JPH09218108A - Panel measuring instrument - Google Patents
Panel measuring instrumentInfo
- Publication number
- JPH09218108A JPH09218108A JP8022252A JP2225296A JPH09218108A JP H09218108 A JPH09218108 A JP H09218108A JP 8022252 A JP8022252 A JP 8022252A JP 2225296 A JP2225296 A JP 2225296A JP H09218108 A JPH09218108 A JP H09218108A
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- temperature
- circuit board
- terminal
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
- G09F13/0418—Constructional details
- G09F13/0422—Reflectors
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/04—Signs, boards or panels, illuminated from behind the insignia
- G09F13/14—Arrangements of reflectors therein
- G09F2013/145—Arrangements of reflectors therein curved reflectors
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば、温度調節
計や温度指示計等のパネル計器に関し、小型化に適し、
正確な温度補償を行うことができるパネル計器に関する
ものである。TECHNICAL FIELD The present invention relates to a panel instrument such as a temperature controller or a temperature indicator, which is suitable for miniaturization.
The present invention relates to a panel instrument capable of performing accurate temperature compensation.
【０００２】[0002]
【従来の技術】従来のパネル計器は、図８に示される装
置が知られている。図において、１はケース、２は回路
基板で、ケース１に格納され、電極３を有している。４
は取付片で、回路基板２に突出して設けられ、温度セン
サ５が取り付けられている。６は端子金具で、ケース１
に設けられ、ネジ穴を有し、電極３と電気的に接続す
る。７は座金付きネジで、端子金具６のネジ穴にネジ止
めされる。このような装置は、特定の端子金具６に座金
付きネジ７により熱電対の端子（図示せず）が止めら
れ、温度センサ５の温度により端子金具６の温度として
温度補償が行われ、熱電対により温度測定を行ってい
る。2. Description of the Related Art As a conventional panel instrument, the device shown in FIG. 8 is known. In the figure, 1 is a case, 2 is a circuit board, which is housed in the case 1 and has electrodes 3. Four
Is a mounting piece, which is provided so as to project from the circuit board 2 and to which the temperature sensor 5 is mounted. 6 is a terminal fitting, case 1
And has a screw hole and is electrically connected to the electrode 3. 7 is a screw with a washer, which is screwed into the screw hole of the terminal fitting 6. In such a device, a terminal (not shown) of a thermocouple is fixed to a specific terminal fitting 6 with a screw 7 having a washer, and temperature compensation of the temperature of the terminal fitting 6 is performed by the temperature of the temperature sensor 5. The temperature is measured by.
【０００３】[0003]
【発明が解決しようとする課題】近年、技術進歩に伴
い、大型のパネル計器も小型化できるようになった。し
かし、パネル計器のケース１に設けられる端子の大きさ
は一定であり、ケース１の後端面の面積により制限を受
ける。このようなため、温度センサ５のスペースを設け
ることは、端子を設けるスペースを少なくするという問
題点があった。また、温度センサ５が測定する温度は、
実際の端子の温度と違うため、熱電対の温度測定の誤差
要因になっていた。In recent years, with the progress of technology, it has become possible to reduce the size of large panel instruments. However, the size of the terminals provided in the case 1 of the panel instrument is constant, and is limited by the area of the rear end surface of the case 1. Therefore, providing the space for the temperature sensor 5 has a problem that the space for providing the terminal is reduced. The temperature measured by the temperature sensor 5 is
Since it is different from the actual temperature of the terminal, it was an error factor in the temperature measurement of the thermocouple.
【０００４】このような問題点を解決する方法として、
特開平７−２０９０９５号公報に開示される方法があ
る。これは、端子に接続する回路基板上に温度センサを
直接設け、端子の温度の測定を端子金具から行ってい
る。この方法では、発明者らが実験した結果では、温度
センサが回路基板に直接設けられるので、回路基板の温
度の影響を受け、実際の端子温度より２度以上も小さ
く、温度補償に誤差が生じてしまうという問題点があっ
た。そこで、本発明の目的は、小型化に適し、熱電対の
正確な温度補償を行うことができるパネル計器を実現す
ることにある。[0004] As a method of solving such a problem,
There is a method disclosed in JP-A-7-209095. In this method, a temperature sensor is directly provided on a circuit board connected to a terminal, and the temperature of the terminal is measured from a terminal fitting. According to the results of experiments conducted by the inventors of this method, since the temperature sensor is directly provided on the circuit board, it is affected by the temperature of the circuit board and is smaller than the actual terminal temperature by 2 degrees or more, resulting in an error in temperature compensation. There was a problem that it would end up. Therefore, an object of the present invention is to realize a panel instrument suitable for miniaturization and capable of performing accurate temperature compensation of a thermocouple.
【０００５】[0005]
【課題を解決するための手段】本発明は、ケースと、こ
のケースに配置され、熱電対が接続される端子と、この
端子に電気的に接続し、前記ケースに格納される回路基
板と、前記端子の温度を測定する温度センサと、を有す
るパネル計器において、断熱材料で形成され、前記温度
センサを保持し、前記回路基板に取り付けられるホルダ
ーと、伝熱材料で形成され、前記ホルダーに前記温度セ
ンサを覆って熱的に接続し、固定すると共に、前記端子
と熱的に接続するカバーと、を具備することを特徴とす
るものである。According to the present invention, there is provided a case, a terminal arranged in the case, to which a thermocouple is connected, and a circuit board electrically connected to the terminal and housed in the case. In a panel instrument having a temperature sensor for measuring the temperature of the terminal, a holder formed of a heat insulating material, which holds the temperature sensor, is attached to the circuit board, and a heat transfer material formed in the holder. And a cover that covers the temperature sensor and is thermally connected and fixed, and that is also thermally connected to the terminal.
【０００６】このような本発明では、ホルダーにより回
路基板からの熱が温度センサに伝熱することを防止す
る。そして、端子の熱がカバーを介して温度センサに伝
熱し、温度センサは温度を測定する。この温度センサが
感知する温度により熱電対の温度補償を行う。In the present invention as described above, the holder prevents the heat from the circuit board from being transferred to the temperature sensor. Then, the heat of the terminal is transferred to the temperature sensor via the cover, and the temperature sensor measures the temperature. The temperature of the thermocouple is compensated by the temperature sensed by the temperature sensor.
【０００７】[0007]
【発明の実施の形態】以下図面を用いて本発明を説明す
る。図１は本発明の一実施例を示した構成断面図で、端
子が設けられる部分を示している。図において、２０は
ケース、２１は取付け穴で、ケース２０に貫通して複数
設けられ、対向する溝部２２，２３，ストッパー部材２
４，挿入溝２５を有している。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing the configuration of an embodiment of the present invention, showing a portion where terminals are provided. In the figure, 20 is a case, 21 is a mounting hole, a plurality of which are provided so as to penetrate through the case 20, and which have groove portions 22 and 23 facing each other and a stopper member 2.
4 has an insertion groove 25.
【０００８】３０は端子で、ナット部材３１，バネ部材
３２，座金３３，ネジ３４からなり、熱電対を接続する
端子３５が取り付けられ、取付け穴２１に挿入されスト
ッパー部材２４により保持される。ナット部材３１は、
厚手の板材で概略コ字形に形成され、図２に示されるよ
うに、中間片３１ａとその両端に開放片３１ｂ，３１ｃ
を有している。ここで、図２の（ａ）は左側面図、
（ｂ）は正面図、（ｃ）は右側面図である。そして、開
放片３１ｂから中間片３１ａに向かって切欠部３１ｄが
形成されている。また、中間片３１ａにはネジ穴３１ｅ
が設けられている。Reference numeral 30 denotes a terminal, which is composed of a nut member 31, a spring member 32, a washer 33, and a screw 34, to which a terminal 35 for connecting a thermocouple is attached, inserted into the attachment hole 21 and held by the stopper member 24. The nut member 31 is
As shown in FIG. 2, it is formed of a thick plate material in a substantially U shape, and as shown in FIG. 2, an intermediate piece 31a and open pieces 31b, 31c at both ends thereof.
have. 2A is a left side view,
(B) is a front view and (c) is a right side view. A cutout portion 31d is formed from the open piece 31b toward the intermediate piece 31a. Further, the intermediate piece 31a has a screw hole 31e.
Is provided.
【０００９】バネ部材３２は、例えば銅のバネ板で概略
コ字形に形成され、内側にナット部材３１を挟み、図３
に示されるように中間片３２ａとその両端に開放片３２
ｂ，３２ｃを有している。ここで、図３の（ａ）は左側
面図、（ｂ）は正面図、（ｃ）は右側面図である。中間
片３２ａはネジ３４が貫通する穴３２ｄが設けられてい
る。開放片３２ｂ，３２ｃは、それぞれ突起部３２ｅ，
３２ｆを有し、突起部３２ｅ，３２ｆが溝部２２，２３
に挿入され、取付け穴２１から端子３０が抜けることを
防止する。そして、開放片３２ｃは概略Ｕ字状にコ字形
の内側に湾曲形成され、さらに先端が内側へ湾曲形成さ
れる。The spring member 32 is formed of, for example, a copper spring plate into a generally U-shape, and the nut member 31 is sandwiched inside the spring member 32.
As shown in FIG.
b and 32c. 3A is a left side view, FIG. 3B is a front view, and FIG. 3C is a right side view. The intermediate piece 32a is provided with a hole 32d through which the screw 34 passes. The open pieces 32b and 32c are the protrusions 32e and 32e, respectively.
32f, and the protrusions 32e and 32f have the grooves 22 and 23.
To prevent the terminal 30 from coming off from the mounting hole 21. The open piece 32c is curved and formed inwardly in a U shape in a generally U-shape, and the tip is curved inwardly.
【００１０】４０は回路基板で、ケース２０に格納さ
れ、挿入溝２５により端子３０に導かれ、図４の組立説
明図に示されるように、搭載する回路（図示せず）に接
続する電極４０ａ，４０ｂ，切欠部４０ｃ，貫通する穴
４０ｄ，４０ｅを有する。電極４０ａは、バネ部材３２
の開放片３２ｃと電気的に接続する。Reference numeral 40 denotes a circuit board, which is housed in the case 20, guided to the terminal 30 by the insertion groove 25, and connected to a circuit (not shown) to be mounted, as shown in the assembly explanatory view of FIG. , 40b, a notch 40c, and holes 40d and 40e penetrating therethrough. The electrode 40a is the spring member 32.
To be electrically connected to the open piece 32c.
【００１１】５０はホルダーで、断熱材料、例えば、ポ
リフェニレンサルファイド樹脂などで形成され、温度セ
ンサ５１を保持し、図５に示すように突起部５０ａ，５
０ｂ，５０ｃ，引掛部５０ｄ，穴部５０ｅ，スリット５
０ｆを有している。ここで、図５の（ａ）は上面図、
（ｂ）は左側面図、（ｃ）は正面図、（ｄ）は右側面
図、（ｅ）は底面図である。突起部５０ａ，５０ｂは、
それぞれ穴４０ｄ，切欠部４０ｃ，に挿入され、回路基
板４０に対するホルダー５０の位置を決める。引掛部５
０ｄは、穴４０ｅに挿入し、ホルダー５０を回路基板４
０に固定する。穴部５０ｅは温度センサ５１の配線５１
ａを上面から底面に導く。Reference numeral 50 denotes a holder, which is made of a heat insulating material such as polyphenylene sulfide resin, holds a temperature sensor 51, and has projections 50a, 5 as shown in FIG.
0b, 50c, hook portion 50d, hole portion 50e, slit 5
It has 0f. Here, FIG. 5A is a top view,
(B) is a left side view, (c) is a front view, (d) is a right side view, and (e) is a bottom view. The protrusions 50a and 50b are
The holder 50 is inserted into the hole 40d and the notch 40c, respectively, and determines the position of the holder 50 with respect to the circuit board 40. Hook part 5
0d is inserted into the hole 40e and the holder 50 is inserted into the circuit board 4
Fix to 0. The hole 50e is the wiring 51 of the temperature sensor 51.
Guide a from the top to the bottom.
【００１２】５２はカバーで、伝熱材料、例えば銅で形
成され、温度センサ５１を湾曲形成された湾曲部５２ａ
により覆って保持し、ホルダー５０のスリット５０ｆに
挿入され穴５２ｂに突起部５０ｃが挿入され、固定され
る。そして、ナット部材３１の切欠部３１ｄに導かれバ
ネ部材３２の開放片３２ｂと熱的に接続する。Reference numeral 52 denotes a cover, which is made of a heat transfer material, for example, copper, and has a curved portion 52a formed by curving the temperature sensor 51.
Then, the protrusion 50c is inserted into the slit 50f of the holder 50, and the protrusion 50c is inserted into the hole 52b and fixed. Then, it is guided to the notch 31d of the nut member 31 and thermally connected to the open piece 32b of the spring member 32.
【００１３】このような装置の組立動作を図４を用いて
以下で説明する。温度センサ５１の配線５１ａが、ホル
ダー５０の穴部５０ｅに挿入され、ホルダー５０の上面
から底面に配線５１ａが導かれる。そして、カバー５２
をホルダー５０のスリット５０ｆに挿入し、穴５２ｂに
突起部５０ｃを入れる。これによりカバー５２がホルダ
ー５０に固定され、温度センサ５１がホルダー５０に固
定される。そして、カバー５２に温度センサ５１をシリ
コンなどにより固定する。The assembling operation of such a device will be described below with reference to FIG. The wiring 51a of the temperature sensor 51 is inserted into the hole 50e of the holder 50, and the wiring 51a is guided from the upper surface to the bottom surface of the holder 50. And the cover 52
Is inserted into the slit 50f of the holder 50, and the protrusion 50c is inserted into the hole 52b. As a result, the cover 52 is fixed to the holder 50, and the temperature sensor 51 is fixed to the holder 50. Then, the temperature sensor 51 is fixed to the cover 52 with silicon or the like.
【００１４】ホルダー５０の突起部５０ａ，５０ｂ，引
掛部５０ｄを、回路基板４０の穴４０ｄ，切欠部４０
ｃ，穴４０ｅに挿入する。これにより、引掛部５０ｄが
回路基板４０に引っ掛かりホルダー５０を回路基板４０
に固定する。温度センサ５１の配線５１ａを回路基板４
０の電極４０ｂに半田付けし、図６の組立完了状態にす
る。The protrusions 50a and 50b and the hooking portion 50d of the holder 50 are connected to the hole 40d of the circuit board 40 and the notch 40.
c, insert into the hole 40e. As a result, the hook portion 50d is hooked on the circuit board 40 and the holder 50 is attached to the circuit board 40.
Fixed to Connect the wiring 51a of the temperature sensor 51 to the circuit board 4
Soldered to the electrode 40b of No. 0, and the assembly completed state of FIG.
【００１５】そして、次に図１の状態にするために、図
１の左側から右側に挿入溝２５に沿って回路基板４０を
挿入する。これにより、回路基板４０の電極４０ａにバ
ネ部材３２の開放片３２ｃが電気的に接続されると共
に、切欠部３１ｄに導かれ、カバー５２とバネ部材３２
の開放片３２ｂが熱的に接続される。これにより、端子
３０の熱がカバー５２を介して温度センサ５１に伝熱す
る。この温度センサ５１が感知する温度により、熱電対
の温度補償を行う。Then, in order to obtain the state of FIG. 1, the circuit board 40 is inserted from the left side to the right side of FIG. 1 along the insertion groove 25. As a result, the open piece 32c of the spring member 32 is electrically connected to the electrode 40a of the circuit board 40, and is guided to the cutout portion 31d to cover the cover 52 and the spring member 32.
The open piece 32b is thermally connected. As a result, the heat of the terminal 30 is transferred to the temperature sensor 51 via the cover 52. The temperature sensed by the temperature sensor 51 compensates the temperature of the thermocouple.
【００１６】このように、温度センサ５１は、回路基板
４０とはホルダー５０により断熱しており、回路基板４
０の温度の影響を受けずに端子の温度を測定することが
できるので、熱電対の正確な温度補償を行うことができ
る。また、ホルダー５０とカバー５２とにより温度セン
サ５１を固定するので、あたかも１つの部品として回路
基板４０に取り付けることができる。このため、組立を
容易に行うことができる。そして、温度センサ５１を端
子３０の取り付けスペースに設けたので、ケース２０に
端子を有効に設けることができ、パネル計器を小型化で
きる。In this way, the temperature sensor 51 is insulated from the circuit board 40 by the holder 50, and the circuit board 4
Since the temperature of the terminal can be measured without being affected by the temperature of 0, accurate temperature compensation of the thermocouple can be performed. Further, since the temperature sensor 51 is fixed by the holder 50 and the cover 52, it can be attached to the circuit board 40 as if it were one component. Therefore, the assembly can be easily performed. Further, since the temperature sensor 51 is provided in the mounting space of the terminal 30, the terminal can be effectively provided in the case 20, and the panel instrument can be miniaturized.
【００１７】なお、実施例において、ナット部材３１と
バネ部材３２とを別にした構成を示したが、本発明はこ
れに限定されるものではなく、図７に示すように１つの
部材で構成してもよい。すなわち、端子金具６０は、厚
板で概略コ字形に形成し、中間片６０ａとその両端に開
放片６０ｂ，６０ｃを有している。中間片６０ａはネジ
６１が取り付けられるネジ穴が設けられている。開放片
６０ｃは、湾曲部６０ｄを鍛造加工により薄肉化し湾曲
形成され、概略Ｕ字状にコ字形の内側に形成され、さら
に先端が内側へ湾曲形成される。これにより、回路基板
の電極に接触するために必要なバネ力を得る構成になっ
ている。In the embodiment, the nut member 31 and the spring member 32 are separately provided, but the present invention is not limited to this, and the nut member 31 and the spring member 32 are formed by one member as shown in FIG. May be. That is, the terminal fitting 60 is formed of a thick plate in a substantially U shape, and has an intermediate piece 60a and open pieces 60b and 60c at both ends thereof. The intermediate piece 60a is provided with a screw hole into which the screw 61 is attached. The open piece 60c is formed by thinning the curved portion 60d by forging to form a curved shape, is formed in a substantially U-shape inside the U-shape, and is further curved inward at the tip. As a result, the spring force required to contact the electrodes of the circuit board is obtained.
【００１８】[0018]
【発明の効果】本発明によれば、以下のような効果があ
る。温度センサは、回路基板とはホルダーにより断熱し
ており、回路基板の温度の影響を受けずに端子の温度を
測定することができるので、熱電対の正確な温度補償を
行うことができる。The present invention has the following effects. Since the temperature sensor is insulated from the circuit board by the holder and can measure the temperature of the terminal without being affected by the temperature of the circuit board, the temperature of the thermocouple can be accurately compensated.
【００１９】また、ホルダーとカバーとにより温度セン
サを固定するので、あたかも１つの部品として回路基板
に取り付けることができる。このため、組立が容易に行
うことができる。そして、温度センサを端子の取り付け
スペースに設けたので、ケースに端子を有効に設けるこ
とができ、パネル計器を小型化できる。Further, since the temperature sensor is fixed by the holder and the cover, it can be attached to the circuit board as one component. Therefore, the assembly can be easily performed. Further, since the temperature sensor is provided in the terminal mounting space, the terminal can be effectively provided in the case, and the panel instrument can be miniaturized.
【図１】本発明の一実施例を示した構成断面図である。FIG. 1 is a configuration cross-sectional view showing an embodiment of the present invention.
【図２】ナット部材３１の構成図である。FIG. 2 is a configuration diagram of a nut member 31.
【図３】バネ部材３２の構成図である。FIG. 3 is a configuration diagram of a spring member 32.
【図４】組立動作の説明図である。FIG. 4 is an explanatory diagram of an assembling operation.
【図５】ホルダー５０の構成図である。5 is a configuration diagram of a holder 50. FIG.
【図６】組立完了時の構成図である。FIG. 6 is a configuration diagram when assembly is completed.
【図７】端子の他の実施例を示した構成図である。FIG. 7 is a configuration diagram showing another embodiment of a terminal.
【図８】従来のパネル計器の概略構成図を示した図であ
る。FIG. 8 is a diagram showing a schematic configuration diagram of a conventional panel instrument.
２０ ケース ３０ 端子 ４０ 回路基板 ５０ ホルダー ５１ 温度センサ ５２ カバー 20 case 30 terminal 40 circuit board 50 holder 51 temperature sensor 52 cover
───────────────────────────────────────────────────── フロントページの続き (72)発明者 ▲はま▼田 孝幸 東京都武蔵野市中町２丁目９番32号 横河 電機株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor ▲ Hama ▼ Takayuki Taba 2-932 Nakamachi, Musashino-shi, Tokyo Yokogawa Electric Co., Ltd.
Claims (1)
路基板と、 前記端子の温度を測定する温度センサと、を有するパネ
ル計器において、 断熱材料で形成され、前記温度センサを保持し、前記回
路基板に取り付けられるホルダーと、 伝熱材料で形成され、前記ホルダーに前記温度センサを
覆って熱的に接続し、固定すると共に、前記端子と熱的
に接続するカバーと、を具備することを特徴とするパネ
ル計器。1. A case, a terminal arranged in the case, to which a thermocouple is connected, a circuit board electrically connected to the terminal and housed in the case, and a temperature for measuring the temperature of the terminal. In a panel instrument having a sensor, a holder formed of a heat insulating material for holding the temperature sensor and attached to the circuit board, and a holder formed of a heat transfer material for covering the temperature sensor and thermally A panel instrument comprising: a cover that is connected and fixed and that is thermally connected to the terminal.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02225296A JP3161317B2 (en) | 1996-02-08 | 1996-02-08 | Panel instrument |
| US08/730,428 US6020824A (en) | 1995-10-27 | 1996-10-15 | Panel instrument |
| KR1019960048984A KR100274311B1 (en) | 1995-10-27 | 1996-10-28 | Panel instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02225296A JP3161317B2 (en) | 1996-02-08 | 1996-02-08 | Panel instrument |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09218108A true JPH09218108A (en) | 1997-08-19 |
| JP3161317B2 JP3161317B2 (en) | 2001-04-25 |
Family
ID=12077604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02225296A Expired - Lifetime JP3161317B2 (en) | 1995-10-27 | 1996-02-08 | Panel instrument |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3161317B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007101334A (en) * | 2005-10-04 | 2007-04-19 | Oizumi Seisakusho:Kk | Temperature sensor for hot water supply apparatus |
| WO2016024767A1 (en) * | 2014-08-12 | 2016-02-18 | 주식회사 오토닉스 | Terminal board for temperature compensation of thermocouple |
| WO2017191935A1 (en) * | 2016-05-03 | 2017-11-09 | 주식회사 오토닉스 | Temperature measuring device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101651262B1 (en) * | 2016-05-16 | 2016-08-26 | 주식회사 오토닉스 | Temperature measurable device |
-
1996
- 1996-02-08 JP JP02225296A patent/JP3161317B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007101334A (en) * | 2005-10-04 | 2007-04-19 | Oizumi Seisakusho:Kk | Temperature sensor for hot water supply apparatus |
| WO2016024767A1 (en) * | 2014-08-12 | 2016-02-18 | 주식회사 오토닉스 | Terminal board for temperature compensation of thermocouple |
| US10281339B2 (en) | 2014-08-12 | 2019-05-07 | Autonics Corporation | Terminal board for temperature compensation of thermocouple |
| WO2017191935A1 (en) * | 2016-05-03 | 2017-11-09 | 주식회사 오토닉스 | Temperature measuring device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3161317B2 (en) | 2001-04-25 |
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