description of drawings]

[Figure 1] MCM with MCM package connector
It is explanatory drawing which showed an example of a package, (a) is a side view, (b) is a top view.

2A and 2B are explanatory views showing a substrate on which the MCM package of FIG. 1 is mounted, where FIG. 2A is a plan view and FIG. 2B is a side view.

3 is a side view showing a mounting process of the MCM package of FIG. 1 on the substrate of FIG.

4 is a side view showing a state in which the MCM package of FIG. 1 is mounted on the substrate of FIG.

5A and 5B are explanatory views showing an embodiment of an inter-board connector, wherein FIG. 5A is a plan view and FIG. 5B is a side view.

FIG. 6 is a diagram showing a structure in which two boards are connected to each other by a board-to-board connector.
It is an explanatory view showing a number of substrates, (a) is a plan view,
(B) is a side view.

FIG. 7 is an explanatory diagram showing a connection process by the inter-board connector.

FIG. 8 is an explanatory view showing a state (first connection mode) of being connected by a board-to-board connecting connector, in which (a) is a front view,
(B) is a side view.

9A and 9B are explanatory views showing another embodiment of the inter-board connector, wherein FIG. 9A is a plan view and FIG. 9B is a side view.

FIG. 10 is a side view showing a second connection mode by the inter-board connecting connector.

FIG. 11 is a side view showing a third connection mode by the inter-board connection connector.

FIG. 12 is a side view showing a fourth connection mode by the inter-board connection connector.

13A and 13B are explanatory views showing a conventional MCM package, in which FIG. 13A is a side view and FIG. 13B is a plan view.

14A and 14B are explanatory views showing a substrate on which a conventional MCM package is mounted, where FIG. 14A is a plan view and FIG. 14B is a side view.

[Explanation of symbols]

 1 MCM Package 3, 11 Board 4, 6 Board-to-Board Connector 5A, 5B Circuit Board 7A, 7B Back Panel 8A, 8B MCM Package 9A, 9B Circuit Board 12, 32, 42, 52, 62 Small Coaxial Connector

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takao Suzuki 1-21-2, Dogenzaka, Shibuya-ku, Tokyo Within Japan Aviation Electronics Industry, Ltd. (72) Hidenao Nakajima 1015 Uedanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Incorporated (72) Inventor Nobuyuki Shimizu 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited

Claims (2)

[Claims] 1. A MCM package connected to an object to be connected, comprising a board on which a predetermined number of elements are mounted and made of a flexible material, and a mating side mounted on the mating object to be mated to the board. An MCM package characterized by being provided with a coaxial connector for mating connection with the connector. 2. A board-to-board connector, wherein coaxial connectors are provided at both ends of the coaxial flexible cable for mating connection with mating coaxial connectors respectively mounted on the boards. Board-to-board connector.